CN212755581U - Depth of field debugging mechanism and depth of field debugging device of image transmission assembly of electronic endoscope - Google Patents

Depth of field debugging mechanism and depth of field debugging device of image transmission assembly of electronic endoscope Download PDF

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Publication number
CN212755581U
CN212755581U CN202020666521.1U CN202020666521U CN212755581U CN 212755581 U CN212755581 U CN 212755581U CN 202020666521 U CN202020666521 U CN 202020666521U CN 212755581 U CN212755581 U CN 212755581U
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depth
debugging
field
block
motor
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CN202020666521.1U
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李�杰
邓安鹏
方斌
蒋青林
陈魁
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Chongqing Jinshan Medical Technology Research Institute Co Ltd
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Chongqing Jinshan Medical Technology Research Institute Co Ltd
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Abstract

The utility model discloses a depth of field debugging mechanism, electronic endoscope biography image subassembly depth of field debugging device, wherein, depth of field debugging mechanism includes the supporting shoe, fix on the debugging motor module on the supporting shoe, with the combination slider of debugging motor module fixed connection, be fixed with the fixture that is used for centre gripping objective lens module on the combination slider, be used for the upper briquetting of centre gripping objective lens seat and centre gripping COMS image sensitization chip's lower briquetting; the debugging motor module comprises a second motor, a second lead screw and a third movable sliding table, wherein the second motor is electrically connected with a debugging control system; the third movable sliding table is fixedly connected with the combined sliding block through a connecting block. The utility model discloses depth of field debugging mechanism can realize that electric control automatically regulated objective lens module and COMS image sensitization chip have improved production efficiency in the interval of Z axle direction even, the cost is reduced.

