CN212834077U - Full-automatic nickel brushing operation platform for semiconductor etching reaction chamber - Google Patents
Full-automatic nickel brushing operation platform for semiconductor etching reaction chamber Download PDFInfo
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- CN212834077U CN212834077U CN202021667378.4U CN202021667378U CN212834077U CN 212834077 U CN212834077 U CN 212834077U CN 202021667378 U CN202021667378 U CN 202021667378U CN 212834077 U CN212834077 U CN 212834077U
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Abstract
The utility model discloses an operation platform that is used for full-automatic brush nickel plating of semiconductor etching reaction cavity, including frame, fixer, liquid recovery box and numerical control device, the frame be the cuboid structure, the centre of frame is provided with the work piece groove, the fixer install in the both sides of frame, the fixer comprises curb plate and two dead levers, two dead levers are located same horizontal plane and are parallel to each other, the one end of dead lever is passed frame and curb plate fixed connection, the dead lever is sliding connection with the frame. The utility model has the advantages that the numerical control device receives the input information and outputs corresponding instruction pulses to the moving mechanism and the electroplating brush, thereby controlling the equipment to carry out full-automatic brush nickel plating treatment; the pressure sensor is used for detecting the pressure on the plated workpiece, and the motion state of the moving mechanism is adjusted by detecting different pressure values on the plated workpiece, so that full-automatic numerical control brush plating on irregular workpieces is realized.
Description
Technical Field
The utility model relates to a brush nickel plating technical field especially relates to an operation platform that is used for full-automatic brush nickel plating of semiconductor etching reaction chamber.
Background
The semiconductor etching is also called as semiconductor photochemical etching, the protective film of the etching area is removed through exposure platemaking, and the area where the protective film is removed is dissolved and corroded during etching, so that the effects of concave-convex and hollow forming are formed; with the increase of chip integration and the reduction of size, a highly precise plasma etching process is more and more important, wherein an etching reaction chamber in a semiconductor etching device is an indispensable component, and since the surface of the etching reaction chamber is also damaged by plasma during the etching process of the plasma, especially near a gas inlet, the damage is the most serious here because of the point discharge effect of the plasma, thus causing two problems to the etching reaction chamber, firstly, as the wall of the reaction chamber is damaged, the generated fine particles easily affect the etched substance in the reaction chamber to form defects thereon, thereby negatively affecting the subsequent process and yield; on the other hand, the reaction chamber needs to be replaced according to the damage degree after being used to a certain degree so as to ensure the normal use of the equipment.
In order to protect etching equipment, the surface of an etching reaction cavity is usually subjected to brush plating, which is also called coating plating or slotless plating, and belongs to the field of electroplating technology in electrochemical machining.
The current brush nickel plating device relies on one to provide the electrolyte that electroplates the needs with the electroplating pen of positive pole contact, the electroplating pen moves on the negative pole of being plated during electroplating, the electroplating pen uses customized electroplating solution and dedicated DC power supply, the during operation is plated the negative pole of work piece connection power, the positive pole of pen connection power is plated, the electroplating pen of connection positive pole is surrounding the cladding plating solution, the electroplating pen is cleaned on the work piece surface, metal ion in the electroplating solution takes place the crystallization of discharging on the each point that the work piece surface and positive pole contacted, thereby the cladding layer thickens gradually and covers the surface at the work piece of being plated along with the time growth. However, the current brush nickel plating device can not meet the surface treatment requirement of a semiconductor etching reaction chamber, and in the electroplating process by using the current brush nickel plating device, a plated workpiece and a plating pen have the phenomenon of uneven relative movement speed, the uneven movement speed can cause the generation of particles on the surface of a plating layer in the process of intermittent crystallization, and the poor binding force between the plating layer and the plating layer can cause the problems of foaming and falling of the plating layer.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an operation platform that is used for full-automatic brush nickel plating of semiconductor etching reaction chamber, operation platform are provided with pressure sensor and are used for detecting the pressure that is plated the work piece and receives, when carrying out the brush plating to irregular work piece, adjust moving mechanism's motion state through the different pressure values that detect that the work piece of being plated received to the realization carries out full-automatic numerical control brush plating to irregular work piece.
