CN212781578U

CN212781578U - Electronic device

Info

Publication number: CN212781578U
Application number: CN202021849611.0U
Authority: CN
Inventors: 陈志顺
Original assignee: Oppo Chongqing Intelligent Technology Co Ltd
Current assignee: Oppo Chongqing Intelligent Technology Co Ltd
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2021-03-23
Anticipated expiration: 2030-08-28

Abstract

The embodiment of the application provides electronic equipment, which comprises a middle frame; the circuit board is arranged on one side of the middle frame; the display memory chip is arranged on the circuit board; the display driving chip is arranged on the circuit board and used for transmitting display data to the display storage chip; and the conductive piece is electrically connected with the circuit board and the middle frame and is used for transmitting the induction signal generated on the circuit board when the display driving chip transmits the display data to the middle frame. The electronic equipment conducts the induction signal to the middle frame through the conductive pieces electrically connected with the circuit board and the middle frame, so that the problem that the induction signal generated by the display screen during working interferes with the electronic equipment to receive and send the communication signal can be effectively solved, and the communication quality of the electronic equipment is effectively improved.

Description

Electronic device

Technical Field

The present disclosure relates to electronic devices, and particularly to an electronic device.

Background

With the rapid development of science and technology, electronic devices such as smart phones and the like are increasingly popularized. At present, electronic devices such as smart phones and tablet computers in the market are generally touch display screens. In order to bring better visual experience to users, the display effect of the display screen is better and better. However, when the display screen is in operation, it is easy to interfere with the electronic device to transmit and receive communication signals, so that the communication quality of the electronic device is reduced.

Disclosure of Invention

The embodiment of the application provides an electronic device, can solve the problem that the produced inductive signal of display screen during operation disturbs electronic device receiving and dispatching communication signal effectively, and then promotes electronic device's communication quality effectively.

The embodiment of the application discloses electronic equipment, includes:

a middle frame;

the circuit board is arranged on one side of the middle frame;

the display memory chip is arranged on the circuit board;

the display driving chip is arranged on the circuit board and used for transmitting display data to the display storage chip;

and the conductive piece is electrically connected with the circuit board and the middle frame and is used for transmitting the induction signal generated on the circuit board when the display driving chip transmits the display data to the middle frame.

The electronic equipment that provides in the embodiment of this application is through the electrically conductive piece of being connected with circuit board, the equal electricity of center, with sensing signal conduction to center, can solve the produced sensing signal interference electronic equipment receiving and dispatching communication signal's of display screen during operation problem effectively, and then promote electronic equipment's communication quality effectively.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a first structural schematic diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a first cross-sectional view of the electronic device of fig. 1 taken along the direction P1-P2.

Fig. 3 is a second cross-sectional view of the electronic device of fig. 1 taken along the direction P1-P2.

Fig. 4 is a schematic flowchart of the display screen operation provided in the embodiment of the present application.

Fig. 5 is a third cross-sectional view of an electronic device provided in an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.

The embodiment of the application provides an electronic device, which may be an electronic device such as a smart phone, a tablet computer, a Personal Digital Assistant (PDA), and the like.

Referring to fig. 1, fig. 1 is a first structural schematic diagram of an electronic device 10 according to an embodiment of the present disclosure, where the electronic device 10 may include a middle frame 100, a circuit board 200, a display memory chip 300, a display driving chip 400, and a conductive member 500.

In some embodiments, the middle frame 100 may mainly allow the sensing signal generated on the circuit board 200 where the display memory chip 300 and the display driver chip 400 are located when transmitting the display data to flow back to the middle frame main ground through the conductive member 500, so as to shield the interference of the sensing signal to the communication signal of the electronic device 10. The middle frame 100 may be made of various materials, such as metal, plastic, etc., and may be specifically configured according to actual requirements.

In some embodiments, the circuit board 200 is disposed inside the electronic device 10. Referring to fig. 2 in addition to fig. 1, fig. 2 is a cross-sectional view of the electronic device 10 taken along a direction P1-P2 in fig. 1. As shown in fig. 2, the circuit board 200 is disposed at one side of the middle frame 100, the display memory chip 300 is disposed on the circuit board 200, and the display driving chip 400 is disposed on the circuit board 200, the display driving chip 400 being used to transmit display data to the display memory chip 300.

In some embodiments, the display Memory chip 300 may be a Static Random-Access Memory (SRAM IC).

In some embodiments, the display Driver chip 400 may be a Driver Integrated Circuit (Driver IC).

It can be understood that when the display screen is in operation, the display driving chip 400 and the display memory chip 300 transmit display data, which may generate an inductive signal on the circuit board 200, specifically, generate an inductive signal when data is transmitted between the chips, and couple to the circuit board 200, which may interfere with the normal operation of the antenna assembly of the electronic device 10, interfere with the communication signal of the electronic device 10, cause the communication quality of the electronic device 10 to be degraded, and affect the user experience.