Description

Depth of field debugging mechanism and depth of field debugging device of image transmission assembly of electronic endoscope
Technical Field
The utility model relates to an electron endoscope debugging equipment field especially relates to a depth of field debugging mechanism, electron endoscope biography image subassembly depth of field debugging device.
Background
The micro high-resolution camera is arranged in the head end part of the electronic endoscope body, so that when a doctor uses the electronic endoscope to inspect a patient, whether the stomach tissue of the patient is diseased or not can be effectively observed through the micro high-resolution camera arranged in the head end part of the electronic endoscope, and the micro high-resolution camera is used for assisting electronic gastroscopy, electronic gastroscopy operation treatment and early cancer screening. Meanwhile, doctors can also check the condition of the stomach tissues of patients in real time through the electronic endoscope system in the operation process, and the electronic endoscope system is widely applied to digestive system professionals of all levels of medical institutions at present.
According to the standard requirement of 4.2.7 in YY1028-2008 'endoscope for upper digestive tract of fiber' on observing the depth of field range, in order to enable a doctor to acquire clear images in an effective depth of field range when using an electronic endoscope system, when an image transmission assembly in the electronic endoscope is produced and assembled, the depth of field distance between an objective lens module and a COMS image photosensitive chip needs to be adjusted.
When the depth of field is adjusted, the existing production process needs to manually fix the image transmission assembly on the tool fixing seat, then sequentially assemble the objective lens seat (the COMS image photosensitive chip is fixed on the objective lens seat) and the objective lens module, respectively fix the objective lens seat and the objective lens module through the tool, and then drive the objective lens module to move up and down through the manual adjusting sliding table, and meanwhile, the definition degree of the near-end resolution plate image is observed and determined through the mode of visual inspection of staff. If the detected image is not clear in the process of adjusting the depth of field and the standard target required on the depth of field near-end resolution board cannot be accurately identified, the objective lens module needs to be repeatedly adjusted to move up and down and then the standard of the resolution is visually observed to judge whether the standard of the resolution reaches the standard or not. And the debugging is repeated for a plurality of times until the near-end resolution debugging reaches the standard, and then the far-end resolution is debugged in the same way. And when the near-end resolution and the far-end resolution meet the resolution standard requirement, the qualified depth of field debugging of the image transmission assembly of the electronic endoscope can be judged.
The existing depth of field debugging device for the image transmission assembly of the electronic endoscope mostly adjusts the distance between an objective lens module and a COMS image photosensitive chip in the Z-axis direction through manual work when the depth of field is adjusted, and has the problems of low production efficiency, time waste and labor waste.
Therefore, those skilled in the art are devoted to developing an efficient depth of field debugging mechanism and a depth of field debugging device for an electronic endoscope image transmission assembly.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned defects in the prior art, the technical problem to be solved in the present invention is to provide an efficient depth of field debugging mechanism and depth of field debugging device for image transmission assembly of electronic endoscope.
In order to achieve the above object, the utility model provides a depth of field debugging mechanism, which comprises a supporting block, a debugging motor module fixed on the supporting block, and a combined slide block fixedly connected with the debugging motor module, wherein a clamping mechanism for clamping an objective lens module, an upper press block for clamping an objective lens seat and a lower press block for clamping a COMS image photosensitive chip are fixed on the combined slide block;
the debugging motor module comprises a second motor, a second lead screw and a third movable sliding table, wherein the second motor is electrically connected with a debugging control system;
the third movable sliding table is fixedly connected with the combined sliding block through a connecting block.
In order to control the stroke of debugging motor module reciprocating in the Z axle direction, still be equipped with on the debugging motor module be used for with farthest position detection photoelectric switch and nearest position detection photoelectric switch that the debugging control system electricity is connected, farthest position detection photoelectric switch and nearest position detection photoelectric switch equally divide respectively with debugging control system and second motor electricity are connected.
In order to ensure that the objective lens module and the COMS image photosensitive chip can be centered, the combined slide block comprises a Z-axis slide rail and a Z-axis slide block in sliding fit with the Z-axis slide rail, an X-axis slide rail is fixed on the Z-axis slide block, an X-axis slide block is in sliding fit with the X-axis slide rail, a Y-axis slide rail is fixed on the X-axis slide block, and a Y-axis slide block is in sliding fit with the Y-axis slide rail;
the clamping mechanism is fixedly connected to the Y-axis sliding block.
In order to conveniently install the COMS image sensing chip on the objective lens seat, the lower pressing block is in sliding fit with the upper pressing block.
The utility model also provides an electronic endoscope biography image subassembly depth of field debugging device, including foretell depth of field debugging mechanism.
The utility model has the advantages that: the utility model discloses depth of field debugging mechanism can realize that electric control automatically regulated objective lens module and COMS image sensitization chip have improved production efficiency in the interval of Z axle direction even, the cost is reduced.
Drawings
Fig. 1 is a schematic perspective view of a depth-of-field debugging device for an image transmission assembly of an electronic endoscope according to an embodiment of the present invention.
Fig. 2 is a front view of fig. 1.
