CN212648209U - Chip clamping equipment for series-voltage corrosion of semiconductor chip - Google Patents

Abstract

The utility model discloses a chip centre gripping equipment that semiconductor chip cluster pressed and corrodes, the on-line screen storage device comprises a base, fixedly connected with chassis on the base, fixedly connected with dead lever on the base, the upper end fixedly connected with upper plate of dead lever, the bottom of upper plate is equipped with two sliding tray, two equal fixedly connected with gag lever post, two in the sliding tray equal sliding connection has the bracing piece, two all run through on the bracing piece and be equipped with logical groove, two the gag lever post runs through two logical grooves respectively and rather than the swing joint, two all be equipped with adjustment mechanism between bracing piece and the base, run through on the upper plate and be equipped with rather than threaded connection's threaded rod, the bottom fixedly connected with of threaded rod compresses tightly the dish. The utility model discloses rational in infrastructure, can carry out normal phase relative positioning to the baffle fast, to the efficient that the baffle prevented, improve work efficiency, also can be applicable to the baffle of equidimension not, the practicality is better.

Description

Chip clamping equipment for series-voltage corrosion of semiconductor chip

Technical Field

The utility model relates to a chip processing technology field especially relates to a chip centre gripping equipment that semiconductor chip cluster pressed the corruption.

Background

The prior art discloses a chip clamping device for serial pressure corrosion of semiconductor chips with application number of CN200720064503.0, which comprises a chip, spacers and a pressing mechanism, wherein the chip and the spacers are arranged together in a serial connection manner by one chip and one spacer, and the chips and the spacer components which are arranged together in the serial connection manner are pressed into a whole by the pressing mechanism. The spacer is a single-side protective type series-pressure corrosion spacer, is made of acid-resistant plastic or rubber, and needs to be matched with the chip in size and shape. The two surfaces of the spacer are annular surfaces with different diameters; wherein, the side with large diameter is a table-board protective surface, the diameter of which is equal to the outer diameter of the chip and is tightly attached to the side of the chip which does not need to be corroded, so as to ensure that the covered table-board of the chip can not be corroded by acid in the corrosion process; the side with small diameter is a mesa corrosion side, the diameter of which is smaller than that of the chip and is tightly attached to the side, needing corrosion, of the mesa of the chip, so that the mesa of the chip is exposed, and the exposed mesa of the chip can be protected from acid corrosion. When in work, the chip clamping device is arranged in the soaking type acid corrosion equipment for use.

In order to ensure that the chip and the partition plate can be stably clamped, a worker needs to manually and rightly face the partition plate, so that on one hand, when the compression plate clamps the partition plate, the stability after clamping can be ensured, and on the other hand, the partition plate cannot be misplaced, so that the partition plate cannot crush the edge of the chip to damage the chip; the above patent can not rapidly perform the function of positive relative positioning on the partition plate, and reduces the working efficiency, so that a chip clamping device for semiconductor chip series pressure corrosion is designed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, and the chip centre gripping equipment of corruption is pressed to semiconductor chip cluster that proposes, it can carry out normal phase relative positioning to the baffle fast, and is efficient to the baffle prevents, improves work efficiency, also can be applicable to the baffle of equidimension not, and the practicality is better.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a chip centre gripping equipment of semiconductor chip cluster pressure corruption, includes the base, fixedly connected with chassis on the base, fixedly connected with dead lever on the base, the upper end fixedly connected with upper plate of dead lever, the bottom of upper plate is equipped with two sliding tray, two equal fixedly connected with gag lever post, two in the sliding tray equal sliding connection has the bracing piece, two all run through on the bracing piece and be equipped with logical groove, two the gag lever post runs through two logical grooves respectively and rather than the swing joint, two all be equipped with adjustment mechanism between bracing piece and the base, run through on the upper plate and be equipped with rather than threaded connection's threaded rod, the bottom fixedly connected with of threaded rod compresses tightly the dish.

Preferably, the base, the chassis, the upper plate and the pressing plate are all round plates, and the chassis and the pressing plate are all made of rubber materials.

