CN212846288U - Liquid crystal display module with improved FPC bonding pad - Google Patents
Liquid crystal display module with improved FPC bonding pad Download PDFInfo
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- CN212846288U CN212846288U CN202021783174.7U CN202021783174U CN212846288U CN 212846288 U CN212846288 U CN 212846288U CN 202021783174 U CN202021783174 U CN 202021783174U CN 212846288 U CN212846288 U CN 212846288U
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Abstract
The utility model discloses an improve liquid crystal display module of FPC pad mainly comprises LCD, accessory in a poor light, main flexible circuit board and flexible circuit board in a poor light. The upper shoulder of the main flexible circuit board is provided with a main bonding pad, and the lower edge of the backlight flexible circuit board is provided with a backlight bonding pad. The positive main bonding pad and the negative main bonding pad of the main bonding pad are both square. The positive backlight bonding pad and the negative backlight bonding pad of the backlight bonding pad are both semicircular. The main flexible circuit board is connected with the backlight flexible circuit board through the main bonding pad and the backlight bonding pad. The utility model improves the structure of the main bonding pad and the backlight bonding pad, thereby not only ensuring the connection reliability of the main bonding pad and the backlight bonding pad in the bending process along with the FPC, but also improving the reliability of the whole liquid crystal display module so as to meet the design requirements of customers on products; and the width of the welding pad can be reduced, and the welding pad can still be concealed in the element groove under the condition that the width of the backlight element groove is limited, thereby reducing the thickness of the whole liquid crystal display module.
Description
Technical Field
The utility model relates to a liquid crystal display technology field, concretely relates to improve liquid crystal display module of FPC pad.
Background
With the improvement of the living standard of human beings, the requirements on life are higher and higher, the rapid development of display technology drives the mobile phone/digital market to correspondingly develop, and a liquid crystal display module (LCM) is developing towards high reliability and thin thickness. The liquid crystal display module mainly comprises an LCD, a backlight accessory, a main flexible circuit board (main FPC) and a backlight flexible circuit board (backlight FPC), as shown in fig. 1 and 2. The LCD is arranged above the backlight accessory, and the rear edge of the backlight accessory is provided with a component groove. The connection port of the upper edge of the backlight flexible circuit board is connected to the backlight assembly, and the connection port of the upper edge of the main flexible circuit board is connected to the LCD. The upper shoulder of the main flexible circuit board is provided with a main bonding pad, the lower edge of the backlight flexible circuit board is provided with a backlight bonding pad, and the main flexible circuit board and the backlight flexible circuit board are connected through the main bonding pad and the backlight bonding pad. And the connecting port at the lower edge of the main flexible circuit board is suspended and is connected with an external control device in the use process of a subsequent liquid crystal display module.
The main bonding pad of the existing main flexible circuit board and the backlight bonding pad of the backlight flexible circuit board are in a longitudinally extending elongated strip shape, as shown in fig. 3. However, the bonding pad structure in a strip shape has the following problems in use: first, in the subsequent use process of the liquid crystal display module, the main flexible circuit board of the liquid crystal display module often needs to be bent to the rear of the backlight assembly to hide the main flexible circuit board, so that the upper shoulder of the main flexible circuit board is in a continuous bending state in the use process of the liquid crystal display module, that is, the bending line of the main flexible circuit board inevitably passes through the main pad. Because the main pad and the pad that is shaded (the enduring direction of pad) are longitudinal extension, and the bending line of main flexible circuit board (the direction of application of force) is horizontal extension, consequently when main flexible circuit board is buckled, the condition that main pad slightly broke or even completely broke appears easily, and then leads to main pad and the pad that is shaded to strip and weld, and the accessory that is shaded is inefficacy. Secondly, in view of the characteristics of the LCD module, the backlight needs to be illuminated from the periphery of the LCD, and it is required to leave a certain distance from the edge of the LCD to ensure the normal display of the LCD module, so that in the design, the component groove of the backlight assembly can only be opened at the rear edge of the backlight assembly, and the area cannot be enlarged at will. In order to enable the pad to be hidden in the element groove when the pad is bent to the rear side of the backlight accessory along with the main flexible circuit board during design, the main pad is designed on the upper shoulder of the main flexible circuit board. However, in reality, the elongated bonding pads cannot be hidden in the component grooves when being bent to the rear of the backlight assembly along with the main flexible circuit board, and the bonding pads protrude, which eventually results in that the client needs a thicker space to avoid the area.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve is that bad contact appears easily and increase thickness's problem in current elongated strip's main pad and the pad of being shaded, provides an improve the liquid crystal display module assembly of FPC pad.
