CN212652271U - Semiconductor material cleaning device - Google Patents

Semiconductor material cleaning device Download PDF

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Publication number
CN212652271U
CN212652271U CN202020975309.3U CN202020975309U CN212652271U CN 212652271 U CN212652271 U CN 212652271U CN 202020975309 U CN202020975309 U CN 202020975309U CN 212652271 U CN212652271 U CN 212652271U
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box
case
semiconductor material
heat dissipation
arc
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CN202020975309.3U
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Chinese (zh)
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卢鹏荐
曾小龙
张�林
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Wuhan Tuocai Technology Co ltd
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Wuhan Tuocai Technology Co ltd
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Abstract

The utility model discloses a semiconductor material belt cleaning device belongs to the material and washs technical field, and it includes the heat dissipation case, the upper surface of heat dissipation case and the lower fixed surface who washs the case are connected, the left surface that washs the case and the right flank fixed connection of liquid supply case, the lower surface of heat dissipation case and the upper fixed surface of motor are connected. This semiconductor material belt cleaning device, through setting up the heater, motor and carousel, the solenoid valve on the different catheter surfaces of control panel control, make its water pump take out the solution in the different liquid storage tanks, solution heats to the predetermined temperature after at the heater subsequently, through assembling in the pipe gets into the clearance pipe, manage inside pressurization and through the shower head blowout at the clearance afterwards, loop through different solutions and carry out chemical cleaning, the step that distilled water washed and deionized water washes, rivers flow out rapidly through the arc hourglass water board, and assemble in the waste liquid recovery box, the motor drives the wafer slowly rotatory through the carousel simultaneously, make its washing more evenly abundant.

