CN212686879U - Semiconductor element suction mechanism with elastic buffer - Google Patents
Semiconductor element suction mechanism with elastic buffer Download PDFInfo
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- CN212686879U CN212686879U CN202021536260.8U CN202021536260U CN212686879U CN 212686879 U CN212686879 U CN 212686879U CN 202021536260 U CN202021536260 U CN 202021536260U CN 212686879 U CN212686879 U CN 212686879U
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- sleeve
- base
- suction nozzle
- elastic buffer
- sliding shaft
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 50
- 230000007246 mechanism Effects 0.000 title claims description 27
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 5
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 230000009471 action Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 208000004350 Strabismus Diseases 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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Abstract
The utility model discloses a semiconductor element suction means with elastic buffer, include: the suction nozzle comprises a suction nozzle base, a sleeve, a connecting piece and a spring, wherein the suction nozzle base comprises a suction nozzle, a base and a sliding shaft which are sequentially connected from bottom to top, and the base is provided with a plurality of guide holes; the sleeve is sleeved on the periphery of the sliding shaft in a hollow shape and is arranged above the base, the sleeve is provided with a plurality of guide posts extending downwards, each guide post is arranged in a corresponding guide hole, and the sleeve limits the up-and-down movement position of the sliding shaft; the connecting piece is combined with the top of the sleeve; and the spring is sleeved on the periphery of the sleeve and is limited between the base and the connecting piece. The utility model has the advantages that the suction nozzle base plate has the buffering effect under the action of the spring and can stably lift in the sleeve during the process of absorbing the semiconductor element.
Description
Technical Field
The utility model belongs to the technical field of a semiconductor element suction means, concretely relates to semiconductor element suction means with elastic buffer.
Background
Fig. 1 and 2 are a perspective view and a cross-sectional view of a semiconductor device pick-up mechanism in the prior art. The conventional suction mechanism includes a nozzle base 11, a sleeve 12, a coupling member 13, and a spring 14. The nozzle base 11 is provided with a shaft 111 inside the sleeve 12, the shaft 111 can move up and down inside the sleeve 12 without being separated, the connecting part 13 is fixed on the top of the sleeve 12, and the spring 14 is located at the periphery of the sleeve 12 and between the nozzle base 11 and the connecting part 13. The outer wall of the sleeve 12 has two concave guide grooves 121, the two guide grooves 121 are disposed at an interval of 180 degrees, the suction nozzle base 11 has two guide posts 112 extending upward, the guide posts 112 are located in the guide grooves 121, when the suction nozzle base 11 is about to suck a semiconductor device and contacts with the semiconductor device, the guide posts 112 move in the guide grooves 121, and the action of the spring 14 makes the suction nozzle base have a buffering effect, thereby preventing the semiconductor device from being damaged.
However, in the operation of the suction mechanism, no matter in the moving or pressing process, the acting force is transmitted to the nozzle base 11 by the sleeve 12, which easily causes the guide post 112 to break, or the guide groove 121 is an arc groove and does not completely fit the shape of the guide post 112, so that the guide post 112 cannot smoothly slide in the guide groove 121, and the suction mechanism is worn excessively and easily fails or is damaged. In addition, only the bottom end of the guide post 112 is partially fixed to the nozzle base 11, which may cause the suction nozzle base to be inclined when the force is too large, so that the absorbed semiconductor device may be inclined due to the angular deviation in the process of putting the semiconductor device into the tape, and the pins of the semiconductor device may be hooked and bent when the tape is put into the tape, thereby damaging the semiconductor device and further reducing the yield or the quality of the product.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor element suction means with elastic buffer mainly is to set up a plurality of guide pillars in the sleeve, and the degree of depth that the guide pillar was inlayed in the sleeve is longer than exposing the district section, so lets intensity increase, borrows this to increase mechanical function's life, reduces the fault rate, also can reduce test in-process semiconductor element's damage.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
in one embodiment, there is provided a semiconductor element suction mechanism with elastic buffer, comprising: the suction nozzle comprises a suction nozzle base, a sleeve, a connecting piece and a spring, wherein the suction nozzle base comprises a suction nozzle, a base and a sliding shaft which are sequentially connected from bottom to top, and the base is provided with a plurality of guide holes; the sleeve is hollow and sleeved on the periphery of the sliding shaft and above the base, the sleeve is provided with a plurality of guide posts extending downwards, each guide post is arranged in a corresponding guide hole, and the sleeve limits the up-and-down movement position of the sliding shaft; the connecting piece is fixed on the top of the sleeve; and the spring is sleeved on the periphery of the sleeve and is limited between the base and the connecting piece.