An operation platform for full-automatic nickel brushing and plating of a semiconductor etching reaction chamber comprises a frame, a fixer, a liquid recovery box and a numerical control device, the frame is of a cuboid structure, the middle of the frame is provided with a workpiece groove, the fixer is arranged at two sides of the frame and consists of a side plate and two fixing rods, the two fixing rods are positioned on the same horizontal plane and are parallel to each other, one end of each fixing rod penetrates through the frame to be fixedly connected with the side plate, the fixing rods are in sliding connection with the frame, the liquid recovery box is of a hollow cuboid structure, is positioned in the middle of the frame, is fixedly connected with the frame, is provided with a flow guide port, the numerical control device comprises a display screen and an operation table, the operation table is located on the side edge of the display screen, the numerical control device is located below the liquid recovery box, and the numerical control device is fixedly connected with the rack.
Further, the liquid recovery box is the cuboid structure, and the upper surface of liquid recovery box comprises first steel sheet and second steel sheet, one side and the frame fixed connection of steel sheet, the opposite side of steel sheet is unsettled and is provided with the inclined plane, and two steel sheets are fixed in the both sides of frame, form the guiding gutter between two steel sheets.
Furthermore, the numerical control device comprises an operation panel, a display screen, a controller and an arithmetic unit, wherein the controller and the arithmetic unit are integrated in the numerical control device, and the operation panel and the display screen are fixed on the surface of the numerical control device.
The numerical control device receives the input information, identifies, stores and operates the information, outputs corresponding instruction pulses to the moving mechanism and the electroplating brush, and then controls equipment to carry out full-automatic brush nickel plating operation.
Further, pressure sensor is installed to the liquid recovery box, and the steel sheet surface mounting of liquid recovery box has insulating pad, and pressure sensor contains first pressure sensor and second pressure sensor, and first pressure sensor installs on first steel sheet, and second pressure sensor installs on the second steel sheet, and the steel sheet receives pressure can take place bending deformation.
The pressure sensor is used for detecting the pressure of the plated workpiece, when the irregular workpiece is subjected to brush plating, the motion state of the moving mechanism is adjusted by detecting different pressure values of the plated workpiece, and when the detected pressure value is too large, the moving mechanism moves upwards to reduce the pressure of the electroplating brush on the plated workpiece, so that the full-automatic numerical control brush plating on the irregular workpiece is realized.
Furthermore, the side of the operation platform is provided with a connecting hole, and a fixer is installed in the connecting hole.
Further, the fixer comprises curb plate and two dead levers, and the curb plate is the rectangle plank, is provided with the buckle on the dead lever, and the dead lever passes through the super glue with the curb plate to be connected.
Further, the liquid recovery box is provided with inclined plane open-ended cavity recess, and the opening is the funnel structure, and the box upper surface is retrieved to the liquid is placed and is plated the work piece, and the box upper surface is retrieved for having elastic steel sheet, and the steel sheet surface is provided with insulating pad.
Equipment for brushing nickel plating
A full-automatic brush nickel plating device comprises an operation platform, a moving mechanism and an electroplating brush, wherein the moving mechanism is fixedly arranged on the operation platform, and the electroplating brush is detachably connected with the moving mechanism; the operation platform comprises a rack, a fixer, a liquid recovery box and a numerical control device, wherein the fixer is arranged at two ends of the rack, the liquid recovery box is positioned in the middle of the rack and fixedly connected with the rack, the numerical control device is positioned below the liquid recovery box and fixedly connected with the rack; the moving mechanism comprises a vertical moving support, a horizontal transverse moving support and a horizontal longitudinal moving support, the vertical moving support is fixedly installed on the frame of the operating platform, the horizontal transverse moving support is installed on the vertical moving support, the horizontal longitudinal moving support is installed on the horizontal transverse moving support, the electroplating brush comprises a dovetail connecting piece, a liquid storage box, a metal fixing plate and a metal wire, the dovetail connecting piece of the electroplating brush is connected with the horizontal longitudinal moving support in an installing mode, the liquid storage box is installed above the metal fixing plate, and the metal wire is installed below the metal fixing plate.
The brush nickel plating equipment comprises an operation platform, a moving mechanism and an electroplating brush, the brush nickel plating equipment is used for fully automatically operating the moving mechanism and the electroplating brush through the operation platform, the moving precision of the electroplating brush is guaranteed by the brush nickel plating equipment through controlling the speed and the distance of the moving mechanism for workpieces with uneven appearance, the plating thickness is guaranteed to be uniform by the brush nickel plating equipment through controlling the plating solution dosage of the electroplating brush, and the waste of plating solution is avoided, so that the cost of electroplating the brush is reduced.
Furthermore, the moving mechanism is fixedly installed on the rack of the operating platform, the vertical moving support of the moving mechanism is perpendicular to the operating platform, and the vertical moving support is fixed at four corners of the operating platform through bolts.
