CN212850295U - Take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge - Google Patents

Take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge Download PDF

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Publication number
CN212850295U
CN212850295U CN202022190798.4U CN202022190798U CN212850295U CN 212850295 U CN212850295 U CN 212850295U CN 202022190798 U CN202022190798 U CN 202022190798U CN 212850295 U CN212850295 U CN 212850295U
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CN
China
Prior art keywords
circuit board
rectifier bridge
installation shell
shell
heat dissipation
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Active
Application number
CN202022190798.4U
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Chinese (zh)
Inventor
何林
邱永东
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Chongqing Lihua Gentian Technology Co ltd
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Chongqing Lihua Gentian Technology Co ltd
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Priority to CN202022190798.4U priority Critical patent/CN212850295U/en
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Publication of CN212850295U publication Critical patent/CN212850295U/en
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Abstract

The utility model provides a take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge, including circuit board installation shell and rectifier bridge installation shell, circuit board installation shell and rectifier bridge installation shell integrated into one piece fixed connection are in the same place, and the junction of circuit board installation shell and rectifier bridge installation shell leaves clearance vacuole formation, and circuit board installation shell and rectifier bridge installation shell back are equipped with many heat dissipation muscle. According to the rectifier bridge installation structure, the circuit board installation shell and the rectifier bridge installation shell are integrally formed and fixedly connected together, so that the circuit board and the rectifier bridge can be integrally installed, the labor cost is saved, and the production efficiency is improved; meanwhile, a gap is reserved at the joint of the circuit board mounting shell and the rectifier bridge mounting shell to form a cavity, so that the heat conduction quantity between the shells can be reduced, and the heat dissipation can be enhanced through air flow; in addition, a plurality of heat dissipation ribs are arranged on the back surfaces of the circuit board mounting shell and the rectifier bridge mounting shell, so that heat can be dissipated conveniently.

