CN212659821U - Semiconductor laser - Google Patents

Semiconductor laser Download PDF

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Publication number
CN212659821U
CN212659821U CN201922268298.5U CN201922268298U CN212659821U CN 212659821 U CN212659821 U CN 212659821U CN 201922268298 U CN201922268298 U CN 201922268298U CN 212659821 U CN212659821 U CN 212659821U
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CN
China
Prior art keywords
fixedly connected
grooves
semiconductor laser
laser
clamping
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201922268298.5U
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Chinese (zh)
Inventor
樊桂英
柳超龙
杜治国
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Wuhan Wanxutong Technology Co ltd
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Wuhan Wanxutong Technology Co ltd
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Priority to CN201922268298.5U priority Critical patent/CN212659821U/en
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Publication of CN212659821U publication Critical patent/CN212659821U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a semiconductor laser technical field just discloses a semiconductor laser, including the laser body, the top fixedly connected with radiator fan of laser body, the right side fixedly connected with apron of laser body, quantity is two first spout, two is seted up on the right side of apron the inside equal sliding connection of first spout has one end to extend to the slider in the apron outside, two one side that the slider is relative all with receiver fixed connection. This semiconductor laser, through being provided with the rectangular hole in the bobbin, put into the rectangular hole with the connector of power cord one end, the power cord is worn out from a U-shaped groove, then with the even winding of power cord in the space between two separation blades on the bobbin, the power cord can put into the rectangular hole with the connector of the other end through another U-shaped groove, can be in the same place receiver and laser body swing joint, realized the purpose that the power cord was convenient for accomodate.

