CN212811730U

CN212811730U - On-board communication circuit and on-board communication device

Info

Publication number: CN212811730U
Application number: CN202021834648.6U
Authority: CN
Inventors: 刘鹏飞; 唐弘扬; 刘晓红; 邓家勇; 吴壬华
Original assignee: Shenzhen Shinry Technologies Co Ltd
Current assignee: Shenzhen Shinry Technologies Co Ltd
Priority date: 2020-08-26
Filing date: 2020-08-26
Publication date: 2021-03-26
Anticipated expiration: 2030-08-26

Abstract

The embodiment of the utility model discloses an on-board communication circuit and on-board communication device, wherein, the on-board communication circuit includes first diode, second diode, first resistance, second resistance and keeps apart the chip; the on-board communication device includes a first communication node, a second communication node, and the on-board communication circuit. Implement the embodiment of the utility model provides a, CAN realize the CAN communication between the communication node in the board under the condition that does not use the CAN transceiver, reduced the hardware cost.

Description

On-board communication circuit and on-board communication device

Technical Field

The utility model relates to an electronic circuit technical field, concretely relates to inboard communication circuit and inboard communication device.

Background

A Controller Area Network (CAN) bus is a multi-master bus, i.e., each node CAN become a host and CAN communicate with each other. The CAN communication is widely applied to the fields of automobiles, medical treatment, ships, aviation and the like due to the advantages of excellent performance, unique design, high reliability and the like.

The on-board communication generally adopts buses such as a Serial Communication Interface (SCI), a Serial Peripheral Interface (SPI), an I2C (inter-integrated circuit), and the like, but the CAN bus has unique advantages, and the on-board communication adopts the CAN bus to realize communication processes in different scenes by fully utilizing the advantages of the CAN bus. In CAN communication, each communication node transmits and receives signals of other communication nodes on a bus through a CAN transceiver. However, when CAN communication is performed on-board or on-chip, adding a CAN transceiver to each communication node on-board or on-chip results in increased hardware cost.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides an inboard communication circuit and inboard communication device under the condition that does not use the CAN transceiver, realizes CAN communication at the inboard, has reduced the hardware cost.

The embodiment of the utility model provides a first aspect provides an on-board communication circuit, on-board communication circuit is used for realizing the on-board communication between first communication node and the second communication node, on-board communication circuit includes first diode, second diode, first resistance, second resistance and keeps apart the chip, wherein:

the transmitting end of the first communication node is connected with the cathode of the first diode, the anode of the first diode is connected with the receiving end of the first communication node and the first end of the first resistor, and the second end of the first resistor is connected with the first power supply end; the transmitting end of the second communication node is connected with the cathode of the second diode, the anode of the second diode is connected with the receiving end of the second communication node and the first end of the second resistor, and the second end of the second resistor is connected with a second power supply end;

under the condition that the sending end of the first communication node is connected with the second input end of the isolation chip, the receiving end of the first communication node is connected with the first output end of the isolation chip, the sending end of the second communication node is connected with the first input end of the isolation chip, and the receiving end of the second communication node is connected with the second output end of the isolation chip, if the sending end of the first communication node and/or the sending end of the second communication node is at a low level, the on-board communication circuit realizes that the receiving end of the first communication node and the receiving end of the second communication node are at the low level.

Optionally, the on-board communication circuit further includes a third diode and a fourth diode, an anode of the third diode is connected to the receiving end of the first communication node, and an anode of the fourth diode is connected to the receiving end of the second communication node;

under the condition that the cathode of the third diode is connected with the first output end of the isolation chip, the receiving end of the first communication node is connected with the second input end of the isolation chip, the cathode of the fourth diode is connected with the second output end of the isolation chip, and the receiving end of the second communication node is connected with the first input end of the isolation chip, if the transmitting end of the first communication node and/or the transmitting end of the second communication node is at a low level, the on-board communication circuit realizes that the receiving end of the first communication node and the receiving end of the second communication node are at the low level; if the sending end of the first communication node and the sending end of the second communication node are both high level, the on-board communication circuit realizes that the receiving end of the first communication node and the receiving end of the second communication node are high level.

Optionally, the on-board communication circuit further includes a first filter circuit; and the first end of the first resistor is connected with the receiving end of the first communication node through the first filter circuit.

Optionally, the first filter circuit includes a third resistor and a first capacitor; the first end of the first capacitor is connected with the first end of the third resistor and the receiving end of the first communication node, the second end of the first capacitor is connected with the first ground end, and the second end of the third resistor is connected with the first end of the first resistor.

Optionally, the on-board communication circuit further includes a second filter circuit; and the first end of the second resistor is connected with the receiving end of the second communication node through the second filter circuit.