In order to solve the above problems, the utility model discloses a realize through following technical scheme:
the liquid crystal display module of the improved FPC pad, mainly by LCD, backlight fittings, main flexible circuit board and backlight flexible circuit board make up; the upper shoulder of the main flexible circuit board is provided with a main bonding pad, the lower edge of the backlight flexible circuit board is provided with a backlight bonding pad, and the main flexible circuit board and the backlight flexible circuit board are connected through the main bonding pad and the backlight bonding pad; the main bonding pad comprises a positive main bonding pad and a negative main bonding pad; the positive electrode main bonding pad and the negative electrode main bonding pad are the same in shape and size and are square; the positive main bonding pad and the negative main bonding pad are symmetrically distributed at the edge near the upper shoulder of the main flexible circuit board; the backlight bonding pad comprises a positive backlight bonding pad and a negative backlight bonding pad; the shape and the size of the positive electrode backlight bonding pad and the negative electrode backlight bonding pad are the same, and the positive electrode backlight bonding pad and the negative electrode backlight bonding pad are both in a semicircular shape; the positive backlight bonding pad and the negative backlight bonding pad are distributed at the lower edge of the backlight flexible circuit board in a bilateral symmetry manner, and the openings of the positive backlight bonding pad and the negative backlight bonding pad are both positioned at the lower edge of the backlight flexible circuit board; the positive main bonding pad of the main flexible circuit board is opposite to the positive backlight bonding pad of the backlight flexible circuit board in the positive direction; the negative main bonding pad of the main flexible circuit board is opposite to the negative backlight bonding pad of the backlight flexible circuit board in the positive direction.
In the scheme, four corners of the square positive electrode main bonding pad and four corners of the square negative electrode main bonding pad are round chamfers.
In the scheme, the radians of the semicircular positive backlight bonding pad and the semicircular negative backlight bonding pad are between 250 and 280 degrees.
In the scheme, the side length of the square positive electrode main bonding pad is larger than the diameter of the semicircular positive electrode backlight bonding pad; the side length of the square negative electrode main bonding pad is larger than the diameter of the semicircular negative electrode backlight bonding pad.
Compared with the prior art, the utility model improves the structure of the main bonding pad and the backlight bonding pad, thereby not only ensuring the connection reliability of the main bonding pad and the backlight bonding pad in the bending process along with the FPC, but also improving the reliability of the whole liquid crystal display module so as to meet the design requirements of customers on products; and the width of the welding pad can be reduced, and the welding pad can still be concealed in the element groove under the condition that the width of the backlight element groove is limited, thereby reducing the thickness of the whole liquid crystal display module.
Drawings
FIG. 1 is a front view of a liquid crystal display module.
FIG. 2 is a rear view of the liquid crystal display module.
Fig. 3 is an enlarged schematic view of a pad structure of a conventional main flexible circuit board and a backlight flexible circuit board.
Fig. 4 is an enlarged schematic diagram of the pad structure of the main flexible circuit board and the backlight flexible circuit board of the present invention.
Fig. 5 is a schematic diagram of bending of the flexible circuit board.
