CN212695169U

CN212695169U - LED packaging structure

Info

Publication number: CN212695169U
Application number: CN202021267759.3U
Authority: CN
Inventors: 龚文; 朱芸
Original assignee: Suzhou Kinglight Optoelectronics Co ltd
Current assignee: Suzhou Kinglight Optoelectronics Co ltd
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2021-03-12
Anticipated expiration: 2030-07-02

Abstract

The utility model discloses a LED packaging structure, include: the LED substrate comprises an LED substrate body and a welding disc arranged on the LED substrate body; the bonding pad is provided with a plurality of LED chip fixing areas, and the LED chips are fixed on the chip fixing areas; wherein, the adjacent LED chip fixing areas are connected through two opposite gaps. The utility model has the advantages that: the adjacent LED chip fixed regions are connected through two opposite notches, the whole pad is divided into a plurality of LED chip fixed regions, the chips are fixed in the LED chip fixed regions, in addition, the notches prolong the path of the edge of the pad under the limited design space, the flow of solid crystal glue can be effectively reduced, the adhesion between the LED chips is prevented, and therefore the process stability and the product reliability are improved.

Description

LED packaging structure

Technical Field

The utility model relates to a LED encapsulates the field, concretely relates to LED packaging structure.

Background

With the continuous development of full-color RGB display application technology, small-distance products become the dominant force of future technology expansion. The development of LED devices is towards miniaturization, and even miniaturization, so that the small-pitch LED package has higher technical requirements.

With the size of the small-pitch LED becoming smaller and smaller, the safety distances between the functional regions, between the chips, and between the chips and the functional regions are very small in a limited size range, and when a plurality of chips with a certain volume, such as red, green, and blue chips, are packaged, a reasonable design and a good manufacturing process are required to ensure the stability and the application reliability of the manufacturing process.

The traditional bonding pad is designed into a rectangular straight strip shape, and after a chip is subjected to die bonding, the chip is very easy to adhere due to the fluidity of die bonding glue; in addition, the bonding pads are designed to be independent areas with certain intervals between the die bonding areas, but due to the limited size, the requirements on the processing capacity and precision of a substrate supplier are extremely high. Therefore, how to consider the space utilization rate and the safety distance is an urgent problem to be solved in the LED packaging industry.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a LED packaging structure.

In order to solve the technical problem, the utility model provides a LED packaging structure, include: the LED substrate comprises an LED substrate body and a welding disc arranged on the LED substrate body; the bonding pad is provided with a plurality of LED chip fixing areas, and the LED chips are fixed on the chip fixing areas; wherein, the adjacent LED chip fixing areas are connected through two opposite gaps.

The utility model has the advantages that:

the adjacent LED chip fixed regions are connected through two opposite notches, the whole pad is divided into a plurality of LED chip fixed regions, the chips are fixed in the LED chip fixed regions, in addition, the notches prolong the path of the edge of the pad under the limited design space, the flow of solid crystal glue can be effectively reduced, the adhesion between the LED chips is prevented, and therefore the process stability and the product reliability are improved.

In one embodiment, the LED substrate body includes a resin substrate and a copper foil coated on the resin substrate.

In one embodiment, the material of the resin substrate is BT resin.

In one embodiment, the bonding pad is formed on the LED substrate body by etching.

In one embodiment, the height of the pad is 0.02 to 0.03 mm.

In one embodiment, the height of the pad is 0.025 mm.

In one embodiment, the notch is rectangular.

In one embodiment, the gap has a length of 0.04mm and a width of 0.04 mm.

In one embodiment, three LED chip fixing regions are arranged on the bonding pad, and the three LED chip fixing regions are arranged in a long strip shape.

In one embodiment, the three LED chip fixing regions respectively fix a red LED chip, a blue LED chip, and a green LED chip.

Drawings

Fig. 1 is a schematic structural diagram of the LED package structure of the present invention.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Referring to fig. 1, an LED package structure includes: the LED substrate comprises an LED substrate body 1 and a bonding pad 2 arranged on the LED substrate body; the bonding pad is provided with a plurality of LED chip fixing areas, and the LED chips are fixed on the chip fixing areas; wherein, the adjacent LED chip fixing areas are connected through two opposite gaps 3.

The utility model has the advantages that:

The following explains why the notch can prevent the bonding between the LED chips in conjunction with the LED chip dispensing process.

At first the point gum machine is in waiting to solidify brilliant corresponding position, and the point is glued admittedly the crystal, and solid crystal glues into the liquid drop form, has mobility, then puts solid crystal glue center to the LED chip, sets up the breach after, because the blockking of breach, adjacent liquid drop can not flow together, like this, adjacent LED chip just can not take place to glue and link.

Specifically, the LED substrate body generally includes a resin substrate and a copper foil coated on the resin substrate.

In one embodiment, the material of the resin substrate is BT resin. "BT" is a resin chemical trade name produced by mitsubishi gas chemical company of japan, and is synthesized from Bismaleimide (BMI) and Cyanate Ester (CE) resin, and a BT resin-based copper clad laminate (BT board for short) has high glass transition temperature (Tg), excellent dielectric properties, low thermal expansion rate, good mechanical characteristics, and the like, so that it can be widely applied to High Density Interconnect (HDI) multilayer printed boards and packaging substrates which are becoming popular at present. Of course, the material of the resin substrate may be BT resin of the type.

In one embodiment, the bonding pad is formed on the LED substrate body by etching. Of course, also can the pad also can adopt other modes to form on the LED base plate body, the utility model discloses no longer describe herein.

In one embodiment, the height of the pad is 0.02 to 0.03 mm. More specifically, the height of the pad is 0.025 mm.

It will be appreciated that the gap is rectangular. Other shapes, such as semi-circular, are of course possible.

In one embodiment, the gap has a length of 0.04mm and a width of 0.04 mm.

In one embodiment, three LED chip fixing regions are arranged on the bonding pad, and the three LED chip fixing regions are arranged in a long strip shape. In one embodiment, the three LED chip fixing regions respectively fix the red LED chip 4, the blue LED chip 5, and the green LED chip 6.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims

1. An LED package structure, comprising: the LED substrate comprises an LED substrate body and a welding disc arranged on the LED substrate body; the bonding pad is provided with a plurality of LED chip fixing areas, and the LED chips are fixed on the chip fixing areas; wherein, the adjacent LED chip fixing areas are connected through two opposite gaps.

2. The LED package structure of claim 1, wherein the LED substrate body comprises a resin substrate and a copper foil overlying the resin substrate.

3. The LED package structure according to claim 2, wherein a material of the resin substrate is BT resin.

4. The LED package structure of claim 1, wherein the pads are formed on the LED substrate body by etching.

5. The LED package structure of claim 1, wherein a height of the pad is 0.02 to 0.03 mm.

6. The LED package structure of claim 5, wherein the height of the pad is 0.025 mm.

7. The LED package structure of claim 1, wherein said notch is rectangular.

8. The LED package structure of claim 7, wherein the gap has a length of 0.04mm and a width of 0.04 mm.

9. The LED package structure of claim 1, wherein three LED chip attach areas are provided on said pad, said three LED chip attach areas being arranged in an elongated pattern.

10. The LED package structure of claim 9, wherein the three LED chip mounting regions mount a red LED chip, a blue LED chip, and a green LED chip, respectively.