CN212648193U - Wafer film pasting device - Google Patents
Wafer film pasting device Download PDFInfo
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- CN212648193U CN212648193U CN202021734797.5U CN202021734797U CN212648193U CN 212648193 U CN212648193 U CN 212648193U CN 202021734797 U CN202021734797 U CN 202021734797U CN 212648193 U CN212648193 U CN 212648193U
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Abstract
The utility model discloses a wafer pad pasting device, it can realize the automatic adjustment of wafer direction, the follow-up manufacturing procedure of being convenient for goes on, can realize automatic pad pasting simultaneously, time saving and labor saving, can improve production efficiency, it includes the pad pasting platform, cut membrane mechanism, draw membrane mechanism, die pressing mechanism, the middle part of pad pasting platform is provided with the rotatable carousel that is used for placing the wafer, it includes the cutter that is used for the membrane cutting to cut membrane mechanism, draw membrane mechanism to include new membrane gyro wheel, useless membrane gyro wheel, supporting roller, the both ends of membrane are convoluteed respectively in new membrane gyro wheel, useless membrane gyro wheel, the middle part of membrane is driven along the top of wafer under supporting roller supporting role, die pressing mechanism includes the die pressing gyro wheel, the die pressing gyro wheel is used for pasting the membrane in the back of wafer, it still includes positioner, carousel drive arrangement, a controller, positioner includes the image acquisition device who corresponds with the carousel, image acquisition device, The turntable driving device is electrically connected with the controller.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package, specifically be a wafer pad pasting device.
Background
With the continuous progress of science and technology and the continuous development of society, wafers are widely applied as the basis of the packaging semiconductor industry, the size of the wafers is larger and larger, but the packaging equipment is mainly small in size at present, the service life of a machine table is longer, resource waste is easily caused by direct elimination, the wafers with large sizes need to be split for the maximum utilization rate of the machine table, but the split wafers are still realized by adopting a manual film pasting mode, the film pasting mode wastes time and labor, the production efficiency is seriously influenced, the wafers are easy to be partially pasted, the film pasting waste is easily caused, and the direction error during scribing and mounting is also easily caused.
SUMMERY OF THE UTILITY MODEL
To exist not enough among the prior art, the utility model provides a wafer pad pasting device, the device can realize wafer direction automatic adjustment, and the follow-up manufacturing procedure of being convenient for goes on, can realize automatic pad pasting simultaneously, and labour saving and time saving can improve production efficiency.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
a wafer film sticking device comprises a film sticking table, a film cutting mechanism, a film pulling mechanism and a die pressing mechanism, and is characterized in that the rotatable turntable for placing a wafer is arranged in the middle of the film sticking table, the film cutting mechanism comprises a cutter for cutting the film, the film pulling mechanism comprises a new film roller, a waste film roller and a supporting roller, two ends of the film are respectively wound on the new film roller and the waste film roller, the middle of the film is driven along the top end of the wafer under the supporting action of the supporting roller, the die pressing mechanism comprises a die pressing roller, and the die pressing roller is used for sticking the film on the back of the wafer;
the automatic positioning device comprises a positioning device, a turntable driving device and a controller, wherein the positioning device comprises an image acquisition device corresponding to the turntable, and the image acquisition device and the turntable driving device are electrically connected with the controller.
It is further characterized in that:
the cutting device comprises a cutter driving device, a first roller driving device and a second roller driving device, wherein the cutter driving device, the first roller driving device and the second roller driving device are all electrically connected with the controller;
the turntable driving device, the cutter driving device, the first roller driving device and the second roller driving device are all stepping motors;
the novel film laminating machine further comprises a roller supporting frame, the novel film roller and the waste film roller are fixed to one side of the film laminating table through the roller supporting frame, the pressing die roller is fixed to the other side of the film laminating table through the roller supporting frame, the supporting rollers comprise at least four rollers, two of the supporting rollers are located on two sides of the bottom end of the film laminating table, the other two of the supporting rollers are located on two sides of the top end of the film laminating table, one end of a film is wound on the novel film roller, and the other end of the film is sequentially driven along the bottom end and the top end of the film laminating table and above the wafer under the supporting and rotating effects of the supporting rollers and is wound on the waste film roller;
the die pressing mechanism further comprises guide rails distributed on two sides of the film sticking table, two ends of the die pressing roller are supported on the guide rails and move along the upper surface of the wafer under the action of a second roller driving device and a chain transmission device, and the film is located between the die pressing roller and the wafer.
