CN212628648U

CN212628648U - Novel SMT carrier

Info

Publication number: CN212628648U
Application number: CN202021325270.7U
Authority: CN
Inventors: 陈海军
Original assignee: Wan'an Yugao Electronic Technology Co ltd
Current assignee: Wan'an Yugao Electronic Technology Co ltd
Priority date: 2020-07-08
Filing date: 2020-07-08
Publication date: 2021-02-26
Anticipated expiration: 2030-07-08

Abstract

The utility model discloses a novel SMT carrier, which comprises a carrier body and a pick-up device; the middle part of the carrier body is provided with a heat dissipation cavity; a plurality of grooves are formed in the periphery of the outer wall of the heat dissipation cavity; a supporting plate is arranged in the groove and is fixedly connected to the lower wall of the groove through an elastic part; a magnetic part is arranged above the supporting plate and clamped in the groove through a clamping block arranged at a corresponding position above the inner wall of the groove; a carrier plate is arranged at the upper part of the heat dissipation cavity, and a fixing plate is arranged between the carrier plate and the carrier body; a plurality of support columns can be detachably connected to the fixing plate; the bottom ends of the two sides of the extracting device are respectively movably connected to the inner walls of the two sides of the carrier plate body. The utility model discloses not only have splendid radiating effect, conveniently change the PCB board, and conveniently take out the PCB board.

Description

Novel SMT carrier

Technical Field

The utility model relates to a circuit board technical field, more specifically the utility model relates to a novel SMT carrier that says so.

Background

SMT is a surface assembly technique, the most popular technique and process in the electronic assembly industry. The electronic circuit surface mounting technology is called surface mounting or surface mounting technology, and is a circuit connecting technology in which surface mounted components without pins or short leads are mounted on the surface of a PCB board or other substrates and then soldered or assembled by means of reflow soldering, dip soldering or the like. In the processing process of the PCB, a carrier is needed to fix and clamp the PCB, so that an SMT carrier is needed, but the existing SMT carrier can generate certain heat during soldering, and the heat dissipation effect is poor; and the PCB is inconvenient to take out, which wastes time and labor.

Therefore, it is an urgent technical problem to be solved by those skilled in the art to provide a novel SMT carrier that not only has excellent heat dissipation effect, but also facilitates taking out of a PCB.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a novel SMT carrier for solve above-mentioned technical problem.

In order to solve the technical problem, the utility model discloses following technical scheme has been taken:

a novel SMT carrier comprises a carrier body and a picking device; the middle part of the carrier body is provided with a heat dissipation cavity; a plurality of grooves are formed in the periphery of the outer wall of the heat dissipation cavity; a supporting plate is arranged in the groove and is fixedly connected to the lower wall of the groove through an elastic part; a magnetic part is arranged above the supporting plate and clamped in the groove through a clamping block arranged at a corresponding position above the inner wall of the groove; a carrier plate is arranged at the upper part of the heat dissipation cavity, and a fixing plate is arranged between the carrier plate and the carrier body; a plurality of support columns can be detachably connected to the fixing plate;

the bottom ends of the two sides of the extracting device are respectively movably connected to the inner walls of the two sides of the carrier plate body.

Preferably, the two ends of the extracting device are arranged in a hand grip shape.

Preferably, the inner walls of the two sides of the carrier plate body are provided with sliding grooves, and the bottom ends of the two sides of the extraction device are in sliding connection with the carrier plate body through the sliding grooves.

Preferably, the two sides of the heat dissipation cavity are respectively communicated with a heat dissipation pipe, the middle part of the heat dissipation cavity is provided with a plurality of heat dissipation holes on the surface, and the heat dissipation holes are communicated with the heat dissipation cavity.

Preferably, the elastic member is a spring.

Preferably, the magnetic member is a magnetic steel sheet.

The utility model discloses for prior art gain following technological effect:

1) the lifting plate is arranged on the SMT carrier plate, so that a user can grasp the lifting plate by hand to pull upwards, the bearing block at the lower end of the lifting plate can drive the PCB to move upwards, and when the PCB is separated from the limit of the SMT carrier plate, the PCB can be grasped by hand to pull forwards to separate the support of the bearing block, thereby realizing the advantage of conveniently taking down the PCB;

2) the heat dissipation cavity is formed in the carrier body, so that heat generated in the soldering process of the carrier enters the heat dissipation cavity through the heat dissipation holes and flows out through the heat dissipation pipe;

3) and through fixed mounting there is the spring in the recess, the one end of spring is connected with the bottom of backup pad, installs magnet between the fixture block in the backup pad, and the fixture block carries out the chucking effect to magnet, and magnet can carry out the adsorption to the carrier board, can be fine carry out the fixed action to the carrier board, and it is more convenient to operate, and when the spring was not in compression state, magnet stretched out the recess moreover, and this is also more convenient to the change of magnet.

