CN212786014U - PCB production board with explosion-proof construction - Google Patents
PCB production board with explosion-proof construction Download PDFInfo
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- CN212786014U CN212786014U CN202021664123.2U CN202021664123U CN212786014U CN 212786014 U CN212786014 U CN 212786014U CN 202021664123 U CN202021664123 U CN 202021664123U CN 212786014 U CN212786014 U CN 212786014U
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Abstract
The PCB production board with the explosion-proof structure comprises a PCB production board body, wherein a plurality of explosion-proof areas are arranged on the PCB production board body, the explosion-proof areas form a rectangular PCB unit area, and annular targets are arranged at four corners of the PCB unit area; firstly, through the arrangement of the explosion-proof area, the mode of trimming edges of the board edges can be replaced, the thermal stress generated by the PCB under high-temperature thermal shock is effectively released, and the scrapping of the PCB due to board explosion layering under the condition of high-temperature thermal shock is avoided; secondly, arranging a ring-shaped target on the PCB production board body, arranging a positioning mark at a corresponding position in an image to be transferred in the LDI exposure machine, aiming the positioning mark on the image to be transferred in the LDI exposure machine at the ring-shaped target in the exposure process, so that the image can be accurately transferred to the corresponding position on the production board body, and avoiding the production quality problem caused by the deviation of a blind hole; in addition, the occupied area of the annular target is small, automatic image detection can be performed, and the detection image identification is stable.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of PCB (printed circuit board) process manufacturing, in particular to a PCB production board with an explosion-proof structure.
[ background of the invention ]
At present, due to the development of technology and the demand for production, printed circuit boards are being developed from single-layer boards to double-sided boards, multi-layer boards and flexible boards, and are continuously being developed toward high precision, high density and high reliability. Accordingly, the aperture of the blind hole is gradually reduced, which has higher and higher requirements on production precision, especially for HDI (high density interconnection) boards, and the conventional PCB production boards are difficult to meet the production requirements on high precision at present.
And in the PCB laminating process, the problem of glue flowing at the process edge of the board edge is easy to lack glue virtual edges, and tiny resin cavities can be generated at the process edge of the board edge. After high-temperature thermal shock of lead-free tin spraying, resin cavities on the process edges of the plate edges are heated and expanded, and the outermost layer is covered by copper thickness after electroplating, so that thermal stress cannot be released outwards and can only be diffused inwards, and subsequent plate explosion is caused to extend into the plate layer by layer. Particularly, for a thick copper plate, the thickness of copper reaches more than 80um, the thickness of the plate is more than 2.0mm, longer tin immersion time is needed, and more high-temperature thermal shock force is received, so that more plate edge explosion plate delamination can be caused.
Therefore, there is a need to develop a PCB capable of satisfying production precision and preventing delamination due to board explosion.
[ Utility model ] content
The utility model aims at providing an can realize accurate image location in PCB's production, improve production efficiency, can reduce the PCB board simultaneously and explode the risk of board layering at the flange under high temperature thermal shock power, improve the qualification rate of product.
The utility model provides a PCB production board with explosion-proof construction, is including PCB production board body be equipped with a plurality of blast resistant areas on the PCB production board body, it is a plurality of blast resistant area forms the PCB unit district of a rectangle form four angle departments in PCB unit district all are equipped with the annular mark target.
Furthermore, the explosion-proof area is a plurality of explosion-proof holes which are transversely and uniformly distributed and arranged.
Further, the diameter of the explosion-proof hole is 1.6mm, and the distance between two adjacent explosion-proof holes is 0.8 mm.
Further, the length of the explosion-proof area is greater than or equal to 60% of the side length of the PCB production board body.
Further, the distance between the explosion-proof area and the edge of the PCB production board body is 7.5 mm.
Further, the distance between the explosion-proof area and the annular target is 2.5 mm.
Further, the ring outer diameter of the ring target is 2.5 mm.
Further, the ring inner diameter of the ring target is 2.35 mm.
To sum up, the utility model discloses for its beneficial effect of prior art is:
compared with the prior art, the PCB production board with the explosion-proof structure has the advantages that firstly, the mode of trimming the edge of the board can be replaced by the arrangement of the explosion-proof area, the thermal stress generated by the PCB under the high-temperature thermal shock is effectively released, and the board explosion layering of the PCB under the high-temperature thermal shock condition is avoided to be scrapped; meanwhile, the utility model can improve the production yield by 100 percent, reduce the process difficulty and ensure the quality requirement of the PCB; secondly, arranging a ring-shaped target on the PCB production board body, arranging a positioning mark at a corresponding position in an image to be transferred in the LDI exposure machine, aiming the positioning mark on the image to be transferred in the LDI exposure machine at the ring-shaped target in the exposure process, so that the image can be accurately transferred to the corresponding position on the production board body, and avoiding the production quality problem caused by the deviation of a blind hole; in addition, the occupied area of the annular target is small, automatic image detection can be performed, and the detection image identification is stable.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of the present invention.
[ detailed description ] embodiments
The following detailed description provides many different embodiments or examples for implementing the invention. Of course, these are merely embodiments or examples and are not intended to be limiting. In addition, repeated reference numbers, such as repeated numbers and/or letters, may be used in various embodiments. These iterations are for simplicity and clarity of the description of the present invention and do not represent a particular relationship between the various embodiments and/or structures discussed.
