CN112787617B - Base clamping and bearing clamp for subminiature surface-mounted crystal oscillator - Google Patents
Base clamping and bearing clamp for subminiature surface-mounted crystal oscillator Download PDFInfo
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- CN112787617B CN112787617B CN202011588805.4A CN202011588805A CN112787617B CN 112787617 B CN112787617 B CN 112787617B CN 202011588805 A CN202011588805 A CN 202011588805A CN 112787617 B CN112787617 B CN 112787617B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
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Abstract
The embodiment of the application provides a base clamping and bearing clamp for a subminiature surface-mounted crystal oscillator. The clamp can reliably fasten, clamp and bear the bulk material base and form a matched processing array, so that the integrated circuit chips mounted in the clamp can be efficiently and well processed in batch automatic lead bonding. In the bonding engineering, the base can be well fixed on the carrying disc, the dislocation phenomenon is avoided, the positioning precision of the bonding pad is high, the error is small, the batch automatic processing speed is high, and the bonding processing qualified rate and the bonding processing efficiency are high. The problems that in the prior art, the chip mounted on a bulk material base can only be manually picked up and is singly subjected to lead bonding processing one by one, so that the process stability and the repeatability are poor, the chip bonding quality consistency is poor, the bonding strength dispersion is large, the qualified rate is low and the like are solved.
Description
Technical Field
The invention relates to the field of crystal component processing technology, in particular to a base clamping and bearing clamp for a subminiature surface-mounted crystal oscillator.
Background
The quartz crystal oscillator is a frequency standard and selection precision time frequency element made of a quartz wafer with piezoelectric effect and an oscillation circuit. The quartz crystal oscillator has a series of excellent characteristics of small volume, light weight, high reliability, excellent frequency stability and the like, and is widely applied to the industries and fields of communication, medical treatment, aerospace, weaponry and the like.
The integrated circuit chip is used as a core component of a surface-mounted crystal oscillator element and is widely applied to design and development of crystal elements to realize the functions of an oscillating circuit and signal output.
In a crystal oscillator, an integrated circuit chip mounted inside a ceramic base needs to be processed by metal wire bonding to form an electrical connection between a chip circuit and a base circuit. The chip bonding process, one of the key links in the production process of the surface-mounted crystal oscillator, is the process of realizing the circuit connection of the crystal oscillator product, and the processing quality of the process has key influence on the electrical property, vibration resistance, impact resistance and other reliability of the product. At present, the conventional chip bonding equipment can realize single workpiece processing or batch automatic processing operation for forming electric connection by bonding metal leads between the chip and the base. However, the conventional batch processing function is only suitable for batch-wise continuous bonding processing of the whole substrate array of the substrate plate which is not separated into the individual substrates, and cannot perform continuous batch-wise fully automatic processing of the single substrate which is separated into the individual substrates.
In the field of crystal components, in order to avoid lead damage and stress damage possibly caused by separation of the base after bonding, a single bulk material base is generally used for developing and processing surface-mounted components, so that at present, only a mode of manually picking up single bases and performing lead bonding processing one by one is generally adopted. The single processing manual operation participation degree is high, pick up including the base, the position is put and is adjusted, start bonding head etc. and all need artifical the participation, process stability and repeatability are relatively poor, chip bonding quality uniformity is relatively poor, bonding strength scatters badly great, the qualification rate is lower, it is applicable in the base of the reliable centre gripping of formation of chip automatic batch lead bonding to wait urgently to develop through the design and carry a set frock, it reduces into full-page array to carry the dish with the bulk cargo, realize for military use crystal oscillator chip bonding process operation automation in batches, reduce artifical participation degree, improve process stability and product processing uniformity, reduce bonding strength and scatter badly, promote the process qualification rate.
Disclosure of Invention
The invention aims to provide a base clamping and bearing clamp for a subminiature surface-mounted crystal oscillator. The clamp can reliably fasten, bear and clamp the bulk material base and form a matched processing array, so that the integrated circuit chips mounted in the clamp can be efficiently and well processed in batch automatic lead bonding. In the bonding engineering, the base can be well fixed on the carrying disc, the dislocation phenomenon is avoided, the positioning precision of the bonding pad is high, the error is small, the batch automatic processing speed is high, and the bonding processing qualified rate and the bonding processing efficiency are high. The problems that in the prior art, chips installed on a bulk material base can only be manually picked up and individually subjected to lead bonding processing one by one, manual operations including base pickup, position placing and adjusting, starting of a bonding head and the like need manual participation, and accordingly process stability and repeatability are poor, chip bonding quality consistency is poor, bonding strength scattering is large, and qualification rate is low are solved.
