CN212747889U - Temperature and pressure sensor for intake manifold - Google Patents

Abstract

An intake manifold temperature pressure sensor relates to the technical field of sensors and comprises a shell with a concave cavity, wherein the bottom of the shell is provided with an acquisition channel and a detection channel; the detection channel is communicated with the concave cavity, a pressure sensing assembly is arranged in the concave cavity, the pressure sensing assembly comprises a PCB, and the PCB is fixed at the bottom of the concave cavity through a rubber sealing piece; the PCB board is provided with a first through hole communicated with the detection channel; the ceramic plate is welded and fixed on the PCB and is provided with a second through hole communicated with the first through hole; and a pressure chip fixed on the ceramic plate; the pressure chip is provided with an induction hole which is communicated with the second through hole; through the mode of addding the ceramic plate in the forced induction subassembly, make the direct fixed mounting of pressure chip on the ceramic plate, avoid the direct contact of pressure chip and PCB board, be favorable to guaranteeing the stable normal work of pressure chip more to realize the accurate output of whole temperature pressure sensor real-time supervision signal data.

Description

Temperature and pressure sensor for intake manifold

Technical Field

The utility model relates to sensor technical field specifically is an intake manifold temperature pressure sensor.

Background

The intake manifold is mainly applied to an automobile engine and is one of key parts of an engine control system, a pressure sensing assembly and a temperature sensing assembly are required to be mounted on the intake manifold to test the pressure and the temperature of airflow entering the intake manifold, and temperature and pressure signals are transmitted to an engine management system so as to be converted into intake air quantity information serving as basic parameters for controlling the engine.

The mode that SMT technology is usually adopted in the assembly scheme of present forced induction subassembly and is attached the pressure chip to the PCB board to scribble silica gel in PCB board surface and in order to guarantee the steady work of pressure chip, but in use discovers, under the high temperature and the high-pressure circumstances, the PCB board of installation pressure chip often has the condition appearance of partial deformation and warpage, causes the pressure chip displacement easily and leads to the monitoring effect unsatisfactory, leads to intake manifold's reliability relatively poor.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides a new technical scheme to overcome above-mentioned problem, it is high to improve temperature pressure sensor's detection precision, realizes that the forced induction subassembly keeps its stability to atmospheric pressure real-time supervision simultaneously.

The utility model provides a technical scheme as follows:

an intake manifold temperature and pressure sensor comprises a shell with a concave cavity, wherein the bottom of the shell is provided with an acquisition channel and a detection channel, and a temperature sensing assembly is arranged in the acquisition channel; the detection channel is communicated with the cavity, a pressure sensing assembly is arranged in the cavity and comprises

The PCB is fixed at the bottom of the concave cavity through a rubber sealing element; the PCB is provided with a first through hole communicated with the detection channel;

the ceramic plate is welded and fixed on the PCB and is provided with a second through hole communicated with the first through hole; and

the pressure chip is fixed on the ceramic plate; the pressure chip is provided with an induction hole, and the induction hole is communicated with the second through hole.

Further, the surface of the pressure chip is covered with silicone gel, and the pressure chip is fixed on the ceramic plate through the silicone gel.

Furthermore, a surrounding frame is arranged on the ceramic plate, and the pressure chip coated with the silica gel is arranged in the surrounding frame.

Furthermore, a conditioning chip is fixed on the ceramic plate and arranged in the enclosure frame; the conditioning chip is coated with silicone gel.

Furthermore, the shell further comprises a plug-in end, a plurality of pins are fixed in the plug-in end through an injection molding process, and the plurality of pins are in signal connection with the PCB through a second lead.

Furthermore, the pin is made of CuSn6 material, and the second lead is an aluminum wire.

Further, the temperature sensing assembly comprises a temperature sensing piece and a lead connected with the temperature sensing piece, the temperature sensing piece is located in the acquisition channel, and the lead penetrates through the acquisition channel and is connected with the pins in a welding mode.

Furthermore, a protective sleeve is sleeved on the lead.