Optionally, the second filter circuit includes a fourth resistor and a second capacitor; the first end of the second capacitor is connected with the second end of the fourth resistor and the receiving end of the second communication node, the second end of the second capacitor is connected with the second ground end, and the first end of the fourth resistor is connected with the first end of the second resistor.

The embodiment of the utility model provides an in the second aspect provides an on-board communication device, on-board communication device include first communication node, second communication node and the embodiment of the utility model provides an arbitrary on-board communication circuit in the first aspect.

The ground terminal of the first communication node is connected with a third ground terminal, the ground terminal of the second communication node is connected with a fourth ground terminal, and the third ground terminal is different from the fourth ground terminal.

The first communication node and the second communication node respectively comprise a micro control unit and a CAN controller.

Optionally, the first communication node and the second communication node each include a micro control unit, and a CAN controller is integrated in the micro control unit.

The power end of the first communication node is connected with a first auxiliary power supply, and the power end of the second communication node is connected with a second auxiliary power supply.

The embodiment of the application provides an on-board communication circuit, including first diode, second diode, first resistance, second resistance and isolation chip, this on-board communication circuit simple structure, the electronic components who adopts are few. Implement the embodiment of the utility model provides a, CAN be under the condition that the sending terminal of first communication node or second communication node's sending terminal is the low level, the inboard communication circuit realizes first communication node's receiving terminal with second communication node's receiving terminal is the low level to realize the inboard CAN communication under the condition that need not the CAN transceiver, not only in the inboard advantage of fully having utilized CAN communication, still reduced the hardware cost.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1a is a diagram of CAN communication using a CAN transceiver in a conventional method;

fig. 1b is a schematic diagram of a CAN signal for implementing CAN communication by using a CAN transceiver disclosed in an embodiment of the present application;

fig. 1c is a schematic level diagram of a CAN signal for implementing CAN communication by using a CAN transceiver disclosed in an embodiment of the present application;

fig. 2a is a schematic structural diagram of an on-board communication circuit disclosed in an embodiment of the present invention;

fig. 2b is a schematic structural diagram of another on-board communication circuit disclosed in the embodiment of the present invention;

fig. 3 is a schematic structural diagram of another on-board communication circuit disclosed in an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an in-board communication device according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of another in-board communication device disclosed in the embodiment of the present invention.

Detailed Description

The technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It is to be understood that the embodiments described are some, but not all embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.

In CAN communication, each communication node transmits and receives signals of other communication nodes on a bus through a CAN transceiver, and therefore, each communication node must be additionally provided with a CAN transceiver. In addition, a CAN controller is also required to implement CAN communication.

Fig. 1a is a schematic diagram of CAN communication using a CAN transceiver in a conventional method. As shown in fig. 1a, taking a communication node as a Micro Controller Unit (MCU) as an example, a CAN controller is integrated inside the MCU. The CAN controller CAN receive data sent by a microprocessor in the MCU and transmit the data to the CAN transceiver; the CAN transceiver is used for transmitting data to the bus or receiving data from the bus to the CAN controller. However, when CAN communication is implemented within the board, adding a CAN transceiver to each communication node increases the cost of the on-board communication.

Referring to fig. 1b, fig. 1b is a schematic diagram of a CAN signal for implementing CAN communication by using a CAN transceiver disclosed in the embodiment of the present application. Fig. 1b is a CAN signal diagram in CAN communication based on fig. 1a using a CAN transceiver. The CAN signal is a bit stream signal that appears alternately at a dominant level and a recessive level, and may include transmission control commands or may include data segments or blocks. In the CAN signal, "0" represents dominant, dominant corresponds to low level, and "1" represents recessive, recessive corresponds to high level. As shown in fig. 1b, the CAN signal takes a control command as an example, the CAN signal is a dominant level "0" in a first time period, is a recessive level "1" in a second time period, is a dominant level "0" in a third time period, is a dominant level "0" in a fourth time period, and is a recessive level "1" in a fifth time period, a sum of time lengths of the five time periods may be regarded as a period, and levels corresponding to the five time periods may repeatedly appear in a next period, which may be used for periodically transmitting the same control command.

Referring to fig. 1c, fig. 1c is a schematic level diagram of a CAN signal for implementing CAN communication by using a CAN transceiver according to an embodiment of the present disclosure. Fig. 1c is a schematic diagram of the level of CAN signals in CAN communication based on fig. 1a using a CAN transceiver. As shown in fig. 1c, the dominant level and the recessive level in the CAN signal correspond to two voltage ranges, instead of two specific values, for example, when the dominant level in the CAN signal is "0V to 1.5V", the corresponding recessive level is "1.5V to 5V"; when the dominant level in the CAN signal is 0V-2.5V, the corresponding recessive level is 2.5V-5V; when the dominant level in the CAN signal is 0V-3.5V, the corresponding recessive level is 3.5V-5V.

