CN212692637U - Novel temperature equalization plate structure - Google Patents
Novel temperature equalization plate structure Download PDFInfo
- Publication number
- CN212692637U CN212692637U CN202021646960.2U CN202021646960U CN212692637U CN 212692637 U CN212692637 U CN 212692637U CN 202021646960 U CN202021646960 U CN 202021646960U CN 212692637 U CN212692637 U CN 212692637U
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- China
- Prior art keywords
- cover plate
- upper cover
- backup pad
- plate
- top surface
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011889 copper foil Substances 0.000 claims abstract description 19
- 229910017083 AlN Inorganic materials 0.000 claims abstract description 8
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 230000005855 radiation Effects 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000110 cooling liquid Substances 0.000 claims description 9
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 4
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- 238000010301 surface-oxidation reaction Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000007788 liquid Substances 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 238000009434 installation Methods 0.000 abstract description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 17
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 208000007101 Muscle Cramp Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the technical field of the heat dissipation, concretely relates to novel samming plate structure, including lower apron and upper cover plate, the inside fixed mounting of apron and upper cover plate has backup pad and capillary tissue down, the top of the interior bottom surface fixed connection locating piece of upper cover plate, the through-hole has been seted up to the side of backup pad, copper foil fixedly connected with aluminium nitride heat radiation fins is passed through to the top surface of upper cover plate, and backup pad production is quick, saves raw and other materials, low in manufacturing cost, can improve the intensity of this device, and the installation is fixed a position fast to backup pad accessible locating piece, and it is convenient to put, and the through-hole can improve the structural stability of backup pad, reduces the dead weight of backup pad simultaneously to reduce the influence of backup pad to the gas-liquid flow, aluminium nitride heat radiation fins dead weight is little, and the coefficient.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation, concretely relates to novel samming plate structure.
Background
The heat equalizing plate is an extension of heat pipe technology, the working principle of the heat equalizing plate is the same as that of a heat pipe, the heat equalizing plate comprises four main circulating steps of conduction, evaporation, convection and condensation to quickly take away heat from a heat source, the core effect of the heat equalizing plate is heat conduction, heat is transferred through vapor-liquid phase change of working fluid in a totally-closed vacuum cavity, and the heat equalizing plate has extremely high heat conductivity which is hundreds times as high as the heat conductivity of pure copper.
The temperature-equalizing plate is a hollow shell formed by combining an upper cover plate and a lower cover plate, capillary structures are arranged on the inner wall of the periphery of the shell, a support body of a column-shaped object formed by sintering metal powder is arranged in the shell, and the support body mainly has the function of preventing the body of the two cover plates from sinking caused by the temperature-equalizing plate in the production and use processes.
At present, a plurality of cylinders, square cramps or integral punching sheets are not used for the support body, but the plurality of cylinders have the defects of time consumption and uneven arrangement, and the wavy structure is formed by bending, so that the support strength is insufficient, and the support effect is limited; the integral stamping part needs to be provided with a complex stamping die, has the defects of fixed appearance and size, low elasticity and difficult die maintenance, influences the yield and improves the manufacturing cost.
In addition, the aluminum nitride heat dissipation fins of the existing temperature equalization plates are mostly made of pure copper or aluminum alloy, the former has fast heat absorption, but high price, large density and larger mass under the same volume, and the latter is easy to oxidize and bubble in a humid environment, thus affecting the heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a novel samming plate structure, backup pad production is quick, save raw and other materials, low in manufacturing cost, can improve the intensity of this device, and the installation is fixed a position fast to backup pad accessible locating piece, puts the convenience, and the through-hole can improve the structural stability of backup pad, reduces the dead weight of backup pad simultaneously to reduce the backup pad to the influence that the gas-liquid flows, aluminium nitride heat radiation fins dead weight is little, and coefficient of heat conductivity is high, and is insulating, stable corrosion-resistant, high with the bonding strength of upper cover plate.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel samming plate structure, includes apron and upper cover plate down, the inside fixed mounting of apron and upper cover plate has backup pad and capillary tissue down, the top of the interior bottom surface fixed connection locating piece of upper cover plate, the through-hole has been seted up to the side of backup pad, copper foil fixedly connected with aluminium nitride heat radiation fins is passed through to the top surface of upper cover plate.