Preferably, the fixing rod and the two support rods are distributed in an isosceles triangle.

Preferably, the upper end fixedly connected with first in command of threaded rod, the outside cover of first in command is equipped with first rubber sleeve.

Preferably, adjustment mechanism is including setting up the shifting chute on the base, the bracing piece extends to in the shifting chute and rather than sliding connection, the shifting chute internal rotation is connected with adjusting screw, adjusting screw runs through the bracing piece and rather than threaded connection, adjusting screw's the other end fixedly connected with second handle, the cover is equipped with the second rubber sleeve on the second handle.

Preferably, a threaded sleeve penetrates through the support rod, and the adjusting screw penetrates through the threaded sleeve and is in threaded connection with the threaded sleeve.

Compared with the prior art, the utility model, its beneficial effect does:

the partition board can be positioned through the fixed rod and the two supporting rods, and the upper partition board and the lower partition board can be in positive opposition only by abutting the outer wall of the partition board against the fixed rod and the two supporting rods, so that the efficiency of placing the partition boards by workers in positive opposition is greatly improved, the working efficiency is improved, and the damage to chips can be reduced; through adjusting the distance between two bracing pieces, the cooperation of bracing piece and dead lever can be applicable to and fix a position the processing to the baffle of equidimension not, and the practicality is better.

To sum up, the utility model discloses rational in infrastructure, can carry out normal phase relative positioning to the baffle fast, to the efficient that the baffle prevents, improve work efficiency, also can be applicable to the baffle of equidimension not, the practicality is better.

Drawings

Fig. 1 is a schematic structural diagram of a chip clamping apparatus for serial pressure etching of a semiconductor chip according to the present invention;

fig. 2 is an enlarged view of a structure a in fig. 1.

In the figure: the device comprises a base 1, a chassis 2, an upper plate 3, a supporting rod 4, a pressing plate 5, a threaded rod 6, a first handle 7, a moving groove 8, a threaded sleeve 9, an adjusting screw rod 10, a second handle 11, a fixing rod 12, a sliding groove 13, a limiting rod 14 and a through groove 15.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a chip clamping device for semiconductor chip serial pressure corrosion comprises a base 1, a chassis 2 fixedly connected to the base 1, a fixing rod 12 fixedly connected to the base 1, an upper plate 3 fixedly connected to the upper end of the fixing rod 12, circular plates respectively arranged on the base 1, the chassis 2, the upper plate 3 and a pressing plate 5, wherein the chassis 2 and the pressing plate 5 are made of rubber, and the chassis 2 and the pressing plate 5 are made of corrosion-resistant rubber.

The bottom of upper plate 3 is equipped with two sliding tray 13, equal fixedly connected with gag lever post 14 in two sliding tray 13, equal sliding connection has bracing piece 4 in two sliding tray 13, all run through on two bracing pieces 4 and be equipped with logical groove 15, two gag lever posts 14 run through two respectively and lead to groove 15 and rather than move the connection, dead lever 12 is isosceles triangle distribution with two bracing pieces 4, can fix a position the baffle spacing through dead lever 12 and two bracing pieces 4, thereby can make the baffle just right fast, improve work efficiency.

All be equipped with adjustment mechanism between two bracing pieces 4 and the base 1, adjustment mechanism is including setting up the shifting chute 8 on base 1, bracing piece 4 extends to in the shifting chute 8 and rather than sliding connection, 8 internal rotations in shifting chute are connected with adjusting screw 10, adjusting screw 10 runs through bracing piece 4 and rather than threaded connection, run through on the bracing piece 4 and install thread bush 9, adjusting screw 10 runs through thread bush 9 and rather than equal threaded connection, adjusting screw 10's other end fixedly connected with second handle 11, the cover is equipped with the second rubber sleeve on the second handle 11.