In order to achieve the purpose, the invention adopts the following technical scheme:
a pedestal clamp load-bearing fixture for a subminiature surface mount crystal oscillator, comprising: the device comprises a base plate, a carrier plate, a miniature reed assembly and a cover plate;
the support plate is arranged on the bottom plate, mounting holes are formed in the support plate in an array arrangement, the miniature reed assemblies are arranged on the inner side surface of each mounting hole, the cover plate is arranged on the support plate, and base positioning loading holes corresponding to the mounting positions of the bases in the mounting holes are formed in the cover plate;
the bottom plate is used for mounting the carrier plate and the miniature reed assembly, and the bottom of the bottom plate is in close contact with the heating block of the bonding equipment to achieve good heat transfer; the mounting holes are used for bearing the base and the miniature reed assemblies and forming a base array; the miniature reed assembly is used for extruding and clamping the side surface of the base in the mounting hole; the cover plate is used for covering the support plate and pressing the miniature reed assembly, and the base positioning load hole correspondingly matches with the mounting hole to form bearing and positioning for the base.
Furthermore, a through hole corresponding to the position of the base positioning carrying hole is formed in the bottom plate, and the base positioning carrying hole can be used for supporting the base through the through hole of the bottom plate from the bottom of the tool so as to be separated from the reed and be clamped and taken out.
Furthermore, the bottom plate and the support plate are rectangular, the width of the bottom plate is larger than that of the support plate, the support plate and the bottom plate are symmetrically assembled in the width direction, rail clamping guide grooves are formed in two sides of the bottom plate, and the support plate and the bottom plate can be used for being matched with a rail clamping structure of bonding equipment to realize that the tray-carrying clamp moves in a rail clamping mode according to program requirements.
Further, the miniature reed assembly includes: miniature reed, miniature spring and miniature draw-in groove, miniature draw-in groove both ends have the notch of intercommunication, miniature reed and miniature spring are installed in miniature draw-in groove's notch, miniature spring's one end with the interior wall connection of miniature draw-in groove one side wall, miniature spring's the other end with the base of miniature reed is connected, be the elastic contact structure on the base of miniature reed, the elastic contact structure is followed miniature draw-in groove opposite side wall is outwards salient and contact with the base side.
Furthermore, a reed poking hole is formed in the base of the miniature reed, so that the fixture can be inserted into the reed poking hole to poke the miniature reed, and the miniature reed is removed to clamp the base.
Furthermore, the cover plate is provided with a shifting piece through hole corresponding to the position of the reed shifting hole, the shifting piece through hole can be inserted into the reed shifting hole, and the miniature reed is shifted to move so that the base is separated from the clamping of the miniature reed and is taken out.
The invention has the following beneficial effects:
(1) the base clamping and bearing clamp provided by the invention has the advantages that the clamping structure of the bearing disc is preferably designed, so that the bearing disc is simple in structure and convenient to load and use, the miniature reed assembly can directly clamp the base without depending on a load suction structure of equipment, the clamping force is enough to ensure the limiting accuracy and fastening, and the problems that multiple groups of the magnetic suction cover plate type bearing disc separation structure which is usually adopted at present are complicated in installation, the magnet cannot reliably adsorb and fully press the base when the cover plate is easy to deform, and the like are solved;
(2) the base clamping and bearing clamp provided by the invention adopts a porous arrangement structure and a rail clamping guide groove design, and single base of bulk materials is born and reduced into a base array through the bearing disc and is matched with conventional automatic chip bonding equipment, so that batch automatic lead bonding processing of the single base of the bulk materials is realized, and the process stability is improved;
(3) the base clamping and bearing clamp provided by the invention adopts a multilayer function board connecting and assembling structure, has low processing difficulty, can easily realize the precise size processing of the bearing hole, ensures the positioning precision of the base, and reduces the bearing error, thereby ensuring the precision of the final lead bonding position and improving the batch automatic bonding qualification rate of bulk material bases;
(4) the base clamping and bearing clamp provided by the invention adopts the design of the through hole of the bottom plate, the poking hole of the reed and the through hole of the poking sheet of the cover plate, the function of separating the base from clamping and disengaging is increased, and the base is convenient and quick to mount by the preferable structural design characteristics, so that the material damage is avoided, and the product quality is ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application.