An embodiment of the utility model provides an inboard communication circuit and inboard communication device CAN realize CAN communication at the inboard under the condition that does not use the CAN transceiver. The details will be described below.

Referring to fig. 2a, fig. 2a is a schematic structural diagram of an on-board communication circuit according to an embodiment of the present invention. As shown in fig. 2a, the on-board communication circuit 30 described in the present embodiment is used to implement the on-board communication between the first communication node 10 and the second communication node 20, and includes a first diode D1, a second diode D2, a first resistor R1, a second resistor R2, and an isolation chip 301, wherein:

a transmitting terminal TX1 of the first communication node 10 is connected to a cathode of the first diode D1, an anode of the first diode D1 is connected to a receiving terminal RX1 of the first communication node 10 and a first terminal 11 of the first resistor R1, and a second terminal 12 of the first resistor R1 is connected to a first power supply terminal; a transmitting terminal TX2 of the second communication node 20 is connected to a cathode of the second diode D2, an anode of the second diode D2 is connected to a receiving terminal RX2 of the second communication node 20 and a first terminal 21 of the second resistor R2, and a second terminal 22 of the second resistor R2 is connected to a second power supply terminal;

when the transmitting terminal TX1 of the first communication node 10 is connected to the second input terminal IN2 of the isolated chip 301, the receiving terminal RX1 of the first communication node 10 is connected to the first output terminal OUT1 of the isolated chip 301, the transmitting terminal TX2 of the second communication node 20 is connected to the first input terminal IN1 of the isolated chip 301, and the receiving terminal RX2 of the second communication node 20 is connected to the second output terminal OUT2 of the isolated chip 301, if the transmitting terminal TX1 of the first communication node 10 and/or the transmitting terminal TX2 of the second communication node 20 are at a low level, the on-board communication circuit 30 implements that the receiving terminal RX1 of the first communication node 10 and the receiving terminal RX2 of the second communication node 20 are at a low level.

Wherein, the power supply level of the first power supply end is the same as that of the second power supply end.

The on-board communication circuit 30 according to the embodiment of the present application is suitable for a case where the first communication node 10, the second communication node 20, and the isolation chip 301 can only output a low level, for example, the first communication node 10, the second communication node 20, and the isolation chip 301 are Open Collector (OC) gates.

The on-board communication circuit 30 is configured to implement that the receiving terminal RX1 of the first communication node 10 and the receiving terminal RX2 of the second communication node 20 are both low level when the transmitting terminal TX1 of the first communication node 10 and/or the transmitting terminal TX2 of the second communication node 20 are low level.

When the transmitting terminal TX1 of the first communication node 10 is at a low level and the transmitting terminal TX2 of the second communication node 20 is at a low level, the first diode D1 and the second diode D2 in the on-board communication circuit 30 are both turned on, and at this time, the receiving terminal RX1 of the first communication node 10 and the receiving terminal RX2 of the second communication node 20 are both at a low level.

In the embodiment of the application, under the condition that the sending end of the first communication node or the sending end of the second communication node is at low level, the on-board communication circuit realizes that the receiving end of the first communication node and the receiving end of the second communication node are at low level, so that on-board CAN communication is realized under the condition that a CAN transceiver is not needed, the advantages of CAN communication are fully utilized in a board, and the hardware cost is reduced.

Referring to fig. 2b, fig. 2b is a schematic structural diagram of another on-board communication circuit according to an embodiment of the present invention. As shown in fig. 2b, the on-board communication circuit 30 described in the present embodiment is used to implement the on-board communication between the first communication node 10 and the second communication node 20, and includes a first diode D1, a second diode D2, a third diode D3, a fourth diode D4, a first resistor R1, a second resistor R2, and an isolation chip 301, wherein:

the anode of the third diode D3 is connected to the receiving terminal RX1 of the first communication node 10, and the anode of the fourth diode D4 is connected to the receiving terminal RX2 of the second communication node 20;

when the cathode of the third diode D3 is connected to the first output terminal OUT1 of the isolated chip 301, the receiver RX1 of the first communication node 10 is connected to the second input terminal IN2 of the isolated chip 301, the cathode of the fourth diode D4 is connected to the second output terminal OUT2 of the isolated chip 301, and the receiver RX2 of the second communication node 20 is connected to the first input terminal IN1 of the isolated chip 301, if the transmitter TX1 of the first communication node 10 and/or the transmitter TX2 of the second communication node 20 are/is at a low level, the on-board communication circuit 30 realizes that the receiver RX1 of the first communication node 10 and the receiver RX2 of the second communication node 20 are/is at a low level; if the TX1 of the first communication node 10 and the TX2 of the second communication node 20 are both high, the on-board communication circuit 30 enables the RX1 of the first communication node 10 and the RX2 of the second communication node 20 to be high.