Description

Semiconductor material cleaning device
Technical Field
The utility model belongs to the technical field of the material washs, specifically is semiconductor material belt cleaning device.
Background
Immersion wet cleaning baths the wet chemical cleaning system may be either immersion or rotary. The conventional cleaning method for the semiconductor wafer is complex in flow, and each step of manual operation can affect the cleaning effect to a certain extent.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In order to overcome the above-mentioned defect of prior art, the utility model provides a semiconductor material belt cleaning device has solved traditional this kind and has comparatively complicated to the cleaning method flow of semiconductor wafer, and each step manual operation all can cause the problem of certain influence for abluent effect.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: semiconductor material belt cleaning device, including the heat dissipation case, the upper surface of heat dissipation case and the lower fixed surface who washs the case are connected, wash the left surface of case and the right flank fixed connection of feed tank, the lower surface of heat dissipation case and the upper fixed surface of motor are connected, the output shaft of motor is through the lower surface joint of closing water bearing and wasing the incasement wall, the output shaft of motor and the lower fixed surface of carousel are connected, the upper surface of carousel and the lower fixed surface of two arc shelves strip are connected, two equal sliding connection has corrosion-resistant carbon silk in a plurality of card hole that the arc shelves strip openly seted up.
The upper surface of carousel and the lower fixed surface of arc board that leaks are connected, the upper surface of arc board that leaks is provided with the wafer, the inner wall difference joint of liquid supply box has a plurality of liquid storage pot, a plurality of the upper surface of liquid storage pot all is linked together through the water inlet of catheter with the heater, the delivery port of heater is linked together with the water inlet of water pump, the delivery port of water pump is linked together through the water inlet of gathering pipe and clearing pipe, the lower surface of wasing incasement wall is linked together through the left surface of fluid-discharge tube with the waste liquid recovery box, the upper surface joint of wasing the case has the feed inlet, the left surface of feed inlet is articulated through the left surface of hinge and sealing door, the front of liquid supply box and control panel's back fixed connection.
As a further aspect of the present invention: the right side of the cleaning box is fixedly connected with the left side of the dryer, and the air inlet and the air outlet of the dryer are clamped with the right side of the inner wall of the cleaning box.
As a further aspect of the present invention: the left surface of waste liquid recovery box and the right flank fixed connection who washs the case, the four corners department of heat dissipation case, confession liquid case and washing box lower surface all is provided with the shock pad, the front of heat dissipation case is provided with the shutter, the front of wasing the case is provided with sealed window.
As a further aspect of the present invention: electromagnetic valves are arranged on the surfaces of the liquid discharge pipe and the liquid guide pipes, and the input ends of the electromagnetic valves, the motor, the heater and the dryer are electrically connected with the output end of the control panel.
As a further aspect of the present invention: the cleaning box is made of materials including an outermost protective layer and an innermost corrosion-resistant layer, and a heat insulation layer is arranged between the protective layer and the corrosion-resistant layer.
As a further aspect of the present invention: the surface of clearance pipe is provided with a plurality of shower head, two the opposite face of arc shelves strip is provided with the soft strip of a plurality of, a plurality of infiltration hole has been seted up to the upper surface of arc board that leaks, the upper surface of carousel is provided with a plurality of through-hole.
(III) advantageous effects
Compared with the prior art, the beneficial effects of the utility model reside in that:
1. this semiconductor material belt cleaning device, through setting up the heater, the liquid storage pot, a water pump, the clearance pipe, the shower head, motor and carousel, when using, the solenoid valve on different catheter surfaces of control panel control, make its water pump take out the solution in the different liquid storage pots, solution heats behind the predetermined temperature at the heater subsequently, through assembling in the pipe gets into the clearance pipe, pressurize and spout through the shower head inside the clearance pipe afterwards, make the even spraying of solution on the wafer surface, loop through different solutions and carry out chemical cleaning, the step that distilled pure water washed and deionized water washed, rivers flow out rapidly through arc hourglass water board, and assemble in the waste liquid recovery box, the motor drives the wafer slow rotation through the carousel simultaneously, make its washing more evenly abundant.
2. This semiconductor material belt cleaning device, through setting up the motor, the carousel, the arc shelves strip, corrosion-resistant carbon silk and drying-machine, it is rotatory that at first the motor passes through two arc shelves strips of carousel drive after the washing, two arc shelves strip cooperation corrosion-resistant carbon silk are spacing with the wafer, and drive high-speed rotation, make its surface wash remaining deionized water spin-dry, the drying-machine begins working simultaneously, make inside air current keep the rapid flow, the stoving in-process after the wafer surface spin-dries, ensure its complete drying, close motor and drying-machine afterwards and open the sealing door and can take out the wafer.
3. This semiconductor material belt cleaning device, through setting up corrosion-resistant carbon wire, soft strip, heat preservation and corrosion-resistant layer, when using, corrosion-resistant carbon wire can not influence its abluent effect that sprays when spacing to the wafer, through setting up soft strip, can play fine guard action when the rotatory dehydration of wafer, through setting up the heat preservation, can remain the heat of inside under the effect of solution after the heating and drying-machine, make its abluent effect obtain promoting, dry speed is accelerated, corrosion-resistant layer can prevent to use for a long time and cause the corruption, long-term use's stability has been ensured.
Drawings
Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;
fig. 2 is an enlarged schematic structural view at a position a of the present invention;
FIG. 3 is a schematic structural view of a front section of the cleaning tank of the present invention;
fig. 4 is a front view of the present invention;
