CN212821197U - Discharging guide structure, taking and placing device and electronic element testing system - Google Patents

Abstract

The utility model relates to a blowing guide structure, get and put device and electronic component test system. The discharging guide structure comprises a guide piece and a discharging assembly. The guide piece is used for being connected with the taking and placing device body. The guide part is provided with at least two first guide parts, and the first guide parts are used for being matched with the second guide parts of the test area in a positioning mode. The material taking and placing assembly is connected to the guide piece and used for obtaining the element to be tested and placing the element to be tested in the test area. When the device needs to be tested, the discharging guide structure is arranged on the discharging device body, and the component to be tested is obtained through the discharging assembly. After the element to be tested is obtained, the taking and placing device body drives the discharging guide structure to move to the position above the testing area, so that the first guide part and the second guide part of the testing area are in positioning fit, the guiding and positioning of discharging actions are realized, the stability of the taking and placing device body in discharging of the testing area is improved, and the operation stability of equipment is improved. Meanwhile, the placing position of the taking and placing device body in the test area can be determined.

Description

Discharging guide structure, taking and placing device and electronic element testing system

Technical Field

The utility model relates to an electronic component test sorting facilities technical field especially relates to a blowing guide structure, gets and put device and electronic component test system.

Background

With the rapid development of science and technology, products such as communication equipment and consumer electronics are increasing, and an integrated circuit is one of the main components of the electronic products, and the quality of the integrated circuit is directly related to the quality of the electronic products. After the production of the integrated circuit is completed, the integrated circuit is usually tested, sorted and the like by the full-automatic testing and sorting equipment for the integrated circuit. In the full-automatic test sorting equipment for the integrated circuits, the integrated circuit taking and placing device undertakes the work of carrying the integrated circuits, and the stability of the integrated circuit taking and placing device in an integrated circuit test area has great influence on the productivity and the stability of the equipment.

When the traditional integrated circuit taking and placing device discharges materials in an integrated circuit test area, the problems of terminal shaking and the like exist, so that the stability of discharging is poor, and the stability of operation of equipment is influenced.

SUMMERY OF THE UTILITY MODEL

Therefore, there is a need for a feeding guide structure, a pick-and-place device and an electronic component testing system, in which the feeding guide structure can improve the feeding stability of the component to be tested in the testing area, thereby improving the stability of the operation of the device.

A discharge guide structure, comprising:

the guide piece is arranged on the taking and placing device body and provided with at least two first guide parts, and the first guide parts are used for being positioned and matched with the second guide parts of the test area; and

and the material taking and placing assembly is connected to the guide piece and used for acquiring a component to be tested and placing the component to be tested in the test area.

In one embodiment, when the first guide part is matched with the second guide part in a positioning mode, the material taking and placing assembly is located above the middle of the testing area.

In one embodiment, the guide member includes a mounting plate and two guide blocks, the guide blocks are disposed at two ends of the mounting plate, and the first guide portion is disposed on the guide blocks.

In one embodiment, the first guide part is provided with guide holes for positioning and matching with guide pins of the test area;

or the first guide part is provided with a guide pin, and the guide pin is used for positioning and matching with the guide hole of the test area.

In one embodiment, the mounting plate is provided with a plurality of first mounting holes which are arranged at intervals along the length direction of the mounting plate; or the first mounting holes are arranged at intervals along the length direction and the width direction of the mounting plate; the guide block is correspondingly provided with a second mounting hole; the discharging guide structure further comprises a fastener, and the fastener penetrates through the first mounting hole and the second mounting hole.

In one embodiment, the material taking and placing assembly comprises a limiting block and a suction nozzle, the suction nozzle is in clearance fit with the guide piece, and the suction nozzle is arranged outside the limiting block; or the limiting block is provided with a hollow channel, and the suction nozzle is arranged in the channel.

In one embodiment, the discharging guide structure further comprises an adapter for connecting the picking and placing device body, and the adapter is connected with the suction nozzle and the guide piece.

The taking and placing device comprises a taking and placing device body and the feeding guide structure, wherein the feeding guide structure is arranged on the taking and placing device body, and the taking and placing device body is used for driving the feeding guide structure and a component to be tested to move to the test area.

An electronic component testing system, the electronic component testing system comprising: the test area is used for testing the element to be tested and is provided with a second guide part; and the first guide part of the taking and placing device is matched with the second guide part of the test area in a positioning way.

In one embodiment, the second guide portions are disposed at both sides of the test zone.