Furthermore, the dovetail connecting piece of the electroplating brush is detachably connected with the horizontal longitudinal moving support, the dovetail connecting piece and the horizontal longitudinal moving support have a degree of freedom, and the dovetail connecting piece and the horizontal longitudinal moving support horizontally move through a dovetail groove guide rail.
Further, the moving mechanism drives the electroplating brush to move in the vertical direction through the horizontal transverse moving support, and the moving mechanism drives the electroplating brush to move transversely in the horizontal plane left and right through the horizontal longitudinal moving support.
The moving mechanism drives the electroplating brush to move automatically, so that the relative movement speed of the plated workpiece and the electroplating brush is uniform, and no wavy lines or particles are generated on the surface of the plating layer in the intermittent crystallization process.
Further, the liquid storage box of the electroplating brush is provided with a through hole, the metal fixing plate is provided with a through hole, and the liquid storage box is communicated with the metal fixing plate and the metal wire through the through hole.
The electroplating brush is internally provided with a liquid storage box, electroplating liquid in the liquid storage box is uniformly distributed on the metal wire through the through holes, the thickness of the plating layer is uniform in the electroplating process, and the bonding force between the plating layers firmly avoids the plating layer from bubbling and falling off.
Furthermore, a plurality of sealing rings are arranged at the through hole for connecting the liquid storage box and the metal fixing plate.
Moving mechanism
A moving mechanism of full-automatic brush nickel plating equipment comprises a vertical moving support, a horizontal transverse moving support and a horizontal longitudinal moving support; the vertical moving support consists of four cylindrical stand columns, the cylindrical stand columns are perpendicular to the horizontal plane and are parallel to each other, and the four cylindrical stand columns are respectively positioned at four corners of a rectangle; horizontal lateral shifting support constitute by two cuboid stands, the cuboid stand is installed on the cylinder stand of vertical shifting support, cuboid stand and cylinder stand mutually perpendicular, two cuboid stands are located same horizontal plane and are parallel to each other, horizontal longitudinal shifting support be the square stand, the square stand is installed on the cuboid stand of horizontal lateral shifting support, the cuboid stand is mutually perpendicular with the cuboid stand mutually of horizontal lateral shifting support, the cuboid stand is provided with the dovetail.
Furthermore, only one degree of freedom exists between the horizontal transverse moving support and the vertical moving support, the vertical moving support is perpendicular to the horizontal plane, the vertical moving support is fixedly connected with the horizontal plane, the horizontal transverse moving support is installed on the vertical moving support through a ring sleeve structure, and the horizontal transverse moving support moves in the vertical direction.
Furthermore, only one degree of freedom exists between the horizontal longitudinal moving support and the horizontal transverse moving support, the horizontal longitudinal moving support and the two horizontal transverse moving supports are perpendicular to each other, and the horizontal longitudinal moving support moves transversely and leftwards and rightwards on the horizontal plane.
The moving mechanism realizes the movement control of the electroplating brush in the vertical direction and the horizontal direction through the vertical moving support, the horizontal transverse moving support and the horizontal longitudinal moving support, when a plurality of plated workpieces are processed, the automatic control can reduce the labor intensity of operators, the working efficiency is improved, the plating quality is ensured, the operators are prevented from contacting plating solution closely for a long time, and the health and safety of the operators are protected.
Further, the horizontal transverse moving support and the horizontal longitudinal moving support are provided with motors, the motors are positioned at two ends of the horizontal transverse moving support and the horizontal longitudinal moving support, and the motors are fixedly connected with the horizontal transverse moving support and the horizontal longitudinal moving support.
Further, the horizontal transverse moving support and the vertical moving support are connected through a ring sleeve structure, the ring sleeve structure adopts a flange linear bearing, the horizontal longitudinal moving support and the horizontal transverse moving support are connected through a sliding rail structure, and the sliding rail structure adopts a linear sliding rail platform.
Further, the horizontal longitudinal movement support is a square upright post, the horizontal longitudinal movement support is provided with a guide rail, the guide rail is of a dovetail groove structure, and the dovetail groove is formed in the lower surface of the square upright post.
Electroplating brush
An electroplating brush of full-automatic brush nickel plating equipment comprises a dovetail connector, a liquid storage box, a metal fixing plate and a metal wire; dovetail joint spare comprises connecting portion and removal portion, and connecting portion are the forked tail boss, and removal portion is hollow cuboid structure, and removal portion embeds there is the stock solution box, removal portion and metal fixing plate fixed connection, and metal fixing plate is cuboid platelike structure, and metal fixing plate's lower surface is provided with the through-hole, speedtransmitter and infrared sensor, and the through-hole communicates with the stock solution box each other, and the wire is installed in metal fixing plate's through-hole department, and speedtransmitter installs in metal fixing plate's center, and infrared sensor installs in metal fixing plate's both ends.
