CN212793019U - Three-dimensional direct-writing forming temperature monitoring system suitable for semi-solid metal melting - Google Patents
Three-dimensional direct-writing forming temperature monitoring system suitable for semi-solid metal melting Download PDFInfo
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- CN212793019U CN212793019U CN202020476198.1U CN202020476198U CN212793019U CN 212793019 U CN212793019 U CN 212793019U CN 202020476198 U CN202020476198 U CN 202020476198U CN 212793019 U CN212793019 U CN 212793019U
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Abstract
The application discloses be applicable to three-dimensional direct-write forming temperature monitoring system of semi-solid metal melting, this system has included thermocouple following installation device, infrared camera device, base plate temperature control device, molten metal temperature monitoring device, data transmission device and backstage data processing center. The thermocouple following installation device can monitor the temperature of any layer and specified position in the three-dimensional direct writing forming process of semi-solid metal melting in real time; the infrared camera device is used for acquiring the global temperature of the surface of the current layer; the substrate temperature control device is used for acquiring and adjusting the temperature of the formed substrate; the molten metal temperature monitoring device is used for acquiring the temperature of the semi-solid metal slurry; the data transmission device transmits the acquired temperature data to the background data processing center; the background data processing center is used for analyzing and processing the temperature in real time, providing decision basis for adjusting the semisolid forming process and producing a part product object with higher precision and better quality.
Description
Technical Field
The application relates to a temperature detection system for semi-solid metal melting three-dimensional direct-writing forming, and belongs to the field of metal additive manufacturing.
Background
The method is to deposit liquid metal on a substrate layer by layer according to a specified path to obtain a three-dimensional metal part. The high-performance flexible composite material has the characteristics of high efficiency, low cost, flexibility and greenness, and is widely applied to rapid and direct manufacturing of high-performance and complex-structure parts in high-end fields such as aviation, aerospace, military, medical treatment and the like at present.
The semi-solid forming is a novel technology developed in recent years, and has the advantages of lower forming temperature of materials, high dimensional precision of obtained parts, less material waste and realization of near-net forming. The temperature control of the semi-solid forming is a relatively critical process parameter, for example, the temperature control precision requirement of a forming substrate is +/-5 ℃, the temperature control precision of the semi-solid metal forming melting temperature is +/-3 ℃, and the detection control of the overall temperature is required, including the temperature of the forming substrate, the forming metal melting temperature and the temperatures of different layers and different areas in the forming process. The semi-solid process requires real-time analysis, feedback and control of the detected temperature to optimize process parameters and improve the forming quality of a formed part.
Disclosure of Invention
In order to solve the problem that temperature parameter is difficult to comprehensive, directly acquire in the semi-solid melting direct-writing technological process of metal, improve the precision of taking shape, the utility model aims to provide a temperature monitoring system suitable for semi-solid melting three-dimensional direct-writing takes shape.
The utility model discloses a three-dimensional direct-write forming temperature monitoring system suitable for semi-solid metal melting on one hand, including thermocouple follow installation device, infrared camera device, base plate temperature control device, molten metal temperature measurement device, data transmission device and backstage data processing center.
The thermocouple following installation device is arranged on the side of the forming platform and is flush with the initial position of the forming platform, real-time temperature monitoring can be carried out on any layer and an appointed position in the three-dimensional direct writing process of semi-solid metal melting, temperature data are sent to a background data processing center through a data transmission device, and a process temperature interval is controlled to be in a semi-solid metal forming effective interval
The infrared camera device is arranged at the top of the forming platform and used for shooting according to set time to obtain the global temperature in the direct writing process.
The substrate temperature control device is arranged in the substrate and can be used for acquiring and adjusting the temperature of the formed substrate; the forming device comprises a thermocouple preset in a forming substrate and a heating coil at the bottom of the forming substrate; and the thermocouple in the forming substrate detects the temperature of the forming substrate, is used for judging whether the temperature of the forming substrate is at a process safety threshold value or not, and triggers a forming substrate heating coil switch to heat or stop heating when the judgment result is negative.
The molten metal temperature measuring device is arranged on thermocouples arranged on the inner side of the crucible from top to bottom and used for acquiring the temperature of the molten metal and judging whether the temperature of the molten metal is in a semi-solid forming temperature range, and when the judgment result is negative, alarming is carried out and feedback adjustment can be carried out according to the set temperature.
