CN212844122U - Differential pressure sensor - Google Patents
Differential pressure sensor Download PDFInfo
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- CN212844122U CN212844122U CN202022131677.2U CN202022131677U CN212844122U CN 212844122 U CN212844122 U CN 212844122U CN 202022131677 U CN202022131677 U CN 202022131677U CN 212844122 U CN212844122 U CN 212844122U
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- 230000003750 conditioning effect Effects 0.000 claims description 13
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- 239000003292 glue Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
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- 230000009972 noncorrosive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
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Abstract
The present disclosure provides a differential pressure sensor comprising: the pressure regulating device comprises a shell, a pressure regulating device and a pressure regulating device, wherein the shell is provided with an accommodating cavity, and a first pressure inlet hole and a second pressure inlet hole which are communicated with the accommodating cavity; the pressure sensitive chip is positioned in the accommodating cavity and is provided with a high-pressure cavity, a low-pressure cavity and a pressure sensing layer, and the pressure sensing layer is positioned between the high-pressure cavity and the low-pressure cavity; and the high-pressure cavity is communicated with the first pressure inlet hole, and the low-pressure cavity is communicated with the second pressure inlet hole. The differential pressure sensor can utilize the first pressure inlet hole and the second pressure inlet hole to respectively introduce pressure to be measured into the high-pressure cavity and the low-pressure cavity, and a differential pressure signal is obtained through measurement of the pressure sensing layer, so that measurement of a pressure difference value is realized. The pressure difference value can be measured by using one pressure sensitive chip, the structure is simple, and the measurement precision is higher.
Description
Technical Field
The utility model belongs to the technical field of the sensor, concretely relates to differential pressure sensor.
Background
The differential pressure sensor is a sensor for measuring the difference between two pressures, and is widely applied to the fields of industrial process control, flow measurement, medical instruments and equipment, heating and ventilation, air conditioning, hydraulic and pneumatic equipment and the like.
The prior art realizes the mode of differential pressure sensor: (1) two pressure sensors are adopted, and the pressure difference between the two sensors is measured; (2) a diaphragm structure is adopted, a strain resistor is designed on the diaphragm, and differential pressure measurement is realized through diaphragm deformation.
However, not only is the production cost high for the first method, but also the accuracy of the measurement depends on two pressure sensors; for the second approach, although higher accuracy can be achieved, the design is complex and the process requirements are high.
SUMMERY OF THE UTILITY MODEL
The present disclosure is directed to solving at least one of the problems of the prior art and to providing a differential pressure sensor.
In one aspect of the present disclosure, there is provided a differential pressure sensor including:
the pressure regulating device comprises a shell, a pressure regulating device and a pressure regulating device, wherein the shell is provided with an accommodating cavity, and a first pressure inlet hole and a second pressure inlet hole which are communicated with the accommodating cavity;
the pressure sensitive chip is positioned in the accommodating cavity and is provided with a high-pressure cavity, a low-pressure cavity and a pressure sensing layer, and the pressure sensing layer is positioned between the high-pressure cavity and the low-pressure cavity; and the number of the first and second groups,
the high-pressure cavity is communicated with the first pressure inlet hole, and the low-pressure cavity is communicated with the second pressure inlet hole.
In some optional embodiments, the pressure sensitive chip corresponds to the first pressure inlet hole.
In some optional embodiments, the high pressure chamber is directly communicated with the first pressure inlet hole, and the low pressure chamber is communicated with the second pressure inlet hole through the accommodating chamber.
In some optional embodiments, the pressure sensitive chip is adhesively fixed in the accommodating cavity, so that the high-pressure cavity is in sealed communication with the first pressure inlet hole.
In some optional embodiments, the pressure-measuring device further comprises a first pressure-measuring pipe and a second pressure-measuring pipe, wherein the first pressure-measuring pipe is communicated with the first pressure-feeding hole, and the second pressure-measuring pipe is communicated with the second pressure-feeding hole.
