CN212750837U

CN212750837U - Wafer transmission device based on semiconductor manufacturing

Info

Publication number: CN212750837U
Application number: CN202022055693.8U
Authority: CN
Inventors: 李得平; 黄中山
Original assignee: SGS Ningbo Semiconductor Technology Co Ltd
Current assignee: SGS Ningbo Semiconductor Technology Co Ltd
Priority date: 2020-09-18
Filing date: 2020-09-18
Publication date: 2021-03-19
Anticipated expiration: 2030-09-18

Abstract

The utility model discloses a wafer transmission device based on semiconductor preparation, including base, support column and roof, the top of base is provided with adjustment mechanism, third servo motor is installed to one side of branch bottom one side fixed block, the lateral wall activity of second threaded rod has the movable block, the bottom mounting of movable block has the protection casing, the both sides of protection casing bottom all are provided with the grip block, one side of grip block all is provided with fixture. The utility model discloses a be provided with adjustment mechanism, when transporting the wafer, the workman can start first servo motor according to actual transmission's direction and drive the carousel and rotate to make the support column and the first threaded rod of carousel top take place to rotate, the wafer direction of drive grip block centre gripping takes place the adjustment, is convenient for transmit the wafer to different directions, and it is more convenient to use, has improved this conveyer's practicality greatly.

Description

Wafer transmission device based on semiconductor manufacturing

Technical Field

The utility model relates to a wafer production and processing technology field specifically is a wafer transmission device based on semiconductor preparation.

Background

The semiconductor is a material with conductivity, and the wafer is made by pulling and slicing the semiconductor, and the wafer can be made into various chips after being processed, the wafer of the station is often required to be moved to another station in the process of wafer production, and a special wafer transmission device is required for better transporting the wafers;

however, the conventional wafer transfer apparatus manufactured by semiconductor is not easy to adjust the transfer direction according to the actual situation when transferring the wafer, and is not practical, so that a wafer transfer apparatus manufactured by semiconductor has been developed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer transmission device based on semiconductor preparation to solve the wafer transmission device that provides in the above-mentioned background art and be not convenient for according to actual conditions, the problem of the direction of adjustment transmission.

In order to achieve the above object, the utility model provides a following technical scheme: a wafer conveying device based on semiconductor manufacturing comprises a base, supporting columns and a top plate, wherein an adjusting mechanism is arranged at the top end of the base and comprises a first servo motor, a rotary groove, a rotary rod and a rotary plate, the first servo motor is arranged at an intermediate position inside the base, the rotary plate is fixed at the top end of the first servo motor and extends to the top end of the base, the rotary rod is fixed on the outer side wall of the rotary plate, the rotary groove is formed in the bottom end of the rotary rod, the bottom end of the rotary groove is fixed with the top end of the base, the supporting columns are uniformly arranged at the top end of the adjusting mechanism, the top plate is fixed at the top end of each supporting column, a lifting mechanism is arranged between the supporting columns, a supporting rod is arranged on one side of the lifting mechanism, fixed blocks are fixed on two sides of the bottom end of each supporting rod, and a second threaded rod, third servo motor is installed to one side of branch bottom one side fixed block, and one side of third servo motor extends to one side of fixed block and one side of second threaded rod is fixed, the lateral wall activity of second threaded rod has the movable block, the bottom mounting of movable block has the protection casing, the both sides of protection casing bottom all are provided with the grip block, one side of grip block all is provided with fixture.

Preferably, the inside wall of movable block evenly is provided with the internal thread, constitute threaded connection between movable block and the second threaded rod.

Preferably, the rotating rods are provided with a plurality of rotating rods which are distributed in an annular mode relative to the outer side wall of the rotary disc.

Preferably, the outer diameter of the rotating rod is smaller than the inner diameter of the rotating groove, and a sliding structure is formed between the rotating rod and the rotating groove.

Preferably, the lifting mechanism comprises a moving block, a second servo motor, a fixing frame and a first threaded rod, the first threaded rod is fixed at the middle position of the top end of the rotary table, the top end of the first threaded rod is fixed with the middle position of the bottom end of the top plate, the second servo motor is arranged at the top end of the first threaded rod, the moving block is arranged at the top end and the bottom end of the outer side wall of the first threaded rod, the fixing frame is fixed on one side of the moving block arranged at the top end of the first threaded rod, one side of the fixing frame is fixed with the top end of the supporting rod, and one side of the moving block arranged at the bottom end of the first threaded rod is fixed.

