CN212634647U

CN212634647U - Plasma cutting platform

Info

Publication number: CN212634647U
Application number: CN202021513124.7U
Authority: CN
Inventors: 耿益民; 蒙建平; 刘从斌; 李政; 胡进; 刘晓龙
Original assignee: Yichang Gima Precision Technology Co ltd
Current assignee: Yichang Gima Precision Technology Co ltd
Priority date: 2020-07-27
Filing date: 2020-07-27
Publication date: 2021-03-02
Anticipated expiration: 2030-07-27

Abstract

The utility model provides a plasma cutting platform, which comprises a frame, wherein slide rails are arranged on two sides of the top of the frame, and a cutting frame is arranged on the slide rails in a sliding manner; the top of the frame is provided with a die carrier at the inner side of the slide rail, and the top of the die carrier is provided with a sliding device; a bearing table is arranged in the die frame and comprises bearing sheets which are fixed on the die frame and distributed in an array manner, and bearing points are arranged at the top of the bearing sheets; and a chip removal device is arranged below the rack. The utility model utilizes the bearing pieces distributed in array and arranges even bearing points on the bearing pieces, so that the plate is more stable when being cut, and the cutting gun can not interfere when walking; meanwhile, the chip removal device is designed to collect the chips and prevent the chips from scattering on the ground.

Description

Plasma cutting platform

Technical Field

The utility model relates to a plasma cutting machine field especially relates to a plasma cutting platform.

Background

In the process of processing and manufacturing a metal structure, metal materials are often required to be cut, and particularly, the cutting of a steel plate is common; a programmable semi-automatic or full-automatic cutting machine is generally adopted for cutting large-sized steel plates, and the conventional semi-automatic or full-automatic cutting machine is generally used for plasma cutting.

In the plasma cutting process, under general conditions, the lower part of a plate to be cut is generally in an empty state in order to facilitate the walking of a cutting gun, and the condition can cause slight deformation for certain plate plates with insufficient rigidity, which can cause uneven cuts and even influence the precision of cutting size; or some supporting points are arranged according to the cutting shape, but the using limitation of the supporting points is large; in addition, although plasma cutting belongs to cutting with small loss, some chips are still inevitably generated, and the chips can directly fall on the ground, so that the cleaning is inconvenient, and the workshop environment is poor.

Therefore, it is desirable to design a plasma cutting platform that is easy to carry and that can collect debris.

SUMMERY OF THE UTILITY MODEL

The utility model discloses waiting to cut panel when cutting to among the prior art and taking place deformation easily and the piece can scatter the problem on the ground, designed a cutting platform, for waiting to cut panel and provide sufficient strong point, collect the piece simultaneously.

The utility model discloses a realize through following technical scheme:

a plasma cutting platform comprises a rack, wherein slide rails are arranged on two sides of the top of the rack, and a cutting frame is arranged on the slide rails in a sliding manner; the top of the frame is provided with a die carrier at the inner side of the slide rail, and the top of the die carrier is provided with a sliding device; a bearing table is arranged in the die frame and comprises bearing sheets which are fixed on the die frame and distributed in an array manner, and bearing points are arranged at the top of the bearing sheets; and a chip removal device is arranged below the rack.

Compared with the prior art, the utility model utilizes the bearing sheets distributed in array and arranges even bearing points on the bearing sheets, so that the plate is more stable when being cut, and the cutting gun can not interfere with the running; meanwhile, the chip removal device is designed to collect the chips and prevent the chips from scattering on the ground.

Drawings

Fig. 1 is a schematic structural diagram of a plasma cutting platform die carrier and a chip removal port (without a cutting frame) according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a roller seat of a plasma cutting platform according to an embodiment of the present invention.

Fig. 3 is a schematic structural view of a roll cross section of a plasma cutting platform according to an embodiment of the present invention.

The reference numbers are as follows:

1. a frame; 2. a slide rail; 3. a mold frame; 4. a sliding device; 5. a bearing table; 6. a bearing point; 7. a chip removal device; 8. a carrier sheet; 9. a support plate; 10. a roller seat; 11. a bearing; 12. a universal roller; 13. an end cap; 14. a chip removal port; 15. a scrap storage bin; 16. a chip removal plate; 17. and (4) riveting.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

A plasma cutting platform comprises a rack 1, wherein slide rails 2 are arranged on two sides of the top of the rack 1, a cutting frame is arranged on the slide rails 2 in a sliding manner, can reciprocate on the slide rails 2 and is generally installed in a drag chain manner; the cutting frame comprises a plasma cutting gun and other auxiliary mechanisms such as an air blowing pipe connected with an air compressor and the like, the plasma cutting gun and the other auxiliary mechanisms are integrated on the cutting frame, and can slide on the cutting frame by being pulled by an air cylinder or a drag chain, and the prior art can be specifically referred; a die carrier 3 is arranged at the top of the frame 1 and positioned at the inner side of the sliding rail 2, and a sliding device 4 is arranged at the top of the die carrier 3; a bearing table 5 is arranged in the die carrier 3, the bearing table 5 comprises bearing sheets 8 which are fixed on the die carrier 3 and distributed in an array manner, and bearing points 6 are arranged at the tops of the bearing sheets 8; a chip removal device 7 is arranged below the machine frame 1.

