CN212782903U

CN212782903U - Paster type multi-chip piezoresistor

Info

Publication number: CN212782903U
Application number: CN202022130184.7U
Authority: CN
Inventors: 陈色江; 彭少雄
Original assignee: Dongguan Delchuang Electronic Co ltd
Current assignee: Dongguan Delchuang Electronic Co ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-03-23
Anticipated expiration: 2030-09-24

Abstract

The utility model discloses a patch type multi-chip piezoresistor, which comprises a first piezoresistor chip, a second piezoresistor chip, a first sheet metal terminal, a second sheet metal terminal and an insulating layer; the first piezoresistor chip and the second piezoresistor chip are packaged in the insulating layer, a first upper electrode and a first lower electrode are respectively arranged at the top and the bottom of the first piezoresistor chip, a second upper electrode and a second lower electrode are respectively arranged at the top and the bottom of the second piezoresistor chip, one end of the first sheet-shaped metal terminal is welded between the first lower electrode and the second upper electrode or the second lower electrode, the other end of the first sheet-shaped metal terminal penetrates through the insulating layer, one end of the second sheet-shaped metal terminal is welded to the first upper electrode, and the other end of the second sheet-shaped metal terminal penetrates through the insulating layer or is welded to the second lower electrode. The utility model provides high anti overvoltage ability to and withstand voltage, insulating properties have been promoted.

Description

Paster type multi-chip piezoresistor

Technical Field

The utility model relates to an electronic components field, the more specifically multi-chip piezoresistor of paster type that says so.

Background

The voltage dependent resistor is an overvoltage protection type safety device which is connected with a protected circuit in parallel. It can peak and valley when the surge voltage appears in the circuit under the condition of switching on or off or other conditions, so that the devices in the circuit can be prevented from being damaged by overvoltage impact.

At present, the protection level of the electric appliance is required to be higher and higher by consumers, so that the overvoltage protection capability of the electric appliance is required, and the voltage resistance and the insulation performance of the electric appliance are also required to be higher and higher.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a multi-chip piezoresistor of paster type.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a patch type multi-chip piezoresistor comprises a first piezoresistor chip, a first sheet metal terminal, a second sheet metal terminal and an insulating layer; the first piezoresistor chip and the second piezoresistor chip are distributed in an up-down structure, the first piezoresistor chip and the second piezoresistor chip are packaged in an insulating layer, a first upper electrode and a first lower electrode are respectively arranged at the top and the bottom of the first piezoresistor chip, a second upper electrode and a second lower electrode are respectively arranged at the top and the bottom of the first piezoresistor chip, one end of the first sheet-shaped metal terminal is welded between the first lower electrode and the second upper electrode or between the first sheet-shaped metal terminal and the second upper electrode, the other end of the first sheet-shaped metal terminal penetrates through the insulating layer, one end of the second sheet-shaped metal terminal is welded on the first upper electrode, and the other end of the second sheet-shaped metal terminal penetrates through the insulating layer or is welded on the second lower electrode.

The further technical scheme is as follows: the first sheet metal terminal comprises a first inner welding sheet, a first outer welding sheet and a first connecting sheet connected between the first inner welding sheet and the first outer welding sheet; the first inner welding sheet is welded between the first lower electrode and the second upper electrode, and the first outer welding sheet is attached to the outer surface of the insulating layer; the second sheet metal terminal comprises a second upper welding sheet, a second lower welding sheet and a second connecting sheet connected between the second upper welding sheet and the second lower welding sheet; the second upper welding sheet is welded with the first upper electrode, and the second lower welding sheet is welded with the second lower electrode; further comprising a third sheet metal terminal; the third sheet metal terminal comprises a third inner welding sheet, a third outer welding sheet and a third connecting sheet connected between the third inner welding sheet and the third outer welding sheet; the third inner welding sheet is welded with the second connecting sheet, and the third outer welding sheet is attached to the outer surface of the insulating layer.