Preferably, fixture includes plastic mat, electric putter and sucking disc, electric putter evenly sets up in the both sides of protection casing bottom, electric putter's bottom all is provided with the plastic mat, and one side of plastic mat all is fixed with one side of grip block, one side of plastic mat evenly is provided with the sucking disc. Preferably, the suction cups are arranged on one side of the plastic mat and are distributed at equal intervals on one side of the plastic mat

Compared with the prior art, the beneficial effects of the utility model are that: the wafer transmission device based on semiconductor manufacturing not only realizes the convenience in adjusting the transmission direction of the wafer, greatly increases the practicability, but also realizes the convenience in transporting the wafer to different heights, is more convenient to use and clamp wafers of different sizes, and has better clamping effect;

(1) by arranging the adjusting mechanism at the top end of the base, when the wafer is transported, a worker can start the first servo motor to drive the turntable to rotate according to the actual transmission direction, so that the supporting column and the first threaded rod above the turntable rotate to drive the wafer clamped by the clamping plate to be adjusted in the direction, the wafer is conveniently transmitted to different directions, the use is more convenient, and the practicability of the transporting device is greatly improved;

(2) the lifting mechanism is arranged between the support columns, the wafer is transported by starting the second servo motor to drive the first threaded rod to rotate between the support columns, so that the moving block on the outer side wall of the first threaded rod rotates, the moving block drives the fixing frame to move up and down, the clamped wafer is transported to different heights, and the transportation convenience is greatly improved;

(3) through being provided with fixture in one side of grip block, when carrying out the centre gripping to the wafer, the electric putter that can start both sides drives the grip block and moves to the outside, with the interval between the grip block adjust to suitable big or small back, starts electric putter once more and drives the grip block and move to the inside and carry out the centre gripping to the wafer, is convenient for carry out the centre gripping to the wafer of equidimension not, has improved the convenience of centre gripping greatly.

Drawings

Fig. 1 is a schematic view of a front view partial section structure of the present invention;

FIG. 2 is a schematic side view of the present invention;

fig. 3 is a schematic top view of the present invention;

fig. 4 is a schematic view of the enlarged structure of a part a in fig. 1 according to the present invention; FIG. 5 is a schematic side view of the clamping plate of the present invention; fig. 6 is a schematic view of a front view of a local structure of the clamping mechanism of the present invention.

In the figure: 1. a base; 2. an adjustment mechanism; 201. a first servo motor; 202. rotating the groove; 203. a rotating rod; 204. a turntable; 3. a lifting mechanism; 301. a moving block; 302. a second servo motor; 303. a fixed mount; 304. a first threaded rod; 4. a support pillar; 5. a top plate; 6. a strut; 7. a fixed block; 8. a second threaded rod; 9. a movable block; 10. a clamping plate; 11. a clamping mechanism; 1101. a plastic pad; 1102. an electric push rod; 1103. a suction cup; 12. a third servo motor; 13. a shield.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides an embodiment: a wafer transmission device based on semiconductor manufacturing comprises a base 1, a support column 4 and a top plate 5, wherein the top end of the base 1 is provided with an adjusting mechanism 2, the adjusting mechanism 2 comprises a first servo motor 201, a rotary groove 202, rotary rods 203 and a rotary disc 204, the first servo motor 201 is arranged at the middle position inside the base 1, the type of the first servo motor 201 can be EDSMT-2T, the input end of the first servo motor 201 is electrically connected with the output end of a control panel through a lead, the top end of the first servo motor 201 is fixed with the rotary disc 204, the rotary disc 204 extends to the top end of the base 1, the rotary rods 203 are fixed on the outer side walls of the rotary disc 204, the rotary grooves 202 are arranged at the bottom ends of the rotary rods 203, the bottom ends of the rotary grooves 202 are fixed with the top end of the base 1, the rotary rods 203 are provided with a plurality of rotary rods 203, the plurality of rotary rods 203 are distributed in a ring shape relative to the outer side wall of the rotary disc 204, a sliding structure is formed between the rotating rod 203 and the rotating groove 202, supporting columns 4 are uniformly arranged at the top end of the adjusting mechanism 2, a top plate 5 is fixed at the top end of each supporting column 4, a lifting mechanism 3 is arranged between the supporting columns 4, a supporting rod 6 is arranged at one side of the lifting mechanism 3, fixed blocks 7 are respectively fixed at two sides of the bottom end of the supporting rod 6, a second threaded rod 8 is arranged between the fixed blocks 7, a third servo motor 12 is arranged at one side of the fixed block 7 at the bottom end of the supporting rod 6, the type of the third servo motor 12 can be MR-J2S-10A, the input end of the third servo motor 12 is electrically connected with the output end of the control panel through a conducting wire, one side of the third servo motor 12 extends to one side of the fixed block 7 and is fixed with one side of the second threaded rod 8, a movable block 9 is movable on the outer, the movable block 9 is in threaded connection with the second threaded rod 8, a protective cover 13 is fixed at the bottom end of the movable block 9, clamping plates 10 are arranged on two sides of the bottom end of the protective cover 13, and a clamping mechanism 11 is arranged on one side of each clamping plate 10;