The data transmission device is connected with the thermocouple following installation device, the infrared camera device and the molten metal temperature measuring device and is used for sending the temperature data to the background data processing center; and the background data processing center is used for analyzing and processing the temperature in real time and judging whether the current temperature range is in the temperature range of the semi-solid forming process or not according to the temperature measured by the thermocouple and the infrared camera device.
The embodiment of the application discloses three-dimensional direct-writing forming temperature monitoring system suitable for semi-solid metal melting, which comprises a thermocouple following installation device, an infrared camera device, a substrate temperature control device, a molten metal temperature measuring device, a data transmission device and a background data processing center. The thermocouple is arranged on the side of the forming platform along with the mounting device, and can monitor the temperature of any layer and specified position in the three-dimensional direct writing process of semi-solid metal melting in real time; the infrared camera device is arranged at the top of the forming platform and used for acquiring the global temperature of the surface of the current layer of the formed part in the forming process of the metal melting three-dimensional direct-writing semi-solid forming piece; the substrate temperature control device is arranged in the forming substrate and used for acquiring the temperature information in the forming substrate, judging whether the temperature information is in a process safety threshold value or not and feeding back and adjusting the heating temperature of the forming substrate; the molten metal temperature measuring device is arranged in the crucible and used for acquiring the molten metal temperature information in the crucible and judging whether the molten metal temperature information is in a semi-solid forming temperature range. And each temperature measuring device is connected with the data transmission device and used for sending the temperature information to the background data processing center for temperature analysis processing, recording the historical temperatures of the thermocouple and the infrared camera device and generating a temperature process report. The method and the device are based on various temperature measuring modes, the temperature parameters in the semi-solid metal melting direct-writing forming process are obtained in real time, whether the current temperature parameters are in the semi-solid forming interval or not is judged through temperature data analysis, automatic measurement of the melting direct-writing temperature is achieved, and forming accuracy is improved.
Drawings
Fig. 1 is a schematic flow chart of a temperature monitoring system applied to three-dimensional direct-writing forming of semi-solid metal melting according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a temperature monitoring system applied to semi-solid melting three-dimensional direct writing forming of aluminum alloy according to an embodiment of the present invention.
Detailed Description
In order to solve the problem that temperature parameters are difficult to obtain in the process of metal semi-solid melting direct-writing technology and improve forming precision, the application discloses a temperature monitoring system suitable for semi-solid melting three-dimensional direct-writing forming through the following embodiments.
Example 1
Referring to fig. 1, the present embodiment is a temperature monitoring system suitable for three-dimensional direct-writing forming of semi-solid metal melting, taking temperature monitoring of a356 semi-solid aluminum alloy melting three-dimensional direct-writing as an example, the monitoring system includes a thermocouple following installation device 1, an infrared camera device 2, a substrate temperature control device 3, a molten metal temperature measurement device 4, a data transmission device 5, and a background data processing center 6.
The thermocouple following installation device 1 is arranged on the side of the forming platform 7 and is flush with the initial position of the forming platform 7, temperature real-time monitoring can be carried out on any layer and specified position in the three-dimensional direct writing process of semi-solid metal melting, temperature data are sent to the background data processing center 6 through the data transmission device 5, and the process temperature interval is controlled in the effective semi-solid aluminum alloy forming interval 574-630 ℃.
The infrared camera device 2 is arranged at the top of the forming platform 7 and used for acquiring the surface global temperature of the current layer of the part forming in the forming process of the metal melting three-dimensional direct-writing semi-solid forming piece.
The substrate temperature control device 3 includes a thermocouple provided inside the molding substrate 8 and a heating coil provided at the bottom of the molding substrate 8. The thermocouple in the forming substrate 8 detects the temperature of the forming substrate 8, and is used for judging whether the temperature of the forming substrate 8 is at a process safety threshold of 150-.
The molten metal temperature measuring device 4 is arranged on the inner side of the crucible 9 and used for acquiring the real-time temperature information of the molten metal liquid in the crucible 9 and judging whether the molten metal liquid is in a semi-solid forming temperature range of 630 +/-3 ℃.
