CN212907723U

CN212907723U - SOT223 packaging element

Info

Publication number: CN212907723U
Application number: CN202022492432.2U
Authority: CN
Inventors: 张明聪; 樊增勇; 董勇; 许兵; 任伟; 李宁
Original assignee: Chengdu Advanced Power Semiconductor Co Ltd
Current assignee: Chengdu Advanced Power Semiconductor Co Ltd
Priority date: 2020-11-02
Filing date: 2020-11-02
Publication date: 2021-04-06
Anticipated expiration: 2030-11-02

Abstract

The utility model relates to a semiconductor package technical field, concretely relates to SOT223 packaged component, including pin, chip mounting area and fin, pin and fin all are equipped with hinders the cistern, pin, chip mounting area and fin all are equipped with the mode locking hole. The pin, the chip mounting area and the radiating fin are provided with mold locking holes, so that the mold locking force of the packaging element and the plastic packaging body is greatly improved, the layering is reduced, and the packaging air tightness is improved. The pin and the front and the back of the radiating fin are provided with liquid blocking grooves, so that a dual mode locking effect can be achieved, layering is further reduced, and packaging air tightness is improved.

Description

SOT223 packaging element

Technical Field

The utility model relates to a semiconductor package technical field, especially a SOT223 encapsulates component.

Background

The SOT is a chip packaging unit model of an electronic component, and the existing chip packaging model SOT223 has three pins, one heat sink, and a chip mounting region, and the pins and the heat sink are respectively disposed on opposite sides of the chip mounting region. After the packaging of the packaging element is completed, one part of the pins and the radiating fins are in the plastic package body, and the other part of the pins and the radiating fins are outside the plastic package body, so that external water vapor easily enters the plastic package body from the joint of the pins and the radiating fins and the plastic package body after the packaging element is used for a period of time, the pins and the radiating fins in the plastic package body are layered with the plastic package body, the packaging airtightness is reduced, and the packaging element, such as a chip, a pin welding area and the like, in the plastic package body is influenced. At present, the SOT223 only sets a liquid blocking groove at the pin and the radiating fin to block the water vapor from entering, and the adopted packaging air tightness measures are not enough, and the air tightness effect is not obvious enough.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the gas tightness is poor after aim at the SOT223 encapsulation component encapsulation that prior art exists, and the external environment steam gets into the internal condition problem that appears the plastic-sealed body and component layering of plastic-sealed, provides a SOT223 encapsulation component.

In order to realize the purpose, the utility model discloses a technical scheme be:

an SOT223 packaging component comprises a pin, a chip mounting area and a radiating fin, wherein the pin and the radiating fin are provided with liquid blocking grooves, and the pin, the chip mounting area and the radiating fin are provided with mold locking holes.

This application except that pin and fin department all set up and hinder the cistern, have reduced external steam and have followed pin and fin get into the speed in the plastic envelope. Still all be equipped with on pin, fin and the chip mounting area mode locking hole, the plastic envelope is glued and is passed during the plastic envelope mode locking hole, and after the plastic envelope gelatinization is solid, the combination between the plastic envelope body and the encapsulation component is inseparabler, has effectively improved the encapsulation component with the whole clamping force of the plastic envelope body, according to the position that mode locking hole set up is different, shape, the size in mode locking hole can set up according to actual conditions, for example locate pin department the size in mode locking hole needs lessly, avoids influencing the joint strength of pin. And the air tightness after packaging is improved through the combined action of the liquid blocking groove and the mold locking hole.

Preferably, the back of the chip mounting area is provided with a plurality of grooves.

The groove is used for enhancing the mold locking force of the plastic package body and the chip mounting area, reducing layering and improving air tightness, and the mold locking force of the chip mounting area is further improved under the combined action of the mold locking hole and the layering is reduced.

Preferably, the die locking hole is a round hole or a kidney-shaped hole.

Waist type hole includes the semicircle at both ends and the middle limit that is parallel to each other, round hole and waist type hole are the circular arc in the corner, reduce stress concentration. The mold locking hole can be a waist-shaped hole at a place with a large size, and can be a round hole at a place with a small size.

Preferably, the pins and the front and back of the radiating fin are provided with the liquid blocking grooves.

The surface of the same side of the pins and the heat radiating fins with the chip is the front surface. In the prior art, the liquid blocking grooves are usually arranged on the front sides of the pins and the radiating fins, and the liquid blocking grooves are arranged on the front sides and the back sides of the pins and the radiating fins, so that a double mode locking effect can be achieved, the mode locking effect is better, and the air tightness is further improved.

Preferably, the mold locking hole of the chip mounting area is arranged on the side edge of the chip mounting area.

The middle part of the chip mounting area needs to be provided with elements such as a chip, a pin welding area and the like, the size of the mold locking hole cannot be designed to be too large, the mold locking hole is arranged on the side edge, the size of the mold locking hole can be set to be longer, and the mold locking force can be improved.

