CN212676227U - Material frame intercepting device for silicon wafer cleaning machine - Google Patents
Material frame intercepting device for silicon wafer cleaning machine Download PDFInfo
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- CN212676227U CN212676227U CN202021423937.7U CN202021423937U CN212676227U CN 212676227 U CN212676227 U CN 212676227U CN 202021423937 U CN202021423937 U CN 202021423937U CN 212676227 U CN212676227 U CN 212676227U
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- material frame
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- silicon wafer
- interception
- cleaning machine
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Abstract
A material frame intercepting device for a silicon wafer cleaning machine relates to the technical field of silicon wafer cleaning, two intercepting bases are installed at the front end of a conveying belt of the silicon wafer cleaning machine, an intercepting bar is arranged above each intercepting base, the two intercepting bases and the intercepting bar form a door shape, the height and the width of the inner side of each door are ensured to be capable of passing through a material frame, and intercepting grooves of material frame handles which can just pass through are formed in the inner sides of the two intercepting bases. The utility model has the advantages that: the basket turning accident caused by the fact that the handle or the frame body of the material frame is deformed and the lifting hook of the mechanical arm cannot accurately lift the handle of the material frame is avoided, and normal and safe production is guaranteed.
Description
Technical Field
The utility model relates to a photovoltaic production technical field, further be the silicon chip cleaning technology, especially the interception protection system of silicon chip cleaning machine material loading end.
Background
In the technical field of silicon wafer cleaning production, silicon wafers to be cleaned after being sliced need to be inserted into a flower basket, the silicon wafers loaded into the flower basket are placed in a material frame and enter a material loading end of an automatic silicon wafer cleaning machine, the material frame at the material loading end is conveyed into the automatic silicon wafer cleaning machine through a conveying belt to be cleaned, and silicon powder and the like on the surfaces of the silicon wafers are cleaned.
The silicon wafers are loaded through the flower basket and then cleaned and transferred in the material frame, and the material frame is sequentially cleaned through the ultrasonic cleaning, the silicon wafer cleaning agent cleaning, the overflowing and other grooves from the first groove of the cleaning machine by the mechanical arm in the automatic silicon wafer cleaning machine through the lifting hook. The defects of the prior art are that the handles or the frame body of the material frame are deformed, the lifting hooks of the mechanical arm cannot accurately lift the handles on the two sides of the material frame, the basket is turned over in the automatic operation process, normal and safe production cannot be guaranteed, and the silicon wafer is turned out of the basket to form serious accidents of hidden cracks, collapse defects, silicon falling and even directly causing fragments of the silicon wafer, so that the silicon wafer is degraded or scrapped, and great economic loss and potential safety hazards are formed.
Under the existing situation, each silicon wafer is calculated according to 2.5 yuan, each frame of silicon wafer is calculated according to 450 wafers, the loss of more than 1000 yuan is caused by basket turning each time, a large number of material frames are deformed more or less due to frequent use or turnover operation and the like in the production process, and under the industrial background that the cost pressure is increased day by day, the frequent basket turning causes larger cost burden to companies.
Therefore, research is needed to effectively solve the technical problems of the conventional methods.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a silicon chip cleaning machine is with material frame intercepting device, it can avoid effectively turning over the emergence of basket accident.
The utility model discloses a specific embodiment as follows:
silicon chip cleaning machine material frame intercepting device, its characterized in that: the two interception bases are installed at the front end of a conveying belt of the silicon wafer cleaning machine, an interception bar is arranged above the interception base, the two interception bases and the interception bar form a door shape, the height and the width of the inner side of the door are ensured to be capable of passing through a material frame, and interception grooves of a material frame handle which can just pass through are formed in the inner sides of the two interception bases.
Further:
the length of the interception groove is 70mm, the height of the interception groove is 20mm, and the width of the interception groove is 20 mm.
And the intercepting bar is provided with a plurality of spray headers.
The utility model has the advantages that: the material frame intercepting device is additionally arranged at the feeding end of the silicon wafer cleaning machine, so that the phenomenon that the lifting hook of the mechanical arm cannot accurately lift the material frame due to deformation of a handle or a material frame body of the material frame, and a basket turning accident is caused is avoided, and normal and safe production is guaranteed. Meanwhile, the silicon wafer is pre-cleaned once, so that the silicon cleaning effect is effectively improved, and the economic loss caused by back washing of dirty wafers is reduced.
