CN212806682U

CN212806682U - Capillary liquid absorption core for phase-change latent heat type chip radiator

Info

Publication number: CN212806682U
Application number: CN202021593548.9U
Authority: CN
Inventors: 李伍
Original assignee: Kunshan Tongchuan Copper Technology Co ltd
Current assignee: Kunshan Tongchuan Copper Technology Co ltd
Priority date: 2020-08-04
Filing date: 2020-08-04
Publication date: 2021-03-26
Anticipated expiration: 2030-08-04

Abstract

The utility model relates to a capillary imbibition core for phase transition latent heat formula chip radiator, including the woven metal mesh, the woven metal mesh includes a plurality of metal mesh layers, the metal mesh layer is including the wire that vertically and horizontally interweaves, the line footpath diverse of wire, working fluid in the chip radiator vaporizes after the heat that the chip produced is absorbed at the heat absorption end of chip radiator, the working fluid of vaporization liquefies after the heat dissipation of chip radiator end is released through the woven metal mesh, the heat absorption end of chip radiator is got back to the working fluid of liquefaction under the capillary action of woven metal mesh. The utility model discloses a scheme of the capillary imbibition core of being made by the wire that the line footpath is different has the higher characteristics of radiating efficiency.

Description

Capillary liquid absorption core for phase-change latent heat type chip radiator

Technical Field

The utility model relates to a capillary imbibition core, in particular to capillary imbibition core for latent heat of phase transition formula chip radiator belongs to the chip and generates heat and the thermal management field.

Background

With the development and popularization of smart phones, cloud computing, big data and artificial intelligence along with the falling of 5G infrastructure, the heating and heat management of electronic product chips are the same as the chips, and the heat management of the chips not only influences the operation speed and stability of the chips and the user experience feeling, but also influences the service life of the chips in a fatal manner. Nanotechnology has been studied in materials in recent years, in particularIn addition, the method makes a breakthrough in the fields of medical treatment, electric solar energy, graphene and the like, and the research on the nano-grade material technology tends to lead the development of the material. Throughout the chip Heat dissipation management, through the development of key technologies such as metal material Heat conduction, Heat pipe, graphite material, and Vapor Chamber, especially the application of the phase change latent Heat technology, the Heat pipe and the Vapor Chamber have become the mainstream of the Heat dissipation design in recent years for high power and high Heat flux density chips. The phase change heat exchange process utilizes the phase change of the working medium under the tiny temperature difference to release a large amount of latent heat, the heat transfer can provide high heat transfer capacity, and the heat conductivity can reach 10 when the phase change is condensed³-10⁵W/m²K, for use in heat source electronic products with high heat flux density and temperature requirements, boiling or evaporation is a very advantageous way to remove heat. At present, the heat dissipation effect of the existing heat radiator adopting working medium phase change heat exchange still needs to be improved.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a capillary imbibition core for latent heat formula chip radiator of phase transition discloses new scheme, adopts the scheme of the capillary imbibition core of being made by the wire that the line footpath is different, has solved the problem that current latent heat formula radiator radiating efficiency of phase transition remains to improve.

The utility model discloses a capillary imbibition core for phase transition latent heat formula chip radiator includes the metal mesh grid, the metal mesh grid includes a plurality of metal mesh layers, the metal mesh layer is including the wire that vertically and horizontally interweaves, the line footpath diverse of wire, working fluid in the chip radiator vaporizes after the heat that the chip produced is absorbed at the heat absorption end of chip radiator, the working fluid of vaporization liquefies after the heat dissipation of chip radiator end is released through the metal mesh grid, the heat absorption end of chip radiator is got back to the working fluid of liquefaction under the capillary action of metal mesh grid.

Furthermore, the material of the metal mesh grid in the scheme is copper or aluminum or stainless steel or titanium.

Furthermore, the metal wire of the scheme is a flat belt-shaped structure, the width of the metal wire is 20-100 μm, and the mesh diameter of the metal mesh layer is 20-100 μm.

Further, the width of the wire of the present solution is 20 μm or 60 μm or 100 μm.

Furthermore, the section of the metal wire in the scheme is circular, the wire diameter of the metal wire is 20-100 mu m, and the mesh diameter of the metal mesh layer is 20-100 mu m.

Further, the wire diameter of the wire of the present embodiment is 20 μm or 60 μm or 100 μm.

Furthermore, the metal wire of the scheme is provided with a plurality of groove structures with the axial extending groove drift diameter and the depth of micro-nano level along the circumferential direction.

Furthermore, the section of the groove structure in the scheme is in a T shape, an omega shape or a delta shape, and the depth of the groove structure is 0.1-1 mu m.

The utility model discloses a capillary imbibition core for phase transition latent heat formula chip radiator adopts the scheme of the capillary imbibition core of being made by the wire that the line footpath is different, has the higher characteristics of radiating efficiency.

Drawings

Figure 1 is a schematic diagram of an example capillary wick.

Figure 2 is a schematic diagram of a second example capillary wick.

Fig. 3 is a schematic diagram of a chip heat sink employing a capillary wick.

Wherein 100 is a heat sink case, 110 is a heat absorbing end, 120 is a heat dissipating end, 121 is a heat dissipating fin, 200 is a capillary wick, 210 is a metal mesh layer, 211 is a flat ribbon-shaped wire, 212 is a wire having a circular cross section, and 300 is a working fluid.