The electroplating brush is provided with the wire, and the wire can evenly cover by the plating work piece, and the wire has better pliability can be crooked and warp, and the wire can laminate completely by the surface of plating the work piece when the brush plates the curved surface by the plating work piece, and cladding material is even when guaranteeing the brush plating.
Furthermore, the dovetail connecting piece is provided with the forked tail boss, and the forked tail boss can be with dovetail mutual accordant connection, and the forked tail boss is sliding type connection with the dovetail.
Further, metal fixing plate is provided with first infrared sensor and second infrared sensor, and first infrared sensor sets up in metal fixing plate's upper right corner position, and second infrared sensor sets up in metal fixing plate's lower left corner position.
Outer sensor is used for detection distance, and first infrared sensor and second infrared sensor are located the diagonal angle department of metal sheet, and when first infrared sensor and second infrared sensor detected the distance equal, the metal fixing plate is in the horizontality, when first infrared sensor and second infrared sensor detected the distance inequality, the metal fixing plate was in the tilt state to can detect the metal fixing plate distance and the angle state of being plated the piece, improve the electroplating accuracy of electroplating brush.
Furthermore, a plurality of through holes are uniformly distributed on the lower surface of the metal fixing plate, the through holes are of a circular structure, a plurality of metal wires are mounted on each through hole, and the metal wires and the through holes are fixedly connected.
Further, a liquid storage box is arranged in the dovetail connecting piece, a liquid supply device is arranged on the liquid storage box, and the liquid supply device conveys liquid to the metal wire through the through hole.
The utility model has the advantages that: the numerical control device receives the input information and outputs corresponding instruction pulses to the moving mechanism and the electroplating brush, so that the equipment is controlled to carry out full-automatic brush nickel plating treatment. The pressure sensor is used for detecting the pressure of the plated workpiece, when the irregular workpiece is subjected to brush plating, the motion state of the moving mechanism is adjusted by detecting different pressure values of the plated workpiece, and when the detected pressure value is too large, the moving mechanism moves upwards to reduce the pressure of the electroplating brush on the plated workpiece, so that the full-automatic numerical control brush plating on the irregular workpiece is realized.
Drawings
FIG. 1 is a schematic structural diagram of a full-automatic brush nickel plating device.
FIG. 2 is a schematic diagram of an electroplating brush structure of a nickel plating device.
FIG. 3 is a schematic view of a metal fixing plate of the electroplating brush.
FIG. 4 is a schematic structural diagram of a moving mechanism of a nickel brushing apparatus.
FIG. 5 is a schematic view of an operation platform structure of a nickel brushing equipment.
The labels in the figure are: the device comprises an operating platform 1, a moving mechanism 2, an electroplating brush 3, a rack 4, a fixer 5, a liquid recovery box 6, a numerical control device 7, a vertical moving support 8, a horizontal transverse moving support 9, a horizontal longitudinal moving support 10, a dovetail connector 11, a liquid storage box 12, a metal fixing plate 13, a through hole 14, a speed sensor 15, an infrared sensor 16, a metal wire 17 and a pressure sensor 18.
Detailed Description
The utility model provides an be used for full-automatic brush nickel plating's of semiconductor etching reaction chamber operation platform, operation platform are provided with pressure sensor and are used for detecting the pressure that is plated the work piece and receives, when carrying out the brush plating to irregular work piece, adjust moving mechanism's motion state through the different pressure values that detect that are plated the work piece and receive to the realization carries out full-automatic numerical control brush plating to irregular work piece.
