CN212761614U - Vibration device - Google Patents

Vibration device Download PDF

Info

Publication number
CN212761614U
CN212761614U CN202021356832.4U CN202021356832U CN212761614U CN 212761614 U CN212761614 U CN 212761614U CN 202021356832 U CN202021356832 U CN 202021356832U CN 212761614 U CN212761614 U CN 212761614U
Authority
CN
China
Prior art keywords
heat pipe
heat
pipe radiator
vibration
vibratory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021356832.4U
Other languages
Chinese (zh)
Inventor
叶博森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Longhui Electronic Technology Co ltd
Original Assignee
Guangzhou Longhui Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Longhui Electronic Technology Co ltd filed Critical Guangzhou Longhui Electronic Technology Co ltd
Priority to CN202021356832.4U priority Critical patent/CN212761614U/en
Application granted granted Critical
Publication of CN212761614U publication Critical patent/CN212761614U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a vibrating device, including brace table, bobbing machine and anchor clamps, the bobbing machine install in on the brace table, utilize the bobbing machine gives the brace table is applyed the vibration, anchor clamps install in on the mesa of brace table, just anchor clamps are used for being fixed in article locking on the brace table. The vibrating device can clamp and fix the heat pipe radiator, can remove air holes in metal compounds at the welding interface of the heat pipe radiator, and improves the welding quality of the heat pipe radiator, thereby improving the radiating effect.

