CN212910538U - Heat radiator for accurate power of intelligence integration - Google Patents
Heat radiator for accurate power of intelligence integration Download PDFInfo
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- CN212910538U CN212910538U CN202021687260.8U CN202021687260U CN212910538U CN 212910538 U CN212910538 U CN 212910538U CN 202021687260 U CN202021687260 U CN 202021687260U CN 212910538 U CN212910538 U CN 212910538U
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Abstract
The utility model provides a heat abstractor of accurate power of intelligence integration belongs to integration power technical field. The heat dissipation device of the intelligent integrated precise power supply comprises a screen cabinet and a heat dissipation mechanism. The screen cabinet includes the cabinet body, cabinet door and base, heat dissipation mechanism includes refrigeration cabinet, semiconductor refrigeration piece, guide duct and first fan, the cold junction of semiconductor refrigeration piece is located inside the refrigeration cabinet, refrigeration cabinet top intercommunication has the air-supply line, guide duct one end even lets in the refrigeration cabinet, the exhaust pipe all runs through cabinet body bottom extends to inside, first fan fixed mounting is in the both sides of cabinet body inner chamber bottom, the even intercommunication in cabinet body top has a plurality of cooling tubes, the utility model discloses a heat that semiconductor refrigeration piece and first fan made the internal electrical components of low temperature gas absorption cabinet give off is the electrical components cooling, has improved the radiating effect of power, and then improves the life and the security performance of power.
Description
Technical Field
The utility model relates to an integration power technical field particularly, relates to a heat abstractor of accurate power of intelligence integration.
Background
The integrated power supply is a complete equipment which combines devices such as a direct current power supply, an alternating current Uninterruptible Power Supply (UPS) for electric power, an inverter power supply (INV) for electric power, a direct current conversion power supply (DC/DC) for communication, and the like into a whole, shares a storage battery of the direct current power supply, and performs unified monitoring.
The accurate power supply of current intelligence integration each component part is concentrated and is installed in the screen cabinet, and the inside electrical components of screen cabinet can produce a large amount of heats when long-time work moves, and because the inside space of screen cabinet is narrow and small, the inside heat of screen cabinet is difficult to give off and leads to the inside electrical components of screen cabinet to cause the power failure accident because of ageing or short circuit, causes very big loss.
SUMMERY OF THE UTILITY MODEL
In order to compensate the above deficiency, the utility model provides a heat abstractor of intelligent integration precision power supply aims at improving the poor problem of the inside heat dissipation ability of current intelligent integration precision power supply.
The utility model discloses a realize like this:
the utility model provides a heat abstractor of accurate power of intelligence integration, construct including screen cabinet and heat dissipation.
The screen cabinet comprises a cabinet body, a cabinet door and a base, wherein the cabinet body is fixedly connected to the top of the base, the cabinet door is hinged to the cabinet body, and an electric appliance element is arranged on the cabinet door.
The heat dissipation mechanism comprises a refrigeration cabinet, semiconductor refrigeration pieces, an air duct and a first fan, the refrigeration cabinet is fixedly connected to one side of the cabinet body, the semiconductor refrigeration pieces are evenly connected in series to form a plurality of refrigeration pieces, the semiconductor refrigeration pieces are fixed to the refrigeration cabinet in an embedded mode at equal intervals, the side wall of the cabinet body is far away from the refrigeration cabinet, cold ends of the semiconductor refrigeration pieces are located inside the refrigeration cabinet, hot ends of the semiconductor refrigeration pieces are located outside the refrigeration cabinet, the top of the refrigeration cabinet is communicated with an air inlet pipe, one end of the air duct is communicated with the inside of the refrigeration cabinet, the other end of the air duct is evenly communicated with a plurality of exhaust pipes, the exhaust pipes penetrate through the bottom of the cabinet body and extend to the inside, the first fan is fixedly installed on two sides of the bottom of the inner cavity of the.
The utility model discloses an in the embodiment, the hot junction laminating of semiconductor refrigeration piece is provided with the fin, the cold junction laminating of semiconductor refrigeration piece is provided with the heat dissipation copper pipe.