When the feeding guide structure, the taking and placing device and the electronic element testing system need to be tested, the feeding guide structure is arranged on the taking and placing device body, and an element to be tested is obtained through the taking and placing assembly. After the picking and placing assembly acquires the element to be tested, the picking and placing device body drives the picking and placing guide structure and the element to be tested to move to the upper side of the test area, so that the first guide part is in positioning fit with the second guide part of the test area, the guiding and positioning of the picking and placing action are realized, the stability of the picking and placing device body in the process of picking and placing in the test area can be improved, and the operation stability of equipment is improved. In addition, when the first guide part is matched with the second guide part of the test area in a positioning mode, the position of the taking and placing device body at the moment is recorded, the position is the placing position of the taking and placing device body in the test area, and therefore the placing position of the taking and placing device body in the test area can be determined.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic test system according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of a discharge guide structure and a test area of the electronic device testing system shown in FIG. 1;

FIG. 3 is a schematic structural view of the discharge guide structure shown in FIG. 2;

fig. 4 is an exploded view of the discharge guide structure shown in fig. 3.

Reference numerals:

10. a guide member; 11. mounting a plate; 111. a first mounting hole; 12. a guide block; 121. a first guide portion; 122. a second mounting hole; 20. a material taking and placing component; 21. a suction nozzle; 22. a limiting block; 30. a pick-and-place device body; 40. an adapter; 50. a test zone; 51. a second guide portion; 52. and a positioning pin.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

Referring to fig. 1, fig. 2 and fig. 3, fig. 1 shows a schematic structural diagram of an electronic component testing system according to an embodiment of the present invention, fig. 2 shows a schematic structural diagram of a discharging guide structure and a testing area of the electronic component testing system shown in fig. 1, and fig. 3 shows a schematic structural diagram of the discharging guide structure shown in fig. 2. An embodiment of the utility model provides a blowing guide structure, include the guide 10 and get and put material subassembly 20. The guide member 10 is provided on the pick-and-place device body 30. The guide 10 has at least two first guides 121, the first guides 121 being adapted to be in a locating engagement with the second guides 51 of the test zone 50. The pick-and-place assembly 20 is connected to the guide 10, and is used for picking up a device under test and placing the device under test in the test area 50.

When the feeding guide structure needs to be tested, the feeding guide structure is installed on the taking and placing device body 30, and a component to be tested is obtained through the taking and placing assembly 20. After the pick-and-place assembly 20 obtains the device to be tested, the pick-and-place device body 30 drives the placing guide structure and the device to be tested to move to the upper side of the test area 50, so that the first guide portion 121 and the second guide portion 51 of the test area 50 are in positioning fit, the guiding and positioning of the placing action are realized, the stability of the pick-and-place device body 30 in the placing process of the test area 50 can be improved, and the operation stability of the equipment is improved.

It should be noted that, the discharging guide structure not only can improve the stability of discharging, but also can determine the discharging position of the taking and placing device body 30 in the test area 50. Specifically, the pick-and-place device body 30 is started, the pick-and-place guide structure moves to the upper side of the test area 50, so that the first guide portion 121 and the second guide portion 51 of the test area 50 are in positioning fit, and the position of the pick-and-place device body 30 at this time is recorded, and the position is the placing position of the pick-and-place device body 30 in the test area 50.

In an embodiment, referring to fig. 2 and fig. 3, when the first guide portion 121 and the second guide portion 51 are positioned and matched, the pick-and-place assembly 20 is located above the middle of the test area 50, so that the pick-and-place assembly 20 can place a device to be tested in the middle of the test area 50, the device to be tested is prevented from tilting in the test area 50, and the risk of damaging the device to be tested during testing is reduced.

It should be noted that the specific position of the picking assembly 20 on the guide 10 depends on the position of the second guide portion 51 of the testing area 50. Specifically, in the embodiment, the middle of the test area 50 is taken as a symmetric center, the second guiding portions 51 are symmetrically disposed on two sides of the test area 50, and the material taking and placing assembly 20 is disposed at the middle position of the guiding member 10, so that when the first guiding portion 121 and the second guiding portion 51 of the test area 50 are guided and positioned, the material taking and placing assembly 20 can place the device to be tested in the middle of the test area 50.

