CN212653664U

CN212653664U - Silicon wafer cutting device for perovskite solar cell production

Info

Publication number: CN212653664U
Application number: CN202020886116.0U
Authority: CN
Inventors: 刘立帮
Original assignee: Wuhan Xinyu Jintian Technology Co ltd
Current assignee: Wuhan Xinyu Jintian Technology Co ltd
Priority date: 2020-05-25
Filing date: 2020-05-25
Publication date: 2021-03-05
Anticipated expiration: 2030-05-25

Abstract

The utility model discloses a wafer cutting device is used in perovskite solar cell production relates to perovskite solar cell production technical field, for solving current wafer cutting device and easily appearing the problem of both sides perk to silicon chip cutting in-process. The utility model discloses a device for preventing tilting, including first sleeve pipe, second sleeve pipe, first sleeve pipe and second sleeve pipe, the side proof sticks up the device and all installs the lower extreme of first sleeve pipe and second sleeve pipe, and the one end that prevents the side proof sticks up the device respectively with first sleeve pipe and second sleeve pipe welded fastening, the compression leg is installed to the lower extreme that prevents the side proof sticks up the device, the compression leg with prevent side proof sticks up device sliding connection, the fixed workstation that is provided with in upper end of base, the upper end of workstation is the rectangle array and has seted up a.

Description

Silicon wafer cutting device for perovskite solar cell production

Technical Field

The utility model relates to a perovskite solar cell production technical field specifically is a wafer cutting device is used in perovskite solar cell production.

Background

A perovskite solar cell is a solar cell using a perovskite-type organic metal halide semiconductor as a light absorbing material, belongs to a third generation solar cell, and is also referred to as a new concept solar cell. These carriers either become free carriers or form excitons due to differences in exciton binding energy of the perovskite material. In the production process of the perovskite solar cell, silicon wafers used by a main body need to be cut so as to meet the production requirements of the perovskite solar cells with different specifications.

However, when the existing silicon wafer cutting device for producing the perovskite solar cell is used for cutting a silicon wafer, the four corners of the silicon wafer are usually fixed, and when a cutter applies force on the silicon wafer, the phenomenon that the middle of the silicon wafer is concave and the two sides of the silicon wafer are convex easily occurs, so that the cutting precision and the cutting effect are relatively influenced, and therefore the existing requirements are not met.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip cutting device is used in perovskite solar cell production to solve the problem that the both sides perk easily appears in silicon chip cutting process in the silicon chip cutting device who provides among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wafer cutting device for perovskite solar cell production, includes the base, the fixed shell that is provided with in top of base, electric putter is installed to the inside top of shell, the fixed mounting bracket that is provided with of electric putter's lower extreme, the lower extreme of mounting bracket is fixed first sleeve pipe and the fixed block of being provided with respectively, one side of fixed block is provided with the second sleeve pipe, the device of preventing the side warp is all installed to first sleeve pipe and second sheathed tube lower extreme, and prevents the one end of side warp device respectively with first sleeve pipe and second sleeve pipe welded fastening, the compression leg is installed to the lower extreme of preventing the side warp device, and compression leg and the device sliding connection of preventing the side warp, the fixed workstation that is provided with in upper end of base, the upper end of workstation is the rectangle array and has seted up a plurality of regulation holes, the equal fixed mounting in both sides of shell has.

Preferably, a motor is installed inside the fixed block, an output shaft of the motor penetrates through and extends to one end of the second sleeve, and the output shaft of the motor is rotatably connected with the second sleeve through a bearing.

Preferably, the output shaft of the motor is fixedly provided with a cutter, one side of the cutter is rotatably connected with the first sleeve through a bearing, and the other side of the cutter is rotatably connected with the second sleeve through a bearing.

Preferably, adjusting bolt is installed to the upper end of regulation hole, and adjusting bolt passes through the thread tightening with the regulation hole, the upper end of workstation is provided with the rubber slab, and the rubber slab pastes fixedly with the workstation, adjusting bolt's outside is provided with the clamp plate, and the clamp plate rotates with adjusting bolt to be connected.

Preferably, a spring is arranged inside the side tilting prevention device, and the spring is fixedly connected with the side tilting prevention device and the compression leg.

Preferably, one side fixed mounting of negative pressure fan has receipts sediment box, the one side of receiving the sediment box is provided with receives the sediment cover, and receives the inside that the sediment cover extends to the shell, negative pressure fan with receive the sediment box sealed fixed, receive the sediment box with receive the sediment cover sealed fixed.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an all install at first sleeve pipe and second sheathed tube lower extreme and prevent the side perk device, when electric putter promotes the mounting bracket downstream, the cutter cuts the silicon chip, the compression leg of preventing the side perk device lower extreme so at first contacts to the both sides of silicon chip line of cut, along with the decline of cutter, the compression leg is gradually towards preventing the inside extension of side perk device, however under the reaction of spring, make the compression leg still keep the extrusion force to the silicon chip in the shrink, thereby in actual cutting process, the compression leg can be fixed with the both sides of silicon chip, avoid the condition that the side perk appears in cutting process, the cutting precision has been guaranteed on the one hand, on the other hand has improved cutting effect.