In order to make the relevant constructors understand the scheme of the utility model better and make the above-mentioned objects, features and advantages of the utility model can be more clearly understood, it is right to combine the embodiment to make further detailed description of the utility model.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: 1 is a material frame, 2 is a material frame handle, 3 is an interception bar, 4 is an interception base, and 5 is an interception groove.
Detailed Description
As shown in figure 1, the material frame intercepting device for the silicon wafer cleaning machine is characterized in that two intercepting bases 4 are installed at the front end of a conveying belt of the silicon wafer cleaning machine and are parallel to a rail, an intercepting bar 3 is arranged above each intercepting base 4, the two intercepting bases 4 and the intercepting bar 3 form a door shape, the height and the width of the inner side of the door are ensured to be capable of passing through a material frame 1 (not containing a material frame handle 2), and intercepting grooves 5 of the material frame handle 2 which can just pass through are formed in the inner sides of the two intercepting bases 4.
The material frame 1 placed on the flower basket for loading the silicon wafers is placed on a conveyor belt of the silicon wafer cleaning machine, and when the material frame 1 passes through the interception groove 5 of the interception device, the material frame handle 2 just passes through the interception groove 5. 8-10 spray headers are installed on the intercepting bar 3, so that the silicon wafer is pre-cleaned once through spraying on the intercepting bar 3, meanwhile, if deformation exists in the material frame handle 2 or the material frame 1 is deformed, the material frame cannot pass through the intercepting device, and the material frame 1 which cannot pass through is taken out by an operator, so that the problem that the deformed material frame handle 2 cannot be accurately lifted by a lifting hook of a mechanical arm during the automatic operation of the cleaning machine due to the deformation of the material frame handle 2 is avoided, and the phenomenon that the silicon wafer in the flower basket turns over out of the flower basket due to the basket turning accident of the material frame 1 caused by the fact that the deformed material frame handle 2 cannot be accurately lifted is avoided, so that the silicon wafer is hidden and cracked, silicon falls and even directly causes fragments, and the silicon wafer is sprayed during passing through, and is pre-cleaned once, so that the silicon cleaning effect is effectively.
A plurality of spraying holes are formed in the intercepting rod of the material frame intercepting device.
The material frame intercepting device is made of stainless steel.
The intercepting groove of the material frame intercepting device is 70mm long, 20mm high and 20mm wide.
When the lifting hook is used, the material frame 1 of the material frame intercepting device enters the next procedure, namely the lifting hook of the mechanical arm is accurately lifted; the material frame 1 which does not pass through the material frame intercepting device is picked up.
In summary, the present invention is only a specific embodiment, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention.
Claims (3)
1. Silicon chip cleaning machine material frame intercepting device, its characterized in that: the two interception bases are installed at the front end of a conveying belt of the silicon wafer cleaning machine, an interception bar is arranged above the interception base, the two interception bases and the interception bar form a door shape, the height and the width of the inner side of the door are ensured to be capable of passing through a material frame, and interception grooves of a material frame handle which can just pass through are formed in the inner sides of the two interception bases.
2. The material frame intercepting device for the silicon wafer cleaning machine according to claim 1, wherein: the length of the interception groove is 70mm, the height of the interception groove is 20mm, and the width of the interception groove is 20 mm.
3. The material frame intercepting device for the silicon wafer cleaning machine according to claim 1, wherein: and the intercepting bar is provided with a plurality of spray headers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021423937.7U CN212676227U (en) | 2020-07-20 | 2020-07-20 | Material frame intercepting device for silicon wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021423937.7U CN212676227U (en) | 2020-07-20 | 2020-07-20 | Material frame intercepting device for silicon wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212676227U true CN212676227U (en) | 2021-03-09 |
Family
ID=74816101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021423937.7U Active CN212676227U (en) | 2020-07-20 | 2020-07-20 | Material frame intercepting device for silicon wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212676227U (en) |
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2020
- 2020-07-20 CN CN202021423937.7U patent/CN212676227U/en active Active
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