CN212906195U - Heat conduction structure for microcomputer control panel - Google Patents
Heat conduction structure for microcomputer control panel Download PDFInfo
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- CN212906195U CN212906195U CN202022084567.5U CN202022084567U CN212906195U CN 212906195 U CN212906195 U CN 212906195U CN 202022084567 U CN202022084567 U CN 202022084567U CN 212906195 U CN212906195 U CN 212906195U
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- fixedly connected
- microcomputer control
- circuit board
- wall
- heat conduction
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Abstract
The utility model belongs to the technical field of the microcomputer control panel, especially, be a heat conduction structure for microcomputer control panel, which comprises a housin, the inner wall fixedly connected with mounting panel of casing, the mounting groove has been seted up on the surface of mounting panel, the inner wall sliding connection of mounting groove has the circuit board, the inside wall fixedly connected with dead lever of casing, the spring has been cup jointed on the surface of dead lever, the surface sliding connection of dead lever has the slide. The utility model discloses an use between mounting panel and the mounting groove is for the sake of convenience to place this circuit board for certain space is left with the inside of casing to this circuit board, can improve the inside circulation of casing, then uses through the cooperation of radiator fan, radiating groove and filter screen, can cool down the processing to the inside of casing, thereby has improved the radiating effect of this microcomputer control panel, and then has also prolonged the life of this circuit board, and the practicality is stronger.
Description
Technical Field
The utility model relates to a microcomputer control panel technical field specifically is a heat conduction structure for microcomputer control panel.
Background
The computer controller is a master command device which controls the starting, speed regulation, braking and phase reversal of the motor by changing the wiring of a main circuit or a control circuit and changing the resistance value in the circuit according to a preset sequence. The system consists of a program counter, an instruction register, an instruction decoder, a time sequence generator and an operation controller, and is a decision mechanism for issuing commands, namely, the decision mechanism is used for coordinating and commanding the operation of the whole computer system.
However, the existing microcomputer control board has the following problems:
1. when the microcomputer control panel runs, a large amount of heat can be generated, the heat dissipation effect is poor, electronic elements in the microcomputer control panel are easily damaged, the maintenance cost is increased, and the practicability is poor;
2. the existing microcomputer control panel is fastened and installed by using screws, is troublesome to disassemble, needs to be disassembled when the panel is maintained, causes troublesome maintenance, and is easy to cause the loss of the screws after being frequently disassembled.
SUMMERY OF THE UTILITY MODEL
The utility model provides a to prior art not enough, the utility model provides a heat conduction structure for microcomputer control panel has solved the relatively poor and dismantlement difficulty of current microcomputer control panel heat dissipation, problem that wastes time and energy relatively.
In order to achieve the above object, the utility model provides a following technical scheme: a heat conduction structure for a microcomputer control panel comprises a shell, wherein the inner wall of the shell is fixedly connected with a mounting plate, the surface of the mounting plate is provided with a mounting groove, the inner wall of the mounting groove is connected with a circuit board in a sliding way, the inner side wall of the shell is fixedly connected with a fixed rod, the surface of the fixed rod is sleeved with a spring, the surface of the fixed rod is connected with a sliding plate in a sliding way, one side of the sliding plate is fixedly connected with a connecting rod, the end part of the connecting rod is fixedly connected with a clamping plate, one side of the clamping plate is contacted with one side of the circuit board, the bottom of the shell is provided with a heat dissipation groove, the inside of the heat dissipation groove is provided with a heat dissipation fan, the outer end of the heat dissipation groove is fixedly connected with a filter screen, the top of casing is passed through screw fixedly connected with apron, the surface of apron is equipped with the display screen, the below of display screen is equipped with the button, one side of button is equipped with the pilot lamp.
As a preferred technical scheme of the utility model, the air outlet has been seted up to one side of casing, the inner wall fixedly connected with dust screen of air outlet.
As an optimal technical scheme of the utility model, the bottom fixedly connected with fixed plate of casing, the fixed slot has been seted up to the inside of fixed plate.
As a preferred technical scheme of the utility model, the locating hole has been seted up to the inside of circuit board, the inner wall sliding connection of locating hole has the locating lever, the bottom of locating lever and the inner wall fixed connection of mounting groove.
As an optimal technical scheme of the utility model, the shape of locating hole is circular, the inner wall diameter size of locating hole and the surperficial diameter size looks adaptation of locating lever.