The further technical scheme is as follows: the first connecting piece comprises a first vertical part extending downwards along the left end of the first inner welding piece, a transverse part extending leftwards along the lower end of the first vertical part, and a second vertical part extending downwards along the transverse part; the first outer welding sheet is horizontally connected to the lower end of the second vertical part and attached to the outer surface of the insulating layer, and the first inner welding sheet is horizontally connected to the upper end of the first vertical part; the second connecting piece comprises a first inclined part extending upwards along the right end of the second upper welding piece in an inclined mode, a first horizontal part extending rightwards along the right end of the first inclined part, a vertical part extending downwards along the right end of the first horizontal part, a second horizontal part extending leftwards along the lower end of the vertical part, and a second inclined part extending upwards along the left end of the second horizontal part in an inclined mode; the second lower welding piece is horizontally connected to the upper end of the second inclined part, and the second upper welding piece is horizontally connected to the lower end of the first inclined part; the third connecting piece comprises a horizontal connecting part extending rightwards along the lower end of the third inner welding piece and a vertical connecting part extending downwards along the right end of the horizontal connecting part; welding plate vertical connection in the third in the left end of horizontal connecting portion, the outer welding plate horizontal connection of third in the lower extreme of vertical connecting portion and with the surface laminating of insulating layer.

The further technical scheme is as follows: the first sheet metal terminal comprises a first inner welding sheet, a first outer welding sheet and a first connecting sheet connected between the first inner welding sheet and the first outer welding sheet; the first inner welding sheet is welded between the first lower electrode and the second upper electrode, and the first outer welding sheet is positioned outside the insulating layer and separated from the insulating layer; the second sheet metal terminal comprises a second upper welding sheet, a second lower welding sheet and a second connecting sheet connected between the second upper welding sheet and the second lower welding sheet; the second upper welding sheet is welded with the first upper electrode, and the second lower welding sheet is welded with the second lower electrode; further comprising a third sheet metal terminal; the third sheet metal terminal comprises a third inner welding sheet, a third outer welding sheet and a third connecting sheet connected between the third inner welding sheet and the third outer welding sheet; the third inner welding sheet is welded with the second connecting sheet, and the third outer welding sheet is located outside the insulating layer and separated from the insulating layer.

The further technical scheme is as follows: the first connecting piece comprises a vertical part; the first inner welding sheet is horizontally connected to the upper end of the vertical part, the first outer welding sheet is horizontally connected to the lower end of the vertical part, and the left end of the first outer welding sheet is far away from the insulating layer; the second connecting piece comprises a first inclined part extending upwards along the right end of the second upper welding piece in an inclined mode, a first horizontal part extending rightwards along the right end of the first inclined part, a vertical part extending downwards along the right end of the first horizontal part, a second horizontal part extending leftwards along the lower end of the vertical part, and a second inclined part extending upwards along the left end of the second horizontal part in an inclined mode; the second lower welding piece is horizontally connected to the upper end of the second inclined part, and the second upper welding piece is horizontally connected to the lower end of the first inclined part; the third connecting piece comprises a horizontal connecting part extending rightwards along the lower end of the third inner welding piece and a vertical connecting part extending downwards along the right end of the horizontal connecting part; the welding piece vertical connection in the third in the left end of horizontal connecting portion, the outer welding piece horizontal connection of third is in the lower extreme of vertical connecting portion and the right-hand member of the outer welding piece of third is kept away from in the insulating layer.

The further technical scheme is as follows: the first sheet metal terminal comprises a first inner welding sheet, a first outer welding sheet and a first connecting sheet connected between the first inner welding sheet and the first outer welding sheet; the first inner welding sheet is welded on the second lower electrode, and the first outer welding sheet is attached to the outer surface of the insulating layer; the second sheet metal terminal comprises a second inner welding sheet, a second outer welding sheet and a second connecting sheet connected between the second inner welding sheet and the second outer welding sheet; the second inner welding sheet is welded with the first upper electrode, and the second outer welding sheet is attached to the outer surface of the insulating layer.

The further technical scheme is as follows: the first connecting piece comprises an inclined part which extends downwards along the left end of the first inner welding piece in an inclined mode, a first transverse part which extends leftwards along the lower end of the inclined part, a first vertical part which extends upwards along the left end of the first transverse part, a second transverse part which extends leftwards along the upper end of the first vertical part, and a second vertical part which extends downwards along the left end of the second transverse part; the first outer welding sheet is horizontally connected to the lower end of the second vertical part and attached to the outer surface of the insulating layer, and the first inner welding sheet is horizontally connected to the upper end of the inclined part; the second connecting piece comprises an inclined straight part which is obliquely arranged upwards along the right end of the second inner welding piece, a first horizontal part which extends rightwards along the upper end of the inclined straight part, a first vertical part which extends downwards along the right end of the first horizontal part, a second horizontal part which extends rightwards along the lower end of the first vertical part, and a second vertical part which extends downwards along the right end of the second horizontal part; the second outer welding sheet is horizontally connected to the lower end of the second vertical portion and attached to the outer surface of the insulating layer, and the second inner welding sheet is horizontally connected to the lower end of the oblique straight portion.

