CN212676246U

CN212676246U - Semiconductor chip packaging structure

Info

Publication number: CN212676246U
Application number: CN202021559764.1U
Authority: CN
Inventors: 蔡绍锋
Original assignee: Chengdu Xinyi Technology Co ltd
Current assignee: Chengdu Xinyi Technology Co ltd
Priority date: 2020-07-31
Filing date: 2020-07-31
Publication date: 2021-03-09
Anticipated expiration: 2030-07-31

Abstract

The utility model discloses a semiconductor chip packaging structure, comprising a base plate, the top swing joint of bottom plate has the chip body, the equal fixedly connected with fixed plate in front end and the rear end of chip body both sides, the mounting groove has all been seted up all around at bottom plate top, the surperficial swing joint of fixed plate has the dead lever, the bottom of dead lever extends to the inner chamber of mounting groove, the dead lever is located the one end of mounting groove inner chamber and has seted up the fixed orifices, one side fixedly connected with slide bar of mounting groove inner chamber. The utility model discloses a pulling pull rod, pull rod drive sliding sleeve break away from the inner chamber of fixed orifices to the sliding sleeve drives the side motion of sliding rod, and the sliding sleeve breaks away from the inner chamber of fixed orifices in the motion to remove the fixed to the dead lever, conveniently dismantle the chip body, solved traditional semiconductor chip and generally fixed through the welding, this just causes inconveniently for the dismantlement in later stage, thereby changes the problem that the work caused the puzzlement for the maintenance.

Description

Semiconductor chip packaging structure

Technical Field

The utility model relates to the field of semiconductor technology, specifically a semiconductor chip packaging structure.

Background

The semiconductor is a material with the electric conductivity between the conductor and the insulator at normal temperature, has wide application in radio, television and temperature measurement, for example, diodes are devices fabricated using semiconductors, which refers to materials with controllable conductivity, ranging from insulators to conductors, and the importance of semiconductors is enormous from the viewpoint of technological or economic development, and most of the electronic products today, such as computers, displays, mobile phones or digital recorders, in which the core unit is closely related to the semiconductor, the application area is also expanding with the development of high brightness and multi-color of the light emitting diode, and the conventional semiconductor chip is generally fixed by soldering, which causes inconvenience in the later disassembly and thus troubles in the maintenance and replacement work.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor chip packaging structure possesses the advantage of being convenient for to fix, has solved traditional semiconductor chip and generally has fixed through the welding, and this dismantlement just for the later stage causes inconveniently to change the problem that the work caused the puzzlement for the maintenance.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor chip packaging structure, includes the bottom plate, the top swing joint of bottom plate has the chip body, the equal fixedly connected with fixed plate in front end and the rear end of chip body both sides, the mounting groove has all been seted up all around at bottom plate top, the surperficial swing joint of fixed plate has the dead lever, the bottom of dead lever extends to the inner chamber of mounting groove, the fixed orifices has been seted up to the one end that the dead lever is located the mounting groove inner chamber, one side fixedly connected with slide bar of mounting groove inner chamber, the sliding surface of slide bar is connected with the sliding sleeve, the sliding sleeve extends to the inner chamber of.

Preferably, the top of the mounting groove is provided with a limiting sliding hole, an inner cavity of the limiting sliding hole is connected with a pull rod in a sliding manner, and the bottom of the pull rod is fixedly connected with the sliding sleeve.

Preferably, a positioning groove is formed in one side of the inner cavity of the mounting groove, and one end of the sliding sleeve extends to the inner cavity of the positioning groove.

Preferably, the top and the bottom of the slide bar are both provided with movable grooves, and the inner cavity of the slide bar is fixedly connected with a return spring.

Preferably, the inner cavity of the sliding sleeve is fixedly connected with a baffle plate, the baffle plate is positioned in the inner cavity of the movable groove, and one side of the reset spring, which is far away from the inner wall of the sliding rod, is fixedly connected with the baffle plate.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a pulling pull rod, pull rod drive sliding sleeve break away from the inner chamber of fixed orifices to the sliding sleeve drives the side motion of sliding rod, and the sliding sleeve breaks away from the inner chamber of fixed orifices in the motion to remove the fixed to the dead lever, conveniently dismantle the chip body, solved traditional semiconductor chip and generally fixed through the welding, this just causes inconveniently for the dismantlement in later stage, thereby changes the problem that the work caused the puzzlement for the maintenance.

2. The utility model discloses a set up spacing slide opening and pull rod, played the effect of being convenient for stimulate the sliding sleeve, through setting up reset spring, baffle and movable groove, played the effect that makes things convenient for the sliding sleeve to reset.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic side view of the bottom plate of the present invention;

fig. 3 is a schematic view of the cross-sectional structure of the sliding sleeve of the present invention.