in the figure: 1 heat dissipation box, 2 liquid supply box, 3 cleaning box, 31 protective layer, 32 heat preservation layer, 33 corrosion resistant layer, 4 motor, 5 wafer, 6 heater, 7 water pump, 8 cleaning tube, 9 turntable, 10 arc water leakage plate, 11 arc baffle, 12 dryer, 13 waste liquid recovery box, 14 soft strip, 15 spray head, 16 corrosion resistant carbon filament, 17 feed inlet, 18 sealing door, 19 liquid discharge tube, 20 sealing window, 21 control panel, 22 shutter, 23 liquid storage tank, 24 liquid guide tube, 25 collecting tube.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
As shown in fig. 1-4, the utility model provides a technical solution: semiconductor material belt cleaning device, including heat dissipation case 1, the upper surface of heat dissipation case 1 and the lower fixed surface who washs case 3 are connected, the left surface that washs case 3 and the right flank fixed connection of feed tank 2, the lower surface of heat dissipation case 1 and the upper fixed surface of motor 4 are connected, the output shaft of motor 4 is through closing the lower surface joint of water bearing and washing 3 inner walls of case, the output shaft of motor 4 and the lower fixed surface of carousel 9 are connected, the upper surface of carousel 9 and the lower fixed surface of two arc shelves 11 are connected, the downthehole equal sliding connection of a plurality of card that two arc shelves 11 openly seted up has corrosion-resistant carbon silk 16.
The upper surface of the rotary table 9 is fixedly connected with the lower surface of the arc-shaped water leakage plate 10, the upper surface of the arc-shaped water leakage plate 10 is provided with a wafer 5, the inner wall of the liquid supply box 2 is respectively clamped with a plurality of liquid storage tanks 23, the upper surfaces of the plurality of liquid storage tanks 23 are communicated with the water inlet of the heater 6 through liquid guide pipes 24, the water outlet of the heater 6 is communicated with the water inlet of the water pump 7, the water outlet of the water pump 7 is communicated with the water inlet of the cleaning pipe 8 through a gathering pipe 25, the lower surface of the inner wall of the cleaning box 3 is communicated with the left side surface of the waste liquid recovery box 13 through a liquid discharge pipe 19, the upper surface of the cleaning box 3 is clamped with a feed port 17, the left side surface of the feed port 17 is hinged with the left side surface of the sealing door 18 through a hinge, the front surface of the liquid supply box 2 is fixedly connected, and the internal cleaning effect is not interfered by external environmental factors.
Specifically, as shown in fig. 1, the right side of the cleaning box 3 is fixedly connected with the left side of the dryer 12, the air inlet and the air outlet of the dryer 12 are all clamped with the right side of the inner wall of the cleaning box 3, the left side of the waste liquid recovery box 13 is fixedly connected with the right side of the cleaning box 3, four corners of the lower surfaces of the heat dissipation box 1, the liquid supply box 2 and the cleaning box are all provided with shock absorbing pads, the front of the heat dissipation box 1 is provided with a shutter 22, the front of the cleaning box 3 is provided with a sealing window 20, the surfaces of the liquid discharge pipe 19 and the plurality of liquid guide pipes 24 are all provided with electromagnetic valves, the motor 4, the heater 6 and the input end of the dryer 12 are electrically connected with the output end of the control panel 21, by arranging the dryer 12, the dryer 12 can keep the internal airflow flowing when the dryer 12 is used, so as to play a benefit of accelerating, make its convenient unified processing, through setting up heat dissipation case 1, heat dissipation case 1 plays fine supporting role, and plays fine guard action to motor 4, through setting up shutter 22, can play fine ventilation cooling's effect, has ensured motor 4's normal operating in long-time the use.
Specifically, as shown in fig. 1, the surface of clearance pipe 8 is provided with a plurality of shower head 15, the opposite face of two arc shelves strip 11 is provided with the soft strip 14 of a plurality of, a plurality of infiltration hole has been seted up to the upper surface of arc board 10 that leaks, the upper surface of carousel 9 is provided with a plurality of through-hole, through setting up clearance pipe 8, form the high pressure in the clearance pipe 8, make its inside solution conveniently spout through shower head 15 high pressure, through setting up soft strip 14, soft strip 14 can play certain guard action to wafer 5, make it can not receive the spacing contact of rigidity when using wafer 5, through setting up arc board 10 that leaks, the hole that leaks has been seted up on the surface of arc board 10 that leaks, the discharge of waste liquid has been accelerated with the through-hole cooperation on carousel 9 surface.
Specifically, as shown in fig. 1, the material that washs case 3 includes outermost inoxidizing coating 31 and the corrosion-resistant layer 33 of inlayer, is provided with heat preservation 32 between inoxidizing coating 31 and the corrosion-resistant layer 33, through setting up inoxidizing coating 31, can play the benefit that protects the external world and collide with, through setting up heat preservation 32, can play internal heat preservation, makes its cleaning performance better, through setting up corrosion-resistant layer 33, when can preventing to use for a long time, inside solution influences normal use to its corruption.
The utility model discloses a theory of operation does:
s1, when in use, firstly the control panel 21 starts the electromagnetic valves on the surfaces of different liquid guide pipes 24 according to the cleaning procedure, then the solution in the liquid storage tank 23 communicated with the designated liquid guide pipe 24 is pumped out, and the solution is heated to the preset temperature by the heater 6 and then enters the cleaning pipe 8 through the converging pipe 25 under the action of the water pump 7;
s2, then spraying the solution inside by high water pressure in the cleaning pipe 8, washing the surface of the wafer 5, simultaneously slowly rotating the motor 4 under the action of the control panel 21, so that the turntable 9 drives the wafer 5 to slowly rotate, so that the surface of the wafer 5 is more uniformly washed, then the solution flows onto the arc-shaped water leakage plate 10 and is rapidly discharged, the waste liquid inside is discharged into the waste liquid recovery box 13 by opening the electromagnetic valve on the surface of the liquid discharge pipe 19, and finally, the solution inside is cleaned by deionized water;
s3, firstly, the water pump 7 and the heater 6 are turned off, meanwhile, the motor 4 and the dryer 12 are started, the motor 4 drives the arc-shaped baffle strip 11 to rotate through the turntable 9, the arc-shaped baffle strip 11 and the corrosion-resistant carbon filaments 16 limit the position of the wafer 5, the wafer 5 rotates at a high speed to spin the deionized water on the surface of the wafer, and meanwhile, the dryer 12 keeps the internal airflow circulation flow inside the cleaning box 3 to dry the residual solution.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims (6)