The further technical scheme is as follows: the first sheet metal terminal comprises a first inner welding sheet, a first outer welding sheet and a first connecting sheet connected between the first inner welding sheet and the first outer welding sheet; the first inner welding sheet is welded on the second lower electrode, and the first outer welding sheet is positioned outside the insulating layer and separated from the insulating layer; the second sheet metal terminal comprises a second inner welding sheet, a second outer welding sheet and a second connecting sheet connected between the second inner welding sheet and the second outer welding sheet; the second inner welding sheet is welded with the first upper electrode, and the second outer welding sheet is positioned outside the insulating layer and separated from the insulating layer.

The further technical scheme is as follows: the first connecting piece comprises an inclined part which extends downwards along the left end of the first inner welding piece in an inclined mode, a first transverse part which extends leftwards along the lower end of the inclined part, a first vertical part which extends upwards along the left end of the first transverse part, a second transverse part which extends leftwards along the upper end of the first vertical part, and a second vertical part which extends downwards along the left end of the second transverse part; the first outer welding sheet is horizontally connected to the lower end of the second vertical part and is far away from the insulating layer with the left end of the first outer welding sheet, and the first inner welding sheet is horizontally connected to the upper end of the inclined part; the second connecting piece comprises an inclined straight part which is obliquely arranged upwards along the right end of the second inner welding piece, a first horizontal part which extends rightwards along the upper end of the inclined straight part, a first vertical part which extends downwards along the right end of the first horizontal part, a second horizontal part which extends rightwards along the lower end of the first vertical part, and a second vertical part which extends downwards along the right end of the second horizontal part; the second outer welding piece is horizontally connected to the lower end of the second vertical portion, the right end of the second outer welding piece is far away from the insulating layer, and the second inner welding piece is horizontally connected to the lower end of the inclined straight portion.

Compared with the prior art, the utility model beneficial effect be: the utility model adopts the mode that two piezoresistor chips are connected in parallel or in series to improve the overall performance, and particularly, when the two piezoresistor chips are in a parallel structure, the overvoltage resistance of the piezoresistor can be improved; when the two piezoresistor chips are in a series structure, the voltage resistance and the insulation performance of the piezoresistor can be improved.

The foregoing is a summary of the present invention, and other objects, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments, which is provided for the purpose of illustration and understanding of the present invention.

Drawings

Fig. 1 is a schematic structural diagram of a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a second embodiment of the present invention;

fig. 3 is a schematic structural diagram of a third embodiment of the present invention;

fig. 4 is a schematic structural diagram of a fourth embodiment of the present invention.

Detailed Description

In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to the following specific embodiments, but not limited thereto.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "secured" are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," some embodiments, "" an example, "" a specific example, "" or "some examples," or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.

Example one

Referring to fig. 1, the present invention provides a chip-type multi-chip varistor, which includes a first varistor chip 2, a first sheet-like metal terminal 4, a second sheet-like metal terminal 5, and an insulating layer 1 (the insulating layer 1 is made of epoxy resin); the first piezoresistor chip 2 and the second piezoresistor chip 3 are distributed in an up-down structure, the first piezoresistor chip 2 and the second piezoresistor chip 3 are packaged in the insulating layer 1, the top and the bottom of the first piezoresistor chip 2 are respectively provided with a first upper electrode 21 and a first lower electrode 22, the top and the bottom of the first piezoresistor chip 2 are respectively provided with a second upper electrode 31 and a second lower electrode 32, one end of the first sheet-shaped metal terminal 4 is welded between the first lower electrode 22 and the second upper electrode 31, the other end of the first sheet-shaped metal terminal 4 penetrates through the insulating layer 1, one end of the second sheet-shaped metal terminal 5 is welded to the first upper electrode 21, and the other end of the second sheet-shaped metal terminal 5 is welded to the second lower electrode 32. The insulation layer is characterized by further comprising a third sheet metal terminal 6, one end of the third sheet metal terminal 6 is connected with the second sheet metal terminal 5, and the other end of the third sheet metal terminal 6 penetrates through the insulation layer 1 and is attached to the outer surface of the insulation layer 1. The embodiment adopts a structure of a mode that two piezoresistor chips are connected in parallel, and improves the overvoltage resistance of the piezoresistor.