In the figure: 1. a base plate; 2. a chip body; 3. a fixing plate; 4. mounting grooves; 5. fixing the rod; 6. a fixing hole; 7. a slide bar; 8. a sliding sleeve; 9. a limiting slide hole; 10. a pull rod; 11. positioning a groove; 12. a return spring; 13. a baffle plate; 14. a movable groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model discloses a bottom plate 1, chip body 2, fixed plate 3, mounting groove 4, dead lever 5, fixed orifices 6, slide bar 7, sliding sleeve 8, spacing slide opening 9, pull rod 10, constant head tank 11, reset spring 12, baffle 13 and activity groove 14 part are the parts that general standard spare or technical personnel in the field know, and its structure and principle all are that this technical personnel all can learn through the technical manual or learn through conventional experimental method.

Referring to fig. 1-3, a semiconductor chip package structure includes a base plate 1, a chip body 2 movably connected to the top of the base plate 1, fixing plates 3 fixedly connected to the front and rear ends of the chip body 2, mounting grooves 4 formed around the top of the base plate 1, fixing rods 5 movably connected to the surface of the fixing plates 3, the bottoms of the fixing rods 5 extending to the inner cavity of the mounting grooves 4, fixing holes 6 formed at the ends of the fixing rods 5 located in the inner cavity of the mounting grooves 4, slide bars 7 fixedly connected to one side of the inner cavity of the mounting grooves 4, movable grooves 14 formed at the top and bottom of the slide bars 7, return springs 12 fixedly connected to the inner cavity of the slide bars 7, sliding sleeves 8 slidably connected to the surface of the slide bars 7, the sliding sleeves 8 extending to the inner cavity of the fixing holes 6, limit slide holes 9 formed at the top of the mounting grooves 4, and, bottom and sliding sleeve 8 fixed connection of pull rod 10, constant head tank 11 has been seted up to one side of the 4 inner chambers of mounting groove, sliding sleeve 8's one end extends to the inner chamber of constant head tank 11, sliding sleeve 8's inner chamber fixedly connected with baffle 13, baffle 13 is located the inner chamber of activity groove 14, and reset spring 12 keeps away from one side and baffle 13 fixed connection of slide bar 7 inner wall, through pulling pull rod 10, pull rod 10 drives sliding sleeve 8 to slide bar 7's one side motion, sliding sleeve 8 breaks away from the inner chamber of fixed orifices 6 when the motion, thereby relieve the fixed to dead lever 5, conveniently dismantle chip body 2, it generally fixes through the welding to have solved traditional semiconductor chip, this just causes inconveniently for the dismantlement in later stage, thereby cause the problem of puzzlement for maintenance change work.

During the use, through pulling pull rod 10, pull rod 10 drives sliding sleeve 8 and breaks away from the inner chamber of fixed orifices 6 to one side motion of slide bar 7, sliding sleeve 8 in the motion to remove the fixed to dead lever 5, conveniently dismantle chip body 2, it is generally fixed through the welding to have solved traditional semiconductor chip, this dismantlement that just gives the later stage causes inconveniently, thereby the problem that causes the puzzlement for maintenance change work.

The standard parts used in the present application document can be purchased from the market, and can be customized according to the description of the specification and the accompanying drawings, the specific connection mode of each part adopts the conventional means of mature bolt, rivet, welding and the like in the prior art, the machines, parts and equipment adopt the conventional models in the prior art, the control mode is automatically controlled by a controller, the control circuit of the controller can be realized by simple programming of technicians in the field, the control circuit belongs to the common knowledge in the field, and the present application document is mainly used for protecting mechanical devices, so the control mode and the circuit connection are not explained in detail in the present application.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging structure comprises a bottom plate (1), and is characterized in that: the utility model discloses a chip mounting structure, including bottom plate (1), the top swing joint of bottom plate (1) has chip body (2), the equal fixedly connected with fixed plate (3) in front end and the rear end of chip body (2) both sides, mounting groove (4) have all been seted up all around at bottom plate (1) top, the surperficial swing joint of fixed plate (3) has dead lever (5), the bottom of dead lever (5) extends to the inner chamber of mounting groove (4), fixed orifices (6) have been seted up to the one end that dead lever (5) are located mounting groove (4) inner chamber, one side fixedly connected with slide bar (7) of mounting groove (4) inner chamber, the sliding surface of slide bar (7) is connected with sliding sleeve (8), sliding sleeve (8.

2. The semiconductor chip package structure of claim 1, wherein: spacing slide opening (9) have been seted up at the top of mounting groove (4), the inner chamber sliding connection of spacing slide opening (9) has pull rod (10), the bottom and sliding sleeve (8) fixed connection of pull rod (10).

3. The semiconductor chip package structure of claim 1, wherein: the mounting groove is characterized in that a positioning groove (11) is formed in one side of the inner cavity of the mounting groove (4), and one end of the sliding sleeve (8) extends to the inner cavity of the positioning groove (11).

4. The semiconductor chip package structure of claim 1, wherein: the top and the bottom of the sliding rod (7) are both provided with movable grooves (14), and an inner cavity of the sliding rod (7) is fixedly connected with a return spring (12).

5. The semiconductor chip package structure of claim 1, wherein: the inner cavity of the sliding sleeve (8) is fixedly connected with a baffle (13), the baffle (13) is positioned in the inner cavity of the movable groove (14), and one side, away from the inner wall of the sliding rod (7), of the reset spring (12) is fixedly connected with the baffle (13).