Description

Vibration device
Technical Field
The utility model relates to a bobbing machine technical field especially relates to a vibrating device.
Background
The heat pipe radiator has the advantages of high heat conductivity, light weight, simple structure, low cost, capability of transferring a large amount of heat without electric power and the like, and is widely applied to various occasions needing heat dissipation. For example, the heat dissipation is quickly conducted away to the integrated devices with large heat productivity, such as the CPU of the electronic heating component, and the like, so that the heat accumulation caused by the heating of the electronic heating component is effectively reduced, and the normal work of the electronic component is ensured.
The heat pipe radiator at least comprises a base and heat pipes, the top surface of the base is used for being in contact with a heat source, a plurality of heat pipe grooves are formed in the top surface of the base, and the heat pipes are arranged in the heat pipe grooves and are fixedly welded with the heat pipe grooves. The top surface of the base is in close contact with the electronic heating element, and the heat of the electronic heating element is transferred to the outside of the heat source through the heat pipe and is dissipated.
The current method for manufacturing the heat pipe radiator comprises the following steps: the base is placed into a jig with a positioning function, then the heat pipe is placed into a heat pipe groove, soldering paste is smeared in a gap between the heat pipe and the heat pipe groove which need to be connected during welding through a dispenser, an upper cover body of the jig is covered, the soldering paste is fed into a reflow furnace for heating and hot melting, the soldering paste is softened and collapsed to cover the gap between the heat pipe and the heat pipe groove, then the heat pipe radiator is cooled to enable a welding interface to be solidified and form a metal compound, and then the surface treatment is carried out on the welding interface of the heat pipe radiator.
However, in practice, after the solder paste is heated and melted, internal impurities (such as rosin) overflow outwards, and the impurities prop out air holes inside the solder paste, and since the solder paste is immediately discharged from a furnace after being melted, the solder paste is cooled in a short time after being discharged from the furnace, so that air inside a metal compound at a welding interface of a heat pipe radiator is not discharged in time and is solidified, internal residual air holes are caused, and the internal residual air holes cause increase of contact thermal resistance and influence on the heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a vibrating device, this vibrating device can carry out the clamping to heat pipe radiator and fix to can get rid of the inside gas hole of the metallic compound of heat pipe radiator's welding interface department, improve heat pipe radiator's welding quality, thereby improve the radiating effect.
The purpose of the utility model is realized by adopting the following technical scheme:
the vibrating device is used for applying vibration to the heated heat pipe radiator and comprises a supporting table, a vibrating machine and a clamp, wherein the vibrating machine is installed on the supporting table and used for applying vibration to the supporting table, the clamp is installed on the table top of the supporting table, and the clamp is used for locking and fixing the heated heat pipe radiator on the supporting table.
Further, the clamp comprises a pair of supporting pieces, a pressing piece and a locking structure, the supporting pieces are vertically fixed on the table top of the supporting table, the supporting pieces are arranged in parallel at intervals, connecting holes are formed in two ends of the pressing piece, the pressing piece is sleeved on the supporting pieces through the connecting holes, an object is arranged between the table top of the supporting table and the pressing piece, and the pressing piece is locked through the locking structure.
Further, a pair of the supporting members are arranged at intervals in a vibration direction of the vibrator.
Furthermore, the locking structure is a locking nut, the supporting piece is provided with a threaded section, the locking nut is matched with the threaded section, and the bottom of the locking nut abuts against the top of the pressing piece.
Further, the clamp is configured with two, and the interval sets up between two clamps.
Further, the vibrating machine is a vibrating motor.
Further, the vibration acceleration of the vibrator is equal to or greater than 1 g.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the heated heat pipe radiator can be reliably clamped on the support table by utilizing the clamp, the vibrating machine is started, the molten soldering paste can rapidly flow to the air hole position and be filled by utilizing vibration, so that the air at the air hole position can be timely and rapidly discharged before the molten soldering paste is solidified, the air hole in the metal compound at the welding interface of the heat pipe radiator can be removed, the welding defect can be effectively eliminated, the welding quality is improved, meanwhile, the structure of the metal compound for eliminating the air hole is finer, after the surface treatment is carried out on the welding interface of the heat pipe radiator, the surface of the treated welding interface is smooth and has no recess, the surface area of the heat pipe radiator contacted with a heat source can be increased, the heat conduction performance is improved, the heat dissipation effect is better, in addition, the air hole in the welding interface of the heat pipe radiator can be eliminated, the heat conduction coefficient of the metal compound at the fine-structure welding interface is larger than that of the metal compound with the air hole remained in the welding interface of the The heat conductivity coefficient of the heat-conducting material is high, the heat-conducting performance of the heat-conducting material can be further improved, and the heat-radiating effect is better.
Drawings
Fig. 1 is a schematic structural view of a heat pipe radiator of the present invention;
FIG. 2 is a schematic view of the heat pipe heat sink shown in FIG. 1 clamped to a mold;
fig. 3 is a schematic structural view of the heat pipe radiator shown in fig. 1 clamped on the vibration device.
In the figure: 10. a heat pipe radiator; 101. a base; 1011. a heat pipe groove; 102. a heat pipe; 103. heat dissipation fins; 20. a mold; 30. a vibrating device; 301. a vibrator; 302. a support table; 303. a clamp; 3031. a support member; 3032. a pressing member; 3033. and locking the nut.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.
Referring to fig. 1, a heat pipe radiator 10 according to the present invention is shown, the heat pipe radiator 10 at least includes a base 101, a plurality of heat pipes 102 and a plurality of heat dissipating fins 103, a top surface of the base 101 shown in the figure is a heat source surface contacting with an external heat source, a plurality of heat pipe grooves 1011 adapted to the shape of the heat pipes 102 are formed on the top surface of the base 101, the heat pipes 102 are welded in the heat pipe grooves 1011, the heat pipes 102 have at least one plane, the plane is located on the same horizontal plane as the top surface of the base 101, and the heat dissipating fins 103 are disposed at the bottom of the base 101, the heat pipes 102 are used to rapidly take out heat from the external heat source and dissipate the heat outwards through the heat dissipating fins 103.
The utility model relates to a method for removing melting soldering paste air hole of heat pipe radiator in a better embodiment, which comprises the following steps:
s1: providing at least a heat pipe 102 and a base 101, and manufacturing a heat pipe groove 1011 on the base 101 by machining, wherein the shape of the heat pipe 102 is matched with that of the heat pipe groove;
s2: the heat pipe 102 is in clearance fit with the heat pipe groove 1011, then solder paste is coated in the clearance between the heat pipe 102 and the heat pipe groove 1011, then the heat pipe 102 and the base 101 are locked and fixed through the mold 20 shown in fig. 2, the heat pipe 102 is prevented from moving relative to the base 101, then the mold 20 and the heat pipe radiator 10 are placed in a heating furnace with the temperature of 270 ℃ -350 ℃ (preferably 300 ℃) for heating, and the heating time is controlled to be 15 min-25 min (preferably 20min), so that the solder paste is fully melted.
In the step, the heat pipe radiator 10 passes through two temperature zones, namely a preheating zone and a welding zone, in the heating furnace, firstly, the heat pipe radiator 10 enters the preheating zone, the solvent and the gas in the soldering paste are evaporated, meanwhile, the soldering flux in the soldering paste wets the welding pad, the soldering paste is softened and collapsed to cover the welding pad, the welding pad is isolated from oxygen, and the heat pipe radiator 10 is fully preheated; then the solder paste enters a welding area, the temperature rises rapidly to enable the solder paste to reach a molten state, and the liquid solder paste wets, diffuses, flows over and reflows on a welding interface between the parts of the heat pipe radiator 10 to generate metal compounds so as to form a solder joint;
s3: when the heating time is up, the mold 20 together with the heat pipe radiator 10 is immediately taken out of the heating furnace, then the mold 20 together with the heat pipe radiator 10 is rapidly placed on the vibration device 30 as shown in fig. 3 and is fixed on the vibration device 30 through the clamp 303, then the vibration device 30 is started to apply vibration to the heat pipe radiator 10, the molten solder paste is oscillated by the vibration, so that the molten solder paste can rapidly flow to the air hole position and fill the air hole, so that the air at the air hole position can be timely and rapidly exhausted before the molten solder paste is solidified, thereby removing the air hole inside the metal compound at the welding interface of the heat pipe radiator 10, effectively eliminating the welding defects and improving the welding quality, meanwhile, because the structure of the metal compound for eliminating the air hole is finer, after the surface treatment is carried out on the welding interface of the heat pipe radiator 10, the processed welding interface surface is smooth and has no depression, the surface area of the heat pipe radiator 10 contacted with a heat source can be increased, thereby improving the heat conduction performance, and the heat dissipation effect is better.
It is understood that the air holes mentioned in the embodiments of the present invention are understood as cavities formed due to the failure of timely discharging of the internal air.
As shown in fig. 3, in the step S3, when the heat pipe heat sink 10 is clamped, the length extending direction of the heat pipe 102 is controlled to be the same as the vibration direction of the vibration device 30, so that the heat pipe heat sink 10 vibrates along the length extending direction of the heat pipe 102, which makes the vibration stroke of the molten solder paste longer, and the vibration is more severe, which is more beneficial to discharge the internal gas, and effectively eliminates the air holes.
Further, in the step S3, the vibration time of the vibration device 30 is controlled to be 3min to 7min, preferably 5 min.
In the step S3, the vibration acceleration of the vibration device 30 is equal to or greater than 1g to improve the air hole eliminating effect.
S4: the jig 303 is removed to cool the heat pipe radiator 10, and then the mold is removed, and the surface treatment is performed on the welding interface of the heat pipe radiator 10, thereby completing the machining operation of the heat pipe radiator.
As shown in fig. 3, the utility model provides a vibrating device 30 includes a supporting bench 302, a vibrator 301 and a clamp 303, vibrator 301 install in on the supporting bench 302, apply the vibration for supporting bench 302 through vibrator 301, clamp 303 install in on the mesa of supporting bench 302, just clamp 303 is used for with heat pipe radiator 10 is locked and is fixed in on the supporting bench 302.
In a preferred embodiment, the vibration machine 301 is a vibration motor, and the vibration acceleration of the vibration motor is equal to or greater than 1g to increase the flow rate of the molten solder paste, so that the molten solder paste can be rapidly filled into the air holes, thereby improving the air hole removal efficiency.
With continued reference to fig. 3, the fixture 303 includes a pair of support members 3031, a pressing member 3032, and a locking structure, wherein the support members 3031 are vertically fixed on the table top of the support table 302, the pair of support members 3031 are spaced and arranged in parallel, two ends of the pressing member 3032 are both provided with through connection holes, the pressing member 3032 is sleeved on the support members 3031 through the connection holes, so that the pressing member 3032 can move up and down relative to the support members 3031, the heated mold 20 and the heat pipe radiator 10 are disposed between the table top of the support table 302 and the pressing member 3032, and the pressing member 3032 is locked by the locking structure, so as to reliably lock the heat pipe radiator 10 on the vibration device 30.
Specifically, the locking structure is a locking nut 3033, the support 3031 is configured with a threaded section, the locking nut 3033 is matched with the threaded section, the bottom of the locking nut 3033 abuts against the top of the abutting part 3032, during clamping, the heated mold 20 and the heat pipe radiator 10 are configured between the table surface of the support table 302 and the abutting part 3032, and then the heat pipe radiator 10 can be reliably fixed on the vibration device 30 by locking the locking nut 3033, so that the clamping operation is convenient.
With continued reference to fig. 3, a pair of the supporting members 3031 are arranged at intervals along the vibration direction of the vibrator 301, so that the length extending direction of the pressing member 3032 is consistent with the vibration direction of the vibrator 301, thereby providing better clamping force for the heat pipe radiator 10 and ensuring more reliable clamping.
Further, the two clamps 303 are configured, and the two clamps 303 are arranged at intervals, so that the clamping of the heat pipe radiator 10 is more reliable, and meanwhile, the clamping efficiency is higher. Of course, the number of the jigs 303 may be one or two or more.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims (7)