Specifically, in the present embodiment, the first sheet-like metal terminal 4 includes a first inner bonding tab 41, a first outer bonding tab 45, and a first connecting tab connected between the first inner bonding tab 41 and the first outer bonding tab 45; the first inner welding sheet 41 is welded between the first lower electrode 22 and the second upper electrode 31, and the first outer welding sheet 45 is attached to the outer surface of the insulating layer 1; the second sheet metal terminal 5 includes a second upper welding piece 51, a second lower welding piece 57, and a second connecting piece connected between the second upper welding piece 51 and the second lower welding piece 57; the second upper bonding pad 51 is bonded to the first upper electrode 2121, and the second lower bonding pad 57 is bonded to the second lower electrode 3232; the third sheet metal terminal 6 includes a third inner bonding tab 61, a third outer bonding tab 64, and a third connecting tab connected between the third inner bonding tab 61 and the third outer bonding tab 64; the third inner welding sheet 61 is welded to the second connecting sheet, and the third outer welding sheet 64 is attached to the outer surface of the insulating layer 1.

Further, the first connecting piece includes a first vertical portion 42 extending downward along a left end of the first inner welding piece 41, a lateral portion 43 extending leftward along a lower end of the first vertical portion 42, and a second vertical portion 44 extending downward along the lateral portion 43; the first outer welding sheet 45 is horizontally connected to the lower end of the second vertical portion 44 and attached to the outer surface of the insulating layer 1, and the first inner welding sheet 41 is horizontally connected to the upper end of the first vertical portion 42; the second connection piece includes a first inclined portion 52 extending obliquely upward along a right end of the second upper welding piece 51, a first horizontal portion 53 extending rightward along the right end of the first inclined portion 52, a vertical portion 54 extending downward along the right end of the first horizontal portion 53, a second horizontal portion 55 extending leftward along a lower end of the vertical portion 54, and a second inclined portion 56 extending obliquely upward along a left end of the second horizontal portion 55; a second lower welding tab 57 horizontally connected to the upper end of the second inclined portion 56, and a second upper welding tab 51 horizontally connected to the lower end of the first inclined portion 52; the third connecting piece 6 includes a horizontal connecting portion 62 extending rightward along the lower end of the third inner welding piece 61, and a vertical connecting portion 63 extending downward along the right end of the horizontal connecting portion 62; the third inner welding tab 61 is vertically connected to the left end of the horizontal connecting portion 62, and the third outer welding tab 64 is horizontally connected to the lower end of the vertical connecting portion 63 and attached to the outer surface of the insulating layer 1.

Example two

Referring to fig. 2, the present embodiment provides a chip-type multi-chip varistor, which includes a first varistor chip 2A, a second varistor chip 3A, a first sheet-like metal terminal 4A, a second sheet-like metal terminal a5, and an insulating layer 1A (the insulating layer 1A is made of epoxy resin); the first piezoresistor chip 2A and the second piezoresistor chip 3 are distributed in an up-down structure, the first piezoresistor chip 2A and the second piezoresistor chip 3A are packaged in the insulating layer 1A, the top and the bottom of the first piezoresistor chip 2A are respectively provided with a first upper electrode 21A and a first lower electrode 22A, the top and the bottom of the second piezoresistor chip 3A are respectively provided with a second upper electrode 31A and a second lower electrode 32A, one end of the first sheet-shaped metal terminal 4 is welded between the first lower electrode 22A and the second upper electrode 31A, the other end of the first sheet-shaped metal terminal 4A penetrates through the insulating layer 1A, one end of the second sheet-shaped metal terminal 5A is welded to the first upper electrode 21A, and the other end of the second sheet-shaped metal terminal 5A is welded to the second lower electrode 32A. The insulating layer 1A is provided with a third sheet metal terminal 6A, one end of the third sheet metal terminal 6A is connected with the second sheet metal terminal 5A, and the other end of the third sheet metal terminal 6A penetrates through the insulating layer 1A. The embodiment adopts a structure of a mode that two piezoresistor chips are connected in parallel, and improves the overvoltage resistance of the piezoresistor.

