CN212791647U - General glue dispensing jig for improved mobile phone mainboard - Google Patents
General glue dispensing jig for improved mobile phone mainboard Download PDFInfo
- Publication number
- CN212791647U CN212791647U CN202021129705.0U CN202021129705U CN212791647U CN 212791647 U CN212791647 U CN 212791647U CN 202021129705 U CN202021129705 U CN 202021129705U CN 212791647 U CN212791647 U CN 212791647U
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- Prior art keywords
- bottom plate
- mobile phone
- apron
- cover plate
- cap
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- Expired - Fee Related
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- 239000003292 glue Substances 0.000 title claims description 9
- 238000009434 installation Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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Abstract
An improved general dispensing jig for mobile phone mainboards comprises a cover plate, a bottom plate and a positioning column, wherein high-temperature magnet mounting blind holes are formed in the front surface of the cover plate and the back surface of the bottom plate, the blind holes are cylindrical slotted holes, the blind holes are uniformly distributed in the middle and two sides of the cover plate and the bottom plate, the blind holes between the cover plate and the bottom plate are in one-to-one correspondence, the positioning column is positioned at four corners of the surfaces of the cover plate and the bottom plate, column holes are respectively formed in four corners of the front surface of the bottom plate, cap holes are formed in four corners of the cover plate, the positioning column comprises a column body and a column cap, the column body is coaxially fixed in the column holes, the column cap is a cylinder with a cylindrical groove in the axis of the other end of an end cap, the cylindrical groove of the column cap is in interference fit with the column body, and the high-, the processing precision of the subsequent mobile phone mainboard is ensured.
Description
Technical Field
The utility model belongs to the technical field of the mobile phone motherboard assembly, especially, relate to a general glue dispensing jig of improved generation mobile phone motherboard.
Background
The current tool is glued to cell-phone mainboard point is a general tool of a section, generally adopts aluminum alloy material, divide into apron and bottom plate two parts, is equipped with high temperature magnet respectively in the positive position of apron and bottom plate, and through the magnetic force actuation close-fitting between apron and the bottom plate integrative, the customer product is placed in the middle of two aluminum alloy plates, then carries out the operation of gluing, and the operation in-process is glued to the point, and the tool is glued to the point needs to pass through the high temperature furnace behind the automatic line body.
As shown in fig. 1, which is a schematic structural diagram of a current dispensing jig for a mobile phone motherboard, when the dispensing jig passes through a high temperature furnace, the temperature in the furnace is too high to reach 208 ℃, so that the jig is heated, and a large amount of magnets fall off when the high temperature thermal expansion is continuously used, so that the magnetic attraction between a cover plate and a bottom plate is reduced or eliminated, the structural stability of the dispensing jig is greatly reduced, and subsequent processes of positioning, placing and dispensing the mobile phone motherboard are influenced; in addition, adopt reference column tight fit technology between tool apron and the bottom plate, long-time the use receives external force to influence, and the reference column drops easily, and equipment is touched to the reference column that drops and the risk that has destruction equipment belongs to serious defect.
SUMMERY OF THE UTILITY MODEL
The utility model discloses just not enough to prior art exists provides an improved generation general point of mobile phone motherboard tool of gluing.
In order to solve the above problems, the utility model adopts the following technical proposal:
the utility model provides a general glue dispensing jig of improved generation mobile phone motherboard, includes apron, bottom plate and reference column, the apron openly is equipped with high temperature magnet installation blind hole with the bottom plate back, and the blind hole is the cylindrical slotted hole, and blind hole evenly distributed is in the middle part and the both sides of apron and bottom plate, and the blind hole position one-to-one between apron and the bottom plate, the reference column is located the surperficial four corners of apron and bottom plate, and the positive four corners of bottom plate is equipped with the post hole respectively, and the apron four corners is equipped with the cap hole, and the reference column includes cylinder and cap, and the cylinder is coaxial to be fixed in the post hole, and the cap is equipped with the cylinder that the end cap other end axle center.
Further, the wall thickness of the bottom of the blind hole is 0.5 mm.
Furthermore, the center of the front surface of the cover plate and the center of the back surface of the bottom plate are provided with rectangular areas with the sinking depth of 0.15mm, and two-dimensional codes are arranged in the rectangular areas.
Furthermore, the bosses of the cover plate and the base plate are chamfered, and the assembly deformation degree of the cover plate and the base plate is less than 0.1 mm.
Furthermore, characters are engraved on the same side edge of the front surfaces of the cover plate and the bottom plate.
Compared with the prior art, the utility model discloses an implement the effect as follows:
a general glue dispensing jig of improved generation mobile phone motherboard, the mounting means of high temperature magnet has been improved, blind hole design bottom is stayed 0.5mm, the high temperature glue of again makes the firm adhesion of magnet and aluminum alloy after packing into magnet, magnet is difficult for dropping under the magnetic force actuation, and the high temperature inflation can not lead to the fact the deformation to the tool board, guarantee the precision of tool, improve reference column structure and assembly methods simultaneously, change into the gold-pressing mode by the tight-fitting mode before, make the reference column press from both sides tightly on the tool, long-term use can not drop, the stability of tool on the production line has been improved.
Drawings
Fig. 1 is a schematic structural diagram of a current dispensing jig for a mobile phone motherboard;
fig. 2 is a schematic structural view of a general dispensing jig for an improved mobile phone motherboard according to the present invention;
FIG. 3 is a schematic view of the cover plate shown in FIG. 2;
FIG. 4 is a schematic view of the bottom plate structure in FIG. 2
Fig. 5 is a schematic view of a positioning post structure.