In this embodiment, as shown in fig. 1, the mold frame 3 is a rectangular frame, and with the frame 1 is integrated into one piece, the bearing sheet 8 is vertically fixed on the mold frame 3, the bearing sheet 8 is a sheet, the top is set to be a sawtooth shape, and is adjacent to the bearing sheet 8 which is parallel to each other and is set at equal intervals. In order to ensure the stability of the bearing sheet 8, the bottom of the bearing sheet 8 is also provided with a supporting plate 9 which is perpendicular to the bearing sheet 8, and two ends of the supporting plate 9 are fixed on the die carrier 3. The sawteeth vertexes of all the bearing pieces 8 form a group of parallel straight lines, a walking channel of the cutting gun is formed among the straight lines, and even when the cutting gun needs to cut the positions of the addendum points of the saw, surrounding points can play a supporting role.

In this embodiment, as shown in fig. 2, the sliding device 4 includes a roller seat 10 fixed on the mold frame 3, and a universal roller 12 is disposed in the roller seat 10. The roller seat 10 is fixed in a groove at the top of the die carrier 3 through a rivet 17, a universal bearing 11 is arranged in the roller seat 10, a universal roller 12 is arranged in the universal bearing 11, and an end cover 13 is arranged on the roller seat 10 and used for pressing the universal roller 12 and the bearing 11. The height of the plane of the upper surface of the bearing sheet 8 and the height of the plane of the top of the sliding device 4 are in the same horizontal plane. The universal idler wheel 12 and the bearing sheet 8 play a role of bearing the plate together, and the sharp points of the sawteeth also play a limiting role during cutting to prevent the saw teeth from moving. Meanwhile, the bearing table 5 can be set to be a structure which can move up and down and is adjusted by an oil cylinder, and the loading, unloading and moving and position adjustment of the plate by the roller are facilitated.

In this embodiment, as shown in fig. 3, chip removal device 7 is including the chip removal mouth 14 that is located the piece 8 below of bearing, chip removal mouth 14 is big-end-up's loudspeaker form, is formed by four chip removal boards 16 concatenation, the piece 8 bottom and the inboard setting of die carrier 3 are hugged closely in chip removal board 16 top, and there is the distance bottom apart from the mounting plane of frame 1 place. The bottom of the chip removal port 14 is provided with a chip storage bin 15, the chip storage bin 15 is slidably mounted at the bottom of the frame 1, and can be a drawer type, a free tray with rollers or a plurality of small parallel trays. The generated scrap iron falls into the scrap discharging port 14 from the gap between the bearing sheets 8 and then slides down into the scrap storage bin 15 along the inclined surface of the scrap discharging port 14, part of the scrap iron is adhered to the scrap discharging port 14 and can be blown down by compressed air after the cutting is finished, and the scrap storage bin 15 is directly drawn out and transported out of a special storage point after the cutting is finished, so that a large amount of cleaning work is reduced.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A plasma cutting platform is characterized by comprising a rack, wherein slide rails are arranged on two sides of the top of the rack, and a cutting frame is arranged on the slide rails in a sliding manner; the top of the frame is provided with a die carrier at the inner side of the slide rail, and the top of the die carrier is provided with a sliding device; a bearing table is arranged in the die frame and comprises bearing sheets which are fixed on the die frame and distributed in an array manner, and bearing points are arranged at the top of the bearing sheets; and a chip removal device is arranged below the rack.

2. The plasma cutting platform of claim 1, wherein the frame is a rectangular frame and is integrally formed with the frame, the carrier sheet is vertically and fixedly disposed on the frame, the carrier sheet is sheet-shaped, the top of the carrier sheet is zigzag, and the adjacent carrier sheets are parallel to each other and disposed at equal intervals.

3. The plasma cutting platform of claim 1, wherein the sliding means comprises a roller base secured to the frame, the roller base having a universal roller disposed therein.

4. The plasma cutting platform of claim 1, wherein the chip removal device comprises a chip removal port located below the carrier sheet, the chip removal port is in a horn shape with a large top and a small bottom and is formed by splicing four chip removal plates, the top end of each chip removal plate is tightly attached to the bottom of the carrier sheet and the inner side of the die carrier, and the bottom of each chip removal plate is distant from a mounting plane where the die carrier is located.

5. The plasma cutting platform as claimed in claim 4, wherein the chip storage bin is arranged at the bottom of the chip discharge port, and the chip storage bin is slidably mounted at the bottom of the machine frame.

6. The plasma cutting platform of claim 1, wherein the cutting rack is mounted on a slide rail using a drag chain.

7. The plasma cutting platform of claim 2, wherein the upper surface of the carrier plate is in the same horizontal plane as the top of the slide.

8. The plasma cutting platform of claim 2, wherein a support plate perpendicular to the carrier plate is further disposed at the bottom of the carrier plate, and both ends of the support plate are fixed to the mold frame.