CN212727819U - Heat dissipation cooling device - Google Patents
Heat dissipation cooling device Download PDFInfo
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- CN212727819U CN212727819U CN202021513707.XU CN202021513707U CN212727819U CN 212727819 U CN212727819 U CN 212727819U CN 202021513707 U CN202021513707 U CN 202021513707U CN 212727819 U CN212727819 U CN 212727819U
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Abstract
The utility model provides a heat dissipation cooling device relates to exhaust-gas treatment technical field, include: the device comprises a water inlet, a treatment cavity, a fan, a water tank, a pump, a water outlet and a heating electronic element; wherein the processing chamber contains a heat-generating electronic component; the fan is arranged on the heating electronic element; the water inlet and the water outlet are arranged outside the treatment cavity; the water tank contains refrigerating fluid; the pump is disposed within the water tank. The utility model discloses a dispel the heat and cool down the purpose of handling to the electronic component that generates heat according to fan and water circulating system, avoided electronic component because of the problem of the unable normal work of high temperature, further improved electronic component's life.
Description
Technical Field
The utility model relates to an electronic components cooling technical field particularly, relates to a heat dissipation cooling device.
Background
With the rapid development of economy, more and more electronic products appear in the lives of people, and the lives of people are facilitated. The electronic components generate heat in the using process, and the normal work of the electronic components is influenced when the temperature is too high, so that the effective solution of the heat dissipation problem of the electronic components becomes the key technology for manufacturing the current electronic components and electronic equipment.
In the prior art, the heat dissipation structure naturally dissipates heat, and the heat dissipation effect is not ideal, so that the service power of the electronic component is limited, and the service life of the electronic component is shortened. How to provide a heat dissipation and temperature reduction method for an electronic component, which has a good heat dissipation effect and can prolong the service life of the electronic component, is a problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to generate heat in having the use to above-mentioned prior art among the electronic components, can not in time cool down and lead to the unable normal problem of working of components and parts, provide a heat dissipation cooling device to it is unsatisfactory to solve among the prior art electronic components radiating effect, thereby has restricted electronic components's power of use, has shortened electronic components's life's problem.
In order to achieve the above object, the embodiment of the present invention adopts the following technical solutions:
an embodiment of the utility model provides a heat dissipation cooling device, include: the device comprises a water inlet, a treatment cavity, a fan, a water tank, a pump, a water outlet and a heating electronic element;
wherein the processing chamber contains the heat-generating electronic components therein; the fan is arranged on the heating electronic element; the water inlet and the water outlet are arranged outside the treatment cavity; the water tank contains refrigerating fluid; the pump is disposed within the water tank.
Optionally, the apparatus further comprises: temperature sensors and liquid level sensors.
Optionally, the temperature sensor and the liquid level sensor are both arranged in the water tank.
Optionally, the temperature sensor is configured to control a rotation speed of the fan according to the collected temperature.
Optionally, the liquid level sensor is configured to control an operating state of the heat dissipation cooling device according to a water level in the water tank.
Optionally, the working state of the heat dissipation cooling device includes: working and standby states.
The utility model has the advantages that: there is provided a heat-dissipating cooling device including: the device comprises a water inlet, a treatment cavity, a fan, a water tank, a pump, a water outlet and a heating electronic element; wherein the processing chamber contains a heat-generating electronic component; the fan is arranged on the heating electronic element; the water inlet and the water outlet are arranged outside the treatment cavity; the water tank contains refrigerating fluid; the pump is disposed within the water tank. That is to say, the utility model discloses dispel the heat and cool down the purpose of handling to the electronic component that generates heat according to fan and water circulating system, avoided electronic component because of the problem of the unable normal work of high temperature, further improved electronic component's life.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of a heat dissipation cooling device according to an embodiment of the present invention.
Icon: 1-water inlet, 2-treatment cavity, 3-fan, 4-water tank, 5-pump and 6-water outlet.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
FIG. 1 is a schematic view of a heat sink cooling apparatus; the heat dissipation and cooling device provided by the embodiment of the present invention is described in detail with reference to fig. 1.
Fig. 1 is a schematic view of a heat dissipation cooling device according to an embodiment of the present invention, as shown in fig. 1, the heat dissipation cooling device includes: a water inlet 1, a treatment cavity 2, a fan 3, a water tank 4, a pump 5, a water outlet 6 and a heating electronic element.
In the embodiment of the utility model, the water inlet 1 passes through the pipeline with cold water and flows through the treatment chamber 2, and the temperature value scope of cold water is 0 ℃ -40 ℃. Wherein, process chamber 2 is for nai metal material, and the water pipe contains the electronic component that generates heat for wriggling geometry in 2, the water pipe setting of wriggling geometry on the electronic component's that generates heat surface to the realization is cooled down to electronic component fast.
The fan 3 accelerates the air flow on the surface of the object, so that the heat on the surface of the electronic component is taken away by more air, and the aim of cooling is fulfilled. The fan 3 is disposed on the heat generating electronic component.
Exemplarily, the power of the fan 3 is adjustable, and the user can reasonably adjust the power according to actual requirements, so that the effect of rapidly cooling the surface of the electronic element is achieved.