1. Semiconductor material belt cleaning device, including heat dissipation case (1), its characterized in that: the upper surface of the heat dissipation box (1) is fixedly connected with the lower surface of the cleaning box (3), the left side surface of the cleaning box (3) is fixedly connected with the right side surface of the liquid supply box (2), the lower surface of the heat dissipation box (1) is fixedly connected with the upper surface of the motor (4), the output shaft of the motor (4) is clamped with the lower surface of the inner wall of the cleaning box (3) through a water closing bearing, the output shaft of the motor (4) is fixedly connected with the lower surface of the rotating disc (9), the upper surface of the rotating disc (9) is fixedly connected with the lower surfaces of the two arc-shaped stop strips (11), and corrosion-resistant carbon wires (16) are slidably connected in a plurality of clamping holes formed in the front surfaces of the two arc-shaped stop strips (11);
the upper surface of the rotary table (9) is fixedly connected with the lower surface of the arc-shaped water leakage plate (10), the upper surface of the arc-shaped water leakage plate (10) is provided with a wafer (5), the inner wall of the liquid supply box (2) is respectively clamped with a plurality of liquid storage tanks (23), the upper surfaces of the liquid storage tanks (23) are communicated with the water inlet of the heater (6) through liquid guide pipes (24), the water outlet of the heater (6) is communicated with the water inlet of the water pump (7), the water outlet of the water pump (7) is communicated with the water inlet of the cleaning pipe (8) through a gathering pipe (25), the lower surface of the inner wall of the cleaning box (3) is communicated with the left side surface of the waste liquid recovery box (13) through a liquid discharge pipe (19), the upper surface of the cleaning box (3) is clamped with a feed inlet (17), the left side surface of the feed inlet (17) is hinged with the left side surface of the sealing door, the front surface of the liquid supply box (2) is fixedly connected with the back surface of the control panel (21).
2. The semiconductor material cleaning apparatus according to claim 1, wherein: the right flank of wasing case (3) and the left surface fixed connection of drying-machine (12), the income wind gap of drying-machine (12) and air outlet all with wash the right flank joint of case (3) inner wall.
3. The semiconductor material cleaning apparatus according to claim 1, wherein: the left surface of waste liquid recovery box (13) and the right flank fixed connection who washs case (3), the four corners department of heat dissipation case (1), feed tank (2) and washing box lower surface all is provided with the shock pad, the front of heat dissipation case (1) is provided with shutter (22), the front of wasing case (3) is provided with sealed window (20).
4. The semiconductor material cleaning apparatus according to claim 1, wherein: electromagnetic valves are arranged on the surfaces of the liquid discharge pipe (19) and the liquid guide pipes (24), and the input ends of the electromagnetic valves, the motor (4), the heater (6) and the dryer (12) are electrically connected with the output end of the control panel (21).
5. The semiconductor material cleaning apparatus according to claim 1, wherein: the cleaning box (3) is made of an outermost protective layer (31) and an innermost corrosion-resistant layer (33), and a heat-insulating layer (32) is arranged between the protective layer (31) and the corrosion-resistant layer (33).
6. The semiconductor material cleaning apparatus according to claim 1, wherein: the surface of clearance pipe (8) is provided with a plurality of shower head (15), two the opposite face of arc shelves strip (11) is provided with soft strip of a plurality of (14), a plurality of infiltration hole has been seted up to the upper surface of arc board (10) that leaks, the upper surface of carousel (9) is provided with a plurality of through-hole.
CN202020975309.3U 2020-06-02 2020-06-02 Semiconductor material cleaning device Active CN212652271U (en)

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CN202020975309.3U CN212652271U (en) 2020-06-02 2020-06-02 Semiconductor material cleaning device

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Application Number Priority Date Filing Date Title
CN202020975309.3U CN212652271U (en) 2020-06-02 2020-06-02 Semiconductor material cleaning device

Publications (1)

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CN212652271U true CN212652271U (en) 2021-03-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023137815A1 (en) * 2022-01-19 2023-07-27 上海晶盟硅材料有限公司 Epitaxial wafer resistance value measurement pretreatment method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023137815A1 (en) * 2022-01-19 2023-07-27 上海晶盟硅材料有限公司 Epitaxial wafer resistance value measurement pretreatment method

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