Fig. 3 is a schematic structural view of a target moving mechanism in a depth-of-field debugging device of an image transmission assembly of an electronic endoscope according to an embodiment of the present invention.
Fig. 4 is a schematic structural view of a resolution target mechanism in the depth-of-field debugging device of the image transmission assembly of the electronic endoscope according to an embodiment of the present invention.
Fig. 5 is a schematic structural view of a mobile platform in a depth-of-field debugging device of an image transmission assembly of an electronic endoscope according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a depth-of-field adjustment mechanism according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a combined slider in a depth-of-field adjustment mechanism according to an embodiment of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples, wherein it is noted that, in the description of the invention, the terms "upper", "lower", "left", "right", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular manner, and therefore should not be construed as limiting the present invention. The terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 6 and 7, a depth-of-field debugging mechanism includes a supporting block 411, a debugging motor module 401 fixed on the supporting block 411, and a combined slider 405 fixedly connected to the debugging motor module 401; a clamping mechanism 406 for clamping the objective lens module 410, an upper pressing block 407b for clamping the objective lens holder 409 and a lower pressing block 407a for clamping the cmos image sensing chip 408 are fixed on the combined slide block 405.
The debugging motor module 401 comprises a second motor 401a electrically connected with the debugging control system 600, a second screw rod 401b fixedly connected with an output shaft of the second motor 401a, and a third movable sliding table 401c in threaded connection with the second screw rod 401 b.
The third moving sliding table 401c is fixedly connected with a combined sliding block 405 through a connecting block 404.
The debugging motor module 401 is also provided with a farthest position detection photoelectric switch 402 and a nearest position detection photoelectric switch 403 which are electrically connected with the debugging control system 600; the farthest position detecting photoelectric switch 402 and the nearest position detecting photoelectric switch 403 are electrically connected to the second motor 401a, respectively. The distance between the objective lens module 410 and the objective lens holder 409 can be detected by the farthest position detecting photoelectric switch 402 and the nearest position detecting photoelectric switch 403; the debugging control system 600 further controls the second motor 401a to start and stop, so as to control the stroke of the debugging motor module moving up and down in the Z-axis direction.
The combined slide block 405 comprises a Z-axis slide rail 405a and a Z-axis slide block 405b matched with the Z-axis slide rail in a sliding manner; an X-axis slide rail 405c is fixed on the Z-axis slide block; an X-axis sliding block 405d is in sliding fit with the X-axis sliding rail; a Y-axis slide rail 405e is fixed on the X-axis slide block; a Y-axis slider 405f is slidably fitted on the Y-axis slide rail.
The chucking mechanism 406 is fixedly attached to the Y-axis slider 405 f.
The lower press block 407a is slidably fitted on the upper press block 407 b.
As shown in fig. 1 to 5, the depth-of-field debugging mechanism can be applied to a depth-of-field debugging device of an image transmission assembly of an electronic endoscope, and includes a large bottom plate 500; a target moving mechanism 100 is arranged on one side of the upper side of the large bottom plate 500; the target moving mechanism 100 is provided with a resolving target mechanism 200 capable of moving along the Z-axis direction for mounting a resolving test board 207.
The other side of the upper side of the large bottom plate 500 is provided with a movable platform 300; the moving platform 300 is provided with a depth-of-field debugging mechanism 400 capable of moving along the X-axis and Y-axis directions, and is used for installing an objective lens module 410 and a cmos image sensor chip 408 below the resolution test board 207. In this embodiment, the supporting block 411 is fixed on the movable platform 300.
The large bottom plate 500 is also provided with a debugging control system 600; the debug control system 600 includes an image processor for electrically connecting with the cmos image sensor chip 408; the debugging control system 600 is electrically connected with the target moving mechanism 100 and the depth-of-field debugging mechanism 400 respectively; for adjusting the distance between the objective lens module 410 and the cmos image sensor chip 408 in the Z-axis direction.
In this embodiment, the target moving mechanism 100 includes a base plate 101 fixed on the large base plate 500, and a mounting fixing plate 105 erected on the base plate 101; the mounting plate 105 is provided with a motor module 106.
The motor module 106 comprises a first motor 106a electrically connected with the debugging control system 600, a first screw rod 106b fixedly connected with an output shaft of the first motor 106a, and a first movable sliding table 106c in threaded connection with the first screw rod 106 b.
The resolution target mechanism 200 is fixed to the first moving stage 106 c.
The base plate 101 is provided with a first support plate 102 supporting the mounting fixing plate 105.
The motor module 106 is also provided with a near-end depth-of-field position photoelectric switch 103 and a far-end depth-of-field position photoelectric switch 104; the near-end depth-of-field position photoelectric switch 103 and the far-end depth-of-field position photoelectric switch 104 are electrically connected to the debug control system 600 and the first motor 106a, respectively. Whether the resolution target mechanism 200 reaches the near-end depth of field working position and the far-end depth of field working position can be detected through the near-end depth of field position photoelectric switch 103 and the far-end depth of field position photoelectric switch 104; the start and stop of the first motor 106a are further controlled by the debugging control system 600, so as to ensure that the resolution test board can reach the near-end depth of field working position and the far-end depth of field working position.
In this embodiment, the resolution target mechanism 200 includes a connection bottom plate 201 fixed on the first moving sliding table 106c, a second moving sliding table 202 disposed on the connection bottom plate 201, a fixing plate 203 fixed on the second moving sliding table 202, and a light source supporting plate 205 transversely fixed on the fixing plate 203, where the light source supporting plate 205 is used to fix the resolution testing plate 207.