In order to solve the technical problem, the utility model adopts the following technical scheme:
as an embodiment, as shown in fig. 1, a full-automatic brush nickel plating apparatus includes an operation platform 1, a moving mechanism 2 and an electroplating brush 3, wherein the moving mechanism 2 is fixedly mounted on the operation platform 1, and the electroplating brush 3 is detachably connected with the moving mechanism 2; the operation platform 1 comprises a rack 4, a fixer 5, a liquid recovery box 6 and a numerical control device 7, wherein the fixer 5 is arranged at two ends of the rack 4, the liquid recovery box 6 is positioned in the middle of the rack 4, the liquid recovery box 6 is fixedly connected with the rack 4, the numerical control device 7 is positioned below the liquid recovery box 6, and the numerical control device 7 is fixedly connected with the rack 4; the moving mechanism 2 comprises a vertical moving support 8, a horizontal transverse moving support 9 and a horizontal longitudinal moving support 10, the vertical moving support 8 is fixedly installed on the frame 4 of the operating platform 1, the horizontal transverse moving support 9 is installed on the vertical moving support 8, the horizontal longitudinal moving support 10 is installed on the horizontal transverse moving support 9, the electroplating brush 3 comprises a dovetail connector 11, a liquid storage box 12, a metal fixing plate 13 and a metal wire 17, the dovetail connector 11 of the electroplating brush 3 is connected with the horizontal longitudinal moving support 10 in an installing mode, the liquid storage box 12 is installed above the metal fixing plate 13, and the metal wire 17 is installed below the metal fixing plate 13.
Preferably, the brush nickel plating equipment includes operation platform 1, moving mechanism 2 and electroplating brush 3, and the brush nickel plating equipment passes through operation platform 1 to moving mechanism 2 and the full automatic operation of electroplating brush 3, and to the work piece of appearance unevenness, the speed and the distance that the brush nickel plating equipment passes through control moving mechanism 2 guarantee the removal precision of electroplating brush 3, and the plating bath dosage of brush nickel plating equipment through control electroplating brush 3 guarantees that cladding material thickness is even simultaneously, avoids the extravagant cost that reduces the electric brush plating of plating bath.
Preferably, the moving mechanism 2 is fixedly installed on the frame 4 of the operation platform 1, the vertical moving bracket 8 of the moving mechanism 2 is perpendicular to the operation platform 1, and the vertical moving bracket 8 is fixed at four corners of the operation platform 1 by bolts.
In one embodiment, the dovetail joint 11 of the electroplating brush 3 is detachably connected with the horizontal longitudinal moving bracket 10, the dovetail joint 11 has a degree of freedom with the horizontal longitudinal moving bracket 10, and the dovetail joint 11 and the horizontal longitudinal moving bracket 10 move horizontally through a dovetail groove guide rail.
Preferably, the moving mechanism 2 drives the electroplating brush 3 to move in the vertical direction through the horizontal transverse moving bracket 9, and the moving mechanism 2 drives the electroplating brush 3 to move transversely in the horizontal plane through the horizontal longitudinal moving bracket 10.
Preferably, the moving mechanism 2 drives the electroplating brush 3 to move automatically, so that the plated workpiece and the electroplating brush 3 are ensured to move uniformly at a relative speed, and the surface of the plating layer can not generate raised grains and particles in the intermittent crystallization process.
Preferably, the side of the operation platform 1 is provided with a connecting hole, and the fixer 5 is installed in the connecting hole.
In one embodiment, the liquid storage box 12 of the electroplating brush 3 is provided with a through hole 14, the metal fixing plate 13 is provided with a through hole 14, and the liquid storage box 12 is communicated with the metal fixing plate 13 and the metal wire 17 through the through hole 14.
Preferably, the built-in stock solution box 12 that has of electroplate brush 3, the plating solution in the stock solution box 12 passes through 14 evenly distributed on wire 17 of through-hole, and cladding material thickness is even in electroplating process, and the cohesion between the cladding material firmly avoids the cladding material to blister and drop.
Preferably, a plurality of sealing rings are arranged at the through hole 14 connecting the liquid storage box 12 and the metal fixing plate 13.
Implementation scheme of moving mechanism
As an embodiment, as shown in fig. 4, a moving mechanism of a full-automatic brush nickel plating device comprises a vertical moving bracket 8, a horizontal transverse moving bracket 9 and a horizontal longitudinal moving bracket 10; the vertical moving support 8 consists of four cylindrical columns which are vertical to the horizontal plane and parallel to each other, and the four cylindrical columns are respectively positioned at four corners of a rectangle; horizontal lateral shifting support 9 constitute by two cuboid stands, the cuboid stand mounting is on the cylinder stand of vertical shifting support 8, cuboid stand and cylinder stand mutually perpendicular, two cuboid stands are located same horizontal plane and are parallel to each other, horizontal longitudinal shifting support 10 be the square stand, the square stand mounting is on the cuboid stand of horizontal lateral shifting support 9, the cuboid stand is mutually perpendicular with the cuboid stand of horizontal lateral shifting support 9, the cuboid stand is provided with the dovetail.
Preferably, there is only one degree of freedom between the horizontal moving support 9 and the vertical moving support 8, the vertical moving support 8 is perpendicular to the horizontal plane, the vertical moving support 8 is fixedly connected with the horizontal plane, the horizontal moving support 9 is mounted on the vertical moving support 8 through a ring sleeve structure, and the horizontal moving support 9 moves in the vertical direction.