The water inlet 1 and the water outlet 6 are arranged outside the treatment cavity 2. Alternatively, the water inlet 1 and the water outlet 6 may be provided on the same side wall of the process chamber 2, and may be provided on different sides of the outside of the process chamber 2.
The tank 4 contains a refrigerant fluid and the pump 5 is disposed in the tank 4.
The embodiment of the utility model provides an in, behind the electronic component that generates heat, because the heat exchange effect, with the temperature reduction on electronic component surface in the time of the cold water temperature rise in the pipe, behind electronic component, during rivers in the water pipe flow into water tank 4, under the effect of coolant liquid and pump 5, water in the water pipe flows out through delivery port 6, and further entering flows out the water of delivery port 6 and gets into in reaction chamber 1 from water inlet 1 once more.
Optionally, the heat dissipation cooling device in the embodiment of the present invention further includes a temperature sensor and a liquid level sensor. The temperature sensor and the liquid level sensor are both arranged in the water tank 4.
Illustratively, a temperature sensor is used to control the speed of the fan 4 in dependence on the temperature sensed.
The embodiment of the utility model provides an in, the controller among the heat dissipation cooling device real-time supervision water tank 4 normal water temperature, and the liquid level in the water tank 4. Optionally, the controller monitors that the temperature of the water in the water tank 4 is greater than or equal to a preset temperature, and the controller controls the fan 3 to increase power or accelerate the rotating speed, so that the heating element is cooled rapidly.
Illustratively, when the preset temperature is 50 ℃, and the controller monitors that the temperature of water entering the water tank 4 is greater than or equal to 50 ℃, the controller controls the fan 3 to increase power or accelerate the rotating speed, so as to rapidly cool the heating element.
The liquid level sensor is used for controlling the working state of the heat dissipation cooling device according to the water level in the water tank 4. The working state of the heat dissipation cooling device comprises the following steps: working and standby states.
The embodiment of the utility model provides an in, level sensor reports to the controller with the water level information in the water tank 4 of gathering, and the controller is according to the operating condition of the liquid level information control heat dissipation cooling device in the water tank 4. Optionally, the preset liquid level is the lowest liquid level at which water in the water tank 4 normally flows. The controller determines the working state of the heat dissipation cooling device according to the magnitude relation between the collected liquid level and the preset liquid level.
For example, the controller determines that the collected liquid level is lower than a preset liquid level, controls the heat dissipation cooling device to enter a standby state, and prompts a worker to add cooling liquid. Or the controller determines that the acquired liquid level is higher than a preset liquid level and controls the heat dissipation cooling device to normally work; or the controller determines that the collected liquid level is equal to the preset liquid level, and controls the heat dissipation cooling device to prompt the staff to add the cooling liquid.
The embodiment discloses a heat dissipation cooling device, includes: the device comprises a water inlet 1, a treatment cavity 2, a fan 3, a water tank 4, a pump 5, a water outlet 6 and a heating electronic element; wherein, the processing chamber 2 contains heating electronic elements; the fan 3 is arranged on the heat-generating electronic component; the water inlet 1 and the water outlet 6 are arranged outside the treatment cavity 2; the water tank 4 contains refrigerating fluid; a pump 5 is arranged in the water tank 4. That is to say, the utility model discloses dispel the heat and cool down the purpose of handling to the electronic component that generates heat according to fan and water circulating system, avoided electronic component because of the problem of the unable normal work of high temperature, further improved electronic component's life.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A heat sink cooling device, comprising: the device comprises a water inlet, a treatment cavity, a fan, a water tank, a pump, a water outlet and a heating electronic element;
wherein the processing chamber contains the heat-generating electronic components therein; the fan is arranged on the heating electronic element; the water inlet and the water outlet are arranged outside the treatment cavity; the water tank contains refrigerating fluid; the pump is disposed within the water tank.
2. The heat dissipating cooling device of claim 1, further comprising: temperature sensors and liquid level sensors.
3. The heat sink cooling device of claim 2, wherein the temperature sensor and the level sensor are both disposed within the water tank.
4. The thermal dissipation cooling device of claim 3, wherein the temperature sensor is configured to control a speed of the fan based on the sensed temperature.
5. The heat sink cooling device of claim 3, wherein the level sensor is configured to control an operating condition of the heat sink cooling device based on a water level in the water tank.
6. The heat sink cooling device of claim 5, wherein the operating state of the heat sink cooling device comprises: working and standby states.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021513707.XU CN212727819U (en) | 2020-07-28 | 2020-07-28 | Heat dissipation cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021513707.XU CN212727819U (en) | 2020-07-28 | 2020-07-28 | Heat dissipation cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212727819U true CN212727819U (en) | 2021-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021513707.XU Active CN212727819U (en) | 2020-07-28 | 2020-07-28 | Heat dissipation cooling device |
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| CN (1) | CN212727819U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113157014A (en) * | 2021-04-25 | 2021-07-23 | 南京广厦软件有限公司 | Temperature control method and controller of constant-temperature integrated plate with humidification control and medium |
-
2020
- 2020-07-28 CN CN202021513707.XU patent/CN212727819U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113157014A (en) * | 2021-04-25 | 2021-07-23 | 南京广厦软件有限公司 | Temperature control method and controller of constant-temperature integrated plate with humidification control and medium |
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