CN212903454U

CN212903454U - AGC circuit applied to ultrasonic level sensing controller

Info

Publication number: CN212903454U
Application number: CN202022188996.7U
Authority: CN
Inventors: 韩雪刚
Original assignee: Suzhou Manjike Automation Technology Co ltd
Current assignee: Suzhou Manjike Automation Technology Co ltd
Priority date: 2020-09-29
Filing date: 2020-09-29
Publication date: 2021-04-06
Anticipated expiration: 2030-09-29

Abstract

The utility model discloses an AGC circuit is applied to ultrasonic wave level sensing control ware, including casing and the bottom of setting in the terminal box at casing top and bottom, be provided with the circuit board in the casing, be provided with AGC circuit, microprocessor and ultrasonic wave receiving and dispatching probe on the circuit board, ultrasonic wave receiving and dispatching probe sets up in the bottom to through circuit board and AGC circuit connection, the AGC circuit passes through the circuit board and is connected with microprocessor, microprocessor passes through the lead wire that sets up on the circuit board and is connected with the electrical interface of terminal box one side setting. The utility model has novel design and convenient use, can improve the sensitivity of the sensor, increase the measurement precision of the sensor and reduce the system error through the automatic gain sensor of the AGC circuit; and the sensor has simple structure, convenient processing and installation, can effectively reduce the production cost, is convenient to maintain and is easy to popularize.

Description

AGC circuit applied to ultrasonic level sensing controller

Technical Field

The utility model relates to an ultrasonic wave level sensing field especially relates to AGC circuit is applied to ultrasonic wave level sensing control ware.

Background

Currently, in automatic measuring systems, ultrasonic level sensors are used for measuring the levels of almost all solids and liquids, for example, in hazardous situations, due to the non-contact automatic measurement, corrosion resistance of the probe, and wide temperature range.

The utility model discloses an application number CN200420079981.5 discloses an ultrasonic wave level sensor, including interconnect's sensing element and controller, the controller includes arithmetic device, and its main points lie in, the controller still including being used for the analysis processing device of analysis processing signal wave characteristic to and comparing device and benchmark device. The advantage lies in, the principle that launching wave and back wave based on ultrasonic wave have commonality, carries out analysis and processing through analysis processing apparatus with all signal waves that receive to obtain the characteristic parameter of all signal waves, then the judgement through comparing device obtains the back wave that this launching wave corresponds, then calculates the round trip time difference between launching wave and the back wave through arithmetic device, and calculates the position of corresponding working face, makes this utility model ultrasonic wave level sensor can distinguish back wave and space clutter effectively and come, has very strong interference killing feature.

Utility model patent with application number CN201620858394.9 discloses an ultrasonic level sensor, it includes: an ultrasonic transmitting/receiving probe having a temperature sensor therein; a core processing unit; the ultrasonic transmitting module is provided with a PWM (pulse-width modulation) complementary square wave driving H-bridge circuit, a high-frequency pulse transformer driving circuit and a probe resonant circuit which are sequentially connected between the core processing unit and the ultrasonic transceiving probe; the ultrasonic receiving module is provided with an automatic gain amplifying module, a second-order filtering module and an echo receiving module which are sequentially connected between the ultrasonic transceiving probe and the core processing unit; the temperature compensation measurement module is arranged between the ultrasonic transceiving probe and the core processing unit; and the data output module is connected with the core processing unit. Through the arrangement of the structure, the built-in temperature sensor can be adopted to add temperature compensation, so that the influence of temperature change on the sound velocity is compensated, and particularly, the automatic gain amplification module and the temperature compensation measurement module are used for enabling the measurement data to have higher stability and higher precision.