Specifically, the first sheet-like metal terminal 4A includes a first inner bonding tab 41A, a first outer bonding tab 43A, and a first bonding tab connected between the first inner bonding tab 41A and the first outer bonding tab 43A; the first inner bonding pad 41A is bonded between the first lower electrode 22A and the second upper electrode 31A, and the first outer bonding pad 43A is located outside the insulating layer 1A and separated from the insulating layer 1A; the second sheet metal terminal 5A includes a second upper welding piece 51A, a second lower welding piece 57A, and a second connecting piece connected between the second upper welding piece 51 and the second lower welding piece 57A; the second upper bonding pad 51A is bonded to the first upper electrode 21A, and the second lower bonding pad 57A is bonded to the second lower electrode 32A; the third sheet metal terminal 6A includes a third inner bonding tab 61A, a third outer bonding tab 64A, and a third connecting piece connected between the third inner bonding tab 61A and the third outer bonding tab 64A; the third inner bonding pad 61A is bonded to the second connecting pad, and the third outer bonding pad 64A is located outside the insulating layer 1A and separated from the insulating layer 1A.

Further, the first connecting piece includes a vertical portion 42A; the first inner welding piece 41A is horizontally connected to the upper end of the vertical portion 42A, the first outer welding piece 43A is horizontally connected to the lower end of the vertical portion 42A, and the left end of the first outer welding piece 43A is far away from the insulating layer 1A; the second connecting piece includes a first inclined portion 52A extending obliquely upward along the right end of the second upper welding piece 51A, a first horizontal portion 53A extending rightward along the right end of the first inclined portion 52A, a vertical portion 54A extending downward along the right end of the first horizontal portion 53A, a second horizontal portion 55A extending leftward along the lower end of the vertical portion 54A, and a second inclined portion 56A extending obliquely upward along the left end of the second horizontal portion 55A; a second lower welding tab 57A horizontally connected to the upper end of the second inclined portion 56A, and a second upper welding tab 51A horizontally connected to the lower end of the first inclined portion 52A; the third connecting piece includes a horizontal connecting portion 62A extending rightward along the lower end of the third inner welding piece 61A, and a vertical connecting portion 63A extending downward along the right end of the horizontal connecting portion 62A; the third inner welding piece 61A is vertically connected to the left end of the horizontal connecting portion 62A, the third outer welding piece 64A is horizontally connected to the lower end of the vertical connecting portion 64A, and the right end of the third outer welding piece 64A is far away from the insulating layer 1A.

EXAMPLE III

Referring to fig. 3, the present embodiment provides a chip-type multi-chip varistor, which includes a first varistor chip 2B, a second varistor chip 3B, a first sheet-like metal terminal 4B, a second sheet-like metal terminal 5B, and an insulating layer 1B (the insulating layer 1B may be made of insulating paint or a housing made of insulating material); the first piezoresistor chip 2B and the second piezoresistor chip 3B are distributed in an up-down structure, the first piezoresistor chip 2B and the second piezoresistor chip 3B are packaged in an insulating layer, the top and the bottom of the first piezoresistor chip 2B are respectively provided with a first upper electrode 21B and a first lower electrode 22B, the top and the bottom of the second piezoresistor chip 3B are respectively provided with a second upper electrode 31B and a second lower electrode 32B, one end of a first sheet-shaped metal terminal 4B is welded between the second lower electrodes 32B, the other end of the first sheet-shaped metal terminal 4B penetrates through the insulating layer 1B, one end of a second sheet-shaped metal terminal 5B is welded on the first upper electrode 21B, and the other end of the second sheet-shaped metal terminal 5B penetrates through the insulating layer and is attached to the outer surface of the insulating layer. The embodiment adopts a structure of connecting two piezoresistor chips in series, and improves the voltage resistance and the insulation performance of the piezoresistor.

Specifically, the first sheet-like metal terminal 4B includes a first inner bonding tab 41B, a first outer bonding tab 47B, and a first bonding tab connected between the first inner bonding tab 41B and the first outer bonding tab 47B; the first inner bonding pad 41B is bonded to the second lower electrode 32B, and the first outer bonding pad 47B is attached to the outer surface of the insulating layer 1; the second sheet metal terminal 5B includes a second inner bonding tab 51B, a second outer bonding tab 57B, and a second connecting tab connected between the second inner bonding tab 51B and the second outer bonding tab 57B; the second inner bonding tab 51 is bonded to the first upper electrode 21B, and the second outer bonding tab 57B is attached to the outer surface of the insulating layer 1B.