Adopt utility model above-mentioned structure can reach following beneficial effect:
(1) the direction of the wafer is adjusted before film pasting, the turntable is driven to drive the wafer to rotate through the image acquisition device and the turntable driving device, automatic adjustment of the direction of the wafer is achieved, direction adjustment operation is simple and fast, production efficiency is improved, and the problem that the direction is not uniform during subsequent scribing and mounting is avoided.
(2) The both ends of membrane are convoluteed respectively in new membrane gyro wheel, the useless membrane gyro wheel, and the middle part of blue membrane is at the top transmission of support roller supporting action down along the wafer, reuse press mold gyro wheel carries out the press mold, the automatic pad pasting operation of wafer has been realized, the cutter can be convoluteed in the useless membrane gyro wheel along remaining useless membrane behind the blue membrane of wafer outer fringe cutting, the automatic recovery of useless membrane has been realized, the pad pasting of wafer and useless membrane recovery operation are all realized through the pad pasting platform, degree of automation is high, and production efficiency is greatly improved.
Drawings
Fig. 1 is a schematic front view of the utility model (not including the guide rail and the roller support frame);
FIG. 2 is a schematic top view of the film laminating table and the mold pressing mechanism of the utility model;
FIG. 3 is a block diagram of the system of the present invention;
fig. 4 is a flow chart of the wafer film pasting using the device of the present invention.
Detailed Description
Referring to fig. 1, 2 and 3, a wafer film sticking device comprises a film sticking table 1, a film cutting mechanism 3 for cutting a blue film 2 and corresponding to the upper part of the film sticking table 1, a film pulling mechanism 4 and a die pressing mechanism 5, wherein the middle part of the film sticking table 1 is provided with a turntable 11 for placing a wafer 6 and structurally matching with the wafer 6 and a turntable driving device for driving the turntable 11 to rotate, and the turntable driving device is a first stepping motor 12;
the film cutting mechanism 3 comprises a cutter 31 corresponding to the outer edge of the wafer 6 and matched with the shape of the wafer 6, a cutter driving device for driving the cutter 31 to rotate, and a lifting module 32 for driving the cutter 31 to lift, wherein the cutter driving device is a second stepping motor 33, and a lifting motor in the lifting moving module 32 is 34;
the film drawing mechanism 4 comprises a new film roller 41, a waste film roller 42, a supporting roller 43, and a first roller driving device for respectively driving the new film roller 41, the waste film roller 42, and the supporting roller 43 to rotate, wherein the first roller driving device comprises at least three third step motors 44 (not shown in the figure), the new film roller 41, the waste film roller 42, and the supporting roller 43 are respectively fixed on two sides of the film sticking table 1 through roller supporting frames 44, in the embodiment, the supporting roller 43 comprises seven rollers, two of which (indicated by reference numeral 43-1 in the figure) are located on two sides of the bottom end of the film sticking table 1, two of which (indicated by reference numeral 43-2 in the figure) are located on two sides of the top end of the film sticking table 1, one end of the blue film 7 is wound on the new film roller 41, and the other end of the blue film is sequentially driven along the bottom end, the top end, and the top end of the wafer 6, and wound around the waste film roll 42;
the die pressing mechanism 5 comprises a die pressing roller 51, guide rails 52 distributed on two sides of the film sticking table 1, a second roller driving device and a transmission mechanism for driving the die pressing roller 51 to reciprocate along the guide rails, the second roller driving device is a fourth stepping motor 53, the connection of the first stepping motor 12 to the fourth stepping motor 53 and the transmission mechanism with each roller can adopt the prior art, so that the die pressing roller 51 does not shown in the figure, the die pressing roller 51 reciprocates along the guide rails 52 under the driving action of the fourth stepping motor 53 and the transmission mechanism, and the blue film 7 is positioned between the die pressing roller 51 and the wafer 6, so that the blue film 7 is stuck on the outer surface of the wafer 6 under the extrusion action of the die pressing roller;
the automatic wafer positioning device further comprises a positioning device and a controller 8, wherein the positioning device comprises an image acquisition device 9 corresponding to the rotary table, the image acquisition device 9 is a camera with high precision and high resolution and any type, a lens of the camera corresponds to a wafer, and the camera, the first stepping motor 12 to the fourth stepping motor 53 and the lifting motor are all electrically connected with the controller 8.