Furthermore, spatially relative terms, such as "below" … "," below "," inside-out "," above "," upper "and the like, may be used herein to facilitate describing the relationship of one element(s) or feature(s) to another element(s) or feature(s) in the drawings and may encompass different orientations of the device in use or operation and the orientation depicted in the drawings. The device may be turned to a different orientation (rotated 90 degrees or otherwise), and the spatially relative adjectives used therein may be similarly interpreted and, thus, should not be construed as limiting the invention, as the terms "first", "second" are used merely for descriptive purposes and are not intended to indicate or imply relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
The invention will be further described with reference to the following description and embodiments in conjunction with the accompanying drawings:
as shown in fig. 1, the PCB production board with an explosion-proof structure comprises a PCB production board body 1, wherein a plurality of explosion-proof areas 2 are arranged on the PCB production board body 1, the plurality of explosion-proof areas 2 form a rectangular PCB unit area 3, and annular targets 4 are arranged at four corners of the PCB unit area 3; the anti-explosion structure can be used for effectively releasing thermal stress generated by high-temperature thermal shock of the PCB in lead-free tin spraying and other processes, and avoiding scrapping of the PCB due to board explosion layering under the condition of high-temperature thermal shock; in addition, when matched with the LDI exposure machine, the CDD (image sensor) can accurately capture the ring target 4 through the ring target 4 at the four corners of the PCB unit area 3, thereby accurately performing image transfer.
The utility model discloses in explosion-proof area 2 is a plurality of explosion-proof holes 21 that horizontal equipartition was arranged, and a plurality of explosion-proof holes 21 can make PCB production board body 1 can obtain releasing receiving the thermal stress that high temperature thermal shock produced, can prevent that 1 flange explosion board layering of PCB production board body from producing bad product after extending to PCB unit district 3.
In the utility model, the diameter of the explosion-proof hole 21 is 1.6mm, the distance between two adjacent explosion-proof holes 21 is 0.8mm, the length of the explosion-proof area 2 is more than or equal to 60% of the side length of the PCB production board body 1, the distance between the explosion-proof area 2 and the edge of the PCB production board body 1 is 7.5mm, and the distance between the explosion-proof area 2 and the annular target 4 is 2.5 mm; according to the structure, the explosion-proof hole 21 does not influence the normal work and performance of the PCB production board body 1; in addition, the explosion-proof holes 21 can be non-metallized holes which cannot conduct electricity, and further cannot influence the work of the PCB production board body 1.
The utility model discloses in the ring external diameter of ring mark target 4 is 2.5mm the ring internal diameter of ring mark target 4 is 2.35 mm.
In addition, since the ring target 4 is a ring-shaped groove, the center of the ring target 4 comprises a cylindrical columnar structure which is the aiming positioning point of the CCD and LDI exposure machines, and the diameter and the length of the columnar structure are long enough to facilitate the aiming of the CCD and the LDI exposure machines; the diameter of the columnar structure is also the inner diameter of the ring target 4, and in the embodiment, the length range of the inner diameter of the ring target 4 is 2.35; accordingly, the ring width length of the ring target 4 ranges from 0.15 mm; and the occupied area of the ring-shaped target 4 is small, the automatic image detection can be carried out, and the detection image identification is stable.
In order to facilitate alignment between the boards, the PCB unit area 3 in the PCB production board body 1 is rectangular, and the circular targets 4 are disposed at four corners of the PCB unit area 3.
As described above, the embodiments of the present application have been described in detail, but the present application is not limited to the above embodiments. Even if various changes are made in the present application, the protection scope of the present application is still included.
Claims (8)
1. The utility model provides a PCB production board with blast resistant construction, including PCB production board body (1), its characterized in that: be equipped with a plurality of blast resistant areas (2) on PCB production board body (1), it is a plurality of blast resistant area (2) form PCB unit district (3) of a rectangle form four angles departments of PCB unit district (3) all are equipped with annular mark target (4).
2. The PCB production board with explosion-proof structure of claim 1, wherein: the explosion-proof area (2) is a plurality of explosion-proof holes (21) which are transversely and uniformly distributed.
3. The PCB production board with explosion-proof structure of claim 2, wherein: the diameter of each explosion-proof hole (21) is 1.6mm, and the distance between every two adjacent explosion-proof holes (21) is 0.8 mm.
4. The PCB production board with explosion-proof structure of claim 1, wherein: the length of the explosion-proof area (2) is more than or equal to 60% of the side length of the PCB production board body (1).
5. The PCB production board with explosion-proof structure of claim 1, wherein: the distance between the explosion-proof area (2) and the edge of the PCB production board body (1) is 7.5 mm.
6. The PCB production board with explosion-proof structure of claim 1, wherein: the distance between the explosion-proof area (2) and the annular target (4) is 2.5 mm.
7. The PCB production board with explosion-proof structure of claim 1, wherein: the outer diameter of the ring-shaped target (4) is 2.5 mm.
8. The PCB production board with explosion-proof structure of claim 1, wherein: the inner diameter of the ring target (4) is 2.35 mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021664123.2U CN212786014U (en) | 2020-08-11 | 2020-08-11 | PCB production board with explosion-proof construction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021664123.2U CN212786014U (en) | 2020-08-11 | 2020-08-11 | PCB production board with explosion-proof construction |
Publications (1)
Publication Number | Publication Date |
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CN212786014U true CN212786014U (en) | 2021-03-23 |
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CN202021664123.2U Active CN212786014U (en) | 2020-08-11 | 2020-08-11 | PCB production board with explosion-proof construction |
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CN (1) | CN212786014U (en) |
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2020
- 2020-08-11 CN CN202021664123.2U patent/CN212786014U/en active Active
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