The ultrasonic transmitting and receiving probe is usually of a piezoelectric type and is composed of a piezoelectric metal sheet and a ceramic sheet with a piezoelectric effect, the polarized piezoelectric material is mechanically deformed under the action of an external electric field, so that high-frequency voltage can be converted into high-frequency mechanical vibration to generate high-frequency ultrasonic waves, similarly, after the probe receives the ultrasonic vibration, the vibration waves can be converted into electric signals, and then through the timing difference between a driving pulse and a receiving pulse, because the propagation time and the propagation distance are in direct proportion, the linear distance between the sensor and an object to be measured can be calculated according to the known sound velocity. However, due to the influence of the parameter change of the ultrasonic wave in the air propagation on the sound velocity itself, the received signal of the data and the stability and the measurement accuracy are reduced, and therefore, the measurement accuracy and the stability thereof are to be improved. Based on this, we studied an ultrasonic level sensing controller based on an AGC circuit.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the problems in the prior art and provide an AGC circuit applied to an ultrasonic level sensing controller, the utility model has novel design and convenient use, can improve the sensitivity of the sensor, increase the measurement precision of the sensor and reduce the system error through the set AGC circuit automatic gain sensor; and the sensor has simple structure, convenient processing and installation, can effectively reduce the production cost, is convenient to maintain and is easy to popularize.

For realizing above-mentioned technical purpose, reach above-mentioned technological effect, the utility model discloses a following technical scheme realizes:

the AGC circuit is applied to the ultrasonic level sensing controller and comprises a shell, a junction box arranged at the top of the shell and a bottom cover arranged at the bottom of the shell, wherein a circuit board is arranged in the shell, an AGC circuit, a microprocessor and an ultrasonic receiving and transmitting probe are arranged on the circuit board, the ultrasonic receiving and transmitting probe is arranged on the bottom cover and is connected with the AGC circuit through the circuit board, the AGC circuit is connected with the microprocessor through the circuit board, and the microprocessor is connected with an electrical interface arranged on one side of the junction box through a lead arranged on the circuit board. By adopting the technical scheme, the shell is used for bearing various parts and electronic elements; the junction box is connected with an external electronic element through a set electrical interface; the bottom cover is used for installing and fixing the ultrasonic receiving and transmitting probe; the circuit board is used for bearing each electronic element and connecting each electronic element with the microprocessor; the ultrasonic receiving and transmitting probe is used for transmitting ultrasonic waves and receiving the ultrasonic waves; the AGC circuit is used for automatic gain, when the input signal of the ultrasonic receiving and transmitting probe is stronger, the gain of the amplifier is automatically reduced, and when the signal is weaker, the gain of the amplifier is automatically increased, so that the output voltage in the AGC action range is ensured to be more uniform, and the post-stage circuit of the amplifier has good processing characteristics on the input signal; the microprocessor is a central processing unit consisting of one or a few large-scale integrated circuits and can finish the operations of instruction fetching, instruction execution, information exchange with an external memory and a logic component and the like. The bottom cover is provided with two mounting holes, one mounting hole is used for mounting the sound wave transmitting probe, the other mounting hole is used for mounting the sound wave receiving probe, and one side of the mounting hole is further provided with a rotatable pressing strip which is used for pressing the probe in the mounting hole so as to prevent the probe from falling off.

Preferably, the junction box and the bottom cover are connected with the shell through threads, and a sealing ring is arranged at the joint of the junction box and the bottom cover. By adopting the technical scheme, the installation, connection and sealing are facilitated.

Preferably, the two sides of the electrical interface are provided with assembly clamping grooves. By adopting the technical scheme, the external connector is convenient to fix.

Preferably, the shell and the bottom cover are made of stainless steel; the junction box comprises a stainless steel part connected with the shell and a plastic part provided with an electrical interface, wherein the plastic part and the stainless steel part are integrally formed. By adopting the technical scheme, the structure is firm and not easy to damage.