Referring to fig. 4, a wafer film pasting method includes the following steps: placing the wafer on a film sticking table, wherein the wafer is round, 1/2 wafers, 1/4 wafers or 1/8 wafers; adjusting the direction of the wafer to enable the first electrodes of the wafer to be processed to face the same direction; using a film sticking machine to stick a film on the wafer, and placing the wafer in front of a film sticking table, slicing the wafer by using a slicing machine, wherein the size of the wafer before slicing can be 18 inches, 12 inches, 8 inches or 6 inches (but is not limited to 18 inches, 12 inches, 8 inches or 6 inches); cutting the circular wafer according to 1/2, 1/4 or 1/8 structures to obtain 1/2, 1/4 or 1/8 wafers; in step S1, when the wafer is placed on the film sticking table, the front surface of the wafer faces upward and the back surface faces downward, and the front surface of the wafer is provided with the first electrode and the second electrode.
The method and the device for sticking the film to the 1/4 wafers comprise the following steps:
s1, cutting the round wafer by a cutting machine according to a 1/4 structure to obtain 1/4 wafers;
s2, placing 1/4 wafer wafers on the turntable 11 of the film sticking table 1;
and S3, adjusting the direction of the wafer:
s31, the controller 8 controls the camera to collect the image information of the wafer 6, the camera sends the image information to the controller 8, and the controller 8 converts the image information into position information;
s32, the controller controls the first stepping motor 12 to drive the turntable 11 to drive the wafer 6 to rotate according to the position information, automatic initial positioning of the wafer 6 is achieved, the camera is used for collecting image information, the controller 8 adopts the existing image processing mode to convert the image information into the position information, and the control mode that the controller sends an electric signal to the first stepping motor according to the position information can be achieved by adopting the prior art; after the initial positioning of the wafer, the problem of the direction of the subsequent processing procedure of the wafer is not needed to be worried about, the convenience is provided for subsequent repackaging, and the working efficiency and the precision of the blue film of the wafer are improved;
s4, automatic film pasting of the wafer:
s41, the controller 8 controls the fourth stepping motor 53 to drive the die roller 51 to reciprocate along the guide rail 52, so that the blue film 7 is attached to the outer surface of the wafer 6;
s42, after the film is pasted on the wafer, the controller 8 controls the lifting motor in the lifting module 32 to drive the cutter 31 to move towards the direction of the wafer 6, and controls the second stepping motor 33 to drive the cutter 31 to rotate and cut along the edge of the wafer 6, so that the cutting operation of the blue film 7 is realized, the blue film pasted on 1/4 wafers after cutting is circular, the circular blue film is convenient to cut, and meanwhile, the blue film is ensured to be capable of completely covering 1/4 wafers; the waste film remained after the cutter 31 cuts the blue film 7 along the outer edge of the wafer 6 can be wound on the waste film roller 42, so that the automatic recovery of the waste film is realized, the manual recovery is not needed, the time and the labor are saved, and the production efficiency is greatly improved;
s5, after the film pasting is finished, the wafer after the film pasting is moved to the next procedure by the manipulator, the execution end of the manipulator is provided with a sucker for sucking the wafer, the sucker is a wafer claw which is used for grabbing the wafer in the prior art, when the manipulator grabs the wafer and moves the wafer to the next station, the wafer always keeps the initial position in S3, and the problem that the wafer direction is wrong during the subsequent scribing and mounting is avoided.
When the wafer size is less, for example when the wafer size is 6 cun, can not cut the operation to the wafer, directly place circular wafer in the utility model discloses on the pad pasting device, can realize automatic pad pasting operation, when the wafer size is great, for example when the wafer size is 12 cun, and when adopting small-size pad pasting device can't realize this jumbo size wafer pad pasting, can cut apart this 12 cun wafers according to the 1/4 structure, 1/4 wafers after cutting apart are fan-shaped, and the size reduces greatly, consequently can place the small-size pad pasting operation on the device with 1/4 wafers, it need not redesign large-scale pad pasting device, adopt the utility model discloses the pad pasting operation of the wafer piece of different size specifications can be realized to the pad pasting device, and the commonality is good, has practiced thrift equipment resource, has reduced the input cost.
What has been described above is only a preferred embodiment of the present application, and the present invention is not limited to the above examples. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and concepts of the invention are to be considered within the scope of the invention.
