CN212729006U

CN212729006U - Take bluetooth to pass through intelligent shoe-pad

Info

Publication number: CN212729006U
Application number: CN202021341659.0U
Authority: CN
Inventors: 邓安亮; 胡川
Original assignee: CROWN RICH ELECTRONIC (SHENZHEN) CO LTD
Current assignee: CROWN RICH ELECTRONIC (SHENZHEN) CO LTD
Priority date: 2020-07-08
Filing date: 2020-07-08
Publication date: 2021-03-19
Anticipated expiration: 2030-07-08

Abstract

The utility model relates to an intelligent insole with Bluetooth transparent transmission, which comprises an insole body and a flexible PCB arranged in the insole body, wherein a stress detection module is arranged on the flexible PCB, and comprises a first pressure sensor arranged at the front end of the insole body in a welding way and corresponding to the position of a big toe, 3 second pressure sensors arranged at the position of the corresponding front sole of the insole body in a welding way and at step intervals along the width direction of the insole body, a third pressure sensor arranged at the middle part of the insole body and corresponding to the outer side position of the arch of foot, and 2 fourth pressure sensors arranged at the position of the corresponding heel of the insole body in a welding way and at intervals side by side; the flexible PCB is also provided with a temperature detection module, a heating module, a master control microprogram controller, an A/D converter, a Bluetooth module, a storage module, a power module and a USB interface. The intelligent insole provided by the application can detect the stress condition of each stress area of the foot of a user in real time and remind the user of wrong walking posture in real time, so that the purpose of correction is achieved.

Description

Take bluetooth to pass through intelligent shoe-pad

Technical Field

The utility model relates to a shoe-pad technical field especially relates to a take intelligent shoe-pad of bluetooth biography.

Background

At present, children and teenagers influence body development due to poor walking postures, influence body health due to wrong walking postures of adults, and cause substantial pathological changes because people are aged due to incorrect walking postures. Although traditional shoes have carried out a large amount of improvements in material selection and structure, have satisfied people to the requirement of shoes comfort level, can't accomplish to carry out real-time detection and remind in real time to wrong posture of walking to user's posture of walking.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a take bluetooth to pass through intelligent shoe-pad that can carry out real-time detection to user's posture of walking and carry out real-time warning to wrong posture

For realizing the purpose of the utility model, the utility model adopts the following technical scheme:

an intelligent insole with Bluetooth transparent transmission comprises an insole body and a flexible PCB arranged in the insole body, wherein a stress detection module is arranged on the flexible PCB and comprises a first pressure sensor welded at the front end of the insole body corresponding to a big toe position, 3 second pressure sensors welded at the front sole position of the insole body corresponding to a foot sole position and arranged at step intervals along the width direction of the insole body, a third pressure sensor welded at the middle part of the insole body corresponding to the outer side of an arch of a foot, and 2 fourth pressure sensors welded at the rear end of the insole body corresponding to a heel position and arranged at intervals side by side;

the flexible PCB is further provided with a temperature detection module, a heating module, a master control micro-program controller, an A/D converter, a Bluetooth module, a storage module, a power supply module and a USB interface, the master control micro-program controller is electrically connected with the stress detection module through the A/D converter, the storage module, the temperature detection module and the heating module are electrically connected with the master control micro-program controller respectively, the master control micro-program controller is in communication connection with an external mobile terminal through the Bluetooth module, the power supply module is used for supplying power to the master control micro-program controller and the stress detection module, and the power supply module is charged through the USB interface.

Compare in traditional shoe-pad, the intelligent shoe-pad that the bluetooth of taking passes through that this application provided can real-time detection user foot each stress area's atress condition to give outside mobile terminal with this atress condition real-time transmission, realize the real-time warning to the user mistake gesture of walking, reach the purpose of correction.

In one embodiment, the master control micro-program controller adopts a master control chip with the model number HT66F0185-24 SSOP.

In one embodiment, the Bluetooth module adopts a Bluetooth chip with the model number of CRM 508-5.

In one embodiment, the memory module adopts a memory chip with the model W25Q80 DV/DL.

In one embodiment, the power module adopts a three-terminal voltage regulation chip with the model number of HT 7330.

Drawings

FIG. 1 is a schematic diagram of the distribution of 7 pressure sensors on the intelligent insole body in one embodiment;

FIG. 2 is a schematic structural diagram of the intelligent insole in FIG. 1;

FIG. 3 is a schematic circuit diagram of the power module and the USB interface of the intelligent insole of FIG. 2;

FIG. 4 is a schematic circuit diagram of the force detection module in the intelligent insole of FIG. 2;

FIG. 5 is a schematic circuit diagram of the main control micro-program controller in the intelligent insole of FIG. 2;

FIG. 6 is a schematic circuit diagram of the Bluetooth module in the intelligent insole of FIG. 2;

FIG. 7 is a schematic circuit diagram of the memory module in the smart insole of FIG. 2;

