CN212725259U - Wafer flower basket - Google Patents

Wafer flower basket Download PDF

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Publication number
CN212725259U
CN212725259U CN202021859054.0U CN202021859054U CN212725259U CN 212725259 U CN212725259 U CN 212725259U CN 202021859054 U CN202021859054 U CN 202021859054U CN 212725259 U CN212725259 U CN 212725259U
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China
Prior art keywords
wafer
face structure
basket
flowers
face
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CN202021859054.0U
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Chinese (zh)
Inventor
张小永
刘哲伟
张宝庆
马南
要博卿
王慧杰
朱道峰
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Beijing Plastics Research Institute Co ltd
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BEIJING PLASTICS RESEARCH INSTITUTE
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Priority to CN202021859054.0U priority Critical patent/CN212725259U/en
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Abstract

The embodiment of the utility model provides a wafer basket of flowers, include: the first end face structure and the second end face structure are identical in outline, and the side face structures are located on two sides of the first end face structure and the second end face structure and connected between the first end face structure and the second end face structure. The embodiment of the utility model provides a pair of wafer basket of flowers has adopted first terminal surface structure and second terminal surface structure to be the same profile design, and just, the reverse side is the same shape promptly for production facility can all discern the location to the positive and negative of wafer basket of flowers, thereby carries out different technologies such as sculpture, photoetching, coating film to the wafer. To the wafer that needs two-sided processing procedure, adopt the utility model discloses wafer basket of flowers can need not to take off the wafer, can realize the two-sided processing procedure of wafer with the whole upset of wafer basket of flowers, has avoided the wafer to damage at the upset in-process, has improved production efficiency.

Description

Wafer flower basket
Technical Field
The utility model relates to the technical field of integrated circuit, especially, relate to a wafer basket of flowers.
Background
With continuous technological innovation and different technological requirements in the integrated circuit industry, different technologies such as etching, photoetching, film coating and the like need to be carried out on the upper surface and the lower surface of a wafer (silicon wafer) in the production process at the present stage. A conventional wafer carrying basket structure (hereinafter, referred to as a single H-shaped wafer basket) is generally H-shaped on one side, flat or U-shaped on one side, and toothed on the other two sides, as shown in fig. 1. In the design of this kind of list H type, H type structure is used for with different production facility cooperation location, and the flat board of opposite side or U type structure main function are in order to improve basket of flowers overall structure's intensity.
For some wafer products needing double-sided processing, the production processing procedure needs to be carried out on the upper surface and the lower surface of a wafer, after one surface of the wafer is produced by using an H-shaped structure surface as a positioning surface, the wafer needs to be taken out of the basket, the wafer is turned to the other surface to be upward and then put into the wafer basket to be subjected to the second production procedure, the problem of scratching of the surface of the wafer is easily caused in the process of turning the wafer, the fragment rate is influenced, and the production efficiency is reduced by the procedure of turning the wafer. For the single H-shaped wafer basket, since the general production equipment can only identify the H-shaped structure and cannot identify the flat plate or U-shaped structure, the double-sided process can only be realized by taking out and turning over the wafer, and the double-sided process of the wafer cannot be realized by turning over the single H-shaped wafer basket.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a wafer basket of flowers for solve among the prior art can only accomplish the defect of two-sided processing procedure through taking out and the upset with the wafer from the wafer basket of flowers, need not take out the wafer, only realize the two-sided processing procedure of wafer through upset wafer basket of flowers.
The embodiment of the utility model provides a wafer basket of flowers, include: the first end face structure and the second end face structure are identical in outline, and the side face structures are located on two sides of the first end face structure and the second end face structure and connected between the first end face structure and the second end face structure.
And the first end face structure and the second end face structure are both H-shaped structures.
Wherein the side structure includes a plurality of gullets.
Wherein the gullets are spaced 27 cm or 40 cm from each other between the opposing side structures.
The H-shaped structure comprises a first stand column, a second stand column and a cross beam, the cross beam is horizontally arranged, the first stand column and the second stand column are respectively vertically arranged at two ends of the cross beam, and two ends of the cross beam are connected to the central positions of the first stand column and the second stand column in the length direction.
The reinforcing rib is horizontally fixed on the surface of the cross beam, and two ends of the reinforcing rib are supported between the first upright post and the second upright post.
Wherein the first end face structure, the second end face structure, and the side face structure are one of a polyetheretherketone structure, a polyetherimide structure, and a poly (tetramethylene terephthalate) structure.
The embodiment of the utility model provides a pair of wafer basket of flowers has adopted first terminal surface structure and second terminal surface structure to be the same profile design, and just, the reverse side is the same shape promptly for production facility can all discern the location to the positive and negative of wafer basket of flowers, thereby carries out different technologies such as sculpture, photoetching, coating film to the wafer. To the wafer that needs two-sided processing procedure, adopt the utility model discloses wafer basket of flowers can need not to take off the wafer, can realize the two-sided processing procedure of wafer with the whole upset of wafer basket of flowers, has avoided the wafer to damage at the upset in-process, has improved production efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a single H-shaped wafer flower basket in the prior art;
fig. 2 is a schematic structural diagram of a wafer basket according to an embodiment of the present invention;
fig. 3 is a front view of a wafer basket according to an embodiment of the present invention;
fig. 4 is a rear view of a wafer basket according to an embodiment of the present invention;
fig. 5 is a left side view of a wafer basket according to an embodiment of the present invention;
fig. 6 is a top view of a wafer basket according to an embodiment of the present invention.
Reference numerals:
1: a first end face structure; 11: a first upright post; 12: a second upright post; 13: a cross beam; 131: reinforcing ribs; 2: a second end face structure; 3: a side structure; 31: a tooth socket; 4: and (5) a wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
A wafer flower basket according to an embodiment of the present invention is described below with reference to fig. 2 to 6, including: the structure comprises a first end face structure 1, a second end face structure 2 and a side face structure 3, wherein the first end face structure 1 and the second end face structure 2 are identical in outline (namely identical in shape and size), and the side face structure 3 is located on two sides of the first end face structure 1 and the second end face structure 2 and connected between the first end face structure 1 and the second end face structure 2.
The first end face structure 1 and the second end face structure 2 are both H-shaped structures. At present, the production equipment for the wafer 4 can generally identify the wafer basket with the H-shaped structure, so that the first end face structure 1 and the second end face structure 2 in this embodiment are designed to have the H-shaped structures (the same shape), and the two end face structures are ensured to have the same size, i.e., the front and back double H-shaped symmetrical mechanisms, so that the production equipment can identify and position the front and back sides of the wafer basket, and thus perform different processes such as etching, photoetching, film coating and the like on the wafer 4. The side structure 3 is used for placing and limiting the wafer 4, so that the wafer 4 is stably placed in the wafer basket.
For the wafer 4 needing double-sided processing, the wafer 4 can be placed into the wafer basket of the embodiment, the production equipment is used for carrying out the production processing procedure, after the front side of the wafer 4 completes the production procedure, the wafer 4 does not need to be taken out of the wafer basket, but the wafer basket is turned over integrally, and the first end face structure 1 and the second end face structure 2 are both H-shaped structures, so that the production equipment can correspondingly identify, the reverse side production procedure of the wafer 4 can be continuously completed, the production procedure of the double-sided processing can be completed without taking down the wafer 4, and the damage probability of the wafer is avoided.
The embodiment of the utility model provides a pair of wafer basket of flowers has adopted first terminal surface structure 1 and second terminal surface structure 2 to be the same profile design, and just, the reverse side is the same shape promptly for production facility can all discern the location to the positive and negative of wafer basket of flowers, thereby carries out different technologies such as sculpture, photoetching, coating film to wafer 4. To the wafer 4 that needs two-sided processing procedure, adopt the utility model discloses wafer basket of flowers can need not to take off wafer 4, can realize wafer 4's two-sided processing procedure with the whole upset of wafer basket of flowers, has avoided wafer 4 to damage in the upset in-process, has improved production efficiency.
In one embodiment, the number of the side structures 3 is two, and the side structures are arranged oppositely to each other for placing the wafer 4. Further, the side structure 3 comprises a plurality of gullets 31. Specifically, the wafer 4 is placed between the two side surface structures 3 and is placed into the corresponding tooth grooves 31 to be clamped, and the wafer 4 is limited by the tooth grooves 31 of the side surface structures 3 in the embodiment, so that the wafer 4 is prevented from moving in the manufacturing process. Furthermore, according to the size of the wafer 4, the wafer baskets with different intervals between the side structures 3 can be manufactured by adopting a processing method of mold injection molding, for example: the gullets 31 between opposing side structures 3 are spaced apart by 27 centimeters (about 8 inches) or 40 centimeters (about 12 inches).
In one embodiment, as shown in fig. 3 and 4, the H-shaped structure includes a first upright 11, a second upright 12 and a cross beam 13, the cross beam 13 is horizontally disposed, the first upright 11 and the second upright 12 are respectively erected at two ends of the cross beam 13, and the two ends of the cross beam 13 are connected to the central positions of the first upright 11 and the second upright 12 along the length direction. Specifically, the first upright 11 and the second upright 12 in this embodiment support the side structures 3 on both sides, respectively, and the cross beam 13 is used for connecting and supporting the first upright 11 and the second upright 12, so as to ensure the structural stability of the first end surface structure 1 and the second end surface structure 2. In addition, according to actual needs, the width of the beam 13 can be properly increased, the deformation of the wafer basket is further avoided, and the structural stability of the wafer basket is enhanced.
In one embodiment, the wafer basket further comprises a stiffener 131, the stiffener 131 is horizontally fixed on the surface of the cross beam 13, and two ends of the stiffener 131 are supported between the first vertical column 11 and the second vertical column 12. The reinforcing ribs 131 in this embodiment are used to reinforce the supporting function of the cross beam 13, thereby further increasing the overall stability of the wafer basket.
In one embodiment, the first face structure 1, the second face structure 2, and the side structure 3 are one of a polyetheretherketone structure, a polyetherimide structure, and a polytetramethylene terephthalate structure. The wafer flower basket in the embodiment is not made of traditional meltable polytetrafluoroethylene or polypropylene materials any more, and through a large number of tests and comparisons, in order to better improve the product rigidity and the antistatic performance required by the integrated circuit industry, the wafer flower basket is made of one of polyetheretherketone, polyetherimide and poly (tetramethylene terephthalate). It should be understood that, according to the actual requirement, other materials with higher hardness parameter and good antistatic performance may also be adopted, and the present invention is not limited thereto.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (7)

1. A wafer basket of flowers, comprising: the first end face structure and the second end face structure are identical in outline, and the side face structures are located on two sides of the first end face structure and the second end face structure and connected between the first end face structure and the second end face structure.
2. The wafer basket according to claim 1, wherein said first end face structure and said second end face structure are both H-shaped structures.
3. The wafer basket according to claim 1, wherein said side structure comprises a plurality of splines.
4. The wafer basket according to claim 3, wherein the gullets are spaced a distance of 27 cm or 40 cm from the side structures.
5. The wafer flower basket according to claim 2, wherein the H-shaped structure comprises a first upright, a second upright and a cross beam, the cross beam is horizontally disposed, the first upright and the second upright are respectively erected at two ends of the cross beam, and the two ends of the cross beam are connected to the central positions of the first upright and the second upright along the length direction.
6. The wafer flower basket according to claim 5, further comprising a reinforcing rib horizontally fixed on the surface of the cross beam, wherein two ends of the reinforcing rib are supported between the first upright and the second upright.
7. The wafer basket according to claim 1, wherein the first end face structure, the second end face structure, and the side face structure are one of a polyetheretherketone structure, a polyetherimide structure, and a poly (tetramethylene terephthalate) structure.
CN202021859054.0U 2020-08-31 2020-08-31 Wafer flower basket Active CN212725259U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021859054.0U CN212725259U (en) 2020-08-31 2020-08-31 Wafer flower basket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021859054.0U CN212725259U (en) 2020-08-31 2020-08-31 Wafer flower basket

Publications (1)

Publication Number Publication Date
CN212725259U true CN212725259U (en) 2021-03-16

Family

ID=74924807

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021859054.0U Active CN212725259U (en) 2020-08-31 2020-08-31 Wafer flower basket

Country Status (1)

Country Link
CN (1) CN212725259U (en)

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CP01 Change in the name or title of a patent holder

Address after: No.47 jiugulou street, Xicheng District, Beijing 100031

Patentee after: Beijing Plastics Research Institute Co.,Ltd.

Address before: No.47 jiugulou street, Xicheng District, Beijing 100031

Patentee before: BEIJING PLASTICS Research Institute

CP01 Change in the name or title of a patent holder