Claims (8)
1. A wafer film sticking device comprises a film sticking table, a film cutting mechanism, a film pulling mechanism and a die pressing mechanism, and is characterized in that a rotatable turntable for placing a wafer is arranged in the middle of the film sticking table, the film cutting mechanism comprises a cutter for cutting a film, the film pulling mechanism comprises a new film roller, a waste film roller and a supporting roller, two ends of the film are respectively wound on the new film roller and the waste film roller, the middle of the film is driven along the top end of the wafer under the supporting action of the supporting roller, the die pressing mechanism comprises a die pressing roller, and the die pressing roller is used for sticking the film on the back of the wafer;
the automatic positioning device comprises a positioning device, a turntable driving device and a controller, wherein the positioning device comprises an image acquisition device corresponding to the turntable, and the image acquisition device and the turntable driving device are electrically connected with the controller.
2. The wafer film laminating apparatus according to claim 1, wherein: the cutting device comprises a cutter driving device, a first roller driving device and a second roller driving device, wherein the cutter driving device, the first roller driving device and the second roller driving device are all electrically connected with the controller.
3. The wafer film laminating apparatus according to claim 2, wherein: it still includes the gyro wheel support frame, new membrane gyro wheel, useless membrane gyro wheel pass through the gyro wheel support frame is fixed in one side of pad pasting platform, the moulding-die gyro wheel passes through the gyro wheel support frame is fixed in the opposite side of pad pasting platform, the supporting roller includes four at least, and two of them are located the bottom both sides of pad pasting platform, two other are located the top both sides of pad pasting platform, the one end of membrane is convoluteed in new membrane gyro wheel, the other end is in follow in proper order under supporting roller supports and the rotation effect the bottom of pad pasting platform, the top of wafer transmission to convolute in useless membrane gyro wheel.
4. The wafer film laminating apparatus according to claim 3, wherein: the die pressing mechanism further comprises guide rails distributed on two sides of the film sticking table, two ends of the die pressing roller are supported on the guide rails and move along the upper surface of the wafer under the action of a second roller driving device and a chain transmission device, and the film is located between the die pressing roller and the wafer.
5. The wafer lamination device according to any one of claims 1 or 4, wherein the wafer has a size of 18 inches, 12 inches, 8 inches or 6 inches.
6. The wafer laminating device of claim 5, wherein before the wafer is placed on the laminating table, the wafer is divided, and the circular wafer is cut according to 1/2, 1/4 or 1/8 structures to obtain 1/2, 1/4 or 1/8 wafers.
7. The wafer film laminating device according to claim 6, wherein the front surface of the wafer is arranged with the first electrode and the second electrode, and the front surface of the wafer is arranged with the first electrode and the second electrode facing downwards and the back surface facing upwards.
8. The wafer film pasting device as claimed in claim 7, wherein the pasting film is a blue film, a UV film or a PET substrate film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021734797.5U CN212648193U (en) | 2020-08-18 | 2020-08-18 | Wafer film pasting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021734797.5U CN212648193U (en) | 2020-08-18 | 2020-08-18 | Wafer film pasting device |
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| Publication Number | Publication Date |
|---|---|
| CN212648193U true CN212648193U (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021734797.5U Active CN212648193U (en) | 2020-08-18 | 2020-08-18 | Wafer film pasting device |
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| CN (1) | CN212648193U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114735275A (en) * | 2022-05-13 | 2022-07-12 | 上海宏轶电子科技有限公司 | Full-automatic BG sticking film machine |
| CN115285420A (en) * | 2022-08-30 | 2022-11-04 | 华天科技（西安）有限公司 | Automatic film sticking machine |
| CN115662917A (en) * | 2022-08-15 | 2023-01-31 | 深圳市新晶路电子科技有限公司 | Film covering device and method for wafer |
| CN116653031A (en) * | 2023-06-09 | 2023-08-29 | 深圳市博辉特科技有限公司 | Be used for blue membrane of wafer to cut membrane mechanism |
-
2020
- 2020-08-18 CN CN202021734797.5U patent/CN212648193U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114735275A (en) * | 2022-05-13 | 2022-07-12 | 上海宏轶电子科技有限公司 | Full-automatic BG sticking film machine |
| CN115662917A (en) * | 2022-08-15 | 2023-01-31 | 深圳市新晶路电子科技有限公司 | Film covering device and method for wafer |
| CN115662917B (en) * | 2022-08-15 | 2023-11-28 | 深圳市伟方成科技有限公司 | Film laminating device for wafer and method thereof |
| CN115285420A (en) * | 2022-08-30 | 2022-11-04 | 华天科技（西安）有限公司 | Automatic film sticking machine |
| CN116653031A (en) * | 2023-06-09 | 2023-08-29 | 深圳市博辉特科技有限公司 | Be used for blue membrane of wafer to cut membrane mechanism |
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