The utility model discloses an in an embodiment, the refrigeration cabinet is kept away from the outside of the cabinet body is provided with the second fan, the second fan with the fin corresponds the setting.
The utility model discloses an in one embodiment, the refrigeration cabinet outside is fixed with the mounting bracket, the second fan is installed in the mounting bracket, a plurality of heat dissipation through-holes have been seted up on the mounting bracket.
The utility model discloses an in an embodiment, the flowing back through-hole has been seted up to refrigeration cabinet bottom, the flowing back through-hole is the annular and distributes the guide duct extends into around the tip of refrigeration cabinet bottom.
The utility model discloses an in one embodiment, the air inlet department of air-supply line is provided with the drier layer, the air outlet department of cooling tube is provided with the dust screen.
The utility model discloses an in an embodiment, the base bottom is provided with fixed support seat, fixed support seat is including supporting chassis, threaded rod and thread bush, threaded rod top fixed connection in the base bottom, thread bush fixed connection in support the chassis, the thread bush spiro union in the threaded rod bottom.
In an embodiment of the present invention, the middle of the bottom surface of the base is provided with a cavity, the top end of the threaded rod is fixed inside the cavity, and the diameter of the cavity is the same as that of the threaded sleeve.
The utility model discloses an in one embodiment, cabinet body top is provided with shelters from the roof, shelter from the roof pass through telescopic link fixed connection in cabinet body top.
In an embodiment of the present invention, the four corners of the bottom of the base are provided with universal wheels.
The utility model has the advantages that: the utility model discloses a heat abstractor of intelligent integration precision power that above-mentioned design obtained, during the use, start first fan, the intraductal air formation negative pressure of first fan suction exhaust, outside air passes through in the air-supply line gets into the refrigeration cabinet, the air in the refrigeration cabinet is cooled down through the cold junction of semiconductor refrigeration piece, the air through cooling down passes through the internal portion of exhaust pipe quick access cabinet, the heat that the internal electrical components of low temperature gas upward movement in-process absorbed cabinet distributes is the electrical components cooling, hot-blast cooling tube discharge that passes through, thereby improve the radiating effect, be favorable to improving the life and the security performance of this intelligent integration precision power.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation device of an intelligent integrated precision power supply provided by an embodiment of the present invention;
fig. 2 is a schematic view of a screen cabinet structure provided by an embodiment of the present invention;
fig. 3 is a schematic view of a fixed support seat according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a heat dissipation mechanism according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a refrigeration cabinet provided by an embodiment of the present invention.
In the figure: 10-screen cabinet; 110-a cabinet body; 120-a cabinet door; 130-a base; 131-a cavity; 140-fixing the support base; 141-supporting the chassis; 142-a threaded rod; 143-thread bush; 150-universal wheels; 160-a blind ceiling; 170-telescopic rod; 180-electrical components; 20-a heat dissipation mechanism; 210-a refrigeration cabinet; 211-a mounting frame; 212-heat dissipating through holes; 213-liquid discharge through hole; 220-semiconductor refrigerating sheet; 221-a heat sink; 222-heat sink copper tubing; 230-a wind guide pipe; 240-a first fan; 250-an exhaust pipe; 260-radiating pipes; 261-dustproof net; 270-a second fan; 280-an air inlet pipe; 281-desiccant layer.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Examples
Referring to fig. 1-5, the present invention provides a technical solution: a heat dissipation device of an intelligent integrated precision power supply comprises a screen cabinet 10 and a heat dissipation mechanism 20.
Referring to fig. 2, the screen cabinet 10 includes a cabinet body 110, a cabinet door 120 and a base 130, the cabinet body 110 is fixedly connected to the top of the base 130, a cavity is formed between the cabinet body 110 and the base 130, the cabinet door 120 is hinged to the cabinet body 110, one side of the cabinet door 120 is hinged to the cabinet body 110 through a hinge, the other side of the cabinet door 120 is further provided with a handle, an electrical component 180 is arranged on the cabinet door 120, universal wheels 150 are arranged at four corners of the bottom of the base 130 to facilitate the transfer of the screen cabinet 10, a shielding top plate 160 is arranged at the top of the cabinet body 110, the refrigeration cabinet 210 is located in a shielding range of the shielding top plate 160, when the screen cabinet 10 is placed outdoors for use, sunlight and rainwater can be shielded for the cabinet body 110, the time of the sunlight directly irradiating the cabinet body 110 can be reduced, the temperature of the cabinet body 110 is, so as to improve the heat dissipation effect of the cabinet 110.