Preferably, there is only one degree of freedom between the horizontal longitudinal moving support 10 and the horizontal transverse moving support 9, the horizontal longitudinal moving support 10 is perpendicular to the two horizontal transverse moving supports 9, and the horizontal longitudinal moving support 10 moves left and right in the horizontal plane.
Preferably, the moving mechanism 2 realizes the movement control of the electroplating brush 3 in the vertical direction and the horizontal direction through the vertical moving support 8, the horizontal transverse moving support 9 and the horizontal longitudinal moving support 10, when a plurality of plated workpieces are processed, the automatic control can reduce the labor intensity of operators, the coating quality is ensured while the working efficiency is improved, the operators are prevented from contacting the plating solution closely for a long time, and the health and safety of the operators are protected.
As an embodiment, the horizontal transverse moving bracket 9 and the horizontal longitudinal moving bracket 10 are provided with motors, the motors are arranged at two ends of the horizontal transverse moving bracket 9 and the horizontal longitudinal moving bracket 10, and the motors are fixedly connected with the horizontal transverse moving bracket 9 and the horizontal longitudinal moving bracket 10.
Preferably, the horizontal and horizontal moving support 9 and the vertical moving support 8 are connected through a ring sleeve structure, the ring sleeve structure adopts a flange linear bearing, the horizontal and vertical moving support 10 and the horizontal and horizontal moving support 9 are connected through a slide rail structure, and the slide rail structure adopts a linear slide rail platform.
Preferably, the horizontal longitudinal moving support 10 is a square column, the horizontal longitudinal moving support 10 is provided with a guide rail, the guide rail adopts a dovetail groove structure, and the dovetail groove is formed in the lower surface of the square column.
Embodiment of electroplating brush
As an embodiment, as shown in fig. 2, an electroplating brush of a full-automatic brush nickel plating device comprises a dovetail connector 11, a liquid storage box 12, a metal fixing plate 13 and a metal wire 17; dovetail joint 11 comprises connecting portion and removal portion, the connecting portion is the forked tail boss, the removal portion is hollow cuboid structure, the removal portion embeds there is liquid storage box 12, removal portion and metal fixing plate 13 fixed connection, metal fixing plate 13 is cuboid platelike structure, the lower surface of metal fixing plate 13 is provided with through-hole 14, velocity sensor 15 and infrared sensor 16, through-hole 14 and liquid storage box 12 communicate each other, wire 17 installs in the through-hole 14 department of metal fixing plate 13, velocity sensor 15 installs in the center of metal fixing plate 13, infrared sensor 16 installs in the both ends of metal fixing plate 13.
Preferably, the electroplating brush 3 is provided with the metal wire 17, and the metal wire 17 can evenly cover the work piece of being plated, and the metal wire 17 has better pliability can be crooked and warp, and the metal wire 17 can laminate completely when the brush plating curved surface is plated the work piece and is plated the surface of work piece, and the cladding material is even when guaranteeing the brush plating.
Preferably, the dovetail connector 11 is provided with a dovetail boss, the dovetail boss can be connected with the dovetail groove in a matching manner, and the dovetail boss is connected with the dovetail groove in a sliding manner.
As an embodiment, as shown in fig. 3, the metal fixing plate 13 is provided with a first infrared sensor 16 and a second infrared sensor 16, the first infrared sensor 16 is disposed at an upper right corner of the metal fixing plate 13, and the second infrared sensor 16 is disposed at a lower left corner of the metal fixing plate 13.
Preferably, the outer sensor is used for detecting the distance, the first infrared sensor 16 and the second infrared sensor 16 are located at the diagonal corners of the metal plate, when the distances detected by the first infrared sensor 16 and the second infrared sensor 16 are equal, the metal fixing plate 13 is in a horizontal state, and when the distances detected by the first infrared sensor 16 and the second infrared sensor 16 are unequal, the metal fixing plate 13 is in an inclined state, so that the distance and the angle state of the metal fixing plate 13 from the plated part can be detected, and the plating accuracy of the plating brush 3 is improved.
Preferably, a plurality of through holes 14 are uniformly distributed on the lower surface of the metal fixing plate 13, the through holes 14 are of a circular structure, a plurality of metal wires 17 are installed on each through hole 14, and the metal wires 17 are fixedly connected with the through holes 14.