When the transmitting terminal TX1 of the first communication node 10 is at a low level and the transmitting terminal TX2 of the second communication node 20 is at a low level, the first diode D1 and the second diode D2 in the on-board communication circuit 30 are both turned on, and at this time, the receiving terminal RX1 of the first communication node 10 and the receiving terminal RX2 of the second communication node 20 are both at a low level;

when the transmitting terminal TX1 of the first communication node 10 is at a low level and the transmitting terminal TX2 of the second communication node 20 is at a high level, the first diode D1, the second diode D2, the third diode D3 and the fourth diode D4 in the on-board communication circuit 30 are turned on, and at this time, the receiving terminals RX1 of the first communication node 10 and RX2 of the second communication node 20 are both at a low level;

when the transmitting terminal TX1 of the first communication node 10 is at a high level and the transmitting terminal TX2 of the second communication node 20 is at a low level, the first diode D1, the second diode D2, the third diode D3 and the fourth diode D4 in the on-board communication circuit 30 are not conductive, and at this time, the receiving terminals RX1 of the first communication node 10 and RX2 of the second communication node 20 are both at a low level;

when both the transmitting terminal TX1 of the first communication node 10 and the transmitting terminal TX2 of the second communication node 20 are at a high level, the first diode D1 and the second diode D2 in the on-board communication circuit 30 are not conductive, and the receiving terminal RX1 of the first communication node 10 and the receiving terminal RX2 of the second communication node 20 are at a high level.

The isolation chip 301 may be an optical coupling isolation chip, so that there is no electrical direct connection between two isolated communication nodes, and interference caused by electrical connection is mainly prevented. For example, the first communication node 10 is a high voltage node, and the second communication node 20 is a low voltage node, which have different ground levels. For another example, the first communication node 10 operates in a dc mode, the second communication node 20 operates in an ac mode, and the ground levels of the two are different. If the isolation chip 301 is not used between the two communication nodes, the two communication nodes will interfere with each other. After this scheme of adoption, then can avoid appearing such problem.

The first communication node 10 and the second communication node 20 may implement controller area network, CAN, bus, communication via the on-board communication circuit 30. The first communication node 10 and the second communication node 20 may perform data transmission and control command transmission through the on-board communication circuit 30.

The first diode D1 and the second diode D2 may be implemented by using an alternative circuit having diode functions (i.e., functions of unidirectional conduction and reverse blocking), and the embodiment of the present invention is not limited thereto.

In the embodiment of the application, under the condition that the transmitting end of a first communication node or the transmitting end of a second communication node is low level, the on-board communication circuit is realized that the receiving end of the first communication node and the receiving end of the second communication node are low level, and under the condition that the transmitting end of the first communication node and the transmitting end of the second communication node are high level, the on-board communication circuit CAN realize that the receiving end of the first communication node and the receiving end of the second communication node are high level, so that the on-board CAN communication is realized under the condition that a CAN transceiver is not needed, the advantage of CAN communication in the board is fully utilized, and the hardware cost is reduced.

The CAN bus CAN be used for transmitting data and CAN also be used for transmitting control commands. When data is transmitted, a data block may be encoded in units of data blocks, and a data block having a minimum unit of bits (one bit of binary information includes 1 bit) may be obtained.

CAN is one of the most widely used field buses internationally. In the beginning of the 20 th century, in order to solve the problem of data exchange between the numerous control and test instruments in modern cars, the company Bosch, germany, developed a CAN bus. The CAN bus CAN effectively support a serial communication network of distributed control or real-time control, has the advantages of strong anti-interference performance, reliable use and the like, is mainly applied to the automobile industry at first, and is widely applied to the automation fields of the automobile industry, the aviation industry, industrial control and the like, such as a distributed environment monitoring system, a greenhouse environment monitoring system, a transformer substation monitoring system and the like.

The CAN bus is a serial data communication protocol, and the communication interfaces (e.g., the first communication node 10 and the second communication node 20) of the CAN bus integrate the functions of the physical layer and the data link layer of the CAN protocol, and CAN complete the framing processing of data, including bit stuffing, data block encoding, cyclic redundancy check, priority discrimination and other work. On the basis of which the user can develop an application layer communication protocol adapted to the actual needs of the system. The CAN protocol has the main characteristic that the traditional station address coding is abandoned, and the communication data block is coded instead, so that the number of nodes in the network is not limited theoretically by adopting the method, and different nodes CAN receive the same data at the same time.