It will be appreciated that in some embodiments, the electronic device 10 further includes a display screen 600, the display screen 600 and the center frame 100 being disposed on opposite sides of the circuit board 200. For example, the display screen 600 is disposed above the circuit board 200, and the middle frame 100 is disposed below the circuit board 200. The display driving chip 400 transmits the display data to the display memory chip 300 to drive the display screen 600 to operate.

Referring to fig. 3, fig. 3 is a second cross-sectional view of the electronic device 10 taken along a direction P1-P2 in fig. 1, where the electronic device 10 may include a middle frame 100, a circuit board 200, a display memory chip 300, a display driver chip 400, a conductive member 500, and a display screen 600.

Among other things, display screen 600 may be a touch screen display incorporating a conductive capacitive touch sensor electrode layer or other touch sensor components (e.g., resistive touch sensor components, acoustic touch sensor components, force-based touch sensor components, light-based touch sensor components, etc.), or may be a non-touch sensitive display. Capacitive touch screen electrodes may be formed from an array of indium tin oxide pads or other transparent conductive structures.

Display screen 600 may include an array of display pixels formed from Liquid Crystal Display (LCD) components, an array of electrophoretic display pixels, an array of plasma display pixels, an array of organic light emitting diode display pixels, an array of electrowetting display pixels, or display pixels based on other display technologies. Display screen 600 may be protected using a display screen 600 cover layer such as a transparent glass layer, light-transmissive plastic, sapphire, or other transparent dielectric layer. In some embodiments, the display screen 600 may be a flexible screen, i.e., the display screen 600 may be bendable and foldable. The display screen 600 may also be an Organic Light-Emitting semiconductor (OLED) display screen 600.

In some embodiments, the display screen 600 may be a full-screen or a non-full-screen structure, and may be specifically set according to actual requirements.

Specifically, when the display screen 600 needs to display content, the DRIVER IC needs to transfer display data to the SRAM IC to enable the display screen 600 to display the content. As shown in fig. 4, fig. 4 is a schematic flowchart of the display screen operation provided in the embodiment of the present application. In some embodiments, the electronic device 10 may include a Processor 700, and the Processor 700 may send a signal to the Driver IC based on a Mobile Industry Processor Interface (MIPI) protocol. When the Driver IC receives the signal sent by the processor, the signal is sent to the SRAM IC through the T2M protocol (a communication protocol between the SRAM IC and the Driver IC), so that the Driver IC can call the content stored in the SRAM IC through the T2M protocol and send the content to the display screen 600 for displaying.

Since the frequency of the signals transmitted via the T2M protocol is related to the refresh rate of the display screen 600, specifically, the higher the refresh rate of the display screen 600, the higher the oscillation frequency of the corresponding T2M signal. For example, the frequency of the T2M signal may be 8 times the oscillation frequency, i.e., T2M ═ 8 × OSC (Oscillator, OSC).

When the electronic device 10 uses a display screen with a high refresh rate, a user lights up the display screen 600 during the use of the electronic device 10, and a high frequency signal transmitted during the operation of the display screen 600 may affect the receiving and transmitting of a communication signal by an antenna assembly of the electronic device 10, thereby affecting the communication quality of the electronic device 10. Although a user of the display screen 600 with a high refresh rate has a good visual experience, the noise signal generated during the operation of the user affects the communication experience of the user.

In some embodiments, the conductive member 500 is electrically connected to both the circuit board 200 and the middle frame 100, and the conductive member 500 is used for conducting the sensing signal generated on the circuit board 200 when the display driving chip 400 transmits the display data to the middle frame 100.

For example, in the present application, by providing the conductive member 500, the conductive member 500 is electrically connected to both the circuit board 200 and the middle frame 100. When a user lights the display screen in the process of using the electronic device 10, in the working process of the display screen, the sensing signal generated when data is transmitted between the DRIVER IC and the SRAM IC is guided to flow back to the main ground of the middle frame by setting the conductive member 500 to generate a backflow path on the circuit board, so that main interference energy contained in the sensing signal flows back to the main ground, the interference of the sensing signal to the antenna assembly of the electronic device is reduced, and the communication quality of the electronic device is effectively improved.

The conductive member 500 may be made of various materials, for example, the conductive member 500 may be a conductive foam, a metal conductive foam, or the like. When the conductive member 500 is disposed, if the conductive member 500 is a metal conductive foam, the conductive metal conductive foam may be half-wrapped or fully-wrapped so as to transmit the sensing signal generated on the circuit board 200 when the display driving chip 400 transmits the display data to the middle frame 100 from the interference source.