Referring to fig. 3, a fixed support base 140 is disposed at the bottom of the base 130, and when the fixed support base is disposed, the fixed support 140 includes a support chassis 141, a threaded rod 142 and a threaded sleeve 143, the top end of the threaded rod 142 is fixedly connected to the bottom of the base 130, the threaded sleeve 143 is fixedly connected to the support chassis 141, the threaded sleeve 143 is screwed to the bottom end of the threaded rod 142, specifically, a cavity 131 is arranged in the middle of the bottom end surface of the base 130, the top end of the threaded rod 142 is fixed inside the cavity 131, and the diameter of the cavity 131 is the same as that of the threaded sleeve 143, by providing the threaded rod 142 and the threaded sleeve 143, the support chassis 141 can be moved up and down along the cavity 131 by rotating the threaded sleeve 143 left and right, when the support chassis 141 is lower than the height of the universal wheels 150, the cabinet 110 is fixed on the ground, when the supporting chassis 141 is higher than the universal wheels 150, the cabinet 110 can be moved, and the cabinet 110 can be conveniently transferred or fixed.
Referring to fig. 4, the heat dissipation mechanism 20 includes a refrigeration cabinet 210, semiconductor refrigeration sheets 220, an air duct 230 and a first fan 240, the refrigeration cabinet 210 is fixedly connected to one side of the cabinet body 110, the refrigeration cabinet 210 is fixed to the cabinet body 110 by welding or bolts, the semiconductor refrigeration sheets 220 are uniformly connected in series and are a plurality of, the semiconductor refrigeration sheets 220 are embedded and fixed on the side wall of the refrigeration cabinet 210 away from the cabinet body 110 at equal intervals, the cold ends of the semiconductor refrigeration sheets 220 are located inside the refrigeration cabinet 210 and used for cooling the air entering the refrigeration cabinet 210 through the air inlet duct 280, so as to improve the heat dissipation effect inside the cabinet body 110, and the hot ends of the semiconductor refrigeration sheets 220 are located outside the refrigeration cabinet 210 and facilitate.
In this embodiment, the top of the refrigeration cabinet 210 is communicated with the air inlet duct 280, a desiccant layer 281 is disposed at an air inlet of the air inlet duct 280 to prevent water vapor in the outside air from entering the interior of the cabinet body 110 through the air inlet duct 280, one end of the air guiding duct 230 is communicated with the interior of the refrigeration cabinet 210, the other end of the air guiding duct 230 is disposed in a cavity between the cabinet body 110 and the base 130, a plurality of air exhaust ducts 250 are uniformly communicated with the other end of the air guiding duct 230, the air exhaust ducts 250 all extend to the interior through the bottom of the cabinet body 110, the first fan 240 is fixedly mounted at two sides of the bottom of the inner cavity of the cabinet body 110, a plurality of heat dissipation tubes 260 are uniformly communicated with the top of the cabinet body 110, a dust screen 261 is disposed at an air outlet of the heat dissipation tubes 260 to prevent dust in the outside air from entering the interior of the cabinet body 110 through air outlets of the heat dissipation, the air in the refrigeration cabinet 210 is cooled down through the cold junction of semiconductor refrigeration piece 220, and the air through cooling down gets into cabinet body 110 lower part fast, and the gaseous upward movement in-process of low temperature absorbs the heat that interior electrical components of cabinet body 110 distribute for electrical components cooling, and hot-blast discharge through cooling tube 260 to improve the radiating effect.