Preferably, the lower cover plate is of a copper square plate structure, the upper cover plate is of a copper square groove structure, the interiors of the lower cover plate and the upper cover plate are of cavity structures, and the cavity structures in the interiors of the lower cover plate and the upper cover plate are filled with cooling liquid; the lower cover plate and the upper cover plate have excellent heat conductivity and can better conduct the heat of the heating piece.
Preferably, the top surface of the support plate is attached to the inner bottom surface of the lower cover plate, the bottom surface of the support plate is fixedly connected with the inner top surface of the upper cover plate, and the support plate is an S-shaped bent copper sheet; the backup pad can play the supporting role, improves the intensity of this device, and apron and upper cover plate contact down when preventing this temperature-uniforming plate from receiving pressure guarantee down the smooth circulation of heat conduction liquid in apron and the upper cover plate to guarantee heat conduction efficiency, the backup pad is compared and has the advantage of putting the convenience, saving raw and other materials in traditional copper support column, and the backup pad itself uses the technology of buckling to make, and production is quick, low in manufacturing cost.
Preferably, a plurality of through holes with regular hexagonal cross sections are horizontally formed in the side surface of the supporting plate, and the through holes are arranged in an equal sequence; the honeycomb structure that the through-hole is constituteed has excellent compression energy-absorbing performance, can absorb impact load effectively when receiving radial direction's pressure, improves the structural stability of backup pad, simultaneously greatly reduced the material quantity and the dead weight of backup pad, simultaneously, the through-hole still plays the effect that reduces the backup pad and to the influence of apron and upper cover plate cavity gas-liquid flow down in the transverse direction.
Preferably, the positioning block is a flat cylindrical copper column, and the positioning block and the lower cover plate are of an integrated structure; the locating piece plays the positioning role, and can make the manufacturing personnel install the backup pad location in apron down swiftly convenient to carry out subsequent welding process.
Preferably, the capillary tissue is a 3D woven or 2D woven metal mesh, a foam metal or a metal powder; the capillary tissue may direct a return flow of cooling fluid.
Preferably, the top surface of the copper foil is oxidized to form an Al2O3 layer, the bottom surface of the aluminum nitride heat sink is oxidized to form a Cu2O layer, the top surface of the upper cover plate is fixedly connected to the bottom surface of the copper foil, and the top surface of the copper foil is fixedly connected to the bottom surface of the aluminum nitride heat sink; the aluminum nitride radiating fins have small dead weight and high heat conductivity coefficient, are insulating, stable and corrosion-resistant, can effectively radiate heat, and the upper cover plate can be welded with the aluminum nitride radiating fins by a copper foil direct copper-clad method, so that the bonding strength of the upper cover plate and the aluminum nitride radiating fins is greatly improved.
Compared with the prior art, the beneficial effects of the utility model are that: the lower cover plate and the upper cover plate have excellent heat conductivity and can better conduct the heat of the heating element; the supporting plate can play a supporting role, the strength of the device is improved, the lower cover plate is prevented from contacting the upper cover plate when the temperature equalizing plate is stressed, smooth circulation of heat conducting liquid in the lower cover plate and the upper cover plate is ensured, and therefore heat conducting efficiency is ensured; the honeycomb structure formed by the through holes has excellent compression energy absorption performance, can effectively absorb impact load when being subjected to pressure in the radial direction, improves the structural stability of the supporting plate, greatly reduces the material consumption and the dead weight of the supporting plate, and simultaneously plays a role in reducing the influence of the supporting plate on gas-liquid flow in cavities of the lower cover plate and the upper cover plate in the transverse direction; the positioning block plays a role in positioning, so that a manufacturer can quickly and conveniently position and install the support plate in the lower cover plate to perform a subsequent welding process; the capillary tissue can guide the backflow of the cooling liquid; the aluminum nitride radiating fins have high heat conductivity coefficient, are insulating and stable, can effectively radiate heat, and the upper cover plate can be welded with the aluminum nitride radiating fins by a copper foil direct copper-clad method, so that the bonding strength of the upper cover plate and the aluminum nitride radiating fins is greatly improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the middle cover plate and the lower cover plate of the present invention;
fig. 3 is a left side view of the support plate of the present invention;
fig. 4 is a schematic view of the connection structure of the upper cover plate, the copper foil and the aluminum nitride heat dissipation fins of the present invention;
in the figure: 1. a lower cover plate; 2. an upper cover plate; 3. aluminum nitride heat sink fins; 4. positioning blocks; 5. a support plate; 6. capillary tissue; 7. a through hole; 8. copper foil; 301. a Cu2O layer; 801. al2O3 layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides a novel samming plate structure, includes apron 1 and upper cover plate 2 down, the inside fixed mounting of apron 1 and upper cover plate 2 has backup pad 5 and capillary tissue 6 down, the top of the interior bottom surface fixed connection locating piece 4 of upper cover plate 2, through-hole 7 has been seted up to the side of backup pad 5, copper foil 8 fixedly connected with aluminium nitride heat radiation fin 3 is passed through to the top surface of upper cover plate 2.