The light source support plate 205 is provided with a light source module 206.
The fixing plate 203 is provided with a second support plate 204 supporting a light source support plate 205.
The mobile platform 300 includes a mobile sliding table 301 capable of driving the depth of field debugging mechanism 400 to move along the X-axis and Y-axis directions. In this embodiment, the movable sliding table 301 is fixed on the combined rotary sliding table 305; the depth of field debugging mechanism 400 can be driven to move linearly along the X-axis and Y-axis directions by adjusting the knob of the movable sliding table 301. A moving platform bottom plate 307 is arranged on the moving sliding table 301; the movable sliding table 302 is fixed on the left side of the movable platform bottom plate 307; the objective lens holder fixing mechanism at the lower end of the depth of field debugging mechanism 400 can be driven to move linearly along the directions of the X axis and the Y axis by adjusting the knob of the movable sliding table 302. The objective lens holder fixing mechanism at the lower end of the depth of field debugging mechanism 400 can be driven to slightly rotate by a certain angle around the Y axis by adjusting the knob of the rotary sliding table 303. The objective lens holder fixing mechanism at the lower end of the depth of field debugging mechanism 400 can be driven to slightly rotate by a certain angle around the X axis by adjusting the knob of the rotary sliding table 304. The combined rotary sliding table 305 is fixedly connected with the corresponding mounting position of the large base plate 500 through the combined rotary sliding table 306; the movable platform 300 and the depth-of-field debugging mechanism 400 can be driven to integrally rotate by a certain angle around the Y axis by adjusting the knob of the combined rotating sliding table 305; the movable platform 300 and the depth-of-field debugging mechanism 400 can be driven to integrally rotate by a certain angle around the X axis by adjusting the knob of the combined rotating sliding table 306; the 6 sets of sliding tables (301-306) facilitate the operator to correct the relative positions of the image transmission assembly (the objective lens module and the cmos image sensor chip) to be debugged and the resolution test board 207.
Before debugging, the resolution test board 207 is installed on the light source support plate 205 of the resolution target mechanism 200, the objective lens module 410 is clamped on the clamping mechanism 406, the objective lens seat 409 is clamped on the upper pressing block 407b, and the cmos image photosensitive chip 408 is clamped on the lower pressing block 407 a; the positions of the clamping mechanism 406 on the X axis, the Y axis and the Z axis are adjusted through the combined sliding block 405, so that the objective lens module 410 is aligned with the objective lens seat 409; then, the pressing block 407a is pushed to enable the COMS image photosensitive chip 408 to be installed in the objective lens seat 409, and therefore the objective lens module and the COMS image photosensitive chip are centered; then, the depth-of-field debugging mechanism 400 is driven by the mobile platform 300 to move along the X-axis and Y-axis directions; in this embodiment, the mobile platform 300 may further drive the depth-of-field debugging mechanism 400 to slightly rotate around the X axis and the Y axis; the resolution test board 207, the objective lens module 410 and the cmos image sensor chip 408 are made to be concentric.
The debugging process is as follows:
the depth of field debugging device of the electronic endoscope image transmission assembly is powered on and started, and the debugging control system 600 turns on the light source of the light source module 206; after the system is started, the debugging control system 600 controls the motor module 106 to drive the resolution test board 207 to move to the near-end depth of field working position N; meanwhile, the debugging control system 600 controls the debugging motor module 401 to drive the clamping mechanism 406 to move up and down along the Z axis so as to adjust the distance between the objective lens module 410 and the COMS image photosensitive chip 408; the COMS image photosensitive chip 408 collects the resolution target image on the resolution test plate 207, and transmits the image to the image processor for image comparison and analysis; the debug control system 600 automatically determines whether the near-end depth-of-field resolution and the image quality meet the requirements.
If the near-end depth of field resolution meets the requirement, the debugging control system 600 controls the motor module 106 to drive the resolution test board 207 to move to the far-end depth of field working position F; the remote depth-of-field photoelectric switch 104 transmits a signal to the debugging control system 600 after detecting that the resolution test board 207 is in place; the debugging control system 600 controls the motor module 106 to stop working; then, acquiring a resolution target image on the resolution test plate 207 through the COMS image photosensitive chip 408, transmitting the image to an image processor, and then performing image comparison analysis processing; the debug control system 600 automatically determines whether the far-end depth-of-field resolution and the image quality meet the requirements.
The debugging control system 600 automatically debugs and automatically compares and analyzes the acquired image information; when the near-end resolution and the far-end resolution can meet the standard requirements, the system is shut down and a test result is fed back; an employee can visually observe the depth of field debugging result after the system is debugged through the display; after the depth of field is debugged to be qualified, the staff manually carries out glue dispensing and fixing on the objective lens module, the objective lens seat and the COMS image photosensitive chip; and finally completing the depth of field debugging work of the image transmission assembly.
The foregoing has described in detail preferred embodiments of the present invention. It should be understood that numerous modifications and variations can be devised by those skilled in the art in light of the teachings of the present invention without undue experimentation. Therefore, the technical solutions that can be obtained by a person skilled in the art through logic analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection defined by the claims.