In a preferred embodiment, a sleeve is disposed around the sliding shaft, a sleeve ring is fixed to the inner wall of the sleeve, the sleeve ring is a porous self-lubricating bearing, and the sleeve ring can slide in the sleeve ring.
As a preferred embodiment, the top lock of the slide shaft is fixed with a baffle plate, and the size of the baffle plate is between the inner diameter and the maximum outer diameter of the sleeve ring to limit the up-and-down movement position of the suction nozzle base.
As a preferred embodiment, the plurality of guide posts are inserted into the sleeve to a greater depth than the exposed section.
As a preferred embodiment, a plurality of guide holes penetrate through the base and are distributed on the periphery of the sliding shaft.
In a preferred embodiment, the suction nozzle is provided with a connector which communicates with the suction nozzle hole through an air supply passage inside the suction nozzle to suck the semiconductor device from the suction nozzle hole.
In a preferred embodiment, the connecting member has a C-shaped clip member, which is locked to the top of the sleeve.
Compared with the prior art, the utility model discloses have following efficiency:
1. the utility model discloses a semiconductor component suction means with elastic buffer, utilize a plurality of guide pillars to move in a plurality of guide holes axial, make the base position correct and can not squint, and the guide pillar inlays the degree of depth in the sleeve long, and the intensity increases and avoids the fracture, in order to lengthen life;
2. the semiconductor element suction mechanism with the elastic buffer of the utility model has at least three guide columns, which are stable when moving, and the base is not easy to incline if one is broken, so that the semiconductor element is prevented from being damaged when being placed;
3. the utility model discloses a semiconductor component suction means with elastic buffer, the impact force of absorbing the semiconductor component can be reduced, avoid damaging the semiconductor component;
4. the semiconductor element suction mechanism with elastic buffer of the utility model is provided with the shaft sleeve at the periphery of the sliding shaft, and the shaft sleeve is a self-lubricating bearing, which is beneficial to the shaft sleeve to slide in the sleeve ring, so that the sliding is more stable and smooth and the service life can be prolonged;
5. the utility model discloses a semiconductor component suction means with elastic buffer, mechanism's long service life, the fault rate is low, promotes the output (UPH, units per hour) of per hour relatively, increases the profit of using the firm.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a cross-sectional view of a conventional semiconductor device pick-up mechanism;
FIG. 2 is a perspective view of a socket and a nozzle base of a conventional semiconductor device pick-up mechanism;
fig. 3 is a perspective view of a semiconductor device sucking mechanism with elastic buffer according to an embodiment of the present invention;
fig. 4 is an isolated view of a semiconductor device pick-up mechanism with elastic buffer according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a semiconductor device pick-up mechanism with elastic buffer according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of the semiconductor device pick-up mechanism with elastic buffer according to an embodiment of the present invention.