The CAN bus has the following advantages:

(1) the CAN bus is a multi-master bus, namely each node machine CAN be a host machine, and the node machines CAN also communicate with each other;

(2) the communication medium of the CAN bus CAN be a twisted pair, a coaxial cable or an optical fiber, and the communication speed CAN reach 1 Mbps;

(3) the length of the data segment transmitted in the CAN bus is at most 8 bytes, and the general requirements of control commands, working states and test data in the common industrial field CAN be met. Meanwhile, 8 bytes can not occupy the bus for too long time, so that the real-time performance of communication is ensured;

(4) the CAN protocol adopts Cyclic Redundancy Check (CRC) check and CAN provide a corresponding error processing function, so that the reliability of data communication is ensured;

(5) the CAN CAN work in a multi-master mode, and any node on the network CAN actively send information to other nodes on the bus at any time, so that data CAN be sent and received in a point-to-point mode, a point-to-multipoint mode and a global broadcasting mode;

(6) the CAN adopts a non-destructive bus arbitration technology, when two nodes send information to the bus at the same time, the node with low priority actively stops data sending, and the node with high priority CAN continue to transmit data without being influenced, thereby saving the bus conflict arbitration time.

Typical application scenarios for CAN bus: the main node receives field data sent by other nodes, such as parameters of field temperature, current, pressure and the like, generates various control commands after processing, and sends the control commands to other nodes through the CAN bus.

In the embodiment of the present application, the first resistor R1 and the second resistor R2 are pull-up resistors, and the resistances of the first resistor R1 and the second resistor R2 may be the same or different. The first resistor R1 and the second resistor R2 can improve the noise tolerance of signals at the receiving end of the communication node and enhance the anti-interference capability. The first diode D1 and the second diode D2 may be ordinary switching diodes, low power consumption switching diodes, etc., and the parameters of the first diode D1 and the second diode D2 may be the same or different. The isolation chip 301 may be an optical coupling isolation chip, so that there is no electrical direct connection between two isolated communication nodes, and interference caused by electrical connection is mainly prevented. For example, the first communication node 10 is a high voltage node, and the second communication node 20 is a low voltage node, which have different ground levels. For another example, the first communication node 10 operates in a dc mode, the second communication node 20 operates in an ac mode, and the ground levels of the two are different. If the isolation chip 301 is not used between the two communication nodes, the two communication nodes will interfere with each other. After this scheme of adoption, then can avoid appearing such problem.

In this embodiment, the on-board communication circuit may be used in a board that does not need a large cable to carry a large current, such as a Printed Circuit Board (PCB), and the communication node may be a micro control unit MCU, a unit in which the micro control unit MCU is connected to other electronic components, or an integrated electronic device including the micro control unit MCU.

Referring to table 1, table 1 shows level variations between communication nodes of the on-board communication circuits of fig. 2a and 2 b. In table 1, the high level is "1" and the low level is "0". As CAN be seen from table 1, as long as any one of the transmitting terminals (TX1 or TX2) of the first communication node and the second communication node is at a low level, the receiving terminals (RX1 and RX 2) of the first communication node and the second communication node are both at a low level, and when the transmitting terminals (TX1 and TX2) of the first communication node and the second communication node are both at a high level, the receiving terminals (RX1 and RX 2) of the first communication node and the second communication node are both at a high level, the on-board communication circuits of fig. 2a and 2b CAN achieve the function of CAN communication without using the CAN transceiver of fig. 1a and the CAN signal.

The high level and the low level correspond to "1" and "0" of the digital signal, respectively. The voltage range of the analog signal corresponding to the high level and the voltage range of the analog signal corresponding to the low level do not intersect. For example, the voltage range of the analog signal corresponding to the high level is greater than 2.5V, and the voltage range of the analog signal corresponding to the low level is 0-1.2V.

TABLE 1

First communication node TX1	Second communication node TX2	First communications node RX1	Second communication node RX2
				0	0	0	0
0	1	0	0
				1	0	0	0
1	1	1	1