As a preferred technical scheme of the utility model, the tip fixedly connected with stopper of dead lever, the stopper is circular shape.
Compared with the prior art, the utility model provides a heat conduction structure for microcomputer control panel possesses following beneficial effect:
1. this heat conduction structure for microcomputer control panel through the use between mounting panel and the mounting groove, is for the convenience of placing this circuit board for certain space is left with the inside of casing to this circuit board, can improve the inside circulation of casing, then uses through the cooperation of radiator fan, radiating groove and filter screen, can cool down the processing to the inside of casing, thereby has improved the radiating effect of this microcomputer control panel, and then has also prolonged the life of this circuit board, and the practicality is stronger.
2. This heat conduction structure for microcomputer control panel through the cooperation between locating lever and the locating hole, is for the convenience effectively fix a position this circuit board, then through the cooperation between dead lever, spring, slide, connecting rod and the splint for this splint carry out spacing fixed to the circuit board, can avoid the circuit board to carry out the problem fixed through the screw, thereby also conveniently dismantle maintenance and change this circuit board.
Drawings
FIG. 1 is a main sectional view of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a bottom view of the present invention;
FIG. 4 is an enlarged view of the point A of FIG. 1 according to the present invention;
fig. 5 is an enlarged view of the point B in fig. 1 according to the present invention.
In the figure: 1. a housing; 2. mounting a plate; 3. mounting grooves; 4. a circuit board; 5. fixing the rod; 6. a spring; 7. a slide plate; 8. a connecting rod; 9. a splint; 10. a heat sink; 11. a heat radiation fan; 12. a filter screen; 13. a cover plate; 14. a display screen; 15. a button; 16. an indicator light; 17. an air outlet; 18. a dust screen; 19. a fixing plate; 20. fixing grooves; 21. positioning holes; 22. positioning a rod; 23. and a limiting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-5, the present invention provides the following technical solutions: a heat conduction structure for a microcomputer control panel comprises a shell 1, wherein the inner wall of the shell 1 is fixedly connected with a mounting plate 2, the surface of the mounting plate 2 is provided with a mounting groove 3, the inner wall of the mounting groove 3 is slidably connected with a circuit board 4, the inner side wall of the shell 1 is fixedly connected with a fixed rod 5, the surface of the fixed rod 5 is sleeved with a spring 6, the surface of the fixed rod 5 is slidably connected with a sliding plate 7, one side of the sliding plate 7 is fixedly connected with a connecting rod 8, the end part of the connecting rod 8 is fixedly connected with a clamping plate 9, one side of the clamping plate 9 is contacted with one side of the circuit board 4, the bottom of the shell 1 is provided with a radiating groove 10, a radiating fan 11 is arranged inside the radiating groove 10, the outer end of the radiating groove 10 is fixedly connected with a filter screen, an indicator light 16 is provided on one side of the button 15.
In this embodiment, can conveniently install this circuit board 4 through mounting panel 2 and mounting groove 3, then extrude slide 7 through splint 9, make slide 7 at the surperficial slip extrusion spring 6 of dead lever 5, splint 9 passes through the elasticity of spring 6, can fix one side of circuit board 4, be for conveniently installing this circuit board 4, staff's the amount of labour has also been alleviateed simultaneously, cooperation through radiator fan 11 and radiating groove 10, be for conveniently carrying out the heat dissipation treatment to this circuit board 4, make this microcomputer control panel when the operation, the working property is more ideal.
Specifically, an air outlet 17 is formed in one side of the housing 1, and a dust screen 18 is fixedly connected to the inner wall of the air outlet 17.
In this embodiment, the air outlet 17 is provided to effectively discharge heat inside the casing 1, and the dust screen 18 can prevent the dust from entering the casing 1, thereby improving the dust-proof effect of the microcomputer control board.
Specifically, a fixing plate 19 is fixedly connected to the bottom of the housing 1, and a fixing groove 20 is formed in the fixing plate 19.
In this embodiment, the fixing plate 19 and the fixing groove 20 are used to fix the microcomputer control board more conveniently.
Specifically, locating hole 21 has been seted up to circuit board 4's inside, and the inner wall sliding connection of locating hole 21 has locating lever 22, the bottom of locating lever 22 and the inner wall fixed connection of mounting groove 3.