Furthermore, the temperature and pressure sensor also comprises an upper cover, and the upper cover is attached to the shell to enable the concave cavity to be in a closed state.

Furthermore, the upper cover is provided with an air vent communicated with the concave cavity, and the air vent is internally plugged with an air vent sealing piece.

The beneficial effect that adopts this technical scheme to reach does:

the pressure chip is directly and fixedly arranged on the ceramic plate by adding the ceramic plate in the pressure sensing assembly, so that the pressure chip is prevented from being directly contacted with the PCB; utilize the fixed mode of pressure chip and ceramic plate to replace traditional with the fixed mode of PCB board, the ceramic plate is able to bear or endure the high temperature resistance ability and makes it more stable, is favorable to guaranteeing the stable normal work of pressure chip more to realize the accurate output of whole temperature pressure sensor real-time supervision signal data.

Drawings

Fig. 1 is an exploded view of a temperature and pressure sensor.

Fig. 2 is an exploded view of a pressure sensing assembly and a temperature sensing assembly.

Fig. 3 is a structural diagram of the ceramic board in the pressure sensing assembly connected with the PCB board by bonding.

Fig. 4 is an exploded view of the ceramic board connected to the PCB board by bonding.

Fig. 5 is a perspective view of the temperature and pressure sensor.

Fig. 6 is a schematic sectional view taken along line a-a in fig. 5, showing the internal structure of the temperature and pressure sensor.

Fig. 7 is a separate structure view of the upper cover and the housing.

Wherein: 10 upper cover, 11 cover body, 12 bent edge, 13 partition board, 14 air vent, 20 shell, 21 plug end, 22 ring block, 30 pressure sensing component, 31PCB board, 32 ceramic board, 33 pressure chip, 34 conditioning chip, 35 enclosure frame, 36 sealing element, 37 first lead, 38 silica gel, 40 temperature sensing component, 41 temperature sensing component, 42 lead, 50 sealing element, 100 bonding board, 211 pin, 212 second lead, 300 detection channel, 311 first through hole, 321 second through hole, 331 sensing hole and 400 acquisition channel.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.

The present embodiment provides an intake manifold temperature and pressure sensor, referring to fig. 1, 5-6, which is used to monitor real-time temperature and real-time pressure of gas in an engine, and the temperature and pressure sensor comprises an upper cover 10, a housing 20, a pressure sensing assembly 30 and a temperature sensing assembly 40; the pressure sensing component 30 is characterized in that a concave cavity is formed in the shell 20, when the upper cover 10 is connected with the shell 20 in a clamping mode, the concave cavity can be just covered, the concave cavity is in a closed state, and the pressure sensing component is arranged in the concave cavity.

In order to monitor the pressure of the gas by the pressure sensing assembly 30, the bottom of the housing 20 is provided with a detection channel 300, and the detection channel 300 is communicated with the cavity, so that the pressure sensing assembly 30 located in the cavity can monitor the pressure of the gas in real time.

Specifically, referring to fig. 1-2 and 5-6, the pressure sensing assembly 30 includes a PCB 31, the PCB 31 is disposed at the bottom of the cavity, it can be understood that the PCB 31 is located at the bottom of the cavity and fixed to the housing 20, and a first through hole 311 is disposed in the PCB 31, and the first through hole 311 is communicated with the detection channel 300; the PCB 31 is also fixedly provided with a ceramic plate 32, the ceramic plate 32 is provided with a second through hole 321, and the second through hole 321 is communicated with the first through hole 311; the pressure chip 33 is fixedly arranged on the ceramic plate 32, the pressure chip 33 is provided with a sensing hole 331, and the sensing hole 331 corresponds to the second through hole 321; at this time, the detection channel 300, the first through hole 311, the second through hole 321, and the sensing hole 331 form a passage through which the gas in the engine directly reaches the sensing hole 331 of the pressure chip 33, so as to realize the monitoring of the gas pressure by the pressure chip 33.