Preferably, the dovetail joint 11 is provided with a liquid storage box 12 therein, and the liquid storage box 12 is provided with a liquid supply device which supplies liquid onto the wire 17 through the through hole 14.
Implementation scheme of operating platform
As an implementation manner, as shown in fig. 5, an operation platform for full-automatic nickel brushing for a semiconductor etching reaction chamber comprises a frame 4, a fixer 5, a liquid recovery box 6 and a numerical control device 7, wherein the frame 4 is of a cuboid structure, a workpiece groove is arranged in the middle of the frame 4, the fixer 5 is installed on two sides of the frame 4, the fixer 5 is composed of a side plate and two fixing rods, the two fixing rods are positioned on the same horizontal plane and are parallel to each other, one end of each fixing rod penetrates through the frame 4 to be fixedly connected with the side plate, the fixing rods are slidably connected with the frame 4, the liquid recovery box 6 is of a hollow cuboid structure, the liquid recovery box 6 is positioned in the middle of the frame 4, the liquid recovery box 6 is fixedly connected with the frame 4, the liquid recovery box 6 is provided with a diversion port, the numerical control device 7 comprises a display screen and an operation console, the operation console is positioned on a side, the numerical control device 7 is positioned below the liquid recovery box 6, and the numerical control device 7 is fixedly connected with the frame 4.
Preferably, the liquid recovery box 6 is the cuboid structure, and the upper surface of liquid recovery box 6 comprises first steel sheet and second steel sheet, one side and 4 fixed connection of frame of steel sheet, the opposite side of steel sheet is unsettled and is provided with the inclined plane, and two steel sheets are fixed in the both sides of frame 4, form the guiding gutter between two steel sheets.
Preferably, the numerical control device 7 comprises an operation panel, a display screen, a controller and an operator, the controller and the operator are integrated in the numerical control device 7, and the operation panel and the display screen are fixed on the surface of the numerical control device 7.
Preferably, the numerical control device 7 receives input information, identifies, stores and operates the information, outputs corresponding instruction pulses to the moving mechanism 2 and the electroplating brush 3, and further controls equipment to carry out full-automatic brush nickel plating operation.
In one embodiment, the liquid recovery box 6 is provided with a pressure sensor 18, the surface of a steel plate of the liquid recovery box 6 is provided with an insulating pad, the pressure sensor 18 comprises a first pressure sensor 18 and a second pressure sensor 18, the first pressure sensor 18 is arranged on the first steel plate, the second pressure sensor 18 is arranged on the second steel plate, and the steel plate can be subjected to bending deformation when being subjected to pressure.
Preferably, the pressure sensor 18 is used for detecting the pressure applied to the workpiece to be plated, when the irregular workpiece is subjected to brush plating, the motion state of the moving mechanism 2 is adjusted by detecting different pressure values applied to the workpiece to be plated, and when the detected pressure value is too large, the moving mechanism 2 moves upwards to reduce the pressure of the electroplating brush 3 on the workpiece to be plated, so that full-automatic numerical control brush plating on the irregular workpiece is realized.
Preferably, the fixer 5 comprises a side plate and two fixing rods, wherein the side plate is a rectangular wood plate, the fixing rods are provided with buckles, and the fixing rods are connected with the side plate through strong glue.
Preferably, liquid recovery box 6 is provided with inclined plane open-ended cavity recess, and the opening is the funnel structure, and the work piece that is plated is placed to liquid recovery box 6 upper surface, and liquid recovery box 6 upper surface is for having elastic steel sheet, and the steel sheet surface is provided with the insulating pad.
The utility model has the advantages that: the numerical control device receives the input information and outputs corresponding instruction pulses to the moving mechanism and the electroplating brush, so that the equipment is controlled to carry out full-automatic brush nickel plating treatment. The pressure sensor is used for detecting the pressure of the plated workpiece, when the irregular workpiece is subjected to brush plating, the motion state of the moving mechanism is adjusted by detecting different pressure values of the plated workpiece, and when the detected pressure value is too large, the moving mechanism moves upwards to reduce the pressure of the electroplating brush on the plated workpiece, so that the full-automatic numerical control brush plating on the irregular workpiece is realized.
