CN212874477U - Chip support structure of heat sealing machine - Google Patents

Chip support structure of heat sealing machine Download PDF

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Publication number
CN212874477U
CN212874477U CN202022435891.7U CN202022435891U CN212874477U CN 212874477 U CN212874477 U CN 212874477U CN 202022435891 U CN202022435891 U CN 202022435891U CN 212874477 U CN212874477 U CN 212874477U
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CN
China
Prior art keywords
support
chip
mounting plate
copper pipe
bracket
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Expired - Fee Related
Application number
CN202022435891.7U
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Chinese (zh)
Inventor
廖茂翔
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Tianjin Dingyuan Technology Development Co ltd
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Tianjin Dingyuan Technology Development Co ltd
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Priority to CN202022435891.7U priority Critical patent/CN212874477U/en
Application granted granted Critical
Publication of CN212874477U publication Critical patent/CN212874477U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a welding machine chip support structure, which belongs to the technical field of welding machine accessories and comprises a mounting plate and a support, wherein the support is arranged at the top of the mounting plate, the top of the support is provided with a chip, the top of the mounting plate is fixedly connected with four sleeves, the sleeves are internally inserted with connecting rods, the tops of the connecting rods are connected with the bottom of the support, the bottom of the connecting rods is bonded with rubber rings, a spring A is arranged between the mounting plate and the support, when the welding machine shakes or collides, the vibration of a shell can directly drive the vibration of the mounting plate, the spring A can play a role in buffering and reducing impact force to the vibration and reduce the stress of the support, the connecting rods drive the rubber rings to move in the sleeves, the rubber rings are tightly attached to the inner wall of the sleeves, the generated friction force is utilized to play a role in damping, and the shaking and the received impact force, the stability of the chip is kept, and the protection of the chip is improved.