specifically, as shown in fig. 1, fig. 2 and fig. 4, when the mechanism is used, firstly, when the mechanism is used, the first servo motor 201 inside the base 1 is started according to the actual transmission direction of the wafer to drive the turntable 204 to rotate above the base 1, so that the supporting rod 6 is adjusted to a proper direction, the clamping plate 10 below the supporting rod 6 is adjusted to a proper direction, the wafer is better transported, and the rotating rod 203 on the outer side wall of the turntable 204 rotates together inside the rotating groove 202 while the turntable 204 rotates, so that the rotation of the turntable 204 is more stable, and the adjusting effect is better;

the lifting mechanism 3 comprises a moving block 301, a second servo motor 302, a fixed frame 303 and a first threaded rod 304, the first threaded rod 304 is fixed at the middle position of the top end of the turntable 204, the top end of the first threaded rod 304 is fixed with the middle position of the bottom end of the top plate 5, the top end of the first threaded rod 304 is provided with the second servo motor 302, the type of the second servo motor 302 can be ASD-A2, the input end of the second servo motor 302 is electrically connected with the output end of the control panel through a lead, the top end and the bottom end of the outer side wall of the first threaded rod 304 are both provided with the moving block 301, one side of the moving block 301 arranged at the top end of the first threaded rod 304 is fixed with the fixed frame 303, one side of the fixed frame 303 is fixed with the top end of the supporting rod 6, and one side of the moving block 301;

specifically, as shown in fig. 1, fig. 2 and fig. 3, when the mechanism is used, firstly, when the transportation height of a wafer needs to be adjusted, the second servo motor 302 can be started to drive the first threaded rod 304 to rotate between the top plate 5 and the turntable 204, so that the moving block 301 on the outer side wall of the first threaded rod 304 moves up and down, the supporting rod 6 fixed on one side is driven to be adjusted to a proper height, and the wafer clamped by the clamping plate below the supporting rod 6 is adjusted to a proper height, so that the use effect is better, and the transportation convenience is greatly improved;

the clamping mechanism 11 comprises plastic pads 1101, an electric push rod 1102 and suckers 1103, the electric push rod 1102 is uniformly arranged on two sides of the bottom end of the protective cover 13, the model of the electric push rod 1102 can be DYTZB1000-500, the input end of the electric push rod 1102 is electrically connected with the output end of the control panel through a lead, the plastic pads 1101 are arranged at the bottom end of the electric push rod 1102, one sides of the plastic pads 1101 are fixed with one side of the clamping plate 10, and the suckers 1103 are uniformly arranged at one sides of the plastic pads 1101;

specifically, as shown in fig. 1, fig. 5 and fig. 6, when using the mechanism, first, during use, the electric push rod 1102 of both sides is started to drive the clamping plate 10 to move outwards according to the size of the wafer actually transported for clamping, after the distance between the clamping plates 10 is adjusted to a proper size, the electric push rod 1102 is started again to drive the clamping plate 10 to move inwards for clamping the wafer, and the plastic pad 1101 used on one side of the clamping plate 10 has certain elasticity, plays a certain protection role on the wafer, and is not easy to damage the wafer in the clamping process, and the suckers 1103 uniformly distributed on one side of the plastic pad 1101 make the wafer clamped more firmly, so that the use effect is better.