In this embodiment, the positioning holes 21 and the positioning rods 22 are provided to facilitate positioning of the circuit board 4, so that the circuit board 4 can be mounted more quickly.
Specifically, the positioning hole 21 is circular, and the diameter of the inner wall of the positioning hole 21 is matched with the diameter of the surface of the positioning rod 22.
In this embodiment, the positioning holes 21 are used in cooperation with the positioning rods 22, so that the positioning effect of the circuit board 4 can be improved.
Specifically, the end of the fixing rod 5 is fixedly connected with a limiting block 23, and the limiting block 23 is circular.
In this embodiment, the limiting block 23 is used for limiting the sliding plate 7, so that the sliding plate 7 slides more stably on the surface of the fixing rod 5.
The utility model discloses a theory of operation and use flow: firstly, when dispelling the heat to this circuit board 4, use through radiator fan 11, can carry out the thermal treatment to the inner wall of casing 1, the inside heat of this casing 1 can be discharged from air outlet 17 simultaneously, thereby the radiating effect of this circuit board 4 has been improved, when maintaining or changing this circuit board 4, open apron 13 from the top of casing 1, then remove splint 9, splint 9 drives connecting rod 8 extrusion slide 7, make slide 7 slide at the surface of dead lever 5, slide 7 extrusion spring 6, elasticity through spring 6, make this circuit board 4 can take out from the inner wall of mounting groove 3, it is more convenient when dismantling this circuit board 4.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A heat conduction structure for a microcomputer control panel comprises a shell (1), and is characterized in that: the inner wall of the shell (1) is fixedly connected with a mounting plate (2), a mounting groove (3) is formed in the surface of the mounting plate (2), a circuit board (4) is connected to the inner wall of the mounting groove (3) in a sliding manner, a fixing rod (5) is fixedly connected to the inner side wall of the shell (1), a spring (6) is sleeved on the surface of the fixing rod (5), a sliding plate (7) is connected to the surface of the fixing rod (5) in a sliding manner, a connecting rod (8) is fixedly connected to one side of the sliding plate (7), a clamping plate (9) is fixedly connected to the end portion of the connecting rod (8), one side of the clamping plate (9) is contacted with one side of the circuit board (4), a radiating groove (10) is formed in the bottom of the shell (1), a radiating fan (11) is installed inside the radiating groove (, the top of casing (1) passes through screw fixedly connected with apron (13), the surface of apron (13) is equipped with display screen (14), the below of display screen (14) is equipped with button (15), one side of button (15) is equipped with pilot lamp (16).
2. The heat conduction structure for the microcomputer control board as claimed in claim 1, wherein: an air outlet (17) is formed in one side of the shell (1), and a dust screen (18) is fixedly connected to the inner wall of the air outlet (17).
3. The heat conduction structure for the microcomputer control board as claimed in claim 1, wherein: the bottom of the shell (1) is fixedly connected with a fixing plate (19), and a fixing groove (20) is formed in the fixing plate (19).
4. The heat conduction structure for the microcomputer control board as claimed in claim 1, wherein: the circuit board is characterized in that a positioning hole (21) is formed in the circuit board (4), a positioning rod (22) is connected to the inner wall of the positioning hole (21) in a sliding mode, and the bottom end of the positioning rod (22) is fixedly connected with the inner wall of the mounting groove (3).
5. The heat conduction structure for the microcomputer control board as claimed in claim 4, wherein: the positioning hole (21) is circular, and the diameter of the inner wall of the positioning hole (21) is matched with the diameter of the surface of the positioning rod (22).
6. The heat conduction structure for the microcomputer control board as claimed in claim 1, wherein: the end part of the fixed rod (5) is fixedly connected with a limiting block (23), and the limiting block (23) is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022084567.5U CN212906195U (en) | 2020-09-22 | 2020-09-22 | Heat conduction structure for microcomputer control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022084567.5U CN212906195U (en) | 2020-09-22 | 2020-09-22 | Heat conduction structure for microcomputer control panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212906195U true CN212906195U (en) | 2021-04-06 |
Family
ID=75258368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022084567.5U Active CN212906195U (en) | 2020-09-22 | 2020-09-22 | Heat conduction structure for microcomputer control panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212906195U (en) |
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2020
- 2020-09-22 CN CN202022084567.5U patent/CN212906195U/en active Active
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