Specifically, the lower cover plate 1 is a copper square plate structure, the upper cover plate 2 is a copper square groove structure, the interiors of the lower cover plate 1 and the upper cover plate 2 are cavity structures, and the cavity structures in the interiors of the lower cover plate 1 and the upper cover plate 2 are filled with cooling liquid; the cooling liquid is acetone, water or glycol.
Specifically, the top surface of the support plate 5 is attached to the inner bottom surface of the lower cover plate 1, the bottom surface of the support plate 5 is fixedly connected with the inner top surface of the upper cover plate 2, and the support plate 5 is an S-shaped bent copper sheet; backup pad 5 can play the supporting role, improves the intensity of this device, and apron 1 and upper cover plate 2 contact down when preventing this temperature-uniforming plate from receiving pressure guarantee down the smooth circulation of heat conduction liquid in apron 1 and the upper cover plate 2 to guarantee heat conduction efficiency, backup pad 5 compares and has the advantage of putting the convenience, saving raw and other materials in traditional copper support column, and backup pad 5 itself uses the technology of buckling to make, and production is quick, low in manufacturing cost.
Specifically, a plurality of through holes 7 with regular hexagonal cross sections are horizontally formed in the side surface of the supporting plate 5, and the through holes are arranged in an equal sequence; the honeycomb structure that the through-hole 7 is constituteed has excellent compression energy-absorbing performance, can absorb impact load effectively when receiving radial direction's pressure, improves backup pad 5's structural stability, simultaneously greatly reduced backup pad 5's material quantity and dead weight, simultaneously, through-hole 7 still plays the effect that reduces backup pad 5 and to apron 1 and 2 cavity gas-liquid flow's in the upper cover effect down in the transverse direction.
Specifically, the positioning block 4 is a flat cylindrical copper column, and the positioning block 4 and the lower cover plate 1 are of an integrated structure; the positioning block 4 plays a role in positioning, so that a manufacturer can quickly and conveniently position and install the support plate 5 in the lower cover plate 1 to perform a subsequent welding process.
Specifically, the capillary tissue 6 is a 3D woven or 2D woven metal mesh, a foam metal or metal powder; the capillary tissue 6 may guide a return flow of cooling liquid.
Specifically, an Al2O3 layer 801 is generated by oxidizing the top surface of the copper foil 8, a Cu2O layer 301 is generated by oxidizing the bottom surface of the aluminum nitride heat sink fin 3, the top surface of the upper cover plate 2 is fixedly connected to the bottom surface of the copper foil 8, and the top surface of the copper foil 8 is fixedly connected to the bottom surface of the aluminum nitride heat sink fin 3; the aluminum nitride radiating fins 3 have high heat conductivity coefficient, are insulating and stable, and can effectively radiate heat, and the upper cover plate 2 can be welded with the aluminum nitride radiating fins 3 by a direct copper-clad method through the copper foil 8, so that the bonding strength of the upper cover plate 2 and the aluminum nitride radiating fins 3 is greatly improved.