FIG. 8 is a schematic circuit diagram of the temperature detection module in the intelligent insole of FIG. 2;

fig. 9 is a schematic circuit diagram of a heating module in the intelligent insole in fig. 2.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the methods or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1 and 2, the embodiment provides an intelligent insole with bluetooth transparent transmission, which comprises an insole body and a flexible PCB (printed circuit board) arranged in the insole body, wherein a stress detection module 10 is arranged on the flexible PCB, and the stress detection module 10 comprises a first pressure sensor (shown in fig. 1) welded at the front end of the insole body corresponding to a big toe position, 3 second pressure sensors (shown in fig. 1, a third pressure sensor and a fourth pressure sensor) welded at the middle of the insole body corresponding to the outer side of the foot arch, and 2 fourth pressure sensors (shown in fig. 1, { character (c) } and seventy (c) } welded at the rear end of the insole body corresponding to a heel position and spaced side by side;

the flexible PCB is further provided with a temperature detection module 100, a heating module 200, a master control micro-program controller 300, an A/D converter 400, a Bluetooth module 500, a storage module 600, a power supply module 700 and a USB interface 800, the master control micro-program controller 300 is electrically connected with the stress detection module 10 through the A/D converter 400, the storage module 600, the temperature detection module 100 and the heating module 200 are electrically connected with the master control micro-program controller 300 respectively, the master control micro-program controller 300 is in communication connection with an external mobile terminal through the Bluetooth module 500, the power supply module 700 is used for supplying power to the master control micro-program controller 300 and the stress detection module 10, and the power supply module 700 is charged through the USB interface 800.

In this embodiment, referring to fig. 3, the power module 700 may be composed of a three-terminal voltage stabilization chip U1 with model number HT7330, capacitors C1 to C3, a resistor R14 and a resistor R15, the power module 700 is used for supplying power to the main control micro-program controller 300, and the power getting range is 3V to 5V; the 7 pressure sensors (namely the first pressure sensor, the 3 second pressure sensors, the third pressure sensor and the 2 fourth pressure sensors) supply 3V voltage output by the three-terminal voltage-stabilizing chip U1.

In this embodiment, referring to fig. 4, the stress detection module 10 employs 7 pressure sensors (fig. 4 shows J1-J7), the 7 pressure sensors are welded on the flexible PCB, and the layout of the 7 pressure sensors is placed according to the main stress points of the foot when the human body normally walks, referring to fig. 1, 1 pressure sensor JI is placed corresponding to the big toe position, pressure sensors J2, J3 and J4 are placed corresponding to the front sole position, pressure sensor J5 is placed corresponding to the outer side of the arch of the foot, and pressure sensors J6 and J7 are placed corresponding to the heel position. The stress conditions of all stress areas of the feet of the user can be comprehensively detected by the layout of the 7 pressure sensors, so that the follow-up analysis on the walking posture of the user is more accurate.

In this embodiment, the a/D converter 400 is configured to convert an analog voltage signal collected by the pressure sensor into a digital signal, process the digital signal into a pressure variation value, and send the pressure variation value to the main control micro-program controller 300, where the main control micro-program controller 300 processes the received pressure variation value, sends the stress variation value to the bluetooth module 500 through a serial port, and then transmits the stress variation value to the external mobile terminal for display through bluetooth; meanwhile, the storage module 600 may also be configured to store walking data of a user during a day.

Specifically, the external mobile terminal may be a mobile phone or a tablet computer, and the external mobile terminal is taken as an example in this embodiment, a specific APP in the mobile phone draws a change curve table according to the received walking data of the user for the user to check, and meanwhile, the mobile phone APP may further analyze the received walking data of the user, and may be set to remind the user of changing a wrong walking posture through mobile phone vibration, so as to achieve a purpose of correction. Specifically, referring to fig. 5, the master micro-program controller 300 employs a master control chip U2 of model number HT66F0185-24 SSOP; referring to fig. 6, the bluetooth module 500 adopts a bluetooth chip U3 with model number CRM 508-5; referring to FIG. 7, the memory module 600 employs a memory chip U4 model W25Q80 DV/DL. Furthermore, a pedometer can be arranged on the flexible PCB and used for recording the walking steps and/or running steps of the user every day.

In this embodiment, a temperature detecting module 100 and a heating module 200 are further disposed in the insole body, wherein the temperature detecting module 100 is used for detecting the temperature of the foot of the user, and when the detected temperature of the foot of the user is lower than a set value, the main control micro-program controller 300 can control the heating module to heat the insole body, so that the foot of the user is not frozen. Specifically, specific circuits of the temperature detection module 100 and the heating module 200 are respectively see fig. 8 and 9.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An intelligent insole with Bluetooth transparent transmission is characterized by comprising an insole body and a flexible PCB arranged in the insole body, wherein a stress detection module is arranged on the flexible PCB and comprises a first pressure sensor welded at the front end of the insole body corresponding to a big toe position, 3 second pressure sensors welded at the front sole position corresponding to the insole body along the width direction of the insole body at step intervals, a third pressure sensor welded at the middle part of the insole body corresponding to the outer side of the foot arch and 2 fourth pressure sensors welded at the rear end of the insole body corresponding to the heel position at parallel intervals;

2. The intelligent insole with Bluetooth passthrough according to claim 1, wherein the master micro-program controller is a master control chip with model number HT66F0185-24 SSOP.

3. The intelligent insole with Bluetooth transparent transmission according to claim 1, wherein the Bluetooth module is a Bluetooth chip with a model number of CRM 508-5.

4. The intelligent insole with Bluetooth transparent transmission function according to claim 1, wherein the memory module is a W25Q80DV/DL memory chip.

5. The intelligent insole with Bluetooth transparent transmission of claim 1, wherein the power module is a three-terminal voltage regulation chip with type HT 7330.