In one embodiment, referring to fig. 2 and 3, the guide member 10 includes a mounting plate 11 and two guide blocks 12, the two guide blocks 12 are respectively disposed at both ends of the mounting plate 11, and the first guide portion 121 is disposed at the guide block 12. It should be noted that two second guiding portions 51 are provided, and the two second guiding portions 51 are respectively located at two sides of the testing area 50. Through the arrangement of the guide block 12, the first guide part 121 is arranged on the guide block 12, so that the first guide part 121 and the second guide part 51 of the test area 50 can be better matched in positioning, the guiding and positioning of the discharging action are realized, and the stability of discharging is improved. In addition, the material taking and placing assembly 20 is disposed at one end of the mounting plate 11 facing the testing area 50, and since the material taking and placing assembly 20 has a certain height, the guide blocks 12 are disposed at two ends of the mounting plate 11, so that the device to be tested and the testing area 50 can be prevented from being damaged in the material placing process. Of course, in other embodiments, the guide member 10 may be a mounting plate 11 having a certain thickness, and the first guide portions 121 may be provided at both ends of the mounting plate 11.

Further, the matching surfaces of the mounting plate 11 and the guide block 12 have flatness requirements, for example, the surface of the mounting plate 11 close to the guide block 12 and the surface of the guide block 12 close to the mounting plate 11 are both flat surfaces, so as to ensure the parallelism between the lower surface of the mounting plate 11 and the upper surface of the guide block 12. Of course, the surface of the guide block 12 away from the mounting plate 11 also requires flatness, and for example, the lower surface of the guide block 12 is flat, so that smooth guiding and positioning of the first guide portion 121 and the second guide portion 51 are ensured.

In one embodiment, referring to fig. 2 and 3, the first guide portion 121 is provided with a guide hole, and the second guide portion 51 is correspondingly provided with a guide pin. In the process of blowing, blowing guide structure removes to being close to test area 50, and the uide pin stretches into in the guiding hole, realizes the guiding orientation of blowing action, alright improve like this and get the stability of putting device body 30 when the blowing of test area 50 to improve the operating stability of equipment. Of course, in other embodiments, the first guide portion 121 may be provided with a guide pin, the second guide portion 51 may be provided with a guide hole, and the guide pin and the guide hole may be positioned to cooperate with each other to guide and position the discharge operation.

In the present embodiment in particular, the second guide portion 51 of the test zone 50 is provided with guide pins. The first guide portions 121 are provided with pin holes, and both the first guide portions 121 may be provided as circular pin holes, and it should be noted here that, in other embodiments, the first guide portion 121 at one end of the mounting plate 11 may be provided as a circular pin hole, and the first guide portion 121 at the other end of the mounting plate 11 may be provided as a kidney-shaped pin hole, so that the problem that the first guide portion 121 and the second guide portion 51 cannot be matched in a positioning manner due to a machining error can be avoided. The pick-and-place device body 30 is guided by the mutual matching of the guide pins of the test area 50 and the pin holes of the discharge guide structure.

In another embodiment, the first guiding portion 121 is provided with a magnet, and the second guiding portion 51 is correspondingly provided with a magnetic member. At the in-process of blowing, blowing guide structure removes to being close to test area 50, and magnet is inhaled with magnetism under the effect of magnetic force and is adsorbed, realizes the guiding orientation of blowing action, alright improve like this and get the stability of putting device body 30 when the test area 50 blowing to improve equipment's operating stability. Of course, the first guide portion 121 may be provided with a magnetic member, and the second guide portion 51 may be provided with a magnet.

In one embodiment, referring to fig. 2 and 4, fig. 4 shows an exploded view of the discharge guide structure shown in fig. 3. The mounting plate 11 is provided with a plurality of first mounting holes 111, and the plurality of first mounting holes 111 are arranged at intervals along the length direction of the mounting plate 11; alternatively, the first mounting holes 111 are provided at intervals in the longitudinal direction and the width direction of the mounting plate 11. The guide block 12 is correspondingly provided with a second mounting hole 122. The discharging guide structure further comprises a fastener, the fastener penetrates through the first mounting hole 111 and the second mounting hole 122, and detachable connection between the guide block 12 and the mounting plate 11 is achieved. Alternatively, the first and second mounting holes 111 and 122 are pin holes, and the fasteners are pins. In the using process, the first mounting hole 111 and the second mounting hole 122 are used for positioning between the mounting plate 11 and the guide block 12, and the distance between the first guide parts 121 is ensured to be consistent with the distance between the second guide parts 51 of the test area 50 through the first mounting hole 111 of the mounting plate 11, so that the first guide parts 121 are ensured to be accurately matched with the second guide parts 51 of the test area 50.