Referring to fig. 5, a heat sink 221 is attached to the hot end of the semiconductor refrigeration sheet 220, the heat sink 221 increases the heat dissipation area to improve the heat dissipation effect of the hot end of the semiconductor refrigeration sheet 220, a heat dissipation copper tube 222 is attached to the cold end of the semiconductor refrigeration sheet 220, the heat dissipation copper tube 222 increases the refrigeration area to improve the cooling effect of air, a second fan 270 is disposed on the outer side of the refrigeration cabinet 210 away from the cabinet body 110, the second fan 270 is disposed corresponding to the heat sink 221, the second fan 270 is used for rapidly dissipating heat from the heat sink 221 to improve the refrigeration effect of the cold end of the semiconductor refrigeration sheet 220, so as to improve the cooling effect of air entering the refrigeration cabinet 210, a mounting frame 211 is fixed on the outer side of the refrigeration cabinet 210, the second fan 270 is mounted in the mounting frame 211, a plurality of heat dissipation through holes 212 are formed in the mounting frame 211, a plurality of liquid drainage through holes 213 are formed in, the air outlet pipe is used for discharging water drops condensed from the air cooled by the heat dissipation copper pipe 222 to prevent water vapor from entering the cabinet body 110 through the air guide pipe 230, so as to ensure the normal operation of electrical components in the cabinet body 110.
Specifically, this heat abstractor of accurate power of intelligence integration's theory of operation:
when the refrigerator is used, the first fan 240 is started, the first fan 240 sucks air in the exhaust pipe 250 to form negative pressure, external air enters the refrigeration cabinet 210 through the air inlet pipe 280, the air in the refrigeration cabinet 210 is cooled through the cold end of the semiconductor refrigeration sheet 220, the cooled air rapidly enters the cabinet body 110 through the exhaust pipe 250, low-temperature gas absorbs heat emitted by electrical elements in the cabinet body 110 in the upward movement process to cool the electrical elements, and hot air is exhausted through the radiating pipe 260, so that the radiating effect is improved; the fixed support base 140 and the universal wheel 150 which can move up and down are arranged, so that the fixed support base 140 or the universal wheel can be conveniently adjusted to be in contact with the ground according to needs, and the equipment is convenient to fix and transfer; by arranging the shielding top plate 160 and the telescopic rod 170, when the screen cabinet 10 is placed outdoors for use, sunlight or rainwater can be shielded for the cabinet body 110, the temperature rise of the cabinet body 110 due to the long-time irradiation of the sunlight can be reduced, and therefore the heat dissipation effect of the cabinet body 110 is improved.
It should be noted that the specific model specifications of the semiconductor cooling plate 220, the first fan 240 and the second fan 270 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed burdens are not needed.
The power supply of the semiconductor cooling plate 220, the first fan 240 and the second fan 270 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An intelligent integrated heat dissipation device for a precision power supply, which is characterized by comprising
The screen cabinet (10), the screen cabinet (10) comprises a cabinet body (110), a cabinet door (120) and a base (130), the cabinet body (110) is fixedly connected to the top of the base (130), the cabinet door (120) is hinged to the cabinet body (110), and an electrical appliance element (180) is arranged on the cabinet door (120);
the heat dissipation mechanism (20) comprises a refrigeration cabinet (210), a plurality of semiconductor refrigeration sheets (220), an air guide pipe (230) and a first fan (240), the refrigeration cabinet (210) is fixedly connected to one side of the cabinet body (110), the semiconductor refrigeration sheets (220) are uniformly connected in series, the semiconductor refrigeration sheets (220) are embedded and fixed on the side wall, far away from the cabinet body (110), of the refrigeration cabinet (210) at equal intervals, the cold ends of the semiconductor refrigeration sheets (220) are located inside the refrigeration cabinet (210), the hot ends of the semiconductor refrigeration sheets (220) are located outside the refrigeration cabinet (210), the top of the refrigeration cabinet (210) is communicated with an air inlet pipe (280), one end of the air guide pipe (230) is communicated into the refrigeration cabinet (210), and the other end of the air guide pipe (230) is uniformly communicated with a plurality of air guide pipes (250), exhaust pipe (250) all run through the cabinet body (110) bottom extends to inside, first fan (240) fixed mounting in the both sides of the cabinet body (110) inner chamber bottom, the even intercommunication in cabinet body (110) top has a plurality of cooling tubes (260).