Drawings

Fig. 1 is a schematic structural view of a novel SMT carrier of the present invention;

in the figure: 1. a carrier body; 11. a heat dissipation cavity; 12. a groove; 13. a support plate; 14. a spring; 15. a magnetic steel sheet; 16. a clamping block; 17. a fixing plate; 18. a support pillar; 2. an extraction device; 3. a radiating pipe; 4. heat dissipation holes; 5. and a carrier plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1, a novel SMT carrier includes a carrier body 1 and a pick-up device 2;

the middle part of the carrier body 1 is provided with a heat dissipation cavity 11; a plurality of grooves 12 are formed in the periphery of the outer wall of the heat dissipation cavity; a supporting plate 13 is arranged in the groove 12, and the supporting plate 13 is fixedly connected to the lower wall of the groove 12 through a spring 14; a magnetic steel sheet 15 is arranged above the supporting plate 13, and the magnetic steel sheet 15 is clamped in the groove 12 through a clamping block 16 arranged at a corresponding position above the inner wall of the groove 12; a carrier plate 5 is arranged at the upper part of the heat dissipation cavity 11, and a fixing plate 17 is arranged between the carrier plate 5 and the carrier body 1; a plurality of supporting columns 18 can be detachably connected to the fixing plate 17;

the bottom ends of two sides of the extracting device 2 are respectively movably connected to the inner walls of two sides of the carrier plate body 1.

In this embodiment, the two end positions of the extracting device 2 are arranged in a hand grip shape.

In this embodiment, the inner walls of the two sides of the carrier body 1 are provided with sliding grooves, and the bottom ends of the two sides of the extracting device 2 are slidably connected to the carrier body 1 through the sliding grooves.

In some embodiments, the two sides of the heat dissipation chamber 11 are respectively communicated with the heat dissipation pipe 3, the middle surface of the heat dissipation chamber 11 is provided with a plurality of heat dissipation holes 4, and the heat dissipation holes 4 are communicated with the heat dissipation chamber 11.

In other embodiments, the support posts 18 may be reasonably and evenly distributed around the carrier plate 5 according to actual needs.

The lifting plate is arranged on the SMT carrier plate, so that a user can grasp the lifting plate by hand to pull upwards, the bearing block at the lower end of the lifting plate can drive the PCB to move upwards, and when the PCB is separated from the limit of the SMT carrier plate, the PCB can be grasped by hand to pull forwards to separate the support of the bearing block, thereby realizing the advantage of conveniently taking down the PCB; the heat dissipation cavity is formed in the carrier body, so that heat generated in the soldering process of the carrier enters the heat dissipation cavity through the heat dissipation holes and flows out through the heat dissipation pipe; and through fixed mounting there is the spring in the recess, the one end of spring is connected with the bottom of backup pad, installs magnet between the fixture block in the backup pad, and the fixture block carries out the chucking effect to magnet, and magnet can carry out the adsorption to the carrier board, can be fine carry out the fixed action to the carrier board, and it is more convenient to operate, and when the spring was not in compression state, magnet stretched out the recess moreover, and this is also more convenient to the change of magnet.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.

Claims

1. A novel SMT carrier is characterized by comprising a carrier body (1) and a picking device (2); the middle part of the carrier body (1) is provided with a heat dissipation cavity (11); a plurality of grooves (12) are formed in the periphery of the outer wall of the heat dissipation cavity; a supporting plate (13) is arranged in the groove (12), and the supporting plate (13) is fixedly connected to the lower wall of the groove (12) through an elastic piece (14); a magnetic part (15) is arranged above the supporting plate (13), and the magnetic part (15) is clamped in the groove (12) through a clamping block (16) arranged at a corresponding position above the inner wall of the groove (12); a carrier plate (5) is arranged at the upper part of the heat dissipation cavity (11), and a fixing plate (17) is arranged between the carrier plate (5) and the carrier body (1); a plurality of supporting columns (18) can be detachably connected to the fixing plate (17);

the bottom ends of the two sides of the extracting device (2) are respectively and movably connected to the inner walls of the two sides of the carrier body (1).

2. A novel SMT carrier as defined in claim 1, wherein said pick up means (2) is arranged with fingers at both ends.

3. A novel SMT carrier as defined in claim 1, wherein said carrier body (1) has sliding grooves on both inner walls, and said pick-up device (2) is slidably connected to said carrier body (1) through said sliding grooves.

4. A novel SMT carrier according to claim 1, wherein both sides of the heat dissipation chamber (11) are respectively connected to a heat dissipation tube (3), the middle surface of the heat dissipation chamber (11) is provided with a plurality of heat dissipation holes (4), and the heat dissipation holes (4) are connected to the heat dissipation chamber (11).

5. A novel SMT carrier as claimed in claim 1, wherein said resilient member (14) is a spring.

6. A novel SMT carrier as defined in claim 1, wherein said magnetic member (15) is a magnetic steel sheet.