By directly fixing the pressure chip 33 on the ceramic board 32 instead of the PCB board 31, the pressure chip 33 is prevented from directly contacting the PCB board 31, so that even if the PCB board 31 is warped or deformed due to the temperature and pressure, the stability of the connection of the pressure chip 33 is not affected; moreover, the moisture resistance and high temperature resistance of the ceramic plate 32 are beneficial to ensuring the stability of the pressure chip 33 during working, and moreover, the stability of the ceramic plate 32 is more beneficial to prolonging the service life of the pressure chip 33, and has a positive promotion effect on improving the quality of temperature and pressure sensing.

The PCB 31 mentioned herein can be fixed at the bottom of the cavity by gluing, and the glue preferably adopts silicone gel, which not only has good adhesion and fixation, but also has good sealing performance, and the sealing performance of the silicone gel can effectively ensure the sealing performance at the joint between the PCB 31 and the housing 20, so as to ensure that the gas can only reach the sensing hole 331 of the pressure chip 33 through the first through hole 311, and avoid the gas from leaking from the joint.

The PCB 31 may also be fixed to the bottom of the cavity by means of screws/rivets, and in order to ensure the sealing performance at the joint of the PCB 31 and the housing 20, a rubber sealing member 36 is disposed between the PCB 31 and the housing 20, and the sealing performance at the joint of the PCB 31 and the housing 20 is enhanced by the rubber sealing member 36.

In this embodiment, the PCB 31 and the housing 20 are fixed by applying the silicone gel, and the rubber sealing member 36 is disposed between the PCB 31 and the housing 20, which can be understood as a double-safety manner adopted in this embodiment, that is, the silicone gel is used to fix and seal the PCB 31 and the housing 20, and the rubber sealing member 36 is used to further enhance the sealing performance.

In this embodiment, referring to fig. 1-2, the ceramic board 32 is directly fixed on the PCB 31 by soldering, and in order to achieve the conduction between the pressure chip 33 and the PCB 31, the ceramic board 32 is a double-sided board (the double-sided board is understood as the ceramic board 32 having circuits on both the top and bottom surfaces, where the top surface refers to the surface where the ceramic board 32 is connected to the pressure chip 33, and the bottom surface refers to the surface where the ceramic board 32 is soldered to the PCB 31); the ceramic board 32 of the double-sided board realizes the signal conduction between the pressure chip 33 and the PCB board 31, and the pressure chip 33 monitors the pressure data of the gas and transmits the pressure data signal to the PCB board 31 through the ceramic board 32.

In another embodiment, referring to fig. 3-4, the ceramic board 32 can also be bonded to the PCB 31 by directly coating a silicone gel between the ceramic board 32 and the PCB 31 or by additionally attaching an adhesive board 100 between the ceramic board 32 and the PCB 31, and it should be noted that, when the ceramic board 32 is bonded to the PCB, the ceramic board 32 should be a single board, where the single board specifically means that only one side of the ceramic board 32 connected to the pressure chip 33 is provided with a circuit, and the signal connection between the ceramic board 32 and the PCB 31 is realized through the first lead 37, that is, a pressure signal generated by the pressure chip 33 monitoring is transmitted to the PCB 31 through the ceramic board 32 and the first lead 37.

Optionally, referring to fig. 1-2 and 5-6, in order to ensure the stability of the connection of the pressure chip 33 on the ceramic plate 32, a silicone gel 38 is coated on the connection between the pressure chip 33 and the ceramic plate 32, and the stability of the connection between the pressure chip 33 and the ceramic plate 32 is ensured by the viscosity of the silicone gel 38; meanwhile, in order to better protect the pressure chip 33 and prevent the pressure chip 33 from being affected by external dust or water mist, the coated silicone gel 38 should cover the whole surface of the pressure chip 33, so that the pressure chip 33 can be effectively protected after the silicone gel 38 is solidified, and invasion of various interfering substances can be avoided.

It should be noted that, because the silicone gel 38 is in a liquid state before solidification, and the silicone gel 38 in the liquid state has fluidity, so that complete covering of the pressure chip 33 cannot be achieved, in order to solve the above problem, in this embodiment, a surrounding frame 35 is additionally arranged on the ceramic plate 32, the pressure chip 33 is arranged in the surrounding frame 35, and at this time, the pressure chip 33 is subjected to a glue coating operation, so that the silicone gel 38 in the liquid state is completely confined in the surrounding frame 35, and thus the pressure chip 33 is completely covered until solidification.