In some optional embodiments, the pressure sensitive chip is a piezoresistive pressure sensitive chip; or the like, or, alternatively,
the pressure sensitive chip adopts an MEMS resistance pressure sensor.
In some optional embodiments, the pressure-sensitive layer further comprises a waterproof breathable film covering a surface of the pressure-sensitive layer.
In some optional embodiments, the pressure-sensitive sensor further comprises a signal conditioning chip, wherein the signal conditioning chip is arranged in the accommodating cavity and is electrically connected with the pressure-sensitive chip.
In some optional embodiments, the signal conditioning chip further comprises a waterproof and moisture-proof glue, and the waterproof and moisture-proof glue is coated on the surface of the signal conditioning chip.
In some optional embodiments, further comprising a sealing cover, the sealing cover being sealingly connected to the housing.
The differential pressure sensor comprises a shell and a pressure sensitive chip, wherein the shell is provided with an accommodating cavity, a first pressure inlet hole and a second pressure inlet hole, and the first pressure inlet hole and the second pressure inlet hole are communicated with the accommodating cavity. The pressure sensitive chip is positioned in the accommodating cavity and is provided with a high-pressure cavity, a low-pressure cavity and a pressure sensing layer, and the pressure sensing layer is positioned between the high-pressure cavity and the low-pressure cavity; the high-pressure cavity is communicated with the first pressure inlet hole, and the low-pressure cavity is communicated with the second pressure inlet hole and is arranged in a passing mode. So, can utilize first pressure inlet and second pressure inlet to introduce the pressure that awaits measuring respectively to high-pressure chamber and low pressure intracavity to obtain differential pressure signal via the measurement of pressure-sensitive layer, thereby realize the measurement of pressure differential value. The differential pressure sensor of the embodiment can realize the measurement of the pressure difference value by utilizing one pressure sensitive chip, has simple structure and has higher measurement precision.
Drawings
Fig. 1 is a schematic structural diagram of a differential pressure sensor according to an embodiment of the present disclosure.
Detailed Description
For a better understanding of the technical aspects of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
As shown in fig. 1, the present disclosure is directed to a differential pressure sensor 100, the differential pressure sensor 100 including a housing 110 and a pressure sensitive die 120. The housing 110 is provided with a receiving chamber 111, and a first pressure inlet hole 112 and a second pressure inlet hole 113 communicating with the receiving chamber 111. The pressure sensitive chip 120 is located in the accommodating cavity 111, and the pressure sensitive chip 120 has a high pressure cavity 121, a low pressure cavity 122, and a pressure sensing layer (not shown) located between the high pressure cavity 121 and the low pressure cavity 122. The high pressure chamber 121 communicates with the first pressure inlet 112, and the low pressure chamber 122 communicates with the second pressure inlet 113.
Specifically, as shown in fig. 1, when the differential pressure sensor 100 of the present embodiment is used to measure a pressure difference, a first medium to be measured (non-corrosive gas medium, etc.) may be introduced into the first pressure inlet 112, the first medium to be measured enters the high pressure chamber 121 through the first pressure inlet 112, and at the same time, a second medium to be measured (non-corrosive gas medium, etc.) may be introduced into the second pressure inlet 113, the second medium to be measured enters the low pressure chamber 122 through the second pressure inlet 113, and the pressure sensing layer generates a pressure difference signal according to medium pressures in the high pressure chamber 121 and the low pressure chamber 122, so as to measure the pressure difference.