Description

Chip support structure of heat sealing machine
Technical Field
The utility model relates to a heat sealing machine accessory technical field especially relates to a heat sealing machine chip support structure.
Background
The fusion splicer is generally an optical fiber fusion splicer used in the field of optical communication, and has the working principle that two optical fibers are fused into one by using a high-precision motion mechanism to smoothly push the two optical fibers while melting the sections of the two optical fibers by using a high-voltage electric arc so as to realize the coupling of an optical fiber mode field.
The traditional welding machine chip support structure has the following defects that 1, the traditional welding machine chip support structure is directly fixed at the installation position in the welding machine, and when the welding machine shakes or collides, the support is directly stressed, so that chips are easy to fall off and damage, and normal use is influenced; 2. traditional directness only possesses basic support fixed function, and the chip can produce certain heat when the operation, can influence the functioning speed of chip when radiating efficiency is poor, for this reason, we provide a heat sealing machine chip supporting structure.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat sealing machine chip support structure aims at improving the protecting against shock of support and the performance of colliding with of preventing, improves the protection to the chip, makes the support have certain heat dissipation function simultaneously, promotes support functionality.
The utility model provides a specific technical scheme as follows:
the utility model provides a pair of heat sealing machine chip supporting structure, including mounting panel and support, the support mounting is at the mounting panel top, the chip is installed at the support top, mounting panel top fixedly connected with sleeve and sleeve are four, the sleeve is inside to be pegged graft and to have connecting rod and connecting rod top to be connected with the support bottom, the connecting rod bottom bonds there is the rubber ring, install spring A between mounting panel and the support, spring A cup joints at the sleeve outside, the support bottom is installed copper pipe and copper pipe top and is hugged closely the support bottom, the inside cavity of having seted up of copper pipe, the copper pipe is kept away from support one end and is extended to and is close to heat sealing machine louvre one side.
Optionally, the mounting plate is internally provided with four mounting holes, and the mounting holes penetrate through the mounting plate in the vertical direction.
Optionally, the outer side wall of the support is fixedly connected with a plurality of springs B, and the springs B are connected with the inner wall of the welding machine through the springs B.
Optionally, a heat sink is installed at one end of the copper pipe, and the heat sink is located at one end, far away from the support, of the copper pipe.
The utility model has the advantages as follows:
1. mounting panel snap-on is in the inside suitable mounted position of heat sealing machine, the support mounting is at the top of mounting panel, the chip mounting is at the support top, under the user state, when heat sealing machine takes place to rock or collide with, the vibration of casing can directly drive the vibration of mounting panel, spring A between mounting panel and the support can play the buffering to vibration and impact force and subduct the effect, reduce the atress of support, the connecting rod drives the rubber ring and removes inside the sleeve simultaneously, the sleeve inner wall is hugged closely to the rubber ring, the frictional force that utilizes the production plays damping's effect, further reduce rocking of support and the impact force that receives, keep its stability, improve the protection to the chip.
2. The bottom of the bracket is provided with a copper pipe which is tightly attached to the bottom of the bracket, the inside of the copper pipe is provided with a cavity, in the production process of the copper pipe, alcohol is injected into the copper pipe, then the interior of the copper pipe is pumped into a negative pressure state and sealed by using vacuum pumping equipment, one end of the copper pipe, which is far away from the bracket, extends to a position close to the heat dissipation hole, in the actual use process, the heat generated by the operation of the chip can pass through the bracket and be transferred to the copper pipe, so that the alcohol in the copper pipe close to the bracket is heated and vaporized, the alcohol vaporized under the action of negative pressure moves to one side close to the heat dissipation holes, and because the gas circulation near the heat dissipation holes is good, therefore, the temperature is low, the vaporized alcohol can be liquefied and flow to the position close to the bracket again when being close to the heat dissipation holes, therefore, the heat dissipation performance of the support is improved and the heating condition of the chip is reduced by using the alcohol as a medium for conducting heat compared with the traditional chip support structure.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of a chip holder structure of a fusion splicer according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a connection point between a connecting rod and a sleeve of a chip support structure of a fusion splicer according to an embodiment of the present invention;
fig. 3 is a schematic top view of a chip holder structure of a fusion splicer according to an embodiment of the present invention.
In the figure: 1. mounting a plate; 101. mounting holes; 2. a support; 3. a chip; 4. a sleeve; 401. a connecting rod; 402. a rubber ring; 5. a spring A; 6. a spring B; 7. a copper pipe; 701. a cavity; 8. and a heat sink.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
A structure of a chip holder of a fusion splicer according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 3.
Referring to fig. 1, fig. 2 and fig. 3, the embodiment of the utility model provides a heat sealing machine chip supporting structure, including mounting panel 1 and support 2, support 2 installs at mounting panel 1 top, chip 3 is installed at support 2 top, 1 top fixedly connected with sleeve 4 of mounting panel and sleeve 4 are four, it has connecting rod 401 and connecting rod 401 top to be connected with support 2 bottom to peg graft inside sleeve 4, connecting rod 401 bottom bonds there is rubber ring 402, install spring A5 between mounting panel 1 and the support 2, spring A5 cup joints at sleeve 4 outsidely, support 2 bottom is installed copper pipe 7 and copper pipe 7 top and is hugged closely support 2 bottom, the inside cavity 701 that has seted up of copper pipe 7, copper pipe 7 is kept away from support 2 one end and is extended to being close to heat sealing machine louvre one side.
Illustratively, when the welding machine shakes or collides, the vibration of the shell can directly drive the mounting plate 1 to vibrate, the spring A5 can buffer and reduce vibration and impact force, reduce the stress of the bracket 2, meanwhile, the connecting rod 401 drives the rubber ring 402 to move in the sleeve 4, the rubber ring 402 is tightly attached to the inner wall of the sleeve 4, the generated friction force is utilized to play a role in damping and damping, the shaking and the received impact force of the bracket 2 are further reduced, the stability of the bracket is maintained, the chip is protected, the heat generated by the operation of the chip 3 can be transmitted to the copper pipe 7 through the bracket 2, so that the alcohol near the bracket 2 in the copper pipe 7 is heated and vaporized, the vaporized alcohol moves to one side near the heat dissipation holes under the action of negative pressure, the vaporized alcohol can be liquefied and re-flows to the position near the bracket 2 when being near the heat dissipation holes, the steps are repeated, and the alcohol is used as a medium for conducting, the heat dissipation of the bracket 2 is improved, and the heat generation of the chip 3 is reduced.
Referring to fig. 1 and 3, four mounting holes 101 are formed in the mounting plate 1, and the mounting holes 101 penetrate through the mounting plate 1 in the vertical direction.
For example, the mounting plate 1 can be fixed inside the fusion splicer by using a fastening member such as a screw through the mounting hole 101 formed inside the mounting plate 1.
Referring to fig. 1 and 3, a plurality of springs B6 and B6 are fixedly connected to the outer side wall of the support 2, and the support 2 is connected with the inner wall of the welding machine through a spring B6.
For example, a spring B6 is installed between the support 2 and the inner wall of the welding machine, and the spring B6 can further reduce the impact force applied to the support 2.
Referring to fig. 1 and 3, a heat sink 8 is mounted at one end of the copper pipe 7, and the heat sink 8 is located at one end of the copper pipe 7 far away from the bracket 2.
For example, by installing the heat sink at one end of the copper tube 7, when the vaporized alcohol containing heat is always close to the heat sink 8, the heat sink can increase the contact area between the heat and the air environment, which is more beneficial to heat dissipation.
When the welding machine is used, the mounting plate 1 is directly fixed at a proper mounting position in the welding machine, the support 2 is mounted at the top of the mounting plate 1, the chip 3 is mounted at the top of the support 2, in a using state, when the welding machine shakes or collides, the vibration of the shell can directly drive the mounting plate 1 to vibrate, the spring A5 between the mounting plate 1 and the support 2 can play a role in buffering and reducing vibration and impact force and reduce stress of the support 2, meanwhile, the connecting rod 401 drives the rubber ring 402 to move in the sleeve 4, the rubber ring 402 is tightly attached to the inner wall of the sleeve 4, the generated friction force is utilized to play a role in damping, shaking and received impact force of the support 2 are further reduced, the stability of the support is kept, the protection of the chip 3 is improved, the mounting plate 1 can be conveniently fixed in the welding machine by using fasteners such as screws and the like through the mounting holes 101 formed in, a spring B6 is arranged between the support 2 and the inner wall of the welding machine, the spring B6 can further reduce the impact force borne by the support 2, a copper pipe 7 is arranged at the bottom of the support 2, the copper pipe 7 is tightly attached to the bottom of the support 2, a cavity 701 is arranged in the copper pipe 7, alcohol is injected into the copper pipe 7 in the production process, then a vacuumizing device is used for pumping the interior of the copper pipe 7 into a negative pressure state and sealing the interior of the copper pipe 7, one end, away from the support 2, of the copper pipe 7 extends to a position close to the radiating holes, in the actual use process, heat generated by the operation of the chip 3 can pass through the support 2 and be transmitted to the copper pipe 7, so that the alcohol close to the support 2 in the copper pipe 7 is heated and vaporized, the vaporized alcohol moves to one side close to the radiating holes under the action of the negative pressure, and the gas circulation, so reciprocal, utilize alcohol as the medium of conduction heat, compare in traditional chip support 2 structure, improved support 2's thermal diffusivity, reduce the condition of generating heat of chip 3, through the fin of 7 one end installations at the copper pipe, when hot vaporization alcohol is close to fin 8 positions always, the fin can improve the area of contact of heat and air circumstance, is favorable to the heat dissipation more.
It should be noted that the utility model relates to a heat sealing machine chip supporting structure, including mounting panel 1, mounting hole 101, support 2, chip 3, sleeve 4, connecting rod 401, rubber ring 402, spring A5, spring B6, copper pipe 7, cavity 701, fin 8, the part is general standard component or the part that technical staff in this field knows, and its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.
It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (4)