The reference numbers illustrate:
11, a suction nozzle base; 111: a shaft member; 112, a guide post; 12, a sleeve; 121, a guide groove; 13, connecting pieces; 14, a spring;
2, a suction nozzle base; 21, a suction nozzle; 211, a joint; 212, an air passage; 213, a nozzle hole; 22, a base; 221, a guide hole; 23, a sliding shaft; 231, a shaft sleeve;
3, a sleeve; 31, a guide pillar; 32, a bonding section; 33, a lantern ring;
4, connecting pieces; 41, a C-shaped clamp fastener;
5, a spring;
and 6, a semiconductor element.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. However, the present invention is not limited to the embodiments, and the structural, method, or functional changes made by those skilled in the art according to the embodiments are all included in the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Fig. 3 and 4 are perspective and exploded views of a semiconductor device sucking mechanism with elastic buffer according to an embodiment of the present invention. The semiconductor element sucking mechanism with the elastic buffer of the embodiment comprises: nozzle base 2, sleeve 3, connecting piece 4 and spring 5. The nozzle base 2 is partially located in the sleeve 3, and the sleeve 3 is provided with a plurality of guide posts 31 facing downward, so that the nozzle base 2 can move up and down at the sleeve 3 but cannot be separated. The connecting piece 4 is fixed on the top of the sleeve 3; the spring 5 is sleeved on the periphery of the sleeve 3 and is limited between the suction nozzle base 2 and the connecting piece 4. Therefore, the suction mechanism has a buffering effect when sucking the semiconductor element, and has the advantages of long service life and low failure rate.
The structure of each component will be described in detail as follows:
the suction nozzle base 2 includes a suction nozzle 21, a base 22, and a slide shaft 23 connected in this order from the bottom up. The suction nozzle 21 is used for sucking the semiconductor element, the suction nozzle 21 is provided with a connector 211, and the connector 211 is used for communicating with an external air supply device. As shown in fig. 5, the suction nozzle 21 has an air supply passage 212 communicating with the nozzle hole 213, and sucks the semiconductor device through the nozzle hole 213. The base 22 has a plurality of guide holes 221, in the embodiment, the number of the guide holes 221 is at least three, and the guide holes penetrate through the base 22 and are distributed on the periphery of the sliding shaft 22. The slide shaft 23 is a shaft member standing on top of the base 22.
In the present embodiment, the sleeve 3 is a hollow metal cylinder, and is provided with a plurality of guide posts 31 extending downward, a portion of the guide posts 31 is embedded in the sleeve 3, and the length of the guide posts 31 embedded in the sleeve 3 is greater than the exposed section, so as to increase the strength of the guide posts 31 and prolong the service life thereof. During assembly, each guide post 31 is inserted into the corresponding guide hole 221, so that the base 22 moves up and down more smoothly. In addition, in the embodiment, at least three guide posts 31 are adopted, so that the service life is long, if one guide post 31 is broken during use, the other two guide posts can still maintain the base 22 to be horizontal without deviation, damage during subsequent placement of the semiconductor element is avoided, and the mode also enables an operator to find a problem and remove a fault in a long time. In addition, the top periphery of the sleeve 3 is further provided with a joint section 32 with a smaller outer diameter.
In the present embodiment, the structures of the nozzle 21, the base 22, the slide shaft 23, the guide hole 221, the air passage 212, and the nozzle hole 213 of the nozzle base 2 can be formed by machining. In order to increase the moving smoothness of the sliding shaft 23, in the embodiment, a sleeve 231 is disposed on the periphery of the sliding shaft 23, and the sleeve 231 can be a self-lubricating bearing, which is a porous bearing soaked with lubricating oil and made of powder metallurgy. The lantern ring 33 is fixed on the inner wall of the sleeve 3, and the shaft sleeve 231 moves in the lantern ring 33, so that the moving process is more stable and smooth, the service life is long, and the failure rate is low.
To prevent the slide shaft 23 from being separated from the collar 33, in the present embodiment, the slide shaft 23 can be fixed to the top lock by a screw 232 with a stopper 233. The stop 233 is sized between the inner diameter and the maximum outer diameter of the collar 33, thereby limiting the up-and-down movement of the slide shaft 23 in the sleeve 3 (as shown in fig. 5).
The connecting piece 4 is used for connecting with the mechanical equipment end to drive the whole sucking mechanism to move, so that the shape of the top of the connecting piece 4 is matched with the shape of the mechanical equipment end. The connecting piece 4 is a connecting section 32 combined with the top of the sleeve 3, and the other purpose is to prevent the spring 5 from being separated, and the connecting piece is used for having elastic buffer effect during actuation. In this embodiment, the connecting member 4 has a C-shaped clip 41, and the C-shaped clip 41 is locked to the connecting section 33. The spring 4 is sleeved on the periphery of the sleeve 3, and two ends of the spring are respectively propped against the base 22 and the C-shaped clamping piece 41, so that a gap is formed between the sleeve 3 and the base 22 under the condition of no external force, and the gap is a distance that the suction nozzle base 2 can rise.