1. The vibration device is characterized by comprising a supporting table, a vibrator and a clamp, wherein the vibrator is arranged on the supporting table, the vibrator is used for applying vibration to the supporting table, the clamp is arranged on the table top of the supporting table, and the clamp is used for locking and fixing articles on the supporting table.
2. The vibration apparatus as claimed in claim 1, wherein the holder comprises a pair of supporting members, a pressing member and a locking structure, the supporting members are vertically fixed on the table top of the supporting table, the pair of supporting members are spaced and arranged in parallel, connecting holes are formed at both ends of the pressing member, the pressing member is sleeved on the supporting members through the connecting holes, an object is disposed between the table top of the supporting table and the pressing member, and the pressing member is locked by the locking structure.
3. The vibratory apparatus of claim 2 wherein a pair of said support members are spaced apart in the vibratory direction of said vibratory machine.
4. The vibration apparatus as claimed in claim 2, wherein the locking structure is a lock nut, the support member is provided with a threaded section, the lock nut is engaged with the threaded section, and a bottom of the lock nut abuts against a top of the pressing member.
5. The vibration apparatus as claimed in claim 1, wherein the jig is provided in two, and the two jigs are spaced apart from each other.
6. The vibratory apparatus of claim 1 wherein the vibratory machine is a vibratory motor.
7. The vibratory apparatus of claim 1 wherein the vibratory acceleration of the vibratory machine is equal to or greater than 1 g.
CN202021356832.4U 2020-07-10 2020-07-10 Vibration device Active CN212761614U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021356832.4U CN212761614U (en) 2020-07-10 2020-07-10 Vibration device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021356832.4U CN212761614U (en) 2020-07-10 2020-07-10 Vibration device

