CN212800545U

CN212800545U - Metal net

Info

Publication number: CN212800545U
Application number: CN202020701433.0U
Authority: CN
Inventors: 许议文; 李谟霖; 黄昱豪; 林家盟
Original assignee: Jialianyi Tech Suzhou Co ltd; Career Electronic Kunshan Co ltd
Current assignee: Jialianyi Tech Suzhou Co ltd; Career Electronic Kunshan Co ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2021-03-26
Anticipated expiration: 2030-04-30

Abstract

A metal mesh includes a metal substrate having a mesh pattern; and a metal layer covering the metal substrate. Thus, a metal net with thinner overall thickness is formed. In addition, by forming the metal layer to cover the metal base material, the size of the openings in the formed metal mesh can be controlled by controlling the forming thickness of the metal layer. The metal net can be applied to a desired place by transferring the carrier, for example, the metal net can be transferred to an electronic product for heat dissipation.

Description

Metal net

Technical Field

The utility model relates to a metal mesh, in particular to a thin metal mesh.

Background

The traditional metal net is generally formed into a woven metal net in a weaving mode during manufacturing. However, the specification of the metal mesh manufactured by the weaving method is limited by the diameter of the metal wire and the process bottleneck, and the metal mesh cannot be made thinner in thickness and denser in density.

For example, if the metal mesh is formed by a weaving method, since each metal wire will produce an area with overlapping interweaving during the weaving process, the thickness of the area will be twice as thick as the metal wire, so that the overall thickness is limited by the thickness of the metal wire, and cannot be thinner.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a metal mesh, include: a metal substrate and a metal layer. The metal substrate has a mesh pattern. The metal layer covers the metal substrate.

Thus, a metal net with thinner overall thickness is formed. In addition, by forming the metal layer to cover the metal base material, the size of the openings in the formed metal mesh can be controlled by controlling the forming thickness of the metal layer. The metal net can be applied to a desired place by transferring the carrier, for example, by using a PET sheet as the carrier, and the metal net can be transferred to an electronic product for heat dissipation.

In some embodiments, the metal mesh has a thickness of 5 to 50 μm.

In some embodiments, the metal mesh has a plurality of openings, and the minimum diameter of the openings is greater than or equal to 10 μm.

In some embodiments, the metal mesh has a plurality of openings, and a center distance between adjacent openings is greater than or equal to 30 μm.

In another embodiment, the expanded metal is made by a method of expanded metal manufacturing comprising the steps of: providing a substrate; forming a metal base material without a net-shaped pattern on the surface of the substrate; covering the photoresist layer on the metal base material without the net-shaped pattern, and forming the net-shaped pattern on the photoresist layer through exposure and development processes; performing an etching process to remove the metal substrate not covered by the photoresist layer; removing the photoresist layer; forming a metal layer to cover the metal substrate; and peeling from the substrate to form a metal mesh.

In yet another embodiment, the expanded metal is made by a method of expanded metal manufacturing comprising the steps of: providing a substrate with a first surface and a second surface which are opposite; respectively forming a metal base material without a net-shaped pattern on the first surface and the second surface of the substrate; covering a photoresist layer on each metal substrate without the mesh pattern, and forming the mesh pattern on each photoresist layer through exposure and development processes; performing an etching process to remove the metal substrate not covered by the photoresist layer; removing the photoresist layer; forming a metal layer to cover each metal substrate; and stripping from the substrate to form two metal nets.

By the manufacturing method, the problem that the thickness of the metal wire interweaving and overlapping area is thickened in the traditional metal wire weaving process is solved because the image transfer process is matched with the etching and forming process, so that the whole thickness can be thinner. In addition, the metal layer is formed after the photoresistive layer is removed to cover the metal substrate, and the size of the opening on the formed metal mesh can be controlled by controlling the forming thickness of the metal layer. Furthermore, the metal meshes with the same or different specifications can be manufactured on the two sides of the substrate, so that the yield is improved, and the manufacturing time is shortened.

In some embodiments, the metal layer is formed by electroplating and covers the metal substrate.

In some embodiments, the metal layer is formed by chemical deposition and covers the metal substrate.

In some embodiments, the metal substrate and the metal layer are formed using the same metal.

In some embodiments, the mesh pattern of the first surface side is different from the mesh pattern of the second surface side.

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.

Drawings

Fig. 1 is a schematic structural diagram (one) of a method for manufacturing a metal mesh according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram (ii) of a method for manufacturing a metal mesh according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram (iii) of a method for manufacturing a metal mesh according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram (iv) of a method for manufacturing a metal mesh according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram (v) of a method for manufacturing a metal mesh according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram (vi) of a method for manufacturing a metal mesh according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram (seven) of a method for manufacturing a metal mesh according to an embodiment of the present invention;

fig. 8 is a flow chart of a method of manufacturing a metal mesh according to an embodiment of the present invention; and

fig. 9 is a partially enlarged schematic view of a metal mesh according to an embodiment of the present invention.

Wherein the reference numerals

100: metal net

10 base plate

11 first surface

12 second surface

20 metal base material

30 photoresist layer

31, slotting

40 metal layer

50, opening a hole

Distance D

d center distance

t is thickness

Diameter of hole

Step S10, providing a substrate

Step S12, forming metal base material on the first surface and the second surface of the substrate respectively

Step S14, covering a photoresist layer on each metal substrate, exposing and developing to form a mesh pattern on each photoresist layer

Step S16, an etching process is performed to remove the metal substrate not covered by the photoresist layer

Step S18 for removing the photoresist layer

Step S20, forming a metal layer to cover the metal substrate

Step S22 of peeling off the substrate to form two metal nets

Detailed Description

The following describes the structural and operational principles of the present invention in detail with reference to the accompanying drawings:

referring to fig. 1 to 8, fig. 1 to 7 are schematic structural diagrams (a) to (seventh) illustrating a method for manufacturing a metal mesh according to an embodiment of the present invention, and fig. 8 is a flowchart illustrating the method for manufacturing the metal mesh according to the embodiment of the present invention. As shown in fig. 1 and 8, the method for manufacturing a metal mesh 100 (for example, as shown in fig. 9) of the present embodiment includes providing a substrate 10 (step S10), where the substrate 10 has a first surface 11 and a second surface 12 opposite to each other.

Next, the metal base 20 is formed on the first surface 11 and the second surface 12 of the substrate 10, respectively (step S12). As shown in fig. 2, in the present embodiment, the peelable metal base material 20 is formed on the first surface 11 and the second surface 12 of the substrate 10, which are located at two opposite sides, respectively, but in other implementation forms, the metal base material 20 may be formed only on the first surface 11 or the second surface 12 of the substrate 10. That is, the metal nets 100 of the same or different specifications may be simultaneously manufactured by using the first surface 11 and the second surface 12 of the substrate 10, or the metal nets 100 may be manufactured by using only a single side surface.

The metal base material 20 to be formed may be any pure metal material or composite metal material, and a suitable metal material may be selected according to the intended use. For example, in the present embodiment, the metal mesh 100 is applied to heat dissipation of electronic components, and therefore copper is taken as an example for material selection.

Referring to fig. 3 and 8, a photoresist layer 30 is covered on each metal substrate 20, and each photoresist layer 30 is patterned into a mesh pattern by exposure and development processes (step S14). The covering of the photoresist layer 30 and the formation of the mesh pattern by the exposure and development processes are performed by using the conventional processes, such as the photolithography process applied to the circuit board, the formation of the photoresist layer by attaching the dry film photoresist or the formation of the photoresist layer by coating the wet film photoresist, and the formation of the desired mesh pattern by the positive photoresist or the negative photoresist technique, which will not be described herein again. The mesh pattern to be formed may be designed according to the specification of the metal mesh 100 to be finally formed. For example, as shown in fig. 3, a plurality of slots 31 are formed in the photoresist layer 30, and the slots 31 correspond to positions where openings 50 are to be formed in the metal mesh 100. And each slot 31 may be designed in shape, spacing, etc. depending on the desired size of the opening 50. Further, the mesh patterns formed on the first surface 11 side and the second surface 12 side may be the same or different mesh patterns according to requirements.

Referring to fig. 4 and 8, after step S14, an etching process is performed to remove the metal substrate 20 not covered by the photoresist layer 30 (step S16). As shown in fig. 4, after the etching process, the metal base material 20 not covered by the photoresist layer 30 is removed from the substrate 10, and only the metal base material 20 of the metal mesh 100 to be formed remains.

Referring to fig. 5 and 8, after step S16, step S18 is performed: the photoresist layer 30 is removed. As can be seen from fig. 5, after removing the photoresist layer 30, the metal base material 20 forming the desired mesh pattern is left on the substrate 10.

As shown in fig. 6 and 8, after step S18, step S20 is executed: a metal layer 40 is formed to cover the metal substrate 20. In the present embodiment, the metal layer40 is formed by electroplating and covers the metal base material 20. In other embodiments, the metal substrate 20 may be formed and coated by chemical deposition. The thickness of the metal layer 40 can be controlled by electroplating or chemical deposition to form the required thickness of the metal mesh 100, and the distance D between the slots 31 in the mesh pattern, i.e. the diameter of the holes 50 on the metal mesh 100 to be formed

Size (see fig. 9). Thus, the size of the opening 50 can be not limited to the bottleneck of the mesh pattern in step S14, and the diameter of the opening 50 can be reduced by controlling the thickness of the metal layer 40 by electroplating or chemical deposition

To achieve the desired pore size

And (4) size.

The metal material used for forming the metal layer 40 may be the same metal material as the metal base 20 or may be a different metal material. The metal layer 40 may be formed of any suitable metal according to the application requirements.

Finally, as shown in fig. 7 and 8, after the step S20, the step S22 is executed: peeled from the substrate 10 to form two metal meshes 100. The metal mesh 100 peeled from the substrate 10 may be transferred to a carrier (e.g., a PET sheet) and then applied as required.

Through the process, the image transfer process is matched with the etching and forming process, so that the problem that the thickness of the metal wire interweaving and overlapping area is thickened in the traditional metal wire weaving process is solved, and the overall thickness can be thinner. In addition, by forming the metal layer 40 to cover the metal substrate 20 after removing the photoresist layer 30, the aperture of the opening 50 on the metal mesh 100 can be controlled by controlling the forming thickness of the metal layer 40

Further, the metal nets 100 of the same or different specifications may be formed on both sides of the substrate 10, so that the yield may be improved.

Next, referring to fig. 7 and 9, fig. 9 is a partially enlarged schematic view of a metal mesh according to an embodiment of the present invention. The metal mesh 100 formed by the aforementioned manufacturing method in this embodiment includes a metal substrate 20 and a metal layer 40. The metal base material 20 has a mesh pattern. The metal layer 40 covers the metal base material 20.

The thickness t of the metal mesh 100 is 5 to 50 μm. The thickness t is the total thickness of the metal mesh 100, i.e. the sum of the metal base material 20 and the metal layer 40. Since the wire diameter of the existing metal wires is about 0.025mm in the minimum dimension, if the metal wires of this dimension are woven to form a metal mesh, the thickness of the metal mesh in the overlapping area will be at least 0.05mm (50 μm). The thickness t of the metal net 100 manufactured by the manufacturing method of the present embodiment can be less than 50 μm, even to 5 μm, which is much smaller than the thickness that can be achieved by weaving the metal wires, so that the overall thickness of the metal net 100 can be thinner.

In addition, as shown in fig. 9, the metal mesh 100 formed in the present embodiment has a plurality of openings 50, and the shape of the openings 50 is circular, but the present invention is not limited thereto. The shape of the opening 50 may be any shape, such as rectangular, polygonal, etc. The minimum aperture of the opening 50 formed by the above-mentioned manufacturing method

It is 10 μm or more. Actual pore diameter

The size can be designed as desired, and as mentioned above, the aperture of the opening 50 can be changed by adjusting the thickness of the metal layer 40 by adjusting the plating time or the chemical deposition time

The size of the particles can reach the specification of 10 μm.

Further, the center distance d between the adjacent openings 50 of the metal mesh 100 is not less than 30 μm. Likewise, the center distance d between adjacent openings 50 can also be adjusted as desired. The metal mesh 100 formed by the manufacturing method of the present embodiment can achieve a minimum center-to-center distance d of 30 μm between adjacent openings 50.

Naturally, the present invention can be embodied in many other forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be made by one skilled in the art without departing from the spirit or essential attributes thereof, and it is intended that all such changes and modifications be considered as within the scope of the appended claims.

Claims

1. A metal mesh, comprising:

a metal substrate having a mesh pattern; and

a metal layer covering the metal substrate.

2. The metal mesh as set forth in claim 1, wherein the metal mesh has a thickness of 5 to 50 μm.

3. The expanded metal of claim 1, wherein the expanded metal has a plurality of openings, and the minimum diameter of the openings is 10 μm or more.

4. The expanded metal of claim 1, wherein the expanded metal has a plurality of openings, and a center distance between adjacent openings is greater than or equal to 30 μm.

5. The metal netting of claim 1, wherein the metal layer is formed by electroplating and covers the metal substrate.

6. The metal netting of claim 1 wherein the metal layer is formed by chemical deposition and covers the metal substrate.

7. The metal netting of claim 1, wherein the metal substrate and the metal layer are formed using the same metal.