Reference numbers in the figures: 1. an LCD; 2. a backlight assembly; 3. a main flexible circuit board; 31. a main pad; 4. a backlight flexible circuit board; 41. a backlight pad; 5. a component slot; 6. and (4) bending the line.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be noted that directional terms such as "upper", "lower", "middle", "left", "right", "front", "rear", and the like, referred to in the examples, refer only to the direction of the drawings. Accordingly, the directions used are for illustration only and are not intended to limit the scope of the present invention.
A liquid crystal display module with improved FPC pad mainly comprises an LCD1, a backlight accessory 2, a main flexible circuit board 3 and a backlight flexible circuit board 4. The upper shoulder of the main flexible circuit board 3 is provided with a main pad 31, the lower edge of the backlight flexible circuit board 4 is provided with a backlight pad 41, and the main flexible circuit board 3 and the backlight flexible circuit board 4 are connected through the main pad 31 and the backlight pad 41. The lands of the main flexible circuit board 3 and the backlight flexible circuit board 4 are shown in fig. 4.
The main pad 31 includes a positive electrode main pad 31 and a negative electrode main pad 31. The positive electrode main pad 31 and the negative electrode main pad 31 are the same in shape and size, and both are square. The positive electrode main land 31 and the negative electrode main land 31 are symmetrically distributed in the left-right direction at the near edge of the upper shoulder portion of the main flexible circuit board 3. In the preferred embodiment of the present invention, the four corners of the square positive main pad 31 and the square negative main pad 31 are rounded. Because the main bonding pad 31 adopts a square structure and has the same transverse and longitudinal stress tolerance directions, namely, the longitudinal stress tolerance is not far larger than the transverse stress tolerance, even if the bending line 6 of the main flexible circuit board 3 passes through the main bonding pad 31, the bending influence on the main bonding pad 31 is small, the deformation degree of the main bonding pad 31 is limited, thus the situation that the main bonding pad 31 is slightly broken or even broken can be avoided as much as possible, the situation that the main bonding pad 31 and the backlight bonding pad 41 are desoldered can be ensured, and the welding reliability of the main bonding pad 31 and the backlight bonding pad 41 is improved.
The backlight pad 41 includes a positive backlight pad 41 and a negative backlight pad 41. The positive backlight pad 41 and the negative backlight pad 41 have the same shape and size, and both have a semicircular shape. The positive backlight bonding pad 41 and the negative backlight bonding pad 41 are distributed at the lower edge of the backlight flexible circuit board 4 in a bilateral symmetry manner, and the openings of the positive backlight bonding pad 41 and the negative backlight bonding pad 41 are both positioned at the lower edge of the backlight flexible circuit board 4. In the preferred embodiment of the present invention, the radians of the semicircular positive electrode backlight bonding pad 41 and the semicircular negative electrode backlight bonding pad 41 are between 250 ° and 280 °. Because the backlight pad 41 is in a semicircular structure, when the backlight pad 41 is welded to the main pad 31 by using soldering tin, redundant soldering tin overflows from the middle part of the semicircular structure, so that the soldering tin can be attached between the backlight pad 41 and the main pad 31 and can be attached to the surface of the backlight pad 41, the welding strength can be effectively improved, the condition that the main pad 31 and the backlight pad 41 are detached is further avoided, and the welding reliability of the main pad 31 and the backlight pad 41 is further improved.
The positive main pad 31 of the main flexible circuit board 3 is opposite to the positive backlight pad 41 of the backlight flexible circuit board 4 in position, and the negative main pad 31 of the main flexible circuit board 3 is opposite to the negative backlight pad 41 of the backlight flexible circuit board 4 in position. In the preferred embodiment of the present invention, the side length of the square positive electrode main pad 31 is greater than the diameter of the semi-circular positive electrode backlight pad 41, and the side length of the square negative electrode main pad 31 is greater than the diameter of the semi-circular negative electrode backlight pad 41. The main pad 31 of square structure and the annular pad 41 that is shaded of semicircle use of mutually supporting, can be under the prerequisite of guaranteeing joint strength, reduce the area of pad by a wide margin for the anti bending performance of pad is better, thereby makes whole liquid crystal display module's connection reliability higher, and the performance is more stable. Meanwhile, the main bonding pad 31 and the backlight bonding pad 41 can be hidden in the element groove 5 on the premise of not increasing the size of the element groove 5 at the rear of the backlight assembly, as shown in fig. 5, so that the whole thickness of the whole liquid crystal display module is effectively reduced.