When the transmitting terminal TX1 of the first communication node 10 is at a low level and the transmitting terminal TX2 of the second communication node 20 is at a low level, the first diode D1 and the second diode D2 in the on-board communication circuit 30 are both turned on, so that the receiving terminal RX1 of the first communication node 10 and the receiving terminal RX2 of the second communication node 20 are both at a low level. As shown in FIG. 2b, it is assumed that the levels of the first power source terminal and the second power source terminal are preset to 3.3V, the voltage range of the analog signal corresponding to the high level is 2.5-10V, and the voltage range of the analog signal corresponding to the low level is 0-1.2V. The transmitting terminal TX1 of the first communication node 10 is at a low level (e.g., 0V), the transmitting terminal TX2 of the second communication node 20 is at a low level (e.g., 0V), and since the cathode of the first diode D1 is at 0V, the anode of the first diode D1 is connected to the voltage 3.3V of the first power source terminal through the first resistor R1, and the first diode D1 is turned on. Similarly, since the cathode of the second diode D2 is 0V, the anode of the second diode D2 is connected to the voltage of the second power source terminal 3.3V through the second resistor R2, and the second diode D1 is turned on. After the first diode D1 and the second diode D2 are both turned on, the receiver level of the communication node is the same as the transmitter level, and IN case that the isolation chip 301 is turned on (i.e., the first input terminal IN1 of the isolation chip 301 is communicated with the first output terminal OUT1, and the second input terminal IN2 is communicated with the second output terminal OUT 2), the receiver RX1 of the first communication node 10 and the receiver RX2 of the second communication node 20 are both low level.

When the transmitting terminal TX1 of the first communication node 10 is at a low level and the transmitting terminal TX2 of the second communication node 20 is at a high level, the first diode D1, the second diode D2, the third diode D3 and the fourth diode D4 of the on-board communication circuit 30 are turned on, so that the receiving terminals RX1 of the first communication node 10 and RX2 of the second communication node 20 are both at a low level. As shown in FIG. 2b, it is assumed that the levels of the first power source terminal and the second power source terminal are preset to 3.3V, the voltage range of the analog signal corresponding to the high level is 2.5-10V, and the voltage range of the analog signal corresponding to the low level is 0-1.2V. The transmitting terminal TX1 of the first communication node 10 is at a low level (e.g., 0V), i.e., the voltage of the cathode 32 of the first diode D1 is "0", and the transmitting terminal TX2 of the second communication node 20 is at a high level (e.g., 5V), i.e., the voltage of the cathode 42 of the second diode D2 is "5V". Since the cathode of the first diode D1 is 0V, and the anode of the first diode D1 is connected to the voltage of the first power source terminal 3.3V through the first resistor R1, the first diode D1 is turned on, and since the on-state voltage drop of the diode is generally 0.2 to 0.7V, the anode voltage of the first diode D1 is 0.2 to 0.7V. Since the cathode of the second diode D2 is 5V, and the anode of the second diode D2 is connected to the voltage of the second power source terminal 3.3V through the second resistor R2, the second diode D2 is not turned on, and the anode of the second diode D2 is 3.3V. Since the voltage of the anode of the third diode D3 is the same as that of the anode of the first diode D1, and is 0.2-0.7V, the cathode of the third diode D3 is connected to the anode (3.3V) of the second diode D2 through the isolation chip 301, and the third diode D3 is not turned on. The positive electrode of the fourth diode D4 and the positive electrode of the second diode D2 are both at the same voltage of 3.3V, and the negative electrode of the fourth diode D4 is connected to the positive electrode (0.2-0.7V) of the first diode D1 through the isolation chip 301, so that the fourth diode D4 is turned on. When the first diode D1 is turned on, the RX1 level of the first communication node 10 is the same as the TX1 level, and is low; when the second diode D2 is not conducting, the fourth diode D4 is conducting, the first diode D1 is conducting, the receiving terminal RX1 of the first communication node 10 transmits the low level to the receiving terminal RX2 of the second communication node 20 through the second input terminal IN2 of the isolation chip 301, the second output terminal OUT2 of the isolation chip 301, and the fourth diode D4, and the receiving terminal RX2 of the second communication node 20 is also low level.