Further, the first connecting piece includes an inclined portion 42B extending obliquely downward along a left end of the first inner welding piece 41B, a first lateral portion 43B extending leftward along a lower end of the inclined portion 42B, a first vertical portion 44B extending upward along a left end of the first lateral portion 43B, a second lateral portion 45B extending leftward along an upper end of the first vertical portion 44B, and a second vertical portion 46B extending downward along a left end of the second lateral portion 45B; a first outer welding tab 47B horizontally connected to the lower end of the second vertical portion 46B and attached to the outer surface of the insulating layer 1B, and a first inner welding tab 41B horizontally connected to the upper end of the inclined portion 42B; the second connecting piece includes an inclined straight portion 52B provided obliquely upward along a right end of the second inner welding piece 51B, a first horizontal portion 53B extending rightward along an upper end of the inclined straight portion 52B, a first vertical portion 54B extending downward along a right end of the first horizontal portion 53B, a second horizontal portion 55B extending rightward along a lower end of the first vertical portion 54B, a second vertical portion 56B extending downward along a right end of the second horizontal portion 55B; the second outer bonding tab 57B is horizontally connected to the lower end of the second vertical portion 56B and attached to the outer surface of the insulating layer 1B, and the second inner bonding tab 51B is horizontally connected to the lower end of the inclined portion.

Example four

Referring to fig. 4, the present embodiment provides a chip-type multi-chip varistor, which includes a first varistor chip 2C, a second varistor chip 3C, a first sheet-like metal terminal 4C, a second sheet-like metal terminal 5C, and an insulating layer 1C (the insulating layer 1C may be made of insulating paint or a housing made of insulating material); the first piezoresistor chip 2C and the second piezoresistor chip 3C are distributed in an up-down structure, the first piezoresistor chip 2C and the second piezoresistor chip 3C are packaged in the insulating layer, the top and the bottom of the first piezoresistor chip 2C are respectively provided with a first upper electrode 21C and a first lower electrode 22C, the top and the bottom of the second piezoresistor chip 3C are respectively provided with a second upper electrode 31C and a second lower electrode 32C, one end of the first sheet-shaped metal terminal 4C is welded to the second lower electrode 32C, the other end of the first sheet-shaped metal terminal 4C penetrates through the insulating layer 1C, one end of the second sheet-shaped metal terminal 5C is welded to the first upper electrode 21C, and the other end of the second sheet-shaped metal terminal 5C penetrates through the insulating layer 1C and is far away from the insulating layer 1C. The embodiment adopts a structure of connecting two piezoresistor chips in series, and improves the voltage resistance and the insulation performance of the piezoresistor.

Specifically, the first sheet-like metal terminal 4C includes a first inner bonding tab 41C, a first outer bonding tab 47C, and a first bonding tab connected between the first inner bonding tab 41C and the first outer bonding tab 47C; the first inner bonding pad 41C is bonded to the second lower electrode 32C, and the first outer bonding pad 47C is located outside the insulating layer 1C and separated from the insulating layer 1C; the second sheet metal terminal 5C includes a second inner bonding tab 51C, a second outer bonding tab 57C, and a second connecting piece connected between the second inner bonding tab 41C and the second outer bonding tab 47C; the second inner bonding pad 57C is bonded to the first upper electrode 21C, and the second outer bonding pad 57C is located outside the insulating layer 1C and separated from the insulating layer 1C.

Further, the first connecting piece includes an inclined portion 42C extending obliquely downward along a left end of the first inner welding piece 41C, a first lateral portion 43C extending leftward along a lower end of the inclined portion 42C, a first vertical portion 44C extending upward along a left end of the first lateral portion 43C, a second lateral portion 45C extending leftward along an upper end of the first vertical portion 44C, and a second vertical portion 46C extending downward along a left end of the second lateral portion 45C; a first outer welding tab 47C is horizontally connected to the lower end of the second vertical portion 46C and is away from the insulating layer 1C from the left end of the first outer welding tab 47C, and a first inner welding tab 41C is horizontally connected to the upper end of the inclined portion 42C; the second connecting piece includes an inclined straight portion 52C provided obliquely upward along a right end of the second inner welding piece 51C, a first horizontal portion 53C extending rightward along an upper end of the inclined straight portion 52C, a first vertical portion 54C extending downward along a right end of the first horizontal portion 53C, a second horizontal portion 55C extending rightward along a lower end of the first vertical portion 54C, a second vertical portion 56C extending downward along a right end of the second horizontal portion 55C; the second outer welding tab 57C is horizontally connected to the lower end of the second vertical portion 56C with the right end of the second outer welding tab 57C being distant from the insulating layer 1C, and the second inner welding tab 51C is horizontally connected to the lower end of the inclined straight portion 52C.