2. The utility model discloses a be rectangular array in the top of workstation and seted up a plurality of regulation holes, when fixing the silicon chip, according to the specification that the silicon chip was placed on the rubber slab, insert adjusting bolt in the suitable regulation hole, clockwise rotation adjusting bolt, adjusting bolt extends inside gradually with the regulation hole under the effect of frictional force, thereby make the outside clamp plate of adjusting bolt extrude one side of silicon chip, thereby it is fixed to form, and the rubber slab is rubber material frictional force big, can avoid sliding, through this kind of mode, the mounting structure is nimble, and the fastness is strong.

3. The utility model discloses an all install negative-pressure air fan in the both sides of shell, in the cutting process, start negative-pressure air fan, discharge inside air fast, make simultaneously receive sediment cover outside air and constantly supply into negative-pressure air fan, form higher pressure differential with the external world, receive the outside silicon chip piece of sediment cover so and be inhaled along with the air and receive in the sediment box for at the in-process to the silicon chip, collect the inside piece of shell, guaranteed the inside cleanness of cutting device.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a partial enlarged view of the area A of the present invention;

FIG. 3 is a top view of the working table of the present invention;

fig. 4 is the internal structure schematic diagram of the anti-tilting device of the present invention.

In the figure: 1. a housing; 2. a base; 3. a work table; 4. a rubber plate; 5. an electric push rod; 6. a mounting frame; 7. a fixed block; 8. a motor; 9. a first sleeve; 10. a second sleeve; 11. a side-warping prevention device; 12. a cutter; 13. a negative pressure fan; 14. a slag collection box; 15. a slag collecting cover; 16. adjusting the bolt; 17. pressing a plate; 18. an adjustment hole; 19. pressing the column; 20. a spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-4, the present invention provides an embodiment: a silicon wafer cutting device for perovskite solar cell production comprises a base 2, a shell 1 is fixedly arranged above the base 2, an electric push rod 5 is arranged above the inner part of the shell 1, a mounting frame 6 is fixedly arranged at the lower end of the electric push rod 5, a first sleeve 9 and a fixing block 7 are respectively and fixedly arranged at the lower end of the mounting frame 6, a second sleeve 10 is arranged at one side of the fixing block 7, side-warping prevention devices 11 are respectively arranged at the lower ends of the first sleeve 9 and the second sleeve 10, one end of the side warp prevention device 11 is respectively welded and fixed with the first sleeve 9 and the second sleeve 10, the lower end of the side warp prevention device 11 is provided with a compression leg 19, and compression leg 19 and anti-tilting device 11 sliding connection, the fixed workstation 3 that is provided with in upper end of base 2, the upper end of workstation 3 is the rectangle array and has seted up a plurality of regulation holes 18, and the equal fixed mounting in both sides of shell 1 has negative-pressure air fan 13.

Further, the internally mounted of fixed block 7 has motor 8, and motor 8's output shaft runs through and extends to the one end of second sleeve 10, and motor 8's output shaft and second sleeve 10 pass through the bearing and rotate and be connected, and fixed block 7 ensures to motor 8's fixed, avoids taking place to rock in the work.

Further, motor 8's output shaft fixed mounting has cutter 12, and one side of cutter 12 passes through the bearing with first sleeve pipe 9 and rotates and be connected, and the opposite side of cutter 12 passes through the bearing with second sleeve pipe 10 and rotates and be connected, through mutually supporting of first sleeve pipe 9 and second sleeve pipe 10, does not influence the cutting of cutter 12 under the condition of the normal work of order anti-sideslip device 11.

Further, adjusting bolt 16 is installed to the upper end of regulation hole 18, and adjusting bolt 16 passes through the thread tightening with regulation hole 18, and the upper end of workstation 3 is provided with rubber slab 4, and rubber slab 4 pastes fixedly with workstation 3, and adjusting bolt 16's outside is provided with clamp plate 17, and clamp plate 17 rotates with adjusting bolt 16 to be connected, and rubber slab 4 is rubber material frictional force big, can avoid sliding, and through this kind of mode, the mounting structure is nimble, and the fastness is strong.

Further, the spring 20 is arranged in the side tilting prevention device 11, the spring 20 is fixedly connected with the side tilting prevention device 11 and the pressing column 19, and under the reaction of the spring 20, the pressing column 19 still keeps extrusion force on the silicon wafer while contracting, so that in the actual cutting process, the pressing column 19 can fix the two sides of the silicon wafer, and the situation of side tilting in the cutting process is avoided.