The working principle and the using process of the invention are as follows: when the heat dissipation structure works, the bottom surface of the lower cover plate 1 absorbs heat of a heat source and transfers the heat to cooling liquid in inner cavities of the lower cover plate 1 and the upper cover plate 2, the cooling liquid absorbs heat and gasifies in a negative pressure environment and transfers the heat to the inner bottom surface of the upper cover plate 2, then the cooling liquid returns to the position of the heat source under the action of capillary force of the capillary tissue 6, and the inner bottom surface of the upper cover plate 2 transfers the heat to the aluminum nitride heat dissipation fins 3 through the copper foil 8 to perform rapid heat dissipation;
when this temperature-uniforming plate receives the effort of vertical direction, the honeycomb structure that through-hole 7 on the backup pad 5 is constituteed distributes impact load, produce the deformation of caving in, make backup pad 5's structural stability improve, the unstability difficulty, the whole resistance of structure has also been improved simultaneously, apron 1 and upper cover plate 2 under making backup pad 5 better support, prevent apron 1 and upper cover plate 2 contact down, guarantee the smooth circulation of heat-conducting liquid in apron 1 and the upper cover plate 2 down, through-hole 7 still plays the effect that reduces backup pad 5 and to the influence that gas-liquid flows in apron 1 and the 2 cavities of upper cover plate 2 on the transverse direction simultaneously.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a novel samming structure which characterized in that: including lower apron (1) and upper cover plate (2), the inside fixed mounting of lower apron (1) and upper cover plate (2) has backup pad (5) and capillary tissue (6), the top of interior bottom surface fixed connection locating piece (4) of upper cover plate (2), through-hole (7) have been seted up to the side of backup pad (5), copper foil (8) fixedly connected with aluminium nitride heat radiation fins (3) are passed through to the top surface of upper cover plate (2).
2. The novel temperature equalization plate structure of claim 1, wherein: the lower cover plate (1) is of a copper square plate structure, the upper cover plate (2) is of a copper square groove structure, the lower cover plate (1) and the upper cover plate (2) are of hollow cavity structures, and cooling liquid is filled in the hollow cavity structures of the lower cover plate (1) and the upper cover plate (2).
3. The novel temperature equalization plate structure of claim 1, wherein: the top surface of the supporting plate (5) is attached to the inner bottom surface of the lower cover plate (1), the bottom surface of the supporting plate (5) is fixedly connected with the inner top surface of the upper cover plate (2), and the supporting plate (5) is a S-shaped bent copper sheet.
4. The novel temperature equalization plate structure of claim 1, wherein: the side surface of the supporting plate (5) is horizontally provided with a plurality of through holes (7) which are arranged in an equal sequence and have regular hexagonal cross sections.
5. The novel temperature equalization plate structure of claim 1, wherein: the positioning block (4) is a flat cylindrical copper column, and the positioning block (4) and the lower cover plate (1) are of an integrated structure.
6. The novel temperature equalization plate structure of claim 1, wherein: the capillary tissue (6) is a 3D woven or 2D woven metal net, foam metal or metal powder.
7. The novel temperature equalization plate structure of claim 1, wherein: the top surface oxidation of copper foil (8) has generated Al2O3 layer (801), the bottom surface oxidation of aluminium nitride radiator fin (3) has generated Cu2O layer (301), the top surface fixed connection of upper cover plate (2) the bottom surface of copper foil (8), the top surface fixed connection of copper foil (8) the bottom surface of aluminium nitride radiator fin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021646960.2U CN212692637U (en) | 2020-08-10 | 2020-08-10 | Novel temperature equalization plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021646960.2U CN212692637U (en) | 2020-08-10 | 2020-08-10 | Novel temperature equalization plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212692637U true CN212692637U (en) | 2021-03-12 |
Family
ID=74901396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021646960.2U Expired - Fee Related CN212692637U (en) | 2020-08-10 | 2020-08-10 | Novel temperature equalization plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212692637U (en) |
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2020
- 2020-08-10 CN CN202021646960.2U patent/CN212692637U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210312 |