Optionally, a conditioning chip 34 is further fixed on the ceramic plate 32, and the conditioning chip 34 is used for conditioning and amplifying the small signal acquired by the pressure chip 33 into a required signal, and performing temperature compensation and zero point compensation on the signal, so that the signal has high precision in a full temperature region; the conditioning chip 34 is disposed in the surrounding frame 35, and when applying the glue, the silicone gel may be applied on the conditioning chip 34.

In this embodiment, the housing 20 includes an insertion end 21, a plurality of pins 211 are fixed in the insertion end 21 through an injection molding process, where the pins 211 are used to transmit a pressure signal to an external electronic component; specifically, the plurality of pins 211 are connected to the PCB 31 through the second leads 212.

Optionally, the pin 211 is made of CuSn6 material, and the first lead 37 and the second lead 212 are aluminum wires.

After the gas of the engine is monitored and sensed by the pressure chip 33, the gas is conditioned, compensated and amplified by the conditioning chip 34, pressure data is transmitted to the PCB 31 through the ceramic board 32, and then is transmitted to the pin 211 through the PCB 31 and the second lead 212, and the pin 211 is plugged into an external electronic component to realize signal transmission.

Here, by using the manner of the pin 211 and fixing the pin 211 in the inserting end 21 by injection molding, compared with the manner of implementing signal transmission by using a common wire, the technical scheme adopted by the embodiment is beneficial to ensuring the stability of signal transmission.

The temperature and pressure sensor provided by the scheme also needs to have a temperature monitoring function, namely the temperature of gas in the engine also needs to be monitored in real time; still be provided with collection channel 400 in the casing 20, temperature-sensing assembly 40 sets up in collection channel 400, temperature-sensing assembly 40 monitors the gaseous temperature data of collection channel 400 and transmits it for outside electronic components.

Specifically, the temperature sensing assembly 40 comprises a temperature sensitive element 41 and a lead 42 connected with the temperature sensitive element 41, the temperature sensitive element 41 is located in the acquisition channel 400 so as to monitor the gas temperature in the acquisition channel 400 in real time, and the lead 42 is used for transmitting acquired temperature data and conveying the data to an external electronic component.

In consideration of the cost and the stability of signal transmission, in this embodiment, the wire 42 for transmitting the temperature signal is inserted into the collecting channel 400 and is soldered to the pin 211, and it is understood that the pressure signal data and the temperature signal data in this embodiment are exchanged with the external electronic component through the pin 211.

To further protect the wires 42, the temperature sensing assembly 40 will be in direct contact with the gas, and the wires 42 are covered with a protective sheath in this embodiment.

In this embodiment, the structure of the upper cover 10 and the housing 20 is further optimized to ensure that the upper cover 10 and the housing 20 can be smoothly clamped.

Specifically, referring to fig. 7, the upper cover 10 is divided into a cover body 11 and a bent edge 12 provided on the cover body 11, wherein the bent edge 12 is provided in a circle around a side wall of the cover body 11; be equipped with ring fender 22 in the cavity of casing 20, ring fender 22 with the inner wall interval of cavity sets up and encloses into the annular, the annular with bend 12 looks adaptation, bend 12 inserts make in the annular upper cover 10 with the completion of casing 20 joint.

Furthermore, in order to avoid interference in signal transmission, the present embodiment separates the pressure sensing element 30 separately, that is, a partition 13 is disposed on the cover 11, when the upper cover 10 is connected to the housing 20 in a snap-fit manner, the partition 13 divides an area surrounded by the ring 22 into a first space and a second space, the pressure sensing element 30 is located in the first space, and the second lead 212 and the pin 211 are located in the second space.