In another embodiment, the mounting plate 11 is provided with a guide groove, which is arranged along the length direction of the mounting plate 11; the guide block 12 is movably disposed in the guide groove. In the debugging process, the guide blocks 12 are adjusted according to the distance between the second guide parts 51 of the test area 50, when the guide blocks 12 are adjusted to proper positions, the guide blocks 12 are fixed in the guide grooves, the distance between the first guide parts 121 of the two guide blocks 12 is equal to the distance between the second guide parts 51 of the test area 50, and therefore the first guide parts 121 are ensured to be accurately matched with the second guide parts 51 of the test area 50.

In one embodiment, referring to fig. 1 and 4, the pick and place assembly 20 includes a suction nozzle 21. Specifically, the suction nozzle 21 is clearance-fitted to the mounting plate 11 and is connected to the adaptor 40. By arranging the suction nozzle 21, on one hand, under the action of suction force, the suction nozzle 21 can adsorb the component to be tested and move along with the taking and placing device body 30, so that the component to be tested is conveyed; on the other hand, the device to be tested is conveyed in a suction mode, so that the damage of the device to be tested is reduced. Of course, in other embodiments, the pick-and-place assembly 20 may be a robot, which picks up the dut and transports the dut to the test area 50.

Further, referring to fig. 4, the material taking and placing assembly 20 further includes a limiting block 22, the limiting block 22 has a hollow channel, and the suction nozzle 21 is disposed in the channel. By arranging the hollow limiting block 22 outside the suction nozzle 21, the limiting block 22 plays a limiting role on the element to be detected, and the element to be detected is prevented from swinging up and down in the process of being adsorbed on the suction nozzle 21.

It should be noted that, the surface of the end of the limiting block 22 away from the guide 10 has a requirement for flatness, for example, the lower surface of the limiting block 22 is a plane, so as to ensure that the limiting block 22 can effectively function as a limiting function, and simultaneously prevent the limiting block 22 from damaging the element to be measured.

Specifically, the limiting block 22 is connected with the suction nozzle 21, so that the limiting block 22 is prevented from swinging left and right in the moving process, and the suction stability of the element to be tested is improved. In the embodiment, the limiting block 22 is in threaded connection with the suction nozzle 21.

In another embodiment, the material taking and placing assembly 20 includes a limiting block 22 and a suction nozzle 21, and the suction nozzle 21 is disposed outside the limiting block 22. In the process of sucking the component to be tested by the suction nozzle 21 and carrying the component to be tested to the test area 50, the limiting block 22 has a limiting effect on the component to be tested, and the component to be tested is prevented from swinging up and down in the process of being adsorbed by the suction nozzle 21.

In one embodiment, referring to fig. 3 and 4, the discharging guide structure further includes an adaptor 40 for connecting the pick-and-place device body 30, wherein the adaptor 40 connects the suction nozzle 21 and the guide 10. Through the arrangement of the adapter 40, the guide 10 and the material taking and placing assembly 20 are mounted on the material taking and placing device body 30 by the adapter 40, so that the device body 30 drives the element to be tested to be placed in the test area 50.

Specifically, in the embodiment, the device under test is an integrated circuit. The integrated circuit is obtained by the discharging guide structure, and the integrated circuit is moved to the test area 50 by the taking and placing device body 30 for testing. It should be noted that, the material-discharging guide structure can also realize the guide material-discharging of other elements, and is not limited to the guide material-discharging of integrated circuits.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic component testing system according to an embodiment of the present invention. An embodiment of the utility model provides a get and put device, including getting the blowing guide structure of putting device body 30 and any above-mentioned embodiment. The feeding guide structure is disposed on the pick-and-place device body 30, and the pick-and-place device body 30 is used for driving the feeding guide structure and the device to be tested to move to the test area 50.

When the pick-and-place device needs to be tested, the discharge guide structure is installed on the pick-and-place device body 30, and the component to be tested is obtained through the pick-and-place assembly 20. After the pick-and-place assembly 20 obtains the device to be tested, the pick-and-place device body 30 drives the placing guide structure and the device to be tested to move to the upper side of the test area 50, so that the first guide portion 121 and the second guide portion 51 of the test area 50 are in positioning fit, the guiding and positioning of the placing action are realized, the stability of the pick-and-place device body 30 in the placing process of the test area 50 can be improved, and the operation stability of the equipment is improved. In addition, when the first guiding portion 121 is matched with the second guiding portion 51 of the testing area 50, the position of the pick-and-place device body 30 is recorded, and the position is the placing position of the pick-and-place device body 30 in the testing area 50, so that the placing position of the pick-and-place device body 30 in the testing area 50 can be determined.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic component testing system according to an embodiment of the present invention. An embodiment of the present invention provides an electronic device testing system, which includes a testing area 50 and a pick-and-place device according to any of the above embodiments. The test area 50 is used for testing the device to be tested, the test area 50 is provided with a second guide part 51, and the second guide part 51 is matched with the first guide part 121 of the pick-and-place device in a positioning manner.