Embodiments of the invention are described in further detail below with reference to the attached drawing figures, wherein:
FIG. 1 is a schematic view of a base plate structure;
FIG. 2 is a schematic view of a carrier structure;
FIG. 3 is a schematic view of a micro reed structure;
FIG. 4 is a schematic view of a cover plate structure;
FIG. 5 is a schematic diagram of the assembly of the base plate, the carrier plate and the micro-reed assembly
Fig. 6 is a schematic diagram illustrating a mounting structure of a base clamp for a subminiature surface mount crystal oscillator according to an embodiment of the present invention;
in fig. 1-5, 1, a base plate; 2. a carrier plate; 3. a miniature reed assembly; 4. a cover plate; 101. a through hole; 102. a rail clamping guide groove; 201. mounting holes; 301. a micro reed; 302. a micro-spring; 303. a micro card slot; 304. a reed poking hole; 401. a base positioning carrier hole; 402. and (6) a shifting sheet is used for passing through a hole.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar components in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
The invention provides a base bearing and clamping fixture for military quartz crystal components, which can reliably fasten, bear and clamp a bulk material base and form an adaptive processing array, so that integrated circuit chips mounted in the bulk material base can be efficiently and well processed by automatic wire bonding in batches. .
Specifically, referring to fig. 1 to 5, the present invention provides a base holding and carrying clamp for a subminiature surface mount crystal oscillator, comprising: the miniature spring assembly comprises a base plate 1, a carrier plate 2, a miniature spring assembly 3 and a cover plate 4;
the carrier plate 2 is positioned on the bottom plate 1, mounting holes 201 arranged in an array are formed in the carrier plate 2, the miniature reed assemblies 3 are mounted on the inner side surface of each mounting hole 201, the cover plate 4 is positioned on the carrier plate 2, and a base positioning carrier hole 401 corresponding to the mounting position of a base in the mounting hole 201 is formed in the cover plate 4;
the bottom plate 1 is used for mounting the carrier plate 2 and the miniature reed assembly 3, the bottom of the bottom plate 1 is smooth, and the bottom plate is in close contact with a heating block of a bonding device to achieve good heat transfer; the mounting holes 201 are used for bearing a base and the miniature reed assemblies 3 and forming a base array; the miniature reed assembly 3 is used for extruding and clamping the side surface of the base in the mounting hole 201; the cover plate 4 is used for covering the carrier plate 2 and pressing the miniature reed assembly 3, and the base positioning carrying hole 401 is correspondingly matched with the mounting hole 201 to carry and position the base.
Preferably, a through hole 101 corresponding to the base positioning loading hole 401 is formed in the bottom plate 1, and the through hole can be used for enabling the tool to jack the base through the bottom plate through hole 101 from the bottom so as to be separated from the reed and be clamped and taken out through the loading hole.
Preferably, the base plate 1 and the carrier plate 2 are both rectangular, the width of the base plate 1 is greater than that of the carrier plate 2, the carrier plate 2 and the base plate 1 are symmetrically assembled in the width direction, and rail clamping guide grooves 102 are formed on two sides of the base plate 1, and can be used for matching with a rail clamping structure of a bonding device to realize that the tray-carrying clamp moves in a rail clamping manner according to program requirements.
Preferably, the miniature reed assembly 3 comprises: miniature reed 301, miniature spring 302 and miniature draw-in groove 303, miniature draw-in groove 303 both ends have the notch of intercommunication, miniature reed 301 and miniature spring 302 are installed in the notch of miniature draw-in groove 303, the one end of miniature spring 302 with the interior wall connection of miniature draw-in groove 303 side wall face, the other end of miniature spring 302 with miniature reed 301's base is connected, be the elastic contact structure on miniature reed 301's the base, the elastic contact structure is followed the outside protrusion of another side wall face of miniature draw-in groove 303 and contact with the base side.
Preferably, a reed poking hole 304 is formed in the base of the miniature reed 301, and the miniature reed 301 can be poked by inserting a tool into the reed poking hole 304 to remove the clamping of the miniature reed 301 to the base.
Preferably, the cover plate 4 is provided with a pick through hole 402 corresponding to the position of the reed pick hole 304, and the pick through hole can be inserted into the reed pick hole 304 to pick the micro reed 301 to move, so that the base is separated from the clamping of the micro reed 301 and taken out.
