CN212905059U

CN212905059U - Heat dissipation mechanism for AI chip test Cobra vertical probe card

Info

Publication number: CN212905059U
Application number: CN202021816634.1U
Authority: CN
Inventors: 周明; 徐剑
Original assignee: Maxone Semiconductor Suzhou Co Ltd
Current assignee: Strong Half Conductor Suzhou Co ltd
Priority date: 2020-01-11
Filing date: 2020-01-11
Publication date: 2021-04-06
Anticipated expiration: 2030-01-11
Also published as: CN211603290U

Abstract

The utility model relates to a heat dissipation mechanism for a Cobra vertical probe card for AI chip test, which belongs to the technical field of probe cards; the heat dissipation mechanism comprises a PCB, welding pads, probes, a guide mechanism and a heat dissipation plate, wherein the inner wall of the PCB is provided with a plurality of identical welding pads at equal intervals, the probes are welded at the bottoms of the welding pads, the bottom ends of the probes sequentially penetrate through the bottom of the PCB and the bottom of the guide mechanism, the guide mechanism is fixedly connected to the bottom of the PCB, the heat dissipation plate penetrates through the side wall of the guide mechanism, and the probes penetrate through the heat dissipation plate; the utility model discloses among the heat dissipation mechanism, heating panel and probe interconnect can be at the probe during operation, and the heat transfer on probe surface to the surface of heating panel, the heat is dispelling the heat through the heating panel, because the surface area of heating panel is great, can effectual increase radiating effect to prevent that the probe from leading to using unusual circumstances because of the heat is too big at the circular telegram in-process.

Description

Heat dissipation mechanism for AI chip test Cobra vertical probe card

The application is a divisional application of the invention patent application 'a Cobra vertical probe card for AI chip test'.

Application date of the original case: 2020-01-11.

Original application No.: 2020200607369.

the name of the original invention is: a Cobra vertical probe card for AI chip testing.

Technical Field

The utility model relates to a perpendicular probe card of AI chip test Cobra is with heat dissipation mechanism belongs to probe card technical field.

Background

The AI chip, also called AI accelerator or computing card, is a module dedicated to handling a large amount of computing tasks in artificial intelligence applications, and usually needs to be tested or debugged after the AI chip is manufactured, and at this time, the Cobra vertical probe card needs to be used for testing.

After the conventional Cobra vertical probe card is contacted with an AI chip, the temperature of the probe can rapidly rise in a short time due to the fact that the probe is connected with current, and when the temperature of the probe is higher, the test can be influenced; in addition, since the probe contacts the AI chip, the probe may be subjected to a certain pressure when contacting the AI chip, and since the portion of the probe exposed from the guide mechanism is too long and has no fixing structure, the probe may be bent when the pressure is too high, thereby affecting the service life. Therefore, an AI chip test Cobra vertical probe card is proposed to address the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide an AI chip test Cobra vertical probe card and a heat dissipation mechanism and a fixing mechanism thereof in order to solve the above problems.

The utility model discloses a following technical scheme realizes above-mentioned mesh, an AI chip test Cobra vertical probe card, including heat dissipation mechanism and fixed establishment;

the heat dissipation mechanism comprises a PCB, welding pads, probes, a guide mechanism and a heat dissipation plate, wherein the inner wall of the PCB is provided with a plurality of identical welding pads at equal intervals, the probes are welded at the bottoms of the welding pads, the bottom ends of the probes sequentially penetrate through the bottom of the PCB and the bottom of the guide mechanism, the guide mechanism is fixedly connected to the bottom of the PCB, the heat dissipation plate penetrates through the side wall of the guide mechanism, and the probes penetrate through the heat dissipation plate;

the fixing mechanism comprises a support, a heat dissipation fixing plate, a heat dissipation opening and a notch, two same supports are symmetrically and fixedly connected to the bottom of the guide mechanism, and the heat dissipation fixing plate is fixedly connected to the bottom of each support.

Preferably, the bottom ends of the probes penetrate through the heat dissipation fixing plate and are arranged below the heat dissipation fixing plate.

Preferably, two same thermovents are symmetrically formed in the side wall of the heat dissipation fixing plate, and a plurality of same notches are formed in the bottom of the heat dissipation fixing plate at equal intervals.

Preferably, the two ends of the heat dissipation plate are arranged outside the guide mechanism, and a plurality of identical grooves are formed in the top and the bottom of the heat dissipation plate at one end where the guide mechanism is arranged outside.

The utility model provides a AI chip test Cobra is heat dissipation mechanism for vertical probe card, includes PCB board, solder pad, probe, guiding mechanism and heating panel, the inner wall equidistance of PCB board has a plurality of the same solder pads, and is a plurality of the probe has all been welded to the bottom of solder pad, the bottom of probe runs through the bottom of PCB board and guiding mechanism's bottom in proper order, the guiding mechanism rigid coupling is in the bottom of PCB board, the lateral wall of guiding mechanism runs through there is the heating panel, and is a plurality of the probe runs through the heating panel.

A fixing mechanism for an AI chip test Cobra vertical probe card comprises a support, a heat dissipation fixing plate, a heat dissipation port and a notch, wherein two same supports are symmetrically and fixedly connected to the bottom of a guide mechanism, and the heat dissipation fixing plate is fixedly connected to the bottoms of the two supports.