The differential pressure sensor comprises a shell and a pressure sensitive chip, wherein the shell is provided with an accommodating cavity, and a first pressure inlet hole and a second pressure inlet hole which are communicated with the accommodating cavity. The pressure sensitive chip is positioned in the accommodating cavity and is provided with a high-pressure cavity, a low-pressure cavity and a pressure sensing layer, and the pressure sensing layer is positioned between the high-pressure cavity and the low-pressure cavity; the high-pressure cavity is communicated with the first pressure inlet hole, and the low-pressure cavity is communicated with the second pressure inlet hole and is arranged in a passing mode. So, can utilize first pressure inlet and second pressure inlet to introduce the pressure that awaits measuring respectively to high-pressure chamber and low pressure intracavity to obtain differential pressure signal via the measurement of pressure-sensitive layer, thereby realize the measurement of pressure differential value. The differential pressure sensor of the embodiment can realize the measurement of the pressure difference value by utilizing one pressure sensitive chip, has simple structure and has higher measurement precision.
Illustratively, as shown in fig. 1, the pressure sensitive chip 120 corresponds to the first pressure inlet 112, that is, as shown in fig. 1, the pressure sensitive chip 120 is disposed close to the first pressure inlet 112, that is, as shown in fig. 1, the pressure sensitive chip 120 is disposed above the first pressure inlet 112. Of course, besides, those skilled in the art may design other positions of the pressure sensitive chip 120 according to actual needs, for example, the pressure sensitive chip 120 is disposed near the second pressure inlet 113, and the like, which is not limited in this embodiment.
For example, as shown in fig. 1, in order to further improve the differential pressure measurement accuracy, the high pressure chamber 121 is directly communicated with the first pressure inlet hole 112, that is, the high pressure chamber 121 may be attached to the first pressure inlet hole 112. The low pressure chamber 122 is communicated with the second pressure inlet hole 113 through the accommodating chamber 111.
Illustratively, as shown in fig. 1, the pressure sensitive chip 120 is adhesively fixed in the accommodating cavity 111, so that the high pressure cavity 121 is in sealed communication with the first pressure inlet hole 112.
Illustratively, as shown in fig. 1, the differential pressure sensor 100 further includes a first pressure-introducing pipe 114 and a second pressure-introducing pipe 115, the first pressure-introducing pipe 114 is communicated with the first pressure-inlet hole 112, and the second pressure-introducing pipe 115 is communicated with the second pressure-inlet hole 113.
The differential pressure sensor of this embodiment through the first pressure pipe and the second pressure pipe that set up, can be convenient for advance pressure hole and second and advance pressure hole and external intercommunication, the medium that awaits measuring of being convenient for introduces.
For example, the pressure sensitive chip 120 may be a piezoresistive pressure sensitive chip, for example, a MEMS resistance pressure sensor, etc., and besides, a person skilled in the art may select other pressure sensitive chips according to actual needs, which is not limited in this embodiment.
For example, in order to make the pressure sensitive chip waterproof, a waterproof breathable film or other waterproof measures can be covered on the surface of the pressure sensing layer. The specific type of the waterproof breathable film is not limited, and can be selected by the person skilled in the art according to the actual needs.
Illustratively, as shown in fig. 1, in order to condition a differential pressure signal measured by the pressure sensitive chip 120, the differential pressure sensor 100 further includes a signal conditioning chip 130, and the signal conditioning chip 130 is disposed in the accommodating cavity 111 and electrically connected to the pressure sensitive chip 120. The signal conditioning chip 130 may include, for example, an amplifying circuit, a filtering circuit, an analog-to-digital conversion circuit, and the like.
For example, in order to make the signal conditioning chip waterproof, a waterproof and moisture-proof glue or the like may be coated on the surface of the signal conditioning chip.
Illustratively, as shown in fig. 1, to effectively seal the entire differential pressure sensor 100, the differential pressure sensor 100 further includes a sealing cover 140, and the sealing cover 140 is sealingly connected to the housing 110.
Illustratively, as shown in fig. 1, the accommodating chamber 111 includes a first bottom wall 111a, and a first side wall 111b and a second side wall 111c extending from both ends of the first bottom wall 111a in a direction away from the first pressure guiding pipe 114. Wherein the second sidewall 111c is disposed opposite to the first sidewall 111 b. The structural arrangement of the accommodating cavity 111 can ensure the accuracy of pressure transmission and is convenient to install. As shown in fig. 1, the pressure sensitive chip 120 is closely attached to the first bottom wall 111a, and a gap exists between the pressure sensitive chip 120 and the first side wall 111 b.