The technical content of the present invention is further described by the embodiments only, so that the reader can understand it more easily, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. A patch type multi-chip piezoresistor is characterized by comprising a first piezoresistor chip, a second piezoresistor chip, a first sheet metal terminal, a second sheet metal terminal and an insulating layer; the first piezoresistor chip and the second piezoresistor chip are distributed in an up-down structure, the first piezoresistor chip and the second piezoresistor chip are packaged in an insulating layer, a first upper electrode and a first lower electrode are respectively arranged at the top and the bottom of the first piezoresistor chip, a second upper electrode and a second lower electrode are respectively arranged at the top and the bottom of the second piezoresistor chip, one end of the first sheet-shaped metal terminal is welded between the first lower electrode and the second upper electrode or between the first sheet-shaped metal terminal and the second upper electrode, the other end of the first sheet-shaped metal terminal penetrates through the insulating layer, one end of the second sheet-shaped metal terminal is welded on the first upper electrode, and the other end of the second sheet-shaped metal terminal penetrates through the insulating layer or is welded on the second lower electrode.

2. A chip type multi-chip varistor according to claim 1, wherein said first sheet-like metal terminal comprises a first inner bonding pad, a first outer bonding pad, and a first connecting pad connected between the first inner bonding pad and the first outer bonding pad; the first inner welding sheet is welded between the first lower electrode and the second upper electrode, and the first outer welding sheet is attached to the outer surface of the insulating layer; the second sheet metal terminal comprises a second upper welding sheet, a second lower welding sheet and a second connecting sheet connected between the second upper welding sheet and the second lower welding sheet; the second upper welding sheet is welded with the first upper electrode, and the second lower welding sheet is welded with the second lower electrode; further comprising a third sheet metal terminal; the third sheet metal terminal comprises a third inner welding sheet, a third outer welding sheet and a third connecting sheet connected between the third inner welding sheet and the third outer welding sheet; the third inner welding sheet is welded with the second connecting sheet, and the third outer welding sheet is attached to the outer surface of the insulating layer.

3. A chip type multi-chip varistor according to claim 2, wherein said first connection piece comprises a first vertical portion extending downward along a left end of the first inner bonding piece, a lateral portion extending leftward along a lower end of the first vertical portion, and a second vertical portion extending downward along the lateral portion; the first outer welding sheet is horizontally connected to the lower end of the second vertical part and attached to the outer surface of the insulating layer, and the first inner welding sheet is horizontally connected to the upper end of the first vertical part; the second connecting piece comprises a first inclined part extending upwards along the right end of the second upper welding piece in an inclined mode, a first horizontal part extending rightwards along the right end of the first inclined part, a vertical part extending downwards along the right end of the first horizontal part, a second horizontal part extending leftwards along the lower end of the vertical part, and a second inclined part extending upwards along the left end of the second horizontal part in an inclined mode; the second lower welding piece is horizontally connected to the upper end of the second inclined part, and the second upper welding piece is horizontally connected to the lower end of the first inclined part; the third connecting piece comprises a horizontal connecting part extending rightwards along the lower end of the third inner welding piece and a vertical connecting part extending downwards along the right end of the horizontal connecting part; welding plate vertical connection in the third in the left end of horizontal connecting portion, the outer welding plate horizontal connection of third in the lower extreme of vertical connecting portion and with the surface laminating of insulating layer.

4. A chip type multi-chip varistor according to claim 1, wherein said first sheet-like metal terminal comprises a first inner bonding pad, a first outer bonding pad, and a first connecting pad connected between the first inner bonding pad and the first outer bonding pad; the first inner welding sheet is welded between the first lower electrode and the second upper electrode, and the first outer welding sheet is positioned outside the insulating layer and separated from the insulating layer; the second sheet metal terminal comprises a second upper welding sheet, a second lower welding sheet and a second connecting sheet connected between the second upper welding sheet and the second lower welding sheet; the second upper welding sheet is welded with the first upper electrode, and the second lower welding sheet is welded with the second lower electrode; further comprising a third sheet metal terminal; the third sheet metal terminal comprises a third inner welding sheet, a third outer welding sheet and a third connecting sheet connected between the third inner welding sheet and the third outer welding sheet; the third inner welding sheet is welded with the second connecting sheet, and the third outer welding sheet is located outside the insulating layer and separated from the insulating layer.