It should be noted that, although the above-mentioned embodiments of the present invention are illustrative, the present invention is not limited thereto, and therefore, the present invention is not limited to the above-mentioned embodiments. Other embodiments, which can be made by those skilled in the art in light of the teachings of the present invention, are considered to be within the scope of the present invention without departing from the principles thereof.
Claims (4)
1. The liquid crystal display module of the improved FPC pad, by LCD (1), the fittings in a poor light (2), main flexible circuit board (3) and the flexible circuit board (4) in a poor light make up; the upper shoulder of the main flexible circuit board (3) is provided with a main bonding pad (31), the lower edge of the backlight flexible circuit board (4) is provided with a backlight bonding pad (41), and the main flexible circuit board (3) is connected with the backlight flexible circuit board (4) through the main bonding pad (31) and the backlight bonding pad (41); it is characterized in that the utility model is characterized in that,
the main pad (31) comprises a positive electrode main pad (31) and a negative electrode main pad (31); the positive electrode main bonding pad (31) and the negative electrode main bonding pad (31) are the same in shape and size and are square; the positive electrode main bonding pad (31) and the negative electrode main bonding pad (31) are distributed in bilateral symmetry at the edge near the upper shoulder of the main flexible circuit board (3);
the backlight pad (41) comprises a positive backlight pad (41) and a negative backlight pad (41); the shape and the size of the positive backlight bonding pad (41) and the negative backlight bonding pad (41) are the same, and both are semicircular; the positive backlight bonding pad (41) and the negative backlight bonding pad (41) are distributed at the lower edge of the backlight flexible circuit board (4) in a bilateral symmetry mode, and openings of the positive backlight bonding pad (41) and the negative backlight bonding pad (41) are located at the lower edge of the backlight flexible circuit board (4);
the positive electrode main bonding pad (31) of the main flexible circuit board (3) is opposite to the positive electrode backlight bonding pad (41) of the backlight flexible circuit board (4) in the positive direction; the negative electrode main pad (31) of the main flexible circuit board (3) is opposite to the negative electrode backlight pad (41) of the backlight flexible circuit board (4) in the positive direction.
2. The FPC pad modified LCD module as claimed in claim 1, wherein the four corners of the square positive main pad (31) and the square negative main pad (31) are rounded.
3. The liquid crystal display module with the improved FPC pad of claim 1, wherein the radian of the semicircular positive backlight pad (41) and the semicircular negative backlight pad (41) is between 250 and 280 degrees.
4. The FPC pad improved liquid crystal display module as recited in claim 1, wherein the side length of the square positive electrode main pad (31) is larger than the diameter of the semicircular positive electrode backlight pad (41); the side length of the square negative electrode main bonding pad (31) is larger than the diameter of the semicircular negative electrode backlight bonding pad (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021783174.7U CN212846288U (en) | 2020-08-24 | 2020-08-24 | Liquid crystal display module with improved FPC bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021783174.7U CN212846288U (en) | 2020-08-24 | 2020-08-24 | Liquid crystal display module with improved FPC bonding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212846288U true CN212846288U (en) | 2021-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021783174.7U Active CN212846288U (en) | 2020-08-24 | 2020-08-24 | Liquid crystal display module with improved FPC bonding pad |
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| Country | Link |
|---|---|
| CN (1) | CN212846288U (en) |
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2020
- 2020-08-24 CN CN202021783174.7U patent/CN212846288U/en active Active
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