In some embodiments, as shown in fig. 3, the display memory chip 300 and the display driving chip 400 may be disposed at an interval, and in particular, the display memory chip 300 and the display driving chip 400 may be disposed at two sides of the conductive member 500 at an interval.

Referring to fig. 5, fig. 5 is a third cross-sectional view of an electronic device according to an embodiment of the disclosure. Since the conductive member 500 is electrically connected to the middle frame 100 and the middle frame 100 is grounded, in order to enable the display memory chip 300 to normally operate, in some embodiments, a first insulator is disposed between the display memory chip 300 and the conductive member 500, and the first insulator can prevent the display memory chip 300 from being electrically connected to the conductive member 500, which may cause the display memory chip 300 to fail to normally operate due to a ground short circuit.

Referring to fig. 5, in order to enable the display driving chip 400 to operate normally, in some embodiments, a second insulator is disposed between the display driving chip 400 and the conductive member 500, and the second insulator can prevent the display driving chip 400 from being in point connection with the conductive member 500, which may cause the display driving chip 400 to fail to operate normally due to a short circuit.

It should be noted that the terms "first" and "second" in the description of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features.

In some embodiments, the circuit board 200 may be composed of two parts, as shown in fig. 6, fig. 6 is a schematic structural diagram of the circuit board provided in the embodiments of the present application, and the circuit board 200 may include a first sub circuit board 210 and a second sub circuit board 220, where the second sub circuit board 220 is spaced apart from the first sub circuit board 210.

In some embodiments, the first sub-circuit board 210 may be of various types. For example, the first sub Circuit Board 210 may be a Printed Circuit Board (PCB).

In some embodiments, the second sub-Circuit board 220 may be a Flexible Printed Circuit (FPC), which is a Printed Circuit board made of a Flexible insulating substrate, and the FPC may be freely bent, rolled, and folded compared to the PCB, thereby greatly reducing the volume and weight of the electronic device 10.

In some embodiments, when the circuit board 200 is composed of the first sub circuit board 210 and the second sub circuit board 220, the display memory chip 300 may be disposed on the first sub circuit board 210. For example, the SRAM IC may be disposed on a PCB.

In some embodiments, when the circuit board 200 is composed of the first sub circuit board 210 and the second sub circuit board 220, the display driving chip 400 may be disposed on the second sub circuit board 220. For example, the Driver IC may be provided on the FPC.

In some embodiments, when the circuit board 200 is composed of the first sub circuit board 210 and the second sub circuit board 220, the display memory chip 300 may be disposed on the first sub circuit board 210, and the display driving chip 400 may be disposed on the second sub circuit board 220. For example, the SRAM IC may be disposed on the PCB and the Driver IC may be disposed on the FPC.

In some embodiments, a receiving space for receiving the conductive member 500 may be formed between the circuit board 200 and the middle frame 100.

In some embodiments, the electronic device 10 may also include a housing (not shown) that forms an exterior contour of the electronic device 10, which may be formed from plastic, glass, ceramic, fiber composite, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials.

The shell may be formed using a one-piece configuration in which some or all of the shell is machined or molded as a single structure, or may be formed using multiple structures (e.g., an inner frame structure, one or more structures that form an outer shell surface, etc.). The housing may provide a receiving cavity to receive components of the electronic device 10, such as the circuit board 200, the display memory chip 300, the display driver chip 400, and the like.

The electronic device provided by the embodiment of the application is described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An electronic device, characterized in that the electronic device comprises:

a middle frame;

the circuit board is arranged on one side of the middle frame;

the display memory chip is arranged on the circuit board;

2. The electronic device of claim 1, wherein the display memory chip and the display driver chip are disposed at intervals on two sides of the conductive member.

3. The electronic device of claim 2, wherein a first insulating member is disposed between the display memory chip and the conductive member.

4. The electronic device of claim 2, wherein a second insulating member is disposed between the display driving chip and the conductive member.

5. The electronic device of claim 1, wherein the circuit board comprises:

a first sub circuit board;

a second sub circuit board spaced from the first sub circuit board.

6. The electronic device of claim 5, wherein the display memory chip is disposed on the first sub circuit board.

7. The electronic device of claim 5, wherein the display driver chip is disposed on the second sub circuit board.

8. The electronic device according to any one of claims 1 to 7, wherein the circuit board and the middle frame form a receiving space for receiving the conductive member.

9. The electronic device of claim 8, wherein the conductive member comprises conductive foam.

10. The electronic device of claim 1, further comprising a display screen, wherein the display screen and the middle frame are disposed on opposite sides of the circuit board, and the display driver chip transmits display data to the display memory chip to drive the display screen to operate.