5. The chip-type multi-chip varistor according to claim 4, wherein said first connection piece includes a vertical portion; the first inner welding sheet is horizontally connected to the upper end of the vertical part, the first outer welding sheet is horizontally connected to the lower end of the vertical part, and the left end of the first outer welding sheet is far away from the insulating layer; the second connecting piece comprises a first inclined part extending upwards along the right end of the second upper welding piece in an inclined mode, a first horizontal part extending rightwards along the right end of the first inclined part, a vertical part extending downwards along the right end of the first horizontal part, a second horizontal part extending leftwards along the lower end of the vertical part, and a second inclined part extending upwards along the left end of the second horizontal part in an inclined mode; the second lower welding piece is horizontally connected to the upper end of the second inclined part, and the second upper welding piece is horizontally connected to the lower end of the first inclined part; the third connecting piece comprises a horizontal connecting part extending rightwards along the lower end of the third inner welding piece and a vertical connecting part extending downwards along the right end of the horizontal connecting part; the welding piece vertical connection in the third in the left end of horizontal connecting portion, the outer welding piece horizontal connection of third is in the lower extreme of vertical connecting portion and the right-hand member of the outer welding piece of third is kept away from in the insulating layer.

6. A chip type multi-chip varistor according to claim 1, wherein said first sheet-like metal terminal comprises a first inner bonding pad, a first outer bonding pad, and a first connecting pad connected between the first inner bonding pad and the first outer bonding pad; the first inner welding sheet is welded on the second lower electrode, and the first outer welding sheet is attached to the outer surface of the insulating layer; the second sheet metal terminal comprises a second inner welding sheet, a second outer welding sheet and a second connecting sheet connected between the second inner welding sheet and the second outer welding sheet; the second inner welding sheet is welded with the first upper electrode, and the second outer welding sheet is attached to the outer surface of the insulating layer.

7. A chip type multi-chip varistor according to claim 6, wherein said first connection piece comprises an inclined portion extending obliquely downward along a left end of the first inner bonding piece, a first lateral portion extending leftward along a lower end of the inclined portion, a first vertical portion extending upward along a left end of the first lateral portion, a second lateral portion extending leftward along an upper end of the first vertical portion, and a second vertical portion extending downward along a left end of the second lateral portion; the first outer welding sheet is horizontally connected to the lower end of the second vertical part and attached to the outer surface of the insulating layer, and the first inner welding sheet is horizontally connected to the upper end of the inclined part; the second connecting piece comprises an inclined straight part which is obliquely arranged upwards along the right end of the second inner welding piece, a first horizontal part which extends rightwards along the upper end of the inclined straight part, a first vertical part which extends downwards along the right end of the first horizontal part, a second horizontal part which extends rightwards along the lower end of the first vertical part, and a second vertical part which extends downwards along the right end of the second horizontal part; the second outer welding sheet is horizontally connected to the lower end of the second vertical portion and attached to the outer surface of the insulating layer, and the second inner welding sheet is horizontally connected to the lower end of the oblique straight portion.

8. A chip type multi-chip varistor according to claim 1, wherein said first sheet-like metal terminal comprises a first inner bonding pad, a first outer bonding pad, and a first connecting pad connected between the first inner bonding pad and the first outer bonding pad; the first inner welding sheet is welded on the second lower electrode, and the first outer welding sheet is positioned outside the insulating layer and separated from the insulating layer; the second sheet metal terminal comprises a second inner welding sheet, a second outer welding sheet and a second connecting sheet connected between the second inner welding sheet and the second outer welding sheet; the second inner welding connecting sheet is welded with the first upper electrode, and the second outer welding connecting sheet is positioned outside the insulating layer and separated from the insulating layer.

9. A chip type multi-chip varistor according to claim 8, wherein said first connection piece comprises an inclined portion extending obliquely downward along a left end of the first inner bonding piece, a first lateral portion extending leftward along a lower end of the inclined portion, a first vertical portion extending upward along a left end of the first lateral portion, a second lateral portion extending leftward along an upper end of the first vertical portion, and a second vertical portion extending downward along a left end of the second lateral portion; the first outer welding sheet is horizontally connected to the lower end of the second vertical part and is far away from the insulating layer with the left end of the first outer welding sheet, and the first inner welding sheet is horizontally connected to the upper end of the inclined part; the second connecting piece comprises an inclined straight part which is obliquely arranged upwards along the right end of the second inner welding piece, a first horizontal part which extends rightwards along the upper end of the inclined straight part, a first vertical part which extends downwards along the right end of the first horizontal part, a second horizontal part which extends rightwards along the lower end of the first vertical part, and a second vertical part which extends downwards along the right end of the second horizontal part; the second outer welding piece is horizontally connected to the lower end of the second vertical portion, the right end of the second outer welding piece is far away from the insulating layer, and the second inner welding piece is horizontally connected to the lower end of the inclined straight portion.