When the transmitting terminal TX1 of the first communication node 10 is at a high level and the transmitting terminal TX2 of the second communication node 20 is at a low level, the first diode D1, the second diode D2, the third diode D3 and the fourth diode D4 in the on-board communication circuit 30 are not conductive, so that the receiving terminals RX1 of the first communication node 10 and RX2 of the second communication node 20 are both at a low level. As shown in FIG. 2b, it is assumed that the levels of the first power source terminal and the second power source terminal are preset to 3.3V, the voltage range of the analog signal corresponding to the high level is 2.5-10V, and the voltage range of the analog signal corresponding to the low level is 0-1.2V. The transmitting terminal TX1 of the first communication node 10 is at a high level (e.g., 5V), i.e., the voltage of the cathode 32 of the first diode D1 is "5V", and the transmitting terminal TX2 of the second communication node 20 is at a low level (e.g., 0V), i.e., the voltage of the cathode 42 of the second diode D2 is "0V". Since the cathode of the first diode D1 is 5V, the anode of the first diode D1 is connected to the voltage of the first power source terminal 3.3V through the first resistor R1, the first diode D1 is not turned on, and the anode of the first diode D1 is 3.3V. Since the cathode of the second diode D2 is 0V, and the anode of the second diode D2 is connected to the voltage of the second power supply terminal by 3.3V through the second resistor R2, the second diode D2 is turned on, and since the on-state voltage drop of the diode is generally 0.2 to 0.7V, the anode voltage of the second diode D2 is 0.2 to 0.7V. Since the voltage of the anode of the third diode D3 is the same as that of the anode of the first diode D1, both of which are 3.3V, the cathode of the third diode D3 is connected to the anode (0.2-0.7V) of the second diode D2 through the isolation chip 301, and then the third diode D3 is turned on. The positive electrode of the fourth diode D4 and the positive electrode of the second diode D2 are both at the same voltage of 0.2-0.7V, and the negative electrode of the fourth diode D4 is connected to the positive electrode (3.3V) of the first diode D1 through the isolation chip 301, so that the fourth diode D4 is not turned on. When the second diode D2 is turned on, both the transmitter TX2 and the receiver RX2 of the second communication node 20 are at a low level. Since the third diode D3 is turned on, the receiving terminal RX2 of the second communication node 20 transmits a low level to the receiving terminal RX1 of the first communication node 10 through the first input terminal IN1 of the isolation chip 301, the first output terminal OUT1 of the isolation chip 301, and the third diode D3, and the receiving terminal RX1 of the first communication node 10 is also at a low level.

When the transmitting terminal TX1 of the first communication node 10 and the transmitting terminal TX2 of the second communication node 20 are both at high level, the first diode D1 and the second diode D2 in the on-board communication circuit 30 are both non-conductive, so that the receiving terminal RX1 of the first communication node 10 and the receiving terminal RX2 of the second communication node 20 are both at high level. As shown in FIG. 2b, it is assumed that the levels of the first power source terminal and the second power source terminal are preset to 3.3V, the voltage range of the analog signal corresponding to the high level is 2.5-10V, and the voltage range of the analog signal corresponding to the low level is 0-1.2V. The transmitting terminal TX1 of the first communication node 10 and the transmitting terminal TX2 of the second communication node 20 are both high (e.g., 5V), i.e., the voltage of the cathode 32 of the first diode D1 is "5V", and similarly, the voltage of the cathode 42 of the second diode D2 is "V". The anode of the first diode D1 is connected to the voltage of the first power source terminal 3.3V through the first resistor R1, so that the first diode D1 is not turned on, and the anode of the first diode D1 has a voltage of 3.3V. Similarly, the anode of the second diode D2 is connected to the voltage of the second power terminal 3.3V through the second resistor R2, so that the second diode D2 is not turned on and the anode of the second diode D2 has a voltage of 3.3V. At this time, the receiving end RX1 of the first communication node 10 and the receiving end RX2 of the second communication node 20 are both 3.3V, i.e. high.

In the embodiment of the application, the on-board communication circuit CAN be used for realizing the on-board CAN communication between two communication nodes under the condition that the communication nodes in the board are not additionally provided with the CAN transceiver, so that the hardware cost is reduced. The embodiment of the utility model provides a mainly explain inboard communication circuit's structure and theory of operation, set forth the optional means of optimizing inboard communication circuit next.

Optionally, please refer to fig. 3, fig. 3 is obtained by further optimization based on fig. 2a, and fig. 3 is a schematic structural diagram of another on-board communication circuit disclosed in the embodiment of the present invention. As shown in fig. 3, the on-board communication circuit described in this embodiment further includes: a first filter circuit and a second filter circuit; a first end 11 of the first resistor R1 is connected to a receiving end RX1 of the first communication node 10 through a first filter circuit; the first terminal 21 of the second resistor R2 is connected to the receiving terminal RX2 of the second communication node 20 through a second filter circuit. Wherein:

the first filter circuit comprises a third resistor R3 and a first capacitor C1, and the second filter circuit comprises a fourth resistor R4 and a second capacitor C2; the first end 71 of the first capacitor C1 is connected to the first end 51 of the third resistor R3 and the receiving end RX1 of the first communication node 10, the second end 72 of the first capacitor C1 is connected to the first ground, and the second end 52 of the third resistor R3 is connected to the first end 11 of the first resistor R1; the first terminal 81 of the second capacitor C2 is connected to the second terminal 62 of the fourth resistor R4 and the receiving terminal RX2 of the second communication node 20, the second terminal 82 of the second capacitor C2 is connected to the second ground terminal, and the first terminal 61 of the fourth resistor R4 is connected to the first terminal 21 of the second resistor R2.