Description

Semiconductor laser
Technical Field
The utility model relates to a semiconductor laser technical field specifically is a semiconductor laser.
Background
The semiconductor laser is also called laser diode, it is a laser using semiconductor material as working substance, because of the difference of substance structure, the commonly used working substance is gallium arsenide, cadmium sulfide, indium phosphide and zinc sulfide, the excitation mode includes three modes of electric injection, electronic beam excitation and optical pumping, the semiconductor laser device can be divided into several kinds of homojunction, single heterojunction and double heterojunction, the homojunction laser and single heterojunction laser are mostly pulse devices at room temperature, and the double heterojunction laser can implement continuous operation at room temperature.
The semiconductor laser is the most practical and important laser, has small volume and long service life, can adopt a simple current injection mode to pump the working voltage and current of the laser to be compatible with an integrated circuit, and the power line used on the semiconductor laser is longer, easy to wind and inconvenient to use and store, so the semiconductor laser is provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a semiconductor laser possesses advantages such as being convenient for accomodate, has solved the longer easy winding of power cord and the not convenient to use of the last power cord of using of semiconductor laser and the problem of accomodating.
(II) technical scheme
For the purpose of realizing above-mentioned be convenient for accomodate, the utility model provides a following technical scheme: a semiconductor laser comprises a laser body, wherein the top of the laser body is fixedly connected with a cooling fan, the right side of the laser body is fixedly connected with a cover plate, the right side of the cover plate is provided with two first sliding grooves, the insides of the two first sliding grooves are respectively and slidably connected with a sliding block, one end of the sliding block extends to the outer side of the cover plate, one opposite side of the two sliding blocks is respectively and fixedly connected with a storage box, the bottom of the laser body is fixedly connected with a cooling block, the bottom of the cooling block is provided with two second sliding grooves, the right side wall of an inner cavity of the storage box is provided with two first grooves, the insides of the two first grooves are respectively clamped with a clamping block, one end of the clamping block extends to the left side of the first grooves, the left sides of the two clamping blocks are respectively and fixedly connected with a winding frame, and the insides of the storage, two the equal swing joint in inside of second recess has one end to run through the second recess and extend to the inside bayonet lock of fixture block, two the equal fixedly connected with in the outside of bayonet lock is located the inside stopper of second recess, two the equal fixedly connected with one end in one side that the stopper was carried on the back mutually and second recess fixed connection and lie in the compression spring in the bayonet lock outside, two the equal fixedly connected with one end in one side that the bayonet lock was carried on the back mutually runs through compression spring and extends to the outside stay cord of receiver, two the equal fixedly connected with pull ring of one end of bayonet lock is kept away from to the stay cord, the inside threaded connection of receiver has one end to extend to the callus.
Preferably, the bobbin is rectangle, and the rectangular hole has been seted up on the bobbin left side, and the rear side of bobbin is opened and is equipped with quantity be two and with the U-shaped groove of rectangular hole intercommunication, the equal fixedly connected with quantity in top and the bottom of bobbin be nine separation blades, the separation blade is the staggered distribution.
Preferably, the left side of receiver is the opening design, and the thread groove that is located the callus on the sole outside is seted up on the right side of receiver.
Preferably, two the groove of stepping down has all been seted up to the inner chamber right side wall of second spout, and the width in groove of stepping down is greater than the width of slider.
Preferably, two the fixture block is the rectangle post, two the fixture block is all seted up on one side that backs on the back and is located the outside draw-in groove of bayonet lock, two the left side of bayonet lock is the inclined plane design, two the hole of stepping down that is located the stay cord outside is all seted up on one side that the second recess backs on the back.
Preferably, the number of the foot pads is four, and the two foot pads are arranged on the upper portion and the two foot pads are symmetrically distributed on the lower portion.
Advantageous effects
Compared with the prior art, the utility model provides a semiconductor laser possesses following beneficial effect:
1. the semiconductor laser device comprises a rectangular hole arranged in a winding frame, a connector at one end of a power line is placed into the rectangular hole, the power line penetrates out of a U-shaped groove, the power line is uniformly wound in a gap between two separation blades on the winding frame, the connector at the other end of the power line can be placed into the rectangular hole through the other U-shaped groove, a clamping block on the winding frame is inserted into a first groove, the clamping block extrudes a clamping pin when the clamping block is inserted, a limiting block on the clamping pin can extrude a compression spring, the compression spring drives the clamping pin and the limiting block to move reversely after being stressed, when the clamping pin is aligned with a clamping groove on the clamping block, the clamping pin and the limiting block are reset by the compression spring, the clamping pin is clamped into the clamping groove, the winding frame wound with the power line is clamped into a containing box, an upper sliding block of the containing, the purpose that the power cord is convenient for accomodate has been realized.