The utility model has the advantages that:

1. the utility model discloses the heating panel that sets up and probe interconnect, can be when the probe during operation, the heat transmission of probe surface is to the surface of heating panel, and the heat is dispelled the heat through the heating panel, because the surface area of heating panel is great, can effectual increase radiating effect to prevent that the probe from using unusual circumstances because of the heat is too big in the circular telegram process;

2. the heat dissipation fixed plate that sets up can fix the end of a plurality of probes to when detecting, can effectively prevent to lead to the crooked condition of probe because of pressure is too big, the device simple structure, convenient to use is fit for using widely.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a schematic view of the front cross-sectional structure of the present invention;

FIG. 2 is a schematic front view of the present invention;

fig. 3 is a schematic view of the heat dissipating plate of the present invention.

In the figure: 1. PCB board, 2, welding pad, 3, probe, 4, guiding mechanism, 5, heating panel, 6, recess, 7, support, 8, heat dissipation fixed plate, 9, thermovent, 10, notch.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Detailed description of the preferred embodiment

The following embodiment is an embodiment of the AI chip test Cobra vertical probe card of the present application.

Referring to fig. 1-3, an AI chip test Cobra vertical probe card includes a heat dissipation mechanism and a fixing mechanism;

the heat dissipation mechanism comprises a PCB (printed circuit board) 1, welding pads 2, probes 3, a guide mechanism 4 and a heat dissipation plate 5, wherein the plurality of same welding pads 2 are arranged on the inner wall of the PCB 1 at equal intervals, the probes 3 are convenient to connect, the probes 3 are welded at the bottoms of the plurality of welding pads 2, the detection is convenient, the bottom ends of the probes 3 sequentially penetrate through the bottom of the PCB 1 and the bottom of the guide mechanism 4, the guide mechanism 4 is fixedly connected to the bottom of the PCB 1, the heat dissipation plate 5 penetrates through the side wall of the guide mechanism 4, the heat dissipation is convenient, and the plurality of probes 3 penetrate through the heat dissipation plate 5, so that the heat;

the fixing mechanism comprises a support 7, a heat dissipation fixing plate 8, a heat dissipation port 9 and a notch 10, wherein the two same supports 7 and two same heat dissipation fixing plates 8 are symmetrically and fixedly connected to the bottom of the guide mechanism 4, and the fixing and heat dissipation are facilitated.

The bottom ends of the probes 3 penetrate through the heat dissipation fixing plate 8 and are arranged below the heat dissipation fixing plate 8, so that detection is facilitated; the side wall of the heat dissipation fixed plate 8 is symmetrically provided with two identical heat dissipation ports 9, and the bottom of the heat dissipation fixed plate 8 is equidistantly provided with a plurality of identical notches 10, so that the heat dissipation effect is increased; the outside of guiding mechanism 4 is all arranged in at the both ends of heating panel 5, a plurality of the same recesses 6 are all seted up in the outside one end of guiding mechanism 4 in arranging in at the top and the bottom of heating panel 5, are convenient for increase the radiating effect.

The utility model discloses when using, when testing, after a plurality of probes 3 and AI chip contact, the inside of a plurality of probes 3 can produce the heat, the heat passes through the heat transfer and transmits to heat radiation fixed plate 8 and heating panel 5 on, because heat radiation fixed plate 8 and heating panel 5's surface area is great, a plurality of recesses 6 that set up in addition, a plurality of thermovents 9 and a plurality of notch 10, can increase the radiating effect, thereby reduce probe 3's temperature to a certain extent, if the pressure between probe and the AI chip is too big, because heat radiation fixed plate 8 has certain supporting role, can effectually prevent that probe 3 from crooked, thereby to a certain extent, service life has been increased.

Detailed description of the invention

The following embodiments are examples of the heat dissipation mechanism for the AI chip test Cobra vertical probe card of the present application.

The utility model provides a AI chip test Cobra is heat dissipation mechanism for vertical probe card, includes PCB board 1, pad 2, probe 3, guiding mechanism 4 and heating panel 5, PCB board 1's inner wall equidistance has a plurality of the same pad 2, and is a plurality of the probe 3 has all been welded to the bottom of pad 2, the bottom of PCB board 1 and the bottom of guiding mechanism 4 are run through in proper order to the bottom of

probe

3, 4 rigid couplings of guiding mechanism are in the bottom of PCB board 1, the lateral wall of guiding mechanism 4 runs through has heating panel 5, and is a plurality of probe 3 runs through heating panel 5, is convenient for dispel the heat.

Detailed description of the preferred embodiment

The following embodiment is an embodiment of the fixing mechanism for the AI chip test Cobra vertical probe card of the present application.

The fixing mechanism for the AI chip test Cobra vertical probe card comprises a support 7, a heat dissipation fixing plate 8, a heat dissipation port 9 and a notch 10, wherein the bottom of a guide mechanism 4 is symmetrically and fixedly connected with the two same supports 7, and the bottom of each of the two supports 7 is fixedly connected with the heat dissipation fixing plate 8, so that the fixing is facilitated.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A heat dissipation mechanism for an AI chip test Cobra vertical probe card is characterized in that: including PCB board (1), pad (2), probe (3), guiding mechanism (4) and heating panel (5), the inner wall equidistance of PCB board (1) has a plurality of the same pad (2), and is a plurality of probe (3) have all been welded to the bottom of pad (2), the bottom of probe (3) runs through the bottom of PCB board (1) and the bottom of guiding mechanism (4) in proper order, guiding mechanism (4) rigid coupling is in the bottom of PCB board (1), the lateral wall of guiding mechanism (4) runs through has heating panel (5), and is a plurality of heating panel (5) is run through in probe (3).