Publications (1)

Publication Number Publication Date
CN212761614U true CN212761614U (en) 2021-03-23

Family

ID=75078872

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021356832.4U Active CN212761614U (en) 2020-07-10 2020-07-10 Vibration device

Country Status (1)

Country Link
CN (1) CN212761614U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111975160A (en) * 2020-07-10 2020-11-24 广州龙辉电子科技有限公司 Method for removing fused solder paste air hole of heat pipe radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111975160A (en) * 2020-07-10 2020-11-24 广州龙辉电子科技有限公司 Method for removing fused solder paste air hole of heat pipe radiator

Similar Documents

Publication Publication Date Title
US6788537B2 (en) Heat pipe circuit board
US7834442B2 (en) Electronic package method and structure with cure-melt hierarchy
US7185420B2 (en) Apparatus for thermally coupling a heat dissipation device to a microelectronic device
WO2012070264A1 (en) Reflow soldering device and reflow soldering method
CN110678288B (en) Method for producing a welded connection
CN212761614U (en) Vibration device
KR20150133194A (en) Method for manufacturing bonded body and method for manufacturing power-module substrate
CN109256337B (en) Eutectic welding device and method for millimeter-scale elements with circumferences
JP2007335538A (en) Method of manufacturing semiconductor device
CN111975160A (en) Method for removing fused solder paste air hole of heat pipe radiator
JP5062710B2 (en) Method of joining substrate and device using Au-Sn alloy solder paste
JP3753524B2 (en) Manufacturing method of electronic parts
JP2004119944A (en) Semiconductor module and mounting substrate
Lee et al. Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages
CN114406391A (en) Welding method for aluminum-based flexible circuit board and component
Suppiah et al. A review on solder reflow and flux application for flip chip
JP7273369B2 (en) Brazing method and brazing apparatus for aluminum
US4441647A (en) Resoldering tool for ceramic substrate hybrid electronic circuits
Dušek et al. Effect of reflow technology and surface finishes of PCB on solder spreading
CN220672576U (en) IC integrated circuit chip capable of being installed rapidly
Yeo et al. Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging
JP7394243B1 (en) Heating device and method for manufacturing soldered objects
JP2004087609A (en) Inverter unit and manufacturing method thereof
JPH01289566A (en) Vapor phase/reflow soldering device
JP5214483B2 (en) Electronic component processing method and electronic component mounting method

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant