CN212703910U

CN212703910U - Hemisphere punching tool for hollow steel ball machining

Info

Publication number: CN212703910U
Application number: CN202021232217.2U
Authority: CN
Inventors: 不公告发明人
Original assignee: Guanghan Hengrui Steel Ball Manufacturing Co ltd
Current assignee: Guanghan Hengrui Steel Ball Manufacturing Co ltd
Priority date: 2020-06-29
Filing date: 2020-06-29
Publication date: 2021-03-16
Anticipated expiration: 2030-06-29

Abstract

The utility model relates to a hemisphere punching press field discloses a hemisphere punching press frock is used in hollow steel ball processing, including last mould and bed die, the terminal surface of going up the mould is equipped with hemisphere punching press head, be provided with the punching press groove that is used for placing the punching press disk in the bed die, the punching press groove is just right the punching press head, just the punching press groove runs through the bed die. The utility model places the punching disk in the punching groove, thereby fixing the punching disk in the punching groove, then utilizing the hydraulic cylinder to drive the punching head to punch downwards, and punching the punching disk into a hollow hemisphere shape; because the punching groove runs through the lower die, the punched hollow hemisphere can smoothly slide off the lower die from the punching groove, the hollow hemisphere is prevented from being manually taken out, the working time is saved, and the use safety and the working efficiency are improved.

Description

Hemisphere punching tool for hollow steel ball machining

Technical Field

The utility model relates to a hollow hemisphere punching press technical field particularly, relates to a hemisphere punching press frock is used in hollow steel ball processing.

Background

At present, the research on the production and processing of hollow steel balls or the stamping of hemispheres for the processing of the hollow steel balls in the market is less, CN201520633585.0 discloses a stamping die with cutting, a concave die groove is arranged at the middle position of the upper end of a lower die holder, the shape of the lower end of a punch corresponds to the shape of a material discharge groove of a concave die and is hemispherical or square, however, the die has defects in the specific use process, the stamped hollow hemispheres are not easy to take out of the die, the working time is consumed, and the working efficiency is reduced; in addition, the upper die and the lower die are often required to be replaced at the same time aiming at the inconvenience in processing hemispheres with different apertures, so that the use is inconvenient and the cost is relatively high; in addition, the wafer to be punched is inconvenient and unsafe to place on the punching table, certain adverse effects are brought to the use process of people, the working hours are consumed, the production quality is seriously reduced, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a hollow steel ball processing is with hemisphere punching press frock for hollow hemisphere after the punching press breaks away from the bed die easily, and safe in utilization has just reduced man-hour, has improved work efficiency.

The embodiment of the utility model is realized like this:

the utility model provides a hollow steel ball processing is with hemisphere punching press frock, includes mould and bed die, the terminal surface of going up the mould is equipped with hemisphere punching press head, be provided with the punching press groove that is used for placing the punching press disk in the bed die, the punching press groove is just right the punching press head, just the punching press groove runs through the bed die.

Furthermore, the lower die comprises a lower die outer sleeve and a lower die inner ring, an accommodating cavity is formed in one end, close to the upper die, of the lower die outer sleeve, and the lower die inner ring is embedded in the accommodating cavity;

the stamping groove comprises a lower stamping groove and an upper stamping groove, the upper stamping groove is arranged on the lower die inner ring, the lower stamping groove is arranged on the lower die outer sleeve, the upper stamping groove, the lower stamping groove and the containing cavity are coaxially arranged, and the inner diameter of the containing cavity is larger than that of the lower stamping groove.

Further, the stamped disc is in interference fit with the upper stamping groove.

Further, an arc-shaped chamfer is arranged at the top of the upper stamping groove.

Further, the inner diameter of the upper punching groove is not smaller than the outer diameter of the punching head.

Further, the inner diameters of the upper stamping groove and the lower stamping groove are larger than the outer diameter of the stamping head.

Further, the lower die further comprises a positioning and conveying device, and the positioning and conveying device is used for positioning and conveying the punched wafer into the punching groove.

Further, conveyor includes the conveying guide rail, the conveying guide rail slope sets up, the low side of conveying guide rail with the punching press groove butt joint, the high-end extension punching press frock outside of conveying guide rail.

Furthermore, the conveying guide rail is a conveying groove, and the longitudinal section of the conveying groove is downward arc-shaped.

Further, the inner diameter of the conveying guide rail is not smaller than the outer diameter of the punched wafer.

The utility model has the advantages that:

the utility model places the punching disk in the punching groove, thereby fixing the punching disk in the punching groove, then utilizing the hydraulic cylinder to drive the punching head to punch downwards, and punching the punching disk into a hollow hemisphere shape; because the punching groove runs through the lower die, the punched hollow hemisphere can smoothly slide off the lower die from the punching groove, the hollow hemisphere is prevented from being manually taken out, the working time is saved, and the use safety and the working efficiency are improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a hemispherical stamping tool for processing a hollow steel ball according to an embodiment of the present invention;

fig. 2 is a top view of the lower mold provided in the embodiment of the present invention.

Icon: 1-upper die, 11-stamping head, 2-conveying guide rail, 3-lower die, 31-lower die outer sleeve, 311-containing cavity, 312-lower stamping groove, 32-lower die inner ring, 321-upper stamping groove and 322-arc chamfer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

Referring to fig. 1-2, the present embodiment provides a hemispherical stamping tool for processing a hollow steel ball, including an upper die 1 and a lower die 3, where an end surface of the upper die 1 is provided with a hemispherical stamping head 11, a stamping groove for placing a stamping wafer is provided in the lower die 3, the stamping groove faces the stamping head 11, and the stamping groove penetrates through the lower die 3.

The working principle is as follows: during punching, the punched wafer is placed in a punching groove, so that the punched wafer is fixed in the punching groove, then the punching head 11 is driven by the hydraulic cylinder to punch downwards, and the punched wafer is punched into a hollow hemisphere shape; because the punching groove runs through the lower die 3, the punched hollow hemisphere can smoothly slide off the lower die 3 from the punching groove, the artificial hollow hemisphere taking out is avoided, the working hours are saved, and the use safety and the working efficiency are improved.

In this embodiment, the lower mold 3 includes a lower mold outer sleeve 31 and a lower mold inner ring 32, an accommodating cavity 311 is opened at one end of the lower mold outer sleeve 31 close to the upper mold 1, and the lower mold inner ring 32 is embedded in the accommodating cavity 311; the stamping grooves comprise a lower stamping groove 312 and an upper stamping groove 321, the upper stamping groove 321 is arranged on the lower die inner ring 32, the lower stamping groove 312 is arranged on the lower die outer sleeve 31, the upper stamping groove 321, the lower stamping groove 312 and the accommodating cavity 311 are coaxially arranged, and the inner diameter of the accommodating cavity 311 is larger than that of the lower stamping groove 312. When the punching wafer is placed, the punching wafer can be placed at the lower die inner ring 32, so that the punching head 11 can conveniently punch the punching wafer, the punching head 11 is enabled to punch into the upper punching groove 321 of the lower die inner ring 32, and the punching wafer is punched into the hollow hemisphere. It should be noted that the lower mold inner ring 32 is made of a hard alloy material, and the lower mold 3 is just like before, so that the lower mold inner ring 32 can better bear the stamping force from the upper stamping head 11, and the use cost of the lower mold 3 is saved.

In order to facilitate the punching of the punched wafers with different apertures, so as to obtain hollow hemispheres with different inner diameters, in this embodiment, the lower die 3 further includes a lower die inner ring 32, the lower die inner ring 32 is disposed in the upper punch accommodating cavity 311, an upper punch groove 321 for placing the punched wafers is formed in the center of the lower die inner ring 32, and the punched wafers are in interference fit with the upper punch groove 321; the lower die inner ring 32 with different inner diameters is replaced to be matched with the hemispherical punching head 11 with different inner diameters, so that hollow hemispheres with different inner diameters are obtained through punching, the whole lower die does not need to be replaced at the same time, and the cost is greatly saved; in order to fix the punched disc in the lower mold inner ring 32 well, the punched disc is in interference fit with the upper punching groove 321, so that the punched disc is placed in the upper punching groove 321 more stably.

In this embodiment, the top of the upper stamping groove 321 is provided with an arc-shaped chamfer 22, and the arc-shaped chamfer 22 makes the matching with the stamped wafer tighter, and simultaneously protects the edge of the stamped wafer to prevent scratching, abrasion and the like.

In this embodiment, the inner diameter of the upper stamping groove 321 is not smaller than the outer diameter of the stamping head 11, so that the stamping head 11 can extend into the upper stamping groove 321 when stamping the stamping disc, and the stamping disc is stamped to form the hollow hemisphere.

In this embodiment, the inner diameters of the receiving cavity 311 and the lower punch groove 312 are larger than the outer diameter of the punch 11; thereby the punching press of the punching press head 11 of different apertures of matching that can be better is punched, obtains the hollow hemisphere in different apertures, makes the smooth landing of lower punching press groove 312 of following of hollow hemisphere after the punching press break away from lower mould 3 in addition, has avoided artificial hollow hemisphere of taking out, has saved man-hour, has improved the safety in utilization.

In this embodiment, the punching tool further comprises a positioning and conveying device, the positioning and conveying device is used for positioning and conveying the punched wafer into the punching groove, specifically, the positioning and conveying device comprises a conveying guide rail 2, the conveying guide rail 2 is obliquely arranged, the lower end of the conveying guide rail 2 is butted with the punching groove, in this embodiment, the conveying guide rail 2 is butted with the lower die inner ring 32, the lower end of the conveying guide rail 2 annularly surrounds the outer edge of the upper punching groove 321 of the lower die inner ring 32, and the high end of the conveying guide rail 2 extends out of the punching tool; when punching press, send into the punching press disk through conveying guide rail 2, the punching press disk slides in the punching press groove or the lower mould inner circle 32 in the bed die 3 along the conveying guide rail 2 nature of slope in, then can carry out the punching press of punching press disk, improved the placing and conveying efficiency of punching press disk, saved the labour.

In order to make the punching press disk remove more accurately in carrying the guide rail, avoid the punching press disk to break away from and carry the guide rail, in this embodiment, carry guide rail 2 to be a conveying groove, the longitudinal section of conveying groove is decurrent arc, just the internal diameter of carrying guide rail 2 is not less than the external diameter of punching press disk to make the landing that the punching press disk can be more smooth in carrying the groove to lower mould inner circle 32 department.

To sum up, the utility model discloses place the punching press disk in the punching press inslot to be fixed in the punching press inslot with the punching press disk, then utilize pneumatic cylinder drive punching press head punching press downwards, become hollow hemisphere with the punching press disk punching press, because the punching press groove runs through the bed die, make the hollow hemisphere after the punching press smooth can break away from the bed die from the landing of punching press groove, avoided the artificial hollow hemisphere of taking out, saved man-hour, improved safety in utilization and work efficiency; in order to facilitate the punching press disk punching press to different apertures to obtain the hollow hemisphere of different internal diameters, the utility model discloses still be provided with the lower mould inner circle in the bed die, through the lower mould inner circle of changing different internal diameters and the cooperation of the hemisphere punching press head of different internal diameters, thereby the punching press obtains the hollow hemisphere of different internal diameters.

In addition, the punched wafer naturally slides into a punching groove in the lower die or an inner ring of the lower die along the inclined conveying guide rail, and then the punched wafer can be punched, so that the placing and conveying efficiency of the punched wafer is improved, and the labor force is saved.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a hollow steel ball processing is with hemisphere punching press frock, includes mould and bed die, its characterized in that, the terminal surface of going up the mould is equipped with hemisphere punching press head, the bed die is provided with the punching press groove that is used for placing the punching press disk, the punching press groove is just right the punching press head, just the punching press groove runs through the bed die.

2. The hemispherical punching tool for processing the hollow steel ball according to claim 1, wherein the lower die comprises a lower die outer sleeve and a lower die inner ring, an accommodating cavity is formed in one end, close to the upper die, of the lower die outer sleeve, and the lower die inner ring is embedded in the accommodating cavity;

3. The hemispherical punching tool for processing the hollow steel ball as claimed in claim 2, wherein the punching wafer is in interference fit with the upper punching groove.

4. The hemispherical punching tool for processing the hollow steel ball as claimed in claim 3, wherein an arc-shaped chamfer is arranged at the top of the upper punching groove.

5. The hemispherical punching tool for processing the hollow steel ball as claimed in claim 4, wherein the inner diameter of the upper punching groove is not less than the outer diameter of the punching head.

6. The hemispherical punching tool for processing the hollow steel ball as claimed in claim 2, wherein the inner diameters of the upper punching groove and the lower punching groove are both larger than the outer diameter of the punching head.

7. The hollow steel ball processing hemisphere punching tool of claim 1, further comprising a positioning and conveying device, wherein the positioning and conveying device is used for positioning and conveying a punched wafer into the punching groove.

8. The hollow steel ball processing hemisphere punching tool according to claim 7, wherein the conveying device includes a conveying guide rail, the conveying guide rail is arranged obliquely, a lower end of the conveying guide rail is in butt joint with the punching groove, and a high end of the conveying guide rail extends out of the punching tool.

9. The hemispherical punching tool for processing the hollow steel ball according to claim 8, wherein the conveying guide rail is a conveying groove, and the longitudinal section of the conveying groove is downward arc-shaped.

10. The hemispherical punching tool for processing the hollow steel ball as claimed in claim 9, wherein the inner diameter of the conveying guide rail is not less than the outer diameter of the punched wafer.