Optionally, referring to fig. 1, 5 and 7, the cover 11 in this embodiment is provided with a vent 14 communicating with the cavity, where the vent 14 is used for realizing gas exchange with the cavity; the purpose of the air holes 14 is to ensure that the silicone gel coated on the pressure sensing assembly 30 is solidified smoothly, and particularly, after the pressure chip 33 and the conditioning chip 34 are coated with glue, the air holes 14 are used for realizing the exchange of air to promote the solidification of the silicone gel, so that the aim of improving the solidification efficiency is fulfilled.

Certainly, the air holes 14 have another function, that is, after the whole temperature and pressure sensor is assembled, a leakage tester is connected to the air holes 14, and the leakage tester detects whether air leakage exists at the position where the PCB 31 and the shell 20 are fixedly attached through the air holes 14, so that the whole cavity is filled with air, and the monitoring accuracy of the temperature and pressure sensor is further ensured.

After the leakage tester is used for detecting that the sensor does not leak air, the air vent 14 needs to be sealed, so that dust is prevented from entering the cavity to influence the precision of the pressure chip 33 and the conditioning chip 34, and the air vent 14 is blocked by adopting the sealing piece 50 in the embodiment.

In this embodiment, the sealing element 50 is a steel ball, and the diameter of the steel ball is larger than the diameter of the vent hole 14, that is, the steel ball blocks the vent hole 14 in an interference fit manner to seal the vent hole.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims (10)

1. An intake manifold temperature and pressure sensor comprises a shell (20) with a concave cavity, and is characterized in that a collecting channel (400) and a detecting channel (300) are arranged at the bottom of the shell (20), and a temperature sensing assembly (40) is arranged in the collecting channel (400); the detection channel (300) is communicated with the cavity, a pressure sensing assembly (30) is arranged in the cavity, and the pressure sensing assembly (30) comprises

The PCB (31), the said PCB (31) is fixed on the bottom of the said cavity through a rubber seal (36); the PCB (31) is provided with a first through hole (311) communicated with the detection channel (300);

the ceramic plate (32) is fixedly welded on the PCB (31), and a second through hole (321) communicated with the first through hole (311) is formed in the ceramic plate (32); and

a pressure chip (33) fixed on the ceramic plate (32); the pressure chip (33) is provided with an induction hole (331), and the induction hole (331) is communicated with the second through hole (321).

2. The temperature-pressure sensor according to claim 1, characterized in that the pressure chip (33) is surface-coated with a silicone gel (38) and fixed on the ceramic plate (32) by the silicone gel (38).

3. Temperature-pressure sensor according to claim 2, characterized in that the ceramic plate (32) is provided with a surrounding frame, inside which the pressure chip (33) coated with a silicone gel (38) is arranged.

4. The temperature-pressure sensor according to claim 3, characterized in that a conditioning chip (34) is further fixed on the ceramic plate (32), and the conditioning chip (34) is arranged in the enclosure; the conditioning chip (34) is coated with a silicone gel (38).

5. The temperature and pressure sensor according to claim 1 or 4, wherein the housing (20) further comprises a plug terminal (21), a plurality of pins (211) are fixed in the plug terminal (21) through an injection molding process, and the plurality of pins (211) are in signal connection with the PCB (31) through second leads (212).

6. The temperature and pressure sensor according to claim 5, wherein the pin (211) is made of CuSn6, and the second lead (212) is an aluminum wire.

7. The temperature-pressure sensor according to claim 5, characterized in that the temperature sensing assembly (40) comprises a temperature sensitive element (41) and a lead (42) connected with the temperature sensitive element, the temperature sensitive element (41) is located in the collecting channel (400), and the lead (42) penetrates through the collecting channel (400) and is connected with the pin (211) in a welding manner.

8. Temperature pressure sensor according to claim 7, characterized in that the wire (42) is sheathed with a protective sheath.

9. The temperature-pressure sensor according to claim 1, further comprising an upper cover (10), wherein the upper cover (10) is attached to the housing (20) to close the cavity.

10. The temperature-pressure sensor according to claim 9, wherein the upper cover (10) is provided with a vent hole (14) communicating with the cavity, and the vent hole (14) is internally plugged with a sealing member (50) for sealing the vent hole (14).

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