Run through on the upper plate 3 and be equipped with rather than threaded connection's threaded rod 6, the bottom fixedly connected with of threaded rod 6 compresses tightly dish 5, the upper end fixedly connected with first in command 7 of threaded rod 6, and the outside cover of first in command 7 is equipped with first rubber sleeve, through the convenient threaded rod 6 that rotates of first in command 7.

When the utility model is used, firstly, a worker places the partition plate on the chassis 2 and pushes against the fixed rod 12, then the worker rotates the second handle 11, the rotation of the second handle 11 can realize the rotation of the adjusting screw rod 10, and because the support rod 4 can not rotate under the limit of the moving groove 8, when the adjusting screw rod 10 rotates, the movement of the thread bush 9 and the support rod 4 can be realized until the support rod 4 pushes against the partition plate, and then the other support rod 4 is adjusted to push against the partition plate 4, thereby realizing the positioning of the partition plate; then, a worker places the chip on the partition plate, and when another partition plate is placed, the upper partition plate and the lower partition plate are opposite only by abutting the outer wall of the partition plate against the fixed rod 12 and the two support rods 4, so that the efficiency of placing the partition plates by the worker in the opposite direction is greatly improved, the working efficiency is improved, and the damage to the chip can be reduced; then the staff manually rotates the first in command 7, and the first in command 7 rotates and realizes that threaded rod 6 rotates, and then realizes compressing tightly that dish 5 moves down and offsets with the baffle, realizes compressing tightly the baffle.

Through adjusting the distance between two bracing pieces 4, bracing piece 4 and dead lever 12's cooperation can be applicable to and fix a position the processing to the baffle of equidimension not, and the practicality is better.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. A chip clamping device for serial pressure corrosion of semiconductor chips comprises a base (1) and is characterized in that a chassis (2) is fixedly connected onto the base (1), a fixed rod (12) is fixedly connected onto the base (1), an upper plate (3) is fixedly connected to the upper end of the fixed rod (12), two sliding grooves (13) are formed in the bottom of the upper plate (3), limit rods (14) are fixedly connected into the two sliding grooves (13), supporting rods (4) are slidably connected into the two sliding grooves (13), through grooves (15) are formed in the two supporting rods (4) in a penetrating manner, the two limit rods (14) respectively penetrate through the two through grooves (15) and are movably connected with the through grooves, adjusting mechanisms are arranged between the two supporting rods (4) and the base (1), and threaded rods (6) in threaded connection with the upper plate (3) are arranged in a penetrating manner, the bottom of the threaded rod (6) is fixedly connected with a pressing disc (5).

2. The chip clamping device for the serial pressure corrosion of the semiconductor chips as claimed in claim 1, wherein the base (1), the bottom plate (2), the upper plate (3) and the pressing plate (5) are all circular plates, and the bottom plate (2) and the pressing plate (5) are all made of rubber.

3. The chip holding apparatus for serial pressure etching of semiconductor chips as claimed in claim 1, wherein the fixing bar (12) and the two support bars (4) are distributed in an isosceles triangle.

4. The chip clamping device for the series-pressure corrosion of the semiconductor chip as recited in claim 1, wherein a first handle (7) is fixedly connected to the upper end of the threaded rod (6), and a first rubber sleeve is sleeved outside the first handle (7).

5. The chip clamping device for the serial pressure corrosion of the semiconductor chip as recited in claim 1, wherein the adjusting mechanism comprises a moving groove (8) disposed on the base (1), the supporting rod (4) extends into the moving groove (8) and is slidably connected with the moving groove, an adjusting screw (10) is rotatably connected in the moving groove (8), the adjusting screw (10) penetrates through the supporting rod (4) and is in threaded connection with the supporting rod, a second handle (11) is fixedly connected to the other end of the adjusting screw (10), and a second rubber sleeve is sleeved on the second handle (11).

6. The chip clamping device for the serial pressure corrosion of the semiconductor chips as claimed in claim 5, wherein the supporting rod (4) is provided with a threaded sleeve (9) in a penetrating manner, and the adjusting screw (10) penetrates through the threaded sleeve (9) and is in threaded connection with the threaded sleeve.

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