Preferably, the ultrasonic transceiving probe comprises an ultrasonic transmitting module and an ultrasonic receiving module; the ultrasonic receiving module is connected with the AGC circuit through a filter circuit; and the ultrasonic transmitting module is connected with the microprocessor through the probe resonance circuit and the high-frequency pulse transformer driving circuit in sequence. By adopting the technical scheme, the arranged AGC circuit is used for automatically gaining the sound waves received by the ultrasonic receiving module and then sending the sound waves to the microprocessor; the probe resonant circuit and the high-frequency pulse transformer driving circuit are used for driving the ultrasonic transmitting module to transmit sound waves.

Preferably, the circuit board is further provided with an integrated voltage stabilizing circuit, and the integrated voltage stabilizing circuit is connected with each electronic element.

The utility model has the advantages that: the automatic gain sensor is novel in design and convenient to use, and can improve the sensitivity of the sensor, increase the measurement precision of the sensor and reduce the system error through the automatic gain sensor of the AGC circuit; and the sensor has simple structure, convenient processing and installation, can effectively reduce the production cost, is convenient to maintain and is easy to popularize.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood and to be implemented according to the content of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:

fig. 1 is a schematic structural diagram related to the present invention;

fig. 2 is a schematic view of the ultrasonic transceiver probe according to the present invention;

fig. 3 is a schematic diagram of a circuit framework according to the present invention.

The reference numbers in the figures illustrate: the ultrasonic transceiver probe comprises a shell 1, a junction box 2, a bottom cover 3, a circuit board 4, an ultrasonic transceiver probe 5, an electrical interface 6, an assembly clamping groove 7, a mounting hole 8, a pressing strip 9, a support 10, a pressing block 11, a stainless steel part 201 and a plastic part 202.

Detailed Description

The invention is further described with reference to the accompanying drawings:

referring to fig. 1 to 3, the AGC circuit applied to the ultrasonic level sensing controller includes a housing 1, a junction box 2 disposed at the top of the housing 1, and a bottom cover 3 disposed at the bottom of the housing, wherein a circuit board 4 is disposed in the housing 1, an AGC circuit, a microprocessor, and an ultrasonic transceiver probe 5 are disposed on the circuit board 4, the ultrasonic transceiver probe 5 is disposed on the bottom cover 3 and connected to the AGC circuit through the circuit board 4, the AGC circuit is connected to the microprocessor through the circuit board 4, and the microprocessor is connected to an electrical interface 6 disposed at one side of the junction box 2 through a lead wire disposed on the circuit board 4. By adopting the technical scheme, the shell 1 is used for bearing various parts and electronic elements; the junction box 2 is connected with an external electronic component through an arranged electric interface 6; the bottom cover 3 is used for installing and fixing the ultrasonic transceiving probe 5; the circuit board 4 is used for bearing each electronic element and connecting each electronic element with the microprocessor; the ultrasonic transmitting and receiving probe 5 is used for transmitting ultrasonic waves and receiving the ultrasonic waves; the AGC circuit is used for automatic gain, when the input signal of the ultrasonic transceiving probe 5 is strong, the gain of the amplifier is automatically reduced, and when the signal is weak, the gain of the amplifier is automatically increased, so that the output voltage in the AGC action range is ensured to be uniform, and the post-stage circuit of the amplifier has good processing characteristics on the input signal; the microprocessor is a central processing unit consisting of one or a few large-scale integrated circuits and can finish the operations of instruction fetching, instruction execution, information exchange with an external memory and a logic component and the like. Wherein, be provided with two mounting holes 8 on the bottom 3, one is used for installing sound wave emission probe, and another is used for installing sound wave receiving probe, and one side of mounting hole 8 still is provided with rotatable layering 9 for compress tightly the probe in mounting hole 8, in order to prevent that the probe from droing. A support 10 is provided in the housing 1 for supporting the circuit board 4, and a press block 11 is provided on the terminal block 2 for pressing the circuit board 4 against the support 10.

Preferably, the junction box 2 and the bottom cover 3 are connected with the housing 1 by screw threads, and a sealing ring is arranged at the joint of the junction box and the bottom cover. By adopting the technical scheme, the installation, connection and sealing are facilitated.