Preferably, the liquid blocking groove area at the radiating fin is provided with the mold locking hole.

The mold locking holes occupy part of the area of the radiating fins, and in order to save the area of the radiating fins, the liquid blocking groove and the mold locking holes on the radiating fins are arranged at the same position.

Preferably, bulges are arranged on two sides of the pin at the position of the mold locking hole.

Because of the pin size is less, after setting up the mode locking hole, the tensile strength of pin can reduce set up protruding both sides in mode locking hole department can improve by setting up the reduction of pin tensile strength that the mode locking hole caused.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:

1. the pin, the chip mounting area and the radiating fin are provided with mold locking holes, so that the mold locking force of the packaging element and the plastic packaging body is greatly improved, the layering is reduced, and the packaging air tightness is improved;

2. the back of the chip mounting area is provided with a plurality of grooves, so that the mold locking force between the chip mounting area and the plastic package body is further improved, the layering is reduced, and the packaging air tightness is improved;

3. liquid blocking grooves are formed in the front and back surfaces of the pins and the radiating fins, so that a double mode locking effect can be achieved, layering is further reduced, and packaging air tightness is improved;

drawings

FIG. 1 is a schematic structural diagram of an SOT223 package device in example 1;

FIG. 2 is a schematic view of the back surface of the chip mounting region in embodiment 1;

the labels in the figure are: 1-chip mounting area, 2-pin welding area, 3-pin, 41-first mode locking hole, 42-second mode locking hole, 43-third mode locking hole, 5-liquid resistance groove, 6-bump, 7-radiating fin and 8-groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Example 1

An SOT223 packaging component comprises a pin 3, a chip mounting area 1 and a radiating fin 7, wherein the pin 3 and the radiating fin 7 are both provided with a liquid blocking groove 5, and the pin 3, the chip mounting area 1 and the radiating fin 7 are all provided with a mold locking hole.

As shown in fig. 1, specifically, three pins 3 are arranged on one side of the chip mounting region 1, the middle pin 3 is connected to the chip mounting region 1, one end of each of the pins 3 on two sides is connected to a pin bonding region 2, and the other side of the chip mounting region 1 is provided with the heat sink 7. One end of the pin 3, which is connected with the pin welding area 2, is provided with the first circular mold locking hole 41, and protrusions 6 are arranged on the pin 3 on two sides of the first mold locking hole 41, so that the tensile strength of the pin 3 is improved. The front surfaces of the pins 3 and the radiating fins 7 are provided with two liquid resistance grooves 5, the back surfaces of the pins and the radiating fins are provided with one liquid resistance groove 5, and the liquid resistance grooves 5 can be V-shaped grooves. Because the size of the heat sink 7 is larger, the second mold locking hole 42 of the heat sink 7 may be two kidney-shaped holes, and in order to save the area of the heat sink 7, the liquid blocking groove 5 and the second mold locking hole 42 on the heat sink 7 are disposed at the same position. The position relationship between the first mold locking hole 41 and the second mold locking hole 42 and the liquid blocking groove 5 is not limited by the position relationship shown in fig. 1. Chip installation district 1 left and right sides limit size is great, third mode locking hole 43 on the chip installation district 1 can set up two longer waist type holes and a circular port respectively, specifically does chip installation district 1 is close to one side of middle pin 3 third mode locking hole 43 can set to the circular port of smaller size, avoids middle pin 3 tensile strength crosses lowly. As shown in fig. 2, the back surface of the chip mounting region 1 is provided with a plurality of grooves 8 arranged in an array, and the depth of the grooves 8 may be 0.02-0.05 mm.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The SOT223 packaging component comprises a pin (3), a chip mounting area (1) and a radiating fin (7), and is characterized in that the pin (3) and the radiating fin (7) are provided with liquid blocking grooves (5), and the pin (3), the chip mounting area (1) and the radiating fin (7) are provided with mold locking holes.

2. The SOT223 package of claim 1, wherein the backside of the chip mounting region (1) is provided with a plurality of grooves (8).

3. The SOT223 packaged component of claim 1, wherein said mold locking holes are round holes or kidney-shaped holes.

4. The SOT223 package of claim 1, wherein the pins (3) and the heat sink (7) are provided with the liquid-blocking grooves (5) on both the front and back sides.

5. The SOT223 package of claim 1, wherein the mold locking hole of the chip mounting region (1) is disposed at a side of the chip mounting region (1).

6. The SOT223 packaged component of claim 1, wherein said mold-locking hole is provided in the area of said liquid-blocking slot (5) at said heat sink (7).

7. The SOT223 package of any of claims 1-6, wherein said pins (3) have protrusions (6) at both sides of said locking holes.