2. This semiconductor laser, when using the laser instrument body, with receiver and laser instrument body separation, the pulling pull ring, the pull ring is through stay cord pulling bayonet lock and stopper, stopper extrusion compression spring, shrink behind the compression spring atress, the bayonet lock breaks away from the draw-in groove on the fixture block, power cord on bobbin and the bobbin can be taken out, then with the second spout on the slider cunning the radiating block on the receiver, can regard the base of receiver as the laser instrument body to use, adjust the height of callus on the sole simultaneously, the angle of shining of the laser of adjustable laser instrument body transmission, the purpose of being convenient for to adjust has been realized.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front sectional view of the storage box of the present invention;
FIG. 3 is an enlarged view of the point A in FIG. 2 according to the present invention;
FIG. 4 is a front sectional view of the first chute of the present invention;
fig. 5 is a top view of the heat dissipation block of the present invention.
In the figure: 1 laser instrument body, 2 radiator fan, 3 apron, 4 first spouts, 5 sliders, 6 receivers, 7 radiating blocks, 8 second spouts, 9 first recesses, 10 fixture blocks, 11 bobbins, 12 second recesses, 13 bayonet locks, 14 stopper, 15 compression spring, 16 stay cords, 17 pull rings, 18 callus on the sole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, a semiconductor laser comprises a laser body 1, a heat dissipation fan 2 is fixedly connected to the top of the laser body 1, a cover plate 3 is fixedly connected to the right side of the laser body 1, two first sliding grooves 4 are formed in the right side of the cover plate 3, two sliding blocks 5 with one ends extending to the outer side of the cover plate 3 are slidably connected to the inner portions of the two first sliding grooves 4, one opposite sides of the two sliding blocks 5 are fixedly connected to a storage box 6, when the laser body 1 is used, the storage box 6 is separated from the laser body 1, a pull ring 17 is pulled, the pull ring 17 pulls a bayonet lock 13 and a limiting block 14 through a pull rope 16, the limiting block 14 extrudes a compression spring 15, the compression spring 15 contracts after being stressed, the bayonet lock 13 is separated from the bayonet lock groove on the bayonet lock 10, a power line on a winding frame 11 and the winding frame 11 can be taken out, and then the sliding blocks, the storage box 6 can be used as a base of the laser body 1, the height of the foot pad 18 can be adjusted at the same time, the irradiation angle of laser emitted by the laser body 1 can be adjusted, and the purpose of convenient adjustment is achieved, the bottom of the laser body 1 is fixedly connected with the heat dissipation block 7, the bottom of the heat dissipation block 7 is provided with two second sliding grooves 8, the right side walls of the inner cavities of the two second sliding grooves 8 are respectively provided with a abdicating groove, the width of the abdicating groove is larger than that of the sliding block 5, the right side wall of the inner cavity of the storage box 6 is provided with two first grooves 9, the insides of the two first grooves 9 are respectively clamped with a clamping block 10, one end of each clamping block 10 extends to the left side of the first groove 9, the two clamping blocks 10 are rectangular columns, one side of the two clamping blocks 10 opposite to each other is provided with a clamping groove positioned outside the clamping pin 13, the left sides of the two clamping pins, the left sides of the two clamping blocks 10 are fixedly connected with the winding frame 11, the winding frame 11 is rectangular, the left side of the winding frame 11 is provided with a rectangular hole, the rear side of the winding frame 11 is provided with two U-shaped grooves which are communicated with the rectangular hole, the top and the bottom of the winding frame 11 are fixedly connected with nine blocking pieces, the blocking pieces are distributed in a staggered manner, the storage box 6 is internally provided with two second grooves 12, the two second grooves 12 are internally movably connected with two clamping pins 13, one ends of the clamping pins penetrate through the second grooves 12 and extend to the inside of the clamping blocks 10, the outer sides of the two clamping pins 13 are fixedly connected with limiting blocks 14 which are positioned inside the second grooves 12, one sides of the two limiting blocks 14, which are opposite to each other, are fixedly connected with compression springs 15, one ends of the compression springs 15 penetrate through the compression springs and extend to the outside of the storage box 6, one ends of two pull ropes 16 far away from the bayonet lock 13 are fixedly connected with pull rings 17, the inner threads of the storage box 6 are connected with foot pads 18, one ends of the foot pads 18 extend to the right side of the storage box 6, the number of the foot pads 18 is four, the upper two foot pads 18 and the lower two foot pads 18 are symmetrically distributed in the front-back direction, a rectangular hole is formed in the winding frame 11, a connector at one end of a power line is placed into the rectangular hole, the power line penetrates out of a U-shaped groove, the power line is uniformly wound in a gap between two blocking pieces on the winding frame 11, the connector at the other end of the power line can be placed into the rectangular hole through the other U-shaped groove, a clamping block 10 on the winding frame 11 is inserted into the first groove 9, the clamping block 10 extrudes the bayonet lock 13 when the clamping block is inserted, a limiting block, after bayonet lock 13 aligns with the draw-in groove on the fixture block 10, compression spring 15 extrudes bayonet lock 13 and stopper 14 and resets, and bayonet lock 13 card is gone into in the draw-in groove, just in the bobbin 11 card that has the power cord of winding has been gone into receiver 6, in inserting the first spout 4 on the apron 3 with receiver 6 top shoe 5, can be in the same place receiver 6 and 1 swing joint of laser instrument body, realized the power cord purpose of being convenient for accomodate.