1. A chip support structure of a welding machine comprises a mounting plate (1) and a support (2), it is characterized in that the bracket (2) is arranged on the top of the mounting plate (1), the chip (3) is arranged on the top of the bracket (2), the top of the mounting plate (1) is fixedly connected with four sleeves (4), a connecting rod (401) is inserted in the sleeve (4), the top of the connecting rod (401) is connected with the bottom of the bracket (2), a rubber ring (402) is bonded at the bottom of the connecting rod (401), a spring A (5) is arranged between the mounting plate (1) and the bracket (2), the spring A (5) is sleeved outside the sleeve (4), the copper pipe (7) is installed at the bottom of the bracket (2), the top of the copper pipe (7) is tightly attached to the bottom of the bracket (2), a cavity (701) is formed in the copper pipe (7), and one end, far away from the support (2), of the copper pipe (7) extends to one side close to a heat dissipation hole of the welding machine.
2. The fusion splicer chip support structure according to claim 1, wherein the mounting plate (1) has four mounting holes (101) therein, and the mounting holes (101) penetrate the mounting plate (1) in a vertical direction.
3. The fusion splicer chip support structure according to claim 1, wherein a plurality of springs B (6) are fixedly connected to the outer side wall of the support (2), and the support (2) is connected with the inner wall of the fusion splicer through the springs B (6).
4. The chip support structure of the fusion splicer according to claim 1, wherein a heat sink (8) is mounted at one end of the copper tube (7), and the heat sink (8) is located at the end of the copper tube (7) far away from the support (2).
CN202022435891.7U 2020-10-28 2020-10-28 Chip support structure of heat sealing machine Expired - Fee Related CN212874477U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022435891.7U CN212874477U (en) 2020-10-28 2020-10-28 Chip support structure of heat sealing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022435891.7U CN212874477U (en) 2020-10-28 2020-10-28 Chip support structure of heat sealing machine

Publications (1)

Publication Number Publication Date
CN212874477U true CN212874477U (en) 2021-04-02

Family

ID=75201491

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022435891.7U Expired - Fee Related CN212874477U (en) 2020-10-28 2020-10-28 Chip support structure of heat sealing machine

Country Status (1)

Country Link
CN (1) CN212874477U (en)

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210402

Termination date: 20211028

CF01 Termination of patent right due to non-payment of annual fee