Description

Take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge
Technical Field
The utility model relates to a controller technical field for range extender or generator, concretely relates to take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge.
Background
Currently, the rectifier bridge and the controller circuit board for the range extender or generator are typically mounted separately. However, the inventor of the utility model discovers through research that there can be the process more with controller circuit board and rectifier bridge separately install when the production equipment, and production efficiency is low, and shortcoming such as cost of labor increase is not conform to modern lean production development. Therefore, how to innovatively integrate and mount the controller circuit board and the rectifier bridge together, which can simplify the production process and ensure the heat dissipation performance, is a problem to be solved at present.
SUMMERY OF THE UTILITY MODEL
To having now separately to install controller circuit board and rectifier bridge and can have the process more when the production equipment, production efficiency is low, and the cost of labor increases, is not conform to the technical problem of modern lean production development, the utility model provides a take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge.
In order to solve the technical problem, the utility model discloses a following technical scheme:
the utility model provides a take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge, includes circuit board installation shell and rectifier bridge installation shell, circuit board installation shell and rectifier bridge installation shell integrated into one piece fixed connection are in the same place, the junction of circuit board installation shell and rectifier bridge installation shell leaves clearance vacuole formation, circuit board installation shell and rectifier bridge installation shell back are equipped with many heat dissipation muscle.
Compared with the prior art, the integrated mounting structure with the heat dissipation type circuit board and the rectifier bridge comprises the circuit board mounting shell and the rectifier bridge mounting shell which are fixedly connected together in an integrated forming mode, so that the controller circuit board and the rectifier bridge can be integrally mounted, the labor cost is saved and the production efficiency is improved on the premise of being in line with modern lean production development; meanwhile, a gap is reserved at the joint of the circuit board mounting shell and the rectifier bridge mounting shell to form a cavity, namely, the middle of the joint of the circuit board mounting shell and the rectifier bridge mounting shell is designed in a hollow-out mode, so that the heat conduction quantity between the circuit board mounting shell and the rectifier bridge mounting shell can be reduced, and the heat dissipation can be enhanced through air flow; in addition, a plurality of heat dissipation ribs are arranged on the back surfaces of the circuit board mounting shell and the rectifier bridge mounting shell, so that heat generated by the circuit board and the rectifier bridge can be dissipated.
Further, the upper end and the lower end of the rectifier bridge mounting shell are provided with heat dissipation holes.
Furthermore, an aluminum substrate horizontal mounting surface parallel to the bottom of the circuit board mounting shell is arranged in the circuit board mounting shell.
Furthermore, an aluminum substrate vertical mounting surface which is laterally erected on the inner wall of the circuit board mounting shell is arranged in the circuit board mounting shell.
Drawings
Fig. 1 is a schematic view of the three-dimensional structure of the integrated mounting structure with heat dissipation circuit board and rectifier bridge provided by the present invention.
Fig. 2 is a schematic structural view of the back side of the integrated mounting structure with the heat dissipation circuit board and the rectifier bridge provided by the present invention.
Fig. 3 is a schematic view of the aluminum substrate mounting surface structure inside the circuit board mounting case provided by the present invention.
Fig. 4 is a schematic view of another aluminum substrate mounting surface structure disposed inside the circuit board mounting housing according to the present invention.
In the figure, 1, a circuit board is mounted on a housing; 2. the rectifier bridge is arranged on the shell; 21. heat dissipation holes; 3. a cavity; 4. heat dissipation ribs; 5. an aluminum substrate horizontal mounting surface; 6. and an aluminum substrate vertical mounting surface.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand and understand, the present invention is further explained by combining with the specific drawings.
In the description of the present invention, it is to be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and to simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Please refer to fig. 1 and fig. 2, the utility model provides a take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge, a serial communication port, including circuit board installation shell 1 and rectifier bridge installation shell 2, circuit board installation shell 1 and rectifier bridge installation shell 2 integrated into one piece fixed connection together, circuit board installation shell 1 and rectifier bridge installation shell 2's junction leaves clearance vacuole formation 3, circuit board installation shell 1 and rectifier bridge installation shell 2 back are equipped with many heat dissipation muscle 4.
Compared with the prior art, the integrated mounting structure with the heat dissipation type circuit board and the rectifier bridge comprises the circuit board mounting shell and the rectifier bridge mounting shell which are fixedly connected together in an integrated forming mode, so that the controller circuit board and the rectifier bridge can be integrally mounted, the labor cost is saved and the production efficiency is improved on the premise of being in line with modern lean production development; meanwhile, a gap is reserved at the joint of the circuit board mounting shell and the rectifier bridge mounting shell to form a cavity, namely, the middle of the joint of the circuit board mounting shell and the rectifier bridge mounting shell is designed in a hollow-out mode, so that the heat conduction quantity between the circuit board mounting shell and the rectifier bridge mounting shell can be reduced, and the heat dissipation can be enhanced through air flow; in addition, a plurality of heat dissipation ribs are arranged on the back surfaces of the circuit board mounting shell and the rectifier bridge mounting shell, so that heat generated by the circuit board and the rectifier bridge can be dissipated.
Referring to fig. 1, heat dissipation holes 21 are formed at the upper and lower ends of the rectifier bridge mounting case 2, so that heat generated at the upper and lower ends of the rectifier bridge can be dissipated.
As an embodiment, referring to fig. 3, an aluminum substrate horizontal mounting surface 5 parallel to the bottom of the circuit board mounting housing 1 is provided inside the circuit board mounting housing 1, that is, a horizontal table for mounting an aluminum substrate with a large heat generation amount is independently provided inside the circuit board mounting housing 1, so that the aluminum substrate can be horizontally mounted inside the circuit board mounting housing 1.
As another specific example, please refer to fig. 4, an aluminum substrate vertical mounting surface 6 that is laterally erected on the inner wall of the circuit board mounting housing 1 is provided inside the circuit board mounting housing 1, that is, an aluminum substrate vertical side surface for mounting a large amount of heat is independently provided inside the circuit board mounting housing 1, so that the aluminum substrate can be vertically mounted inside the circuit board mounting housing 1.
Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.

Claims (4)

1. The utility model provides a take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge, its characterized in that, includes circuit board installation shell (1) and rectifier bridge installation shell (2), circuit board installation shell (1) and rectifier bridge installation shell (2) integrated into one piece fixed connection together, the junction of circuit board installation shell (1) and rectifier bridge installation shell (2) leaves clearance vacuole formation (3), circuit board installation shell (1) and rectifier bridge installation shell (2) back are equipped with many heat dissipation muscle (4).
2. The integrated mounting structure of circuit board and rectifier bridge with heat dissipation of claim 1, wherein the rectifier bridge mounting housing (2) has heat dissipation holes (21) at its upper and lower ends.
3. The integrated mounting structure of circuit board with heat dissipation and rectifier bridge of claim 1, wherein the circuit board mounting shell (1) is internally provided with an aluminum substrate horizontal mounting surface (5) parallel to the bottom of the circuit board mounting shell (1).
4. The integrated mounting structure of the circuit board with the heat dissipation function and the rectifier bridge as claimed in claim 1, wherein an aluminum substrate vertical mounting surface (6) laterally standing on the inner wall of the circuit board mounting shell (1) is arranged inside the circuit board mounting shell (1).
CN202022190798.4U 2020-09-29 2020-09-29 Take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge Active CN212850295U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022190798.4U CN212850295U (en) 2020-09-29 2020-09-29 Take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022190798.4U CN212850295U (en) 2020-09-29 2020-09-29 Take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge

Publications (1)

Publication Number Publication Date
CN212850295U true CN212850295U (en) 2021-03-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022190798.4U Active CN212850295U (en) 2020-09-29 2020-09-29 Take integrative mounting structure of heat dissipation formula circuit board and rectifier bridge

Country Status (1)

Country Link
CN (1) CN212850295U (en)

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