And the data transmission device 5 is connected with the thermocouple following installation device 1, the infrared camera device 2 and the molten metal temperature measurement device 4, and is used for sending the temperature data information to the background data processing center 6, carrying out temperature analysis processing, recording the historical temperatures of the thermocouple and the infrared camera device 2, and generating a temperature process report.
The background data processing center 6 is used for analyzing and processing the temperature in real time, and judging whether the current temperature range is in the temperature range of the semi-solid forming process or not according to the temperature measured by the thermocouple and the infrared camera device 2.
While the present application has been described in detail with reference to specific embodiments and illustrative examples, the foregoing is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and variations can be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The utility model provides a be applicable to three-dimensional direct-write of semi-solid metal melting and take shape temperature monitoring system which characterized in that, includes thermocouple follow installation device (1), infrared camera device (2), base plate temperature control device (3), molten metal temperature survey device (4), data transmission device (5) and backstage data processing center (6):
the thermocouple following installation device (1) is arranged on the side of the forming platform (7) and is flush with the initial position of the forming platform (7), and is used for arranging thermocouples according to set time and set positions according to a metal melting three-dimensional direct writing process to obtain continuous data of forming temperature of each layer;
the infrared camera device (2) is arranged at the top of the forming platform (7) and is used for acquiring the global temperature of the surface of the current layer;
the substrate temperature control device (3) is arranged in the forming substrate (8) and can be used for acquiring and adjusting the temperature of the forming substrate (8);
the molten metal temperature measuring device (4) is arranged on the inner side of the crucible (9) and is used for acquiring the real-time temperature of molten metal;
the data transmission device (5) is connected with the thermocouple following installation device (1), the infrared camera device (2) and the molten metal temperature measuring device (4) and is used for sending the temperature data to the background data processing center (6);
the background data processing center (6) is used for analyzing and processing the temperature in real time, comprises a data analysis module and a report generation module, and judges and feeds back and adjusts the current temperature range according to the temperature measured by the thermocouple, so that the process temperature is always in a semi-solid forming process temperature range.
2. The system for monitoring the temperature of the semi-solid metal melting three-dimensional direct-writing forming according to claim 1, wherein the thermocouple following installation device (1) can monitor the temperature of any layer and designated position in the semi-solid metal melting three-dimensional direct-writing process in real time, and send the temperature data to the background data processing center (6) through the data transmission device (5), and the process temperature interval is controlled to be in the effective semi-solid metal forming interval.
3. The temperature monitoring system for the semi-solid metal melting three-dimensional direct-writing forming is characterized in that the substrate temperature control device (3) comprises a thermocouple which is preset inside the forming substrate (8) and a heating coil at the bottom of the forming substrate (8);
and the thermocouple in the forming substrate (8) detects the temperature of the forming substrate (8) and is used for judging whether the temperature of the forming substrate (8) is at a process safety threshold value or not, and when the judgment result is negative, feedback regulation of the heating temperature of the forming substrate (8) is carried out, so that the temperature of the forming substrate (8) is always in a metal melting three-dimensional direct-writing forming temperature interval.
4. The system for monitoring the three-dimensional direct-writing forming temperature of semi-solid metal melting according to claim 1, wherein the molten metal temperature measuring device (4) comprises thermocouples arranged from top to bottom inside the crucible (9) and used for judging whether the molten metal temperature is in a semi-solid forming temperature range when the liquid levels are different in height, giving an alarm when the liquid levels are not in the semi-solid forming temperature range, and feeding back and adjusting the temperature according to the set temperature.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020476198.1U CN212793019U (en) | 2020-04-03 | 2020-04-03 | Three-dimensional direct-writing forming temperature monitoring system suitable for semi-solid metal melting |
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| CN202020476198.1U CN212793019U (en) | 2020-04-03 | 2020-04-03 | Three-dimensional direct-writing forming temperature monitoring system suitable for semi-solid metal melting |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111570794A (en) * | 2020-04-03 | 2020-08-25 | 北京机科国创轻量化科学研究院有限公司 | System and method suitable for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111570794A (en) * | 2020-04-03 | 2020-08-25 | 北京机科国创轻量化科学研究院有限公司 | System and method suitable for monitoring temperature of semi-solid metal melting three-dimensional direct-writing forming |
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