As shown in fig. 6, is a schematic view of the practical use of the present invention. When the pick-and-place mechanism descends, the suction nozzle hole 213 of the suction nozzle 21 contacts with the semiconductor element 6, and achieves a proper buffer effect due to the ascending relationship of the spring 5 and the suction nozzle base 2, and further, because the plurality of guide posts 31 completely match with the plurality of guide holes 221, the movement is more stable and smooth, and because the section of the guide post 31 embedded in the sleeve 3 is longer than the exposed section, the strength is increased, the breakage is not easy, the service life of the product is greatly prolonged, and the failure rate is reduced. The plurality of designs can also avoid the fracture of the single guide post 31, so that the base 22 is inclined, and the situation that the semiconductor element 6 is damaged in the taking and placing process is caused, therefore, the design of the utility model can improve the yield of taking and placing the semiconductor element 6.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A semiconductor component pickup mechanism having an elastic buffer, comprising:
the suction nozzle base comprises a suction nozzle, a base and a sliding shaft which are sequentially connected from bottom to top, and the base is provided with a plurality of guide holes;
the sleeve is sleeved on the periphery of the sliding shaft in a hollow shape and is arranged above the base, the sleeve is provided with a plurality of guide posts extending downwards, each guide post is arranged in the corresponding guide hole, and the sleeve limits the up-and-down movement position of the sliding shaft;
the connecting piece is combined with the top of the sleeve; and
a spring, which is sleeved on the periphery of the sleeve and is limited between the base and the connecting piece.
2. The semiconductor component suction device with elastic buffer as claimed in claim 1, wherein a sleeve is disposed around the sliding shaft, a collar is fixed to an inner wall of the sleeve, the sleeve is a porous self-lubricating bearing, and the sleeve can slide in the collar.
3. The semiconductor component suction mechanism with elastic buffer as claimed in claim 2, wherein the top lock of the sliding shaft fixes a stop piece, the size of the stop piece is between the inner diameter and the maximum outer diameter of the collar, and the stop piece limits the up-and-down moving position of the nozzle base.
4. The semiconductor device pick-up mechanism with elastic buffer as claimed in claim 1, wherein the plurality of guide posts are embedded in the sleeve to a depth longer than the exposed section.
5. The semiconductor device pick-up mechanism with elastic buffer as claimed in claim 1, wherein said plurality of guiding holes penetrate through said base and are distributed around said slide shaft.
6. The semiconductor component suction mechanism with elastic buffer according to claim 1, wherein said suction nozzle is provided with a connector which communicates with a suction nozzle hole through an air supply passage inside said suction nozzle, and a semiconductor component is sucked by said suction nozzle hole.
7. The semiconductor component pick-up mechanism with elastic buffer as claimed in claim 1, wherein the connecting member is provided with a C-shaped clip fastened to the top of the sleeve by the C-shaped clip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021536260.8U CN212686879U (en) | 2020-07-29 | 2020-07-29 | Semiconductor element suction mechanism with elastic buffer |
| TW109209880U TWM612474U (en) | 2020-07-29 | 2020-07-31 | Semiconductor component suction mechanism with elastic buffering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021536260.8U CN212686879U (en) | 2020-07-29 | 2020-07-29 | Semiconductor element suction mechanism with elastic buffer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212686879U true CN212686879U (en) | 2021-03-12 |
Family
ID=74901515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021536260.8U Active CN212686879U (en) | 2020-07-29 | 2020-07-29 | Semiconductor element suction mechanism with elastic buffer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN212686879U (en) |
| TW (1) | TWM612474U (en) |
-
2020
- 2020-07-29 CN CN202021536260.8U patent/CN212686879U/en active Active
- 2020-07-31 TW TW109209880U patent/TWM612474U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWM612474U (en) | 2021-06-01 |
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