The working principle is as follows: when the wafer transmission device is used, the wafer transmission device manufactured based on the semiconductor is externally connected with a power supply, firstly, the device is moved to a place to be used, then a first servo motor 201 in a base 1 is started according to the actual transmission direction of a wafer to drive a turntable 204 to rotate above the base 1, so that a supporting rod 6 is adjusted to a proper direction, and a clamping plate 10 below the supporting rod 6 is adjusted to a proper direction;

secondly, after the transportation direction is adjusted, the transportation direction is adjusted according to the actual transportation height, and during adjustment, a second servo motor 302 is started to drive a first threaded rod 304 to rotate between a top plate 5 and a turntable 204, so that a moving block 301 on the outer side wall of the first threaded rod 304 moves up and down, a support rod 6 fixed on one side is adjusted to a proper height, and the support rod 6 is connected between two different stations;

finally, after the direction and the height are adjusted, the wafer is placed between the clamping plates 10 at one station, then the electric push rods 1102 at two sides are started to drive the clamping plates 10 to move inwards to clamp the wafer, after clamping is completed, the third servo motor 12 is started to drive the second threaded rod 8 to rotate, so that the movable block 9 moves on the outer side wall of the second threaded rod 8, the wafer clamped below is driven to move to the station at the other side, the electric push rod 1102 at the other side is started again to take down the wafer, and finally the transmission work of the wafer manufactured by the semiconductor can be completed.

The details of the present invention are well known to those skilled in the art.

Finally, it is to be noted that: the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified and replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims

1. A wafer transmission device based on semiconductor manufacturing is characterized in that: comprises a base (1), supporting columns (4) and a top plate (5), wherein the top end of the base (1) is provided with an adjusting mechanism (2), the adjusting mechanism (2) comprises a first servo motor (201), a rotary groove (202), a rotary rod (203) and a rotary disk (204), the first servo motor (201) is arranged at the middle position inside the base (1), the top end of the first servo motor (201) is fixed with the rotary disk (204), the rotary disk (204) extends to the top end of the base (1), the outer side wall of the rotary disk (204) is fixed with the rotary rod (203), the bottom end of the rotary rod (203) is provided with the rotary groove (202), the bottom end of the rotary groove (202) is fixed with the top end of the base (1), the top end of the adjusting mechanism (2) is uniformly provided with the supporting columns (4), the top end of the supporting columns (4) is fixed with the top plate (5), be provided with elevating system (3) between support column (4), one side of elevating system (3) is provided with branch (6), the both sides of branch (6) bottom all are fixed with fixed block (7), be provided with second threaded rod (8) between fixed block (7), third servo motor (12) are installed to one side of branch (6) bottom one side fixed block (7), and one side of third servo motor (12) extends to one side of fixed block (7) and one side of second threaded rod (8) is fixed, the lateral wall activity of second threaded rod (8) has movable block (9), the bottom mounting of movable block (9) has protection casing (13), the both sides of protection casing (13) bottom all are provided with grip block (10), one side of grip block (10) all is provided with fixture (11).

2. The wafer transfer device of claim 1, wherein: the inside wall of movable block (9) evenly is provided with the internal thread, constitute threaded connection between movable block (9) and second threaded rod (8).

3. The wafer transfer device of claim 1, wherein: the rotating rod (203) is provided with a plurality of rotating rods, and the rotating rods (203) are distributed annularly on the outer side wall of the rotating disc (204).

4. The wafer transfer device of claim 1, wherein: the outer diameter of the rotating rod (203) is smaller than the inner diameter of the rotating groove (202), and a sliding structure is formed between the rotating rod (203) and the rotating groove (202).

5. The wafer transfer device of claim 1, wherein: the lifting mechanism (3) comprises a moving block (301), a second servo motor (302), a fixing frame (303) and a first threaded rod (304), the first threaded rod (304) is fixed at the middle position of the top end of the rotary table (204), the top end of the first threaded rod (304) is fixed with the middle position of the bottom end of the top plate (5), the second servo motor (302) is arranged at the top end of the first threaded rod (304), the moving block (301) is arranged at the top end and the bottom end of the outer side wall of the first threaded rod (304), the fixing frame (303) is fixed to one side of the moving block (301) arranged at the top end of the first threaded rod (304), one side of the fixing frame (303) is fixed to the top end of the supporting rod (6), and one side of the moving block (301) arranged at the bottom end of the first threaded rod (304) is fixed to one side of.

6. The wafer transfer device of claim 1, wherein: fixture (11) include plastic pad (1101), electric putter (1102) and sucking disc (1103), electric putter (1102) evenly sets up in the both sides of protection casing (13) bottom, the bottom of electric putter (1102) all is provided with plastic pad (1101), and one side of plastic pad (1101) all is fixed with one side of grip block (10), one side of plastic pad (1101) evenly is provided with sucking disc (1103).

7. The wafer transfer device of claim 6, wherein: the sucking disc (1103) is provided with a plurality of in one side of plastic mat (1101), sucking disc (1103) is equidistant distribution in one side of plastic mat (1101).