When the electronic component testing system needs to be tested, the material placing guide structure is installed on the material placing and placing device body 30, and the component to be tested is obtained through the material placing and placing assembly 20. After the pick-and-place assembly 20 obtains the device to be tested, the pick-and-place device body 30 drives the placing guide structure and the device to be tested to move to the upper side of the test area 50, so that the first guide portion 121 and the second guide portion 51 of the test area 50 are in positioning fit, the guiding and positioning of the placing action are realized, the stability of the pick-and-place device body 30 in the placing process of the test area 50 can be improved, and the operation stability of the equipment is improved. In addition, when the first guiding portion 121 is matched with the second guiding portion 51 of the testing area 50, the position of the pick-and-place device body 30 is recorded, and the position is the placing position of the pick-and-place device body 30 in the testing area 50, so that the placing position of the pick-and-place device body 30 in the testing area 50 can be determined.

In one embodiment, referring to fig. 2 and 4, the second guides 51 are disposed at both sides of the test zone 50. It should be understood that the first guide parts 121 are provided at both ends of the guide 10, respectively. In this way, the guiding and positioning of the first guide part 121 and the second guide part 51 effectively realize the guiding of the discharging, thereby improving the stability of the discharging.

The debugging step of the electronic element testing system specifically comprises the following steps:

1) the discharging guide structure is arranged on the taking and placing device body 30 through the adaptor 40;

2) the pick-and-place device body 30 drives the discharge guide structure and the device to be tested to move above the test area 50, so that the first guide part 121 is matched with the second guide part 51 of the test area 50 in a positioning manner;

3) the position of the pick-and-place device body 30 is recorded, and the position is the position where the pick-and-place device body 30 discharges in the test area 50.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. The utility model provides a blowing guide structure which characterized in that, blowing guide structure includes:

the guide piece is arranged on the taking and placing device body and provided with at least two first guide parts, and the first guide parts are used for being positioned and matched with the second guide parts of the test area; and

and the material taking and placing assembly is connected to the guide piece and used for acquiring a component to be tested and placing the component to be tested in the test area.

2. The discharge guide structure according to claim 1, wherein when the first guide portion is matched with the second guide portion in a positioning manner, the material taking and placing assembly is located above the middle of the test area.

3. The discharge guide structure according to claim 1, wherein the guide member includes a mounting plate and two guide blocks, the guide blocks are provided at both ends of the mounting plate, and the first guide portion is provided at the guide blocks.

4. The discharge guide structure according to claim 3, wherein the first guide part is provided with guide holes for positioning and matching with guide pins of the test zone;

or the first guide part is provided with a guide pin, and the guide pin is used for positioning and matching with the guide hole of the test area.

5. The discharge guide structure according to claim 3, wherein the mounting plate is provided with a plurality of first mounting holes, and the plurality of first mounting holes are arranged at intervals along the length direction of the mounting plate; or the first mounting holes are arranged at intervals along the length direction and the width direction of the mounting plate; the guide block is correspondingly provided with a second mounting hole; the discharging guide structure further comprises a fastener, and the fastener penetrates through the first mounting hole and the second mounting hole.

6. The discharging guide structure according to claim 1, wherein the discharging component comprises a limiting block and a suction nozzle, the suction nozzle is in clearance fit with the guide piece, and the suction nozzle is arranged outside the limiting block; or the limiting block is provided with a hollow channel, and the suction nozzle is arranged in the channel.

7. The discharge guide structure according to claim 6, further comprising an adaptor for connecting the pick-and-place device body, wherein the adaptor connects the suction nozzle and the guide.

8. A pick-and-place apparatus, comprising a pick-and-place apparatus body and the discharge guide structure as claimed in any one of claims 1 to 7, wherein the discharge guide structure is disposed on the pick-and-place apparatus body, and the pick-and-place apparatus body is configured to drive the discharge guide structure and the device under test to move to the test area.

9. An electronic component test system, comprising:

the test area is used for testing the element to be tested and is provided with a second guide part; and

the pick-and-place device of claim 8, wherein the first guide portion of the pick-and-place device is in positioning fit with the second guide portion of the test area.

10. The system of claim 9, wherein the second guides are disposed on opposite sides of the test area.

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