The differential pressure sensor can accurately measure the pressure difference value at the same time, has simple structure, convenient installation and lower production cost, and is suitable for various fields of industrial process control, flow measurement, medical instrument and equipment and the like.
Before use, the differential pressure sensor 100 is mounted as follows: as shown in fig. 1, the pressure sensitive chip 120 is first installed in the accommodating cavity 111, then the signal conditioning chip 130 is installed, then the electrical signal connection is performed, then the surface of the pressure sensitive chip 120 is covered with a waterproof and breathable film (not shown), the surface of the signal conditioning chip 130 is covered with a waterproof and moisture-proof adhesive (not shown), and finally the sealing cover 114 is installed.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present disclosure, and that the present disclosure is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.
Claims (10)
1. A differential pressure sensor, comprising:
the pressure regulating device comprises a shell, a pressure regulating device and a pressure regulating device, wherein the shell is provided with an accommodating cavity, and a first pressure inlet hole and a second pressure inlet hole which are communicated with the accommodating cavity;
the pressure sensitive chip is positioned in the accommodating cavity and is provided with a high-pressure cavity, a low-pressure cavity and a pressure sensing layer, and the pressure sensing layer is positioned between the high-pressure cavity and the low-pressure cavity; and the number of the first and second groups,
the high-pressure cavity is communicated with the first pressure inlet hole, and the low-pressure cavity is communicated with the second pressure inlet hole.
2. The differential pressure sensor of claim 1, wherein the pressure sensitive chip corresponds to the first pressure inlet port.
3. The differential pressure sensor of claim 2, wherein the high pressure chamber is in direct communication with the first pressure inlet port and the low pressure chamber is in communication with the second pressure inlet port through the receiving chamber.
4. The differential pressure sensor of claim 3, wherein the pressure sensitive die is adhesively secured within the receiving chamber such that the high pressure chamber is in sealed communication with the first pressure inlet bore.
5. The differential pressure sensor according to any one of claims 1 to 4, further comprising a first pressure-introducing pipe communicating with the first pressure-feeding hole and a second pressure-introducing pipe communicating with the second pressure-feeding hole.
6. The differential pressure sensor according to any of claims 1 to 4, wherein the pressure sensitive chip is a piezoresistive pressure sensitive chip; or the like, or, alternatively,
the pressure sensitive chip adopts an MEMS resistance pressure sensor.
7. The differential pressure sensor according to any one of claims 1 to 4, further comprising a waterproof gas permeable membrane covering a surface of the pressure sensing layer.
8. The differential pressure sensor of any of claims 1 to 4, further comprising a signal conditioning chip disposed within the receiving cavity and electrically connected to the pressure sensitive chip.
9. The differential pressure sensor of claim 8, further comprising a moisture and water resistant glue coated on a surface of the signal conditioning chip.
10. The differential pressure sensor according to any one of claims 1 to 4, further comprising a sealing cover sealingly connected with the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022131677.2U CN212844122U (en) | 2020-09-24 | 2020-09-24 | Differential pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022131677.2U CN212844122U (en) | 2020-09-24 | 2020-09-24 | Differential pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212844122U true CN212844122U (en) | 2021-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022131677.2U Active CN212844122U (en) | 2020-09-24 | 2020-09-24 | Differential pressure sensor |
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| Country | Link |
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| CN (1) | CN212844122U (en) |
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2020
- 2020-09-24 CN CN202022131677.2U patent/CN212844122U/en active Active
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Address after: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214072 Patentee after: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. Address before: 214000 north side of 3 / F podium, building A10, No. 777, Jianshe West Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. |