When communication is carried out between the communication nodes, the receiving end of each communication node is possibly interfered by various factors and is difficult to receive pure signals, and the first filter circuit and the second filter circuit are high in anti-interference performance, so that the on-board communication circuit CAN not only realize on-board CAN communication between the communication nodes, but also reduce interference signals possibly received by the receiving end of each communication node and realize more accurate on-board CAN communication.

Optionally, the first filter circuit and the second filter circuit may be added on the basis of fig. 2b, and the specific principle is similar to that in fig. 3, and is not described here again.

Please refer to fig. 4, fig. 4 is a schematic structural diagram of an on-board communication device according to an embodiment of the present invention. As shown in fig. 4, the on-board communication apparatus described in the present embodiment includes a first communication node 10, a second communication node 20, and an on-board communication circuit 30 shown in any one of fig. 2a, 2b, or 3. Wherein:

the grounding terminal 103 of the first communication node 10 is connected to a third grounding terminal, the grounding terminal 203 of the second communication node 20 is connected to a fourth grounding terminal, and the third grounding terminal is different from the fourth grounding terminal;

the power supply terminal 104 of the first communication node 10 is connected to a first auxiliary power supply, and the power supply terminal 204 of the second communication node 20 is connected to a second auxiliary power supply;

the first communication node 10 and the second communication node 20 each comprise a micro control unit MCU and a CAN controller.

In this embodiment of the application, the MCU in the first communication node 10 and the MCU in the second communication node 20 may be the same MCU or different MCUs.

In the embodiment of the application, the MCU and the CAN controller are connected with each other and cooperatively work to form a communication node together. Two communication nodes in the on-board communication device realize the on-board CAN communication of different grounds (namely the third ground and the fourth ground are not the same ground) through the on-board communication circuit.

Please refer to fig. 5, fig. 5 is a schematic structural diagram of another on-board communication device according to an embodiment of the present invention. As shown in fig. 5, the on-board communication apparatus described in the present embodiment includes a first communication node 10, a second communication node 20, and an on-board communication circuit 30 shown in any one of fig. 2a, 2b, or 3. Wherein:

the first communication node 10 and the second communication node 20 both comprise a Micro Control Unit (MCU) which is integrated with a CAN controller.

In the embodiment of the application, the CAN controller is integrated in the MCU, and the MCU CAN directly form a communication node. Two communication nodes in the on-board communication device realize the on-board CAN communication of different grounds (namely the third ground and the fourth ground are not the same ground) through the on-board communication circuit.

The in-board communication circuit and the in-board communication device provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by applying specific examples, and the descriptions of the above embodiments are only used to help understand the method and the core ideas of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.

Claims

1. An on-board communication circuit for enabling on-board communication between a first communication node and a second communication node, the on-board communication circuit comprising a first diode, a second diode, a first resistor, a second resistor, and an isolation chip;

2. The on-board communication circuit of claim 1, further comprising a third diode and a fourth diode, wherein an anode of the third diode is connected to the receiving end of the first communication node, and an anode of the fourth diode is connected to the receiving end of the second communication node;

3. The on-board communication circuit according to claim 1 or 2, wherein the on-board communication circuit further comprises a first filter circuit; and the first end of the first resistor is connected with the receiving end of the first communication node through the first filter circuit.

4. The on-board communication circuit of claim 3, wherein the first filtering circuit comprises a third resistor and a first capacitor; the first end of the first capacitor is connected with the first end of the third resistor and the receiving end of the first communication node, the second end of the first capacitor is connected with the first ground end, and the second end of the third resistor is connected with the first end of the first resistor.

5. The on-board communication circuit of claim 4, further comprising a second filtering circuit; and the first end of the second resistor is connected with the receiving end of the second communication node through the second filter circuit.

6. The on-board communication circuit of claim 5, wherein the second filtering circuit comprises a fourth resistor and a second capacitor; the first end of the second capacitor is connected with the second end of the fourth resistor and the receiving end of the second communication node, the second end of the second capacitor is connected with the second ground end, and the first end of the fourth resistor is connected with the first end of the second resistor.

7. An on-board communication device, comprising a first communication node, a second communication node and an on-board communication circuit according to any one of claims 1 to 6.

8. The on-board communication device of claim 7, wherein a ground terminal of the first communication node is connected to a third ground terminal, a ground terminal of the second communication node is connected to a fourth ground terminal, and the third ground terminal is different from the fourth ground terminal.

9. The on-board communication device of claim 7, wherein the first communication node and the second communication node each comprise a micro control unit and a CAN controller.

10. The on-board communication device of claim 7, wherein the first communication node and the second communication node each comprise a micro-control unit having a CAN controller integrated therein.