2. The heat dissipation device of an intelligent integrated precision power supply according to claim 1, wherein a heat dissipation fin (221) is attached to the hot end of the semiconductor refrigeration piece (220), and a heat dissipation copper pipe (222) is attached to the cold end of the semiconductor refrigeration piece (220).
3. The heat dissipation device of the intelligent integrated precise power supply according to claim 2, wherein a second fan (270) is disposed on an outer side of the refrigeration cabinet (210) far away from the cabinet body (110), and the second fan (270) is disposed corresponding to the heat dissipation fins (221).
4. The heat dissipation device of the intelligent integrated precise power supply as claimed in claim 3, wherein a mounting frame (211) is fixed to the outer side of the refrigeration cabinet (210), the second fan (270) is installed in the mounting frame (211), and a plurality of heat dissipation through holes (212) are formed in the mounting frame (211).
5. The heat dissipation device of an intelligent integrated precision power supply according to claim 1, wherein a liquid discharge through hole (213) is formed in the bottom of the refrigeration cabinet (210), and the liquid discharge through holes (213) are annularly distributed around the end of the air duct (230) extending into the bottom of the refrigeration cabinet (210).
6. The heat dissipation device of an intelligent integrated precise power supply as claimed in claim 1, wherein a desiccant layer (281) is disposed at the air inlet of the air inlet pipe (280), and a dust screen (261) is disposed at the air outlet of the heat dissipation pipe (260).
7. The heat dissipation device for the intelligent integrated precision power supply as claimed in claim 1, wherein a fixed support base (140) is disposed at the bottom of the base (130), the fixed support base (140) comprises a support chassis (141), a threaded rod (142) and a threaded sleeve (143), the top end of the threaded rod (142) is fixedly connected to the bottom of the base (130), the threaded sleeve (143) is fixedly connected to the support chassis (141), and the threaded sleeve (143) is screwed to the bottom end of the threaded rod (142).
8. The heat dissipation device for the intelligent integrated precision power supply as claimed in claim 7, wherein a cavity (131) is formed in the middle of the bottom end surface of the base (130), the top end of the threaded rod (142) is fixed inside the cavity (131), and the diameter of the cavity (131) is the same as that of the threaded sleeve (143).
9. The heat dissipation device of the intelligent integrated precise power supply according to claim 1, wherein a shielding top plate (160) is arranged at the top of the cabinet body (110), and the shielding top plate (160) is fixedly connected to the top of the cabinet body (110) through a telescopic rod (170).
10. The heat dissipation device of an intelligent integrated precision power supply according to claim 1, wherein universal wheels (150) are arranged at four corners of the bottom of the base (130).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021687260.8U CN212910538U (en) | 2020-08-13 | 2020-08-13 | Heat radiator for accurate power of intelligence integration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021687260.8U CN212910538U (en) | 2020-08-13 | 2020-08-13 | Heat radiator for accurate power of intelligence integration |
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| CN212910538U true CN212910538U (en) | 2021-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021687260.8U Active CN212910538U (en) | 2020-08-13 | 2020-08-13 | Heat radiator for accurate power of intelligence integration |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113890388A (en) * | 2021-09-29 | 2022-01-04 | 零点创新科技有限公司 | Photovoltaic inverter with stable performance |
| CN114583816A (en) * | 2022-03-10 | 2022-06-03 | 重庆工程职业技术学院 | Miniature light stores up and fills integrative integrated equipment |
-
2020
- 2020-08-13 CN CN202021687260.8U patent/CN212910538U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113890388A (en) * | 2021-09-29 | 2022-01-04 | 零点创新科技有限公司 | Photovoltaic inverter with stable performance |
| CN114583816A (en) * | 2022-03-10 | 2022-06-03 | 重庆工程职业技术学院 | Miniature light stores up and fills integrative integrated equipment |
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