Detailed Description
The present invention will be described with reference to specific embodiments.
As shown in fig. 2-4, an improved generation general point gluing jig of mobile phone motherboard, including apron 1, bottom plate 2 and reference column 3, apron 1 openly is equipped with high temperature magnet installation blind hole 4 with the 2 backs of bottom plate, blind hole 4 is the cylindrical slotted hole, blind hole 4 evenly distributed is in the middle part and both sides of apron 1 and bottom plate 2, and blind hole 4 position one-to-one between apron 1 and the bottom plate 2, reference column 3 is located apron 1 and bottom plate 2's surperficial four corners, and 2 openly four corners of bottom plate are equipped with post hole 5 respectively, and apron 1 four corners are equipped with cap hole 6, and reference column 3 includes cylinder 7 and cap 8, and cylinder 7 is coaxial to be fixed in post hole 5, and cap 8 is equipped with cylinder 7 that the end cap axle center other end was equipped with the cylinder groove for one end, the cylinder groove and the cylinder 7 interference fit of cap 8.
The wall thickness of 4 bottoms of blind holes is 0.5mm, guarantees the magnetic attraction between the magnet for magnet on apron 1 and the bottom plate 2 is in the actuation state.
The front center of the cover plate 1 and the back center of the bottom plate 2 are provided with a rectangular area 9 with the sinking depth of 0.15mm, and a two-dimensional code is arranged in the rectangular area 9, so that the code can be conveniently scanned, and the detailed information of the jig can be conveniently acquired.
The bosses of the cover plate 1 and the base plate 2 are chamfered, the assembly deformation degree of the cover plate 1 and the base plate 2 is less than 0.1mm, the processing precision of the jig is ensured, and the accuracy of subsequent dispensing operation of the mobile phone mainboard is ensured.
The cover plate 1 and the bottom plate 2 are engraved on the same side edge of the front face, so that the model, the processing date and the mounting position information of the jig can be conveniently and rapidly identified.
To sum up, a general glue dispensing jig of improved generation mobile phone motherboard, the mounting means of high temperature magnet has been improved, blind hole 4 designs the bottom and leaves 0.5mm, the high temperature glue of reentrant point makes the firm adhesion of magnet and aluminum alloy after the magnet packs into, magnet is difficult for dropping under the magnetic force actuation, and the high temperature inflation can not lead to the fact the deformation to the tool board, guarantee the precision of tool, improve reference column 3 structure and assembly methods simultaneously, change into the mode of compressing tightly by the tight-fitting mode before, make reference column 3 press from both sides tightly on the tool, long-term use can not drop, the stability of tool on the production line has been improved.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. The utility model provides a general glue dispensing jig of improved generation mobile phone motherboard, characterized by: including apron, bottom plate and reference column, the apron is openly equipped with high temperature magnet installation blind hole with the bottom plate back, and the blind hole is the cylindrical slotted hole, and blind hole evenly distributed is in the middle part and the both sides of apron and bottom plate, and the blind hole position one-to-one between apron and the bottom plate, the reference column is located the surperficial four corners of apron and bottom plate, and the positive four corners of bottom plate is equipped with the post hole respectively, and the apron four corners is equipped with the cap hole, and the reference column includes cylinder and cap, and the cylinder is coaxial to be fixed in the post hole, and the cap is equipped with the cylinder that the end cap other end axle center is equipped with the cylinder groove.
2. The improved universal dispensing jig for mobile phone motherboards as claimed in claim 1, wherein the wall thickness of the bottom of the blind hole is 0.5 mm.
3. The improved universal dispensing jig for mobile phone motherboards as claimed in claim 1, wherein the center of the front surface of the cover plate and the center of the back surface of the bottom plate are provided with rectangular areas with a depth of 0.15mm, and two-dimensional codes are arranged in the rectangular areas.
4. The improved universal dispensing jig for mobile phone motherboards as claimed in claim 1, wherein the bosses of the cover plate and the base plate are chamfered, and the assembly deformation degree of the cover plate and the base plate is less than 0.1 mm.
5. The improved universal dispensing jig for mobile phone motherboards as claimed in claim 1, wherein the cover plate and the bottom plate are engraved on the same side of the front surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021129705.0U CN212791647U (en) | 2020-06-17 | 2020-06-17 | General glue dispensing jig for improved mobile phone mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021129705.0U CN212791647U (en) | 2020-06-17 | 2020-06-17 | General glue dispensing jig for improved mobile phone mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212791647U true CN212791647U (en) | 2021-03-26 |
Family
ID=75097143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021129705.0U Expired - Fee Related CN212791647U (en) | 2020-06-17 | 2020-06-17 | General glue dispensing jig for improved mobile phone mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212791647U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112959247A (en) * | 2021-04-19 | 2021-06-15 | 苏州博古特智造有限公司 | Automatic equipment auxiliary fixtures of cell-phone |
-
2020
- 2020-06-17 CN CN202021129705.0U patent/CN212791647U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112959247A (en) * | 2021-04-19 | 2021-06-15 | 苏州博古特智造有限公司 | Automatic equipment auxiliary fixtures of cell-phone |
| CN112959247B (en) * | 2021-04-19 | 2022-04-22 | 苏州博古特智造有限公司 | Automatic equipment auxiliary fixtures of cell-phone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210326 |
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| CF01 | Termination of patent right due to non-payment of annual fee |