Claims (5)

1. The depth of field debugging mechanism is characterized by comprising a supporting block (411), a debugging motor module (401) fixed on the supporting block (411) and a combined sliding block (405) fixedly connected with the debugging motor module (401), wherein a clamping mechanism (406) used for clamping an objective lens module (410), an upper pressing block (407b) used for clamping an objective lens seat (409) and a lower pressing block (407a) used for clamping a COMS image photosensitive chip (408) are fixed on the combined sliding block (405);
the debugging motor module (401) comprises a second motor (401a) electrically connected with a debugging control system (600), a second screw rod (401b) fixedly connected with an output shaft of the second motor (401a), and a third movable sliding table (401c) in threaded connection with the second screw rod (401 b);
and the third movable sliding table (401c) is fixedly connected with the combined sliding block (405) through a connecting block (404).
2. The depth of field commissioning mechanism of claim 1, wherein said commissioning motor module (401) further comprises a farthest position detecting photoelectric switch (402) and a nearest position detecting photoelectric switch (403) for electrically connecting to said commissioning control system (600), said farthest position detecting photoelectric switch (402) and said nearest position detecting photoelectric switch (403) being electrically connected to said second motor (401a), respectively.
3. The depth-of-field adjustment mechanism according to claim 1, wherein the combined slider (405) comprises a Z-axis slide rail (405a) and a Z-axis slider (405b) slidably engaged with the Z-axis slide rail, an X-axis slide rail (405c) is fixed on the Z-axis slider (405b), an X-axis slider (405d) is slidably engaged with the X-axis slide rail (405c), a Y-axis slide rail (405e) is fixed on the X-axis slider (405d), and a Y-axis slider (405f) is slidably engaged with the Y-axis slide rail (405 e);
the clamping mechanism (406) is fixedly connected to the Y-axis slide block (405 f).
4. The depth of field adjustment mechanism of claim 1, wherein the lower press block (407a) is a sliding fit on the upper press block (407 b).
5. A depth of field adjustment device for an electronic endoscope image transmission assembly, comprising a depth of field adjustment mechanism according to any one of claims 1 to 4.
CN202020666521.1U 2020-04-27 2020-04-27 Depth of field debugging mechanism and depth of field debugging device of image transmission assembly of electronic endoscope Active CN212755581U (en)

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CN202020666521.1U CN212755581U (en) 2020-04-27 2020-04-27 Depth of field debugging mechanism and depth of field debugging device of image transmission assembly of electronic endoscope

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Application Number Priority Date Filing Date Title
CN202020666521.1U CN212755581U (en) 2020-04-27 2020-04-27 Depth of field debugging mechanism and depth of field debugging device of image transmission assembly of electronic endoscope

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CN212755581U true CN212755581U (en) 2021-03-23

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