In summary, in the semiconductor laser, a rectangular hole is formed in the bobbin 11, the connector at one end of the power line is placed into the rectangular hole, the power line penetrates out of one U-shaped groove, then the power line is uniformly wound in a gap between two blocking pieces on the bobbin 11, the connector at the other end of the power line can be placed into the rectangular hole through the other U-shaped groove, the clamping block 10 on the bobbin 11 is inserted into the first groove 9, the clamping block 10 presses the clamping pin 13 when the clamping block 10 is inserted, the limiting block 14 on the clamping pin 13 presses the compression spring 15, the compression spring 15 drives the clamping pin 13 and the limiting block 14 to move in opposite directions after being stressed, when the clamping pin 13 is aligned with the clamping groove on the clamping block 10, the compression spring 15 presses the clamping pin 13 and the limiting block 14 to reset, the clamping pin 13 is clamped into the clamping groove, the bobbin 11 wound with the power line is clamped into the storage box 6, the, the storage box 6 can be movably connected with the laser body 1, so that the power cord can be conveniently stored, when the laser body 1 is used, the storage box 6 is separated from the laser body 1, the pull ring 17 is pulled, the pull ring 17 pulls the bayonet lock 13 and the limit block 14 through the pull rope 16, the limit block 14 extrudes the compression spring 15, the compression spring 15 contracts after being stressed, the bayonet lock 13 is separated from the bayonet lock on the bayonet lock 10, the bobbin 11 and the power line on the bobbin 11 can be taken out, then the slide block 5 on the storage box 6 is slid into the second slide groove 8 on the heat dissipation block 7, the storage box 6 can be used as the base of the laser body 1, the height of the foot pad 18 is adjusted simultaneously, the irradiation angle of the laser emitted by the laser device body 1 can be adjusted, the purpose of convenient adjustment is achieved, and the problems that a power line used on a semiconductor laser device is long and easy to wind, and is inconvenient to use and store are solved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A semiconductor laser comprising a laser body (1), characterized in that: the top of the laser body (1) is fixedly connected with a cooling fan (2), the right side of the laser body (1) is fixedly connected with a cover plate (3), the right side of the cover plate (3) is provided with two first sliding grooves (4), the two first sliding grooves (4) are internally and respectively connected with a sliding block (5) with one end extending to the outer side of the cover plate (3), one opposite sides of the two sliding blocks (5) are respectively and fixedly connected with a storage box (6), the bottom of the laser body (1) is fixedly connected with a cooling block (7), the bottom of the cooling block (7) is provided with two second sliding grooves (8), the right side wall of the inner cavity of the storage box (6) is provided with two first grooves (9), and the two first grooves (9) are internally and respectively clamped with a clamping block (10) with one end extending to the left side of the first groove (9), the left sides of the two clamping blocks (10) are fixedly connected with a winding frame (11), two second grooves (12) are formed in the storage box (6), clamping pins (13) with one ends penetrating through the second grooves (12) and extending into the clamping blocks (10) are movably connected into the two second grooves (12), limiting blocks (14) located in the second grooves (12) are fixedly connected to the outer sides of the two clamping pins (13), compression springs (15) with one ends fixedly connected with the second grooves (12) and located on the outer sides of the clamping pins (13) are fixedly connected to the opposite sides of the two limiting blocks (14), pull ropes (16) with one ends penetrating through the compression springs (15) and extending to the outer portion of the storage box (6) are fixedly connected to the opposite sides of the two clamping pins (13), pull ropes (17) are fixedly connected to the ends, far away from the clamping pins (13), of the pull ropes (16), the inside threaded connection of receiver (6) has callus on the sole (18) that one end extends to receiver (6) right side.
2. A semiconductor laser as claimed in claim 1 wherein: bobbin (11) are rectangle, and the rectangular hole has been seted up on bobbin (11) left side, and the rear side of bobbin (11) is opened and is equipped with quantity be two and with the U-shaped groove of rectangular hole intercommunication, the equal fixedly connected with quantity in top and the bottom of bobbin (11) be nine separation blades, the separation blade is the staggered distribution.
3. A semiconductor laser as claimed in claim 1 wherein: the left side of receiver (6) is the opening design, and the thread groove that is located callus on the sole (18) outside is seted up on the right side of receiver (6).
4. A semiconductor laser as claimed in claim 1 wherein: two the inner chamber right side wall of second spout (8) has all been seted up and has been stepped down the groove, and the width that steps down the groove is greater than the width of slider (5).
5. A semiconductor laser as claimed in claim 1 wherein: two fixture block (10) are the rectangle post, two the draw-in groove that is located bayonet lock (13) outside is all seted up to fixture block (10) one side that backs on the back mutually, two the left side of bayonet lock (13) is the inclined plane design, two the hole of stepping down that is located the stay cord (16) outside is all seted up to one side that second recess (12) back on the back mutually.
6. A semiconductor laser as claimed in claim 1 wherein: the quantity of the foot pads (18) is four, and the upper two foot pads (18) and the lower two foot pads (18) are symmetrically distributed in the front-back direction.
CN201922268298.5U 2019-12-17 2019-12-17 Semiconductor laser Expired - Fee Related CN212659821U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922268298.5U CN212659821U (en) 2019-12-17 2019-12-17 Semiconductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922268298.5U CN212659821U (en) 2019-12-17 2019-12-17 Semiconductor laser

Publications (1)

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CN212659821U true CN212659821U (en) 2021-03-05

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Application Number Title Priority Date Filing Date
CN201922268298.5U Expired - Fee Related CN212659821U (en) 2019-12-17 2019-12-17 Semiconductor laser

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CN (1) CN212659821U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113794102A (en) * 2021-09-17 2021-12-14 陈灿强 Semiconductor diode laser
CN116276599A (en) * 2023-05-19 2023-06-23 合肥倍豪海洋装备技术有限公司 Large-diameter thin-wall sleeve polishing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113794102A (en) * 2021-09-17 2021-12-14 陈灿强 Semiconductor diode laser
CN113794102B (en) * 2021-09-17 2023-10-20 山西大威激光科技有限公司 Semiconductor diode laser
CN116276599A (en) * 2023-05-19 2023-06-23 合肥倍豪海洋装备技术有限公司 Large-diameter thin-wall sleeve polishing device
CN116276599B (en) * 2023-05-19 2023-09-08 合肥倍豪海洋装备技术有限公司 Large-diameter thin-wall sleeve polishing device

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210305

Termination date: 20211217

CF01 Termination of patent right due to non-payment of annual fee