Preferably, the electrical interface 6 is provided with mounting slots 7 on both sides. By adopting the technical scheme, the external connector is convenient to fix. Wherein the electrical interface 6 does not extend beyond the outside of the housing 1 for ease of installation.

Preferably, the housing 1 and the bottom cover 3 are made of stainless steel; the terminal box 2 comprises a stainless steel part 201 connected with the housing 1 and a plastic part 202 provided with the electric interface 6, wherein the plastic part 202 is integrally formed with the stainless steel part 201. By adopting the technical scheme, the structure is firm and not easy to damage.

Preferably, the ultrasonic transceiver probe 5 includes an ultrasonic transmitting module and an ultrasonic receiving module; the ultrasonic receiving module is connected with the AGC circuit through a filter circuit; and the ultrasonic transmitting module is connected with the microprocessor through the probe resonance circuit and the high-frequency pulse transformer driving circuit in sequence. By adopting the technical scheme, the arranged AGC circuit is used for automatically gaining the sound waves received by the ultrasonic receiving module and then sending the sound waves to the microprocessor; the probe resonant circuit and the high-frequency pulse transformer driving circuit are used for driving the ultrasonic transmitting module to transmit sound waves.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

When the ultrasonic storage bin is in actual use, the ultrasonic receiving probe sends a received ultrasonic signal to the AGC circuit after passing through the filter circuit, the AGC circuit automatically gains the ultrasonic signal and sends the signal to the microprocessor, the microprocessor processes and analyzes the material level of the storage bin, and the analyzed result is sent to an external display screen through an electrical interface to be displayed.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

The AGC circuit is applied to an ultrasonic level sensing controller and comprises a shell (1), a junction box (2) arranged at the top of the shell (1) and a bottom cover (3) arranged at the bottom of the shell, and is characterized in that: the novel ultrasonic wave transmission and reception device is characterized in that a circuit board (4) is arranged in the shell (1), an AGC circuit, a microprocessor and an ultrasonic wave transmission and reception probe (5) are arranged on the circuit board (4), the ultrasonic wave transmission and reception probe (5) is arranged on the bottom cover (3) and is connected with the AGC circuit through the circuit board (4), the AGC circuit is connected with the microprocessor through the circuit board (4), and the microprocessor is connected with an electrical interface (6) arranged on one side of the junction box (2) through a lead arranged on the circuit board (4).
2. The AGC circuit of claim 1 applied to an ultrasonic level sensing controller, wherein: the junction box (2) and the bottom cover (3) are connected with the shell (1) through threads, and a sealing ring is arranged at the joint of the junction box and the bottom cover.
3. The AGC circuit of claim 1 applied to an ultrasonic level sensing controller, wherein: and assembling clamping grooves (7) are arranged on two sides of the electrical interface (6).
4. The AGC circuit of claim 1 applied to an ultrasonic level sensing controller, wherein: the shell (1) and the bottom cover (3) are made of stainless steel materials; the junction box (2) comprises a stainless steel part (201) connected with the shell (1) and a plastic part (202) provided with an electric interface (6), wherein the plastic part (202) and the stainless steel part (201) are integrally formed.
5. The AGC circuit of claim 1 applied to an ultrasonic level sensing controller, wherein: the ultrasonic transceiving probe (5) comprises an ultrasonic transmitting module and an ultrasonic receiving module; the ultrasonic receiving module is connected with the AGC circuit through a filter circuit; and the ultrasonic transmitting module is connected with the microprocessor through the probe resonance circuit and the high-frequency pulse transformer driving circuit in sequence.
6. The AGC circuit of claim 1 applied to an ultrasonic level sensing controller, wherein: the circuit board is also provided with an integrated voltage stabilizing circuit, and the integrated voltage stabilizing circuit is connected with each electronic element.