All patents and publications mentioned in the specification of the invention are indicative of the state of the art to which this invention pertains and of the technology disclosed herein as being applicable. All patents and publications cited herein are hereby incorporated by reference to the same extent as if each individual publication was specifically and individually indicated to be incorporated by reference. The invention described herein may be practiced in the absence of any element or elements, limitation or limitations, which limitation is not specifically disclosed herein. For example, in each of the examples herein the terms "comprising", "consisting essentially of", and "consisting of" may be substituted for the remaining 2 terms of either. The terms and expressions which have been employed herein are used as terms of description and not of limitation, and there is no intention in the use of such terms and expressions of excluding any equivalents of the features shown and described, but it is recognized that various modifications and changes may be made within the scope of the invention and the claims which follow. It is to be understood that the embodiments described herein are preferred embodiments and features and that modifications and variations may be made by one skilled in the art in light of the teachings of the present disclosure, and are to be considered within the purview of this disclosure and scope of the invention as defined by the appended claims and the independent claims.
Claims (7)
1. The utility model provides an operation platform that is used for full-automatic brush nickel plating of semiconductor etching reaction chamber which characterized in that: including the frame, the fixer, liquid recovery box and numerical control device, the frame be the cuboid structure, the centre of frame is provided with the work piece groove, the fixer install in the both sides of frame, the fixer comprises curb plate and two dead levers, two dead levers are located same horizontal plane and are parallel to each other, the one end of dead lever is passed frame and curb plate fixed connection, the dead lever is sliding connection with the frame, liquid recovery box be hollow cuboid structure, liquid recovery box is located the centre of frame, liquid recovery box and frame fixed connection, liquid recovery box are provided with the water conservancy diversion mouth, numerical control device contain display screen and operation panel, the operation panel is located the side of display screen, numerical control device is located the below of liquid recovery box, numerical control device and frame fixed connection.
2. The full-automatic brush nickel plating operation platform for the semiconductor etching reaction chamber, according to claim 1, is characterized in that: the liquid recovery box be the cuboid structure, the upper surface of liquid recovery box comprises first steel sheet and second steel sheet, one side and the frame fixed connection of steel sheet, the opposite side of steel sheet is unsettled and is provided with the inclined plane, two steel sheets are fixed in the both sides of frame, form the guiding gutter between two steel sheets.
3. The full-automatic brush nickel plating operation platform for the semiconductor etching reaction chamber, according to claim 1, is characterized in that: the numerical control device comprises an operation panel, a display screen, a controller and an arithmetic unit, wherein the controller and the arithmetic unit are integrated in the numerical control device, and the operation panel and the display screen are fixed on the surface of the numerical control device.
4. The full-automatic brush nickel plating operation platform for the semiconductor etching reaction chamber, according to claim 1, is characterized in that: the liquid recovery box install pressure sensor, the steel sheet surface mounting of liquid recovery box has insulating pad, pressure sensor contains first pressure sensor and second pressure sensor, first pressure sensor installs on first steel sheet, second pressure sensor installs on the second steel sheet, the steel sheet receives pressure can take place bending deformation.
5. The full-automatic brush nickel plating operation platform for the semiconductor etching reaction chamber, according to claim 1, is characterized in that: the side of the operation platform is provided with a connecting hole, and a fixer is installed in the connecting hole.
6. The full-automatic brush nickel plating operation platform for the semiconductor etching reaction chamber, according to claim 1, is characterized in that: the fixer comprises curb plate and two dead levers, the curb plate is the rectangle plank, is provided with the buckle on the dead lever, the dead lever passes through the super glue with the curb plate and is connected.
7. The full-automatic brush nickel plating operation platform for the semiconductor etching reaction chamber, according to claim 1, is characterized in that: the liquid recovery box is provided with a hollow groove with an inclined plane opening, the opening is of a funnel structure, a plated workpiece is placed on the upper surface of the liquid recovery box, the upper surface of the liquid recovery box is an elastic steel plate, and an insulating pad is arranged on the surface of the steel plate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021667378.4U CN212834077U (en) | 2020-08-12 | 2020-08-12 | Full-automatic nickel brushing operation platform for semiconductor etching reaction chamber |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021667378.4U CN212834077U (en) | 2020-08-12 | 2020-08-12 | Full-automatic nickel brushing operation platform for semiconductor etching reaction chamber |
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| CN212834077U true CN212834077U (en) | 2021-03-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113584560A (en) * | 2021-06-18 | 2021-11-02 | 嵇志华 | Clamping type production coating device capable of preventing semiconductor from shifting |
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2020
- 2020-08-12 CN CN202021667378.4U patent/CN212834077U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113584560A (en) * | 2021-06-18 | 2021-11-02 | 嵇志华 | Clamping type production coating device capable of preventing semiconductor from shifting |
| CN113584560B (en) * | 2021-06-18 | 2023-09-15 | 宜宾卓邦科技有限公司 | Clamping type production coating device capable of preventing semiconductor from shifting |
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