Detailed Description

As shown in fig. 1, 2, 3, the utility model discloses a capillary imbibition core for latent heat of phase transition formula chip radiator includes the metal mesh grid, the metal mesh grid includes a plurality of metal mesh layers, the metal mesh layer includes the wire of vertically and horizontally interweaving, the line footpath diverse of wire, working fluid in the chip radiator vaporizes after the heat that the chip produced is absorbed at the heat absorption end of chip radiator, the working fluid of vaporization liquefies after passing through the heat release of metal mesh grid at the heat dissipation end of chip radiator, the heat absorption end of chip radiator is got back to the working fluid of liquefaction under the capillary effect of metal mesh grid. The material of the woven metal mesh in the scheme can be preferably copper or aluminum or stainless steel or titanium. According to the scheme, the capillary wick is made of metal wires with different wire diameters, the metal wires adopted by the metal net layer are metal wires with different wire diameters, the metal wires are mixed and woven according to the functional requirements to form the wire net of the capillary wick which is compounded and woven in a mixed mode, the metal wires with different wire diameters are woven in different directions of the composite wire net, the capillary resistance and the capillary wick absorbing capacity (capillary force) can be flexibly and changeably applied to the structural design of phase change latent heat products with different structures, particularly long-distance heat transfer is achieved, and the heat dissipation efficiency of the chip heat radiator is improved.

In order to realize the capillary function of the metal mesh layer, the scheme discloses the following two specific structures.

Example one

As shown in FIG. 1, the wire of the present embodiment has a flat band-like structure, the width of the wire is 20 μm to 100 μm, and the mesh diameter of the mesh layer is 20 μm to 100 μm. Based on the above, the width of the wire of the present solution may preferably be 20 μm or 60 μm or 100 μm.

Example two

As shown in FIG. 2, the cross section of the wire in this embodiment is circular, the wire diameter is 20 μm to 100 μm, and the mesh diameter of the mesh layer is 20 μm to 100 μm. Based on the above scheme, the wire diameter of the metal wire in the scheme is 20 μm or 60 μm or 100 μm. In order to further improve the heat exchange effect, a plurality of groove structures with the micro-nano-scale groove drift diameter and depth extending along the axial direction are arranged on the metal wire along the circumferential direction. Based on the scheme, the section of the groove structure in the scheme is in a T shape, an omega shape or a delta shape, and the depth of the groove structure is 0.1-1 mu m.

The woven mesh of the above example is made of a material suitable for a wire mesh of copper, aluminum, stainless steel, titanium, or the like, but is not limited to the listed metal materials. The wire used for the woven mesh is not limited by its wire diameter or physical shape, the wire diameter of the wire is not limited by the listed dimensions, and the mesh layer is formed by interlacing wires having different wire diameters in a criss-cross manner. The trench structure is not limited to the above shape limitations, as well as the enumerated dimensional range limitations. The metal wires of the metal mesh layer can be arranged in parallel or staggered mode, and the metal woven mesh can comprise a single metal mesh layer or a plurality of metal mesh layers.

The scheme discloses a capillary wick for latent heat of phase change formula chip radiator, the metal mesh layer that capillary wick adopted is the compound mixed silk screen of weaving that forms that selects for use the wire that has different line footpaths to weave, can show to promote its capillary power, especially long distance capillary backward flow design, has better heat transfer effect.

The present solution of capillary wicks is not limited to that disclosed in the specific embodiments, the technical solutions presented in the examples can be extended based on the understanding of the person skilled in the art, and simple alternatives made by the person skilled in the art in light of the present solution in combination with common general knowledge also fall within the scope of the present solution.

Claims

1. The capillary wick for the phase-change latent heat type chip radiator is characterized by comprising a metal woven net, wherein the metal woven net comprises a plurality of metal net layers, each metal net layer comprises metal wires which are interwoven in a longitudinal and transverse mode, the wire diameters of the metal wires are different, working fluid in the chip radiator is vaporized after absorbing heat generated by a chip at a heat absorption end of the chip radiator, the vaporized working fluid is liquefied after releasing heat at a heat dissipation end of the chip radiator through the metal woven net, and the liquefied working fluid returns to the heat absorption end of the chip radiator under the action of capillary force of the metal woven net.

2. A capillary wick for a phase change latent heat chip heat sink according to claim 1, wherein the woven metal mesh is copper or aluminum or stainless steel or titanium.

3. A capillary wick for a phase change latent heat chip heat sink according to claim 1, wherein said metal wire is a flat ribbon structure, said metal wire has a width of 20 to 100 μm, and said metal mesh layer has a mesh diameter of 20 to 100 μm.

4. Capillary wick for a phase change latent heat chip heat sink according to claim 3, wherein said metal wire has a width of 20 μm or 60 μm or 100 μm.

5. A capillary wick for a phase change latent heat chip heat sink according to claim 1, wherein said wire has a circular cross-section, a wire diameter of said wire is 20 to 100 μm, and a mesh diameter of said mesh layer is 20 to 100 μm.

6. A capillary wick for a latent phase change chip heat sink according to claim 5, wherein the wire diameter of the wire is 20 μm or 60 μm or 100 μm.

7. A capillary wick for a phase change latent heat chip heat sink according to claim 5, wherein the wire has a plurality of axially extending grooves of a channel diameter and depth on the order of a micro-nanometer along a circumferential direction.

8. A capillary wick for a phase change latent heat chip heat sink according to claim 7, wherein the cross-section of the groove structure is "T" or "Ω" or "Δ" and the depth of the groove structure is 0.1 μm to 1 μm.