Further, a slag receiving box 14 is fixedly installed on one side of the negative pressure fan 13, a slag receiving cover 15 is arranged on one side of the slag receiving box 14, the slag receiving cover 15 extends into the shell 1, the negative pressure fan 13 and the slag receiving box 14 are fixed in a sealing mode, the slag receiving box 14 and the slag receiving cover 15 are fixed in a sealing mode, the negative pressure fan 13 quickly discharges air inside, meanwhile, air outside the slag receiving cover 15 is continuously supplemented into the negative pressure fan 13 to form high pressure difference with the outside, silicon wafer scraps outside the slag receiving cover 15 are sucked into the slag receiving box 14 along with the air, and accordingly the scraps inside the shell 1 are collected in the silicon wafer process.

The working principle is as follows: when the silicon wafer cutting device is used, according to the specification of a silicon wafer placed on the rubber plate 4, the adjusting bolt 16 is inserted into the proper adjusting hole 18, the adjusting bolt 16 is rotated clockwise, the adjusting bolt 16 and the adjusting hole 18 extend towards the inner part gradually under the action of friction force, so that the pressing plate 17 outside the adjusting bolt 16 extrudes one side of the silicon wafer to form fixation, the rubber plate 4 is made of rubber, the friction force is large, the sliding can be avoided, when the electric push rod 5 pushes the mounting frame 6 to move downwards, the cutter 12 cuts the silicon wafer, the pressing columns 19 at the lower end of the side warping prevention device 11 firstly contact with two sides of a silicon wafer cutting line, along with the descending of the cutter 12, the pressing columns 19 extend towards the inner part of the side warping prevention device 11 gradually, however, under the reaction effect of the spring 20, the pressing columns 19 keep extrusion force on the silicon wafer while contracting, so that in the actual cutting process, the pressing columns 19 can fix two sides of the silicon wafer, avoid the condition that the side perk appears in the cutting process, start negative pressure fan 13, discharge inside air fast, make simultaneously receive 15 outside air of sediment cover and constantly supply into negative pressure fan 13, form higher pressure differential with the external world, receive the outside silicon chip piece of sediment cover 15 so and receive in the sediment box 14 along with the air is inhaled to the air for in-process to the silicon chip, collect the inside piece of shell 1, guaranteed the inside cleanness of cutting device.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a wafer cutting device for perovskite solar cell production, includes base (2), its characterized in that: the upper end of the base (2) is fixedly provided with a shell (1), an electric push rod (5) is installed above the inner portion of the shell (1), a mounting frame (6) is fixedly arranged at the lower end of the electric push rod (5), a first sleeve (9) and a fixed block (7) are respectively fixedly arranged at the lower end of the mounting frame (6), a second sleeve (10) is arranged on one side of the fixed block (7), side tilting prevention devices (11) are respectively installed at the lower ends of the first sleeve (9) and the second sleeve (10), one end of each side tilting prevention device (11) is respectively welded and fixed with the first sleeve (9) and the second sleeve (10), a compression leg (19) is installed at the lower end of each side tilting prevention device (11), the compression leg (19) is connected with the side tilting prevention devices (11) in a sliding mode, a workbench (3) is fixedly arranged at the upper end of the base (2), a plurality of adjusting holes (18) are formed in a rectangular array at the upper end of the workbench (, and negative pressure fans (13) are fixedly mounted on two sides of the shell (1).

2. The silicon wafer cutting apparatus for perovskite solar cell production according to claim 1, characterized in that: the inside mounting of fixed block (7) has motor (8), and the output shaft of motor (8) runs through and extends to the one end of second sleeve pipe (10), and the output shaft of motor (8) passes through bearing rotation with second sleeve pipe (10) and is connected.

3. The silicon wafer cutting apparatus for perovskite solar cell production according to claim 2, characterized in that: the cutting knife is characterized in that a cutting knife (12) is fixedly mounted on an output shaft of the motor (8), one side of the cutting knife (12) is rotatably connected with the first sleeve (9) through a bearing, and the other side of the cutting knife (12) is rotatably connected with the second sleeve (10) through a bearing.

4. The silicon wafer cutting apparatus for perovskite solar cell production according to claim 1, characterized in that: adjusting bolt (16) are installed to the upper end of regulation hole (18), and adjusting bolt (16) pass through threaded fixation with regulation hole (18), the upper end of workstation (3) is provided with rubber slab (4), and rubber slab (4) paste fixedly with workstation (3), the outside of adjusting bolt (16) is provided with clamp plate (17), and clamp plate (17) rotate with adjusting bolt (16) and be connected.

5. The silicon wafer cutting apparatus for perovskite solar cell production according to claim 1, characterized in that: the anti-side-warping device (11) is internally provided with a spring (20), and the spring (20) is fixedly connected with the anti-side-warping device (11) and the compression column (19).

6. The silicon wafer cutting apparatus for perovskite solar cell production according to claim 1, characterized in that: one side fixed mounting of negative pressure fan (13) has receipts sediment box (14), the one side of receiving sediment box (14) is provided with receives sediment cover (15), and receives the inside that sediment cover (15) extend to shell (1), negative pressure fan (13) are sealed fixed with receipts sediment box (14), receive sediment box (14) and receive sediment cover (15) sealed fixed.