In the specific embodiment, the detailed description of the embodiment of the present invention is continued with reference to fig. 5, and it can be seen in reference to fig. 5 that:
the carrier plate 2 is installed on the bottom plate 1 by spot welding and other methods, the carrier plate 2 and the bottom plate 1 are symmetrically assembled to form rail clamping guide grooves 102, and the rail clamping guide grooves 102 can be matched with a rail clamping structure of bonding equipment to realize that the carrier plate clamp moves in a rail clamping process according to program requirements; furthermore, the miniature reed assemblies 3 are uniformly arranged on one side of the mounting hole 201 in the width direction in a spot welding mode and the like, and the rest space size of the mounting hole is matched with the size of the base and is used for bearing the base; further, the cover plate 4 covers the carrier plate 2 and is mounted on the carrier plate 2 by spot welding or the like, and the base positioning carrier hole 401 thereon corresponds to the mounting hole 201, and the pick through hole 402 thereon corresponds to the pick hole 304. Finally, the complete assembly structure of the base clamping and bearing clamp provided by the method is formed.
The clamp can reliably fasten, bear and clamp the bulk material base and form a matched processing array, so that the integrated circuit chips mounted in the clamp can be efficiently and well processed in batch automatic lead bonding. In the bonding engineering, the base can be well fixed on the carrying disc, the dislocation phenomenon is avoided, the positioning precision of the bonding pad is high, the error is small, the batch automatic processing speed is high, and the bonding processing qualified rate and the bonding processing efficiency are high. The chip of the bulk cargo base installation that has solved the prior art existence can only adopt the manual mode of picking up, singly only carrying out the wire bonding processing one by one, and process stability and repeatability are relatively poor, and chip bonding quality uniformity is relatively poor, and bonding strength scatters the poor great, and the qualification rate is lower, machining efficiency low scheduling problem mainly includes:
(1) the disc-carrying clamp adopts the micro reed component clamping structure design, so that the disc-carrying structure is simple, when the base is loaded into the disc-carrying, the side edge of the base slightly pushes the reed on one side of the ballast hole, the reed can be easily loaded into the ballast hole, the loading operation is convenient, and meanwhile, the reed always applies thrust to the side surface of the base to clamp and fix the base in the ballast hole. The clamping force is enough to ensure the limiting accuracy and fastening, and the problems that a magnetic attraction cover plate type carrying disc separating structure which is usually adopted has complex multi-group installation, the cover plate is easy to deform, the magnet adsorption is unreliable, and the base cannot be fully pressed are solved. Meanwhile, the reed structure is tiny and occupies small space, so that the loading hole array of the loading disc can be more dense, and the processing efficiency of the single plate is high;
(2) on the basis of realizing the reliable clamping and accurate limiting of the fastening of the base, the carrier disc clamp adopts a porous arrangement structure, the single bulk material base is reduced into a base array through the carrying of the carrier disc, and the rail clamping guide grooves are formed through the size difference and the symmetrical assembly of the bottom plate and the carrier disc, so that the carrier disc can be adapted to conventional automatic chip bonding equipment, the batch automatic lead bonding processing of the single bulk material base is realized, and the process stability is improved;
(3) the carrier disc clamp disclosed by the invention integrally adopts a multilayer assembly structure, the carrier plate mounting hole and the cover plate positioning hole are designed by adopting through holes, the processing difficulty is low, the precise size processing of the base carrier hole can be easily realized, the positioning precision of the base is ensured, and the bearing error is reduced, so that the final lead bonding position precision is ensured, the batch automatic bonding qualification rate and the processing consistency of bulk material bases are improved, and the bonding strength variance is reduced;
(4) the base bearing clamping fixture provided by the invention adopts the design of the through hole of the bottom plate, the poking hole of the reed and the long through hole of the cover plate, the function of separating the base from clamping and separating is added, and the preferable structural design characteristics ensure that the base can be conveniently and quickly taken, the material damage is avoided, and the product quality is ensured.
It should be understood that the above-described embodiments of the present invention are examples for clearly illustrating the invention, and are not to be construed as limiting the embodiments of the present invention, and it will be obvious to those skilled in the art that various changes and modifications can be made on the basis of the above description, and it is not intended to exhaust all embodiments, and obvious changes and modifications can be made on the basis of the technical solutions of the present invention.
Claims (3)
1. A pedestal clamp load-bearing fixture for a subminiature surface mount crystal oscillator, comprising: the miniature spring component comprises a base plate (1), a carrier plate (2), a miniature spring component (3) and a cover plate (4);
the carrier plate (2) is mounted on the bottom plate (1), mounting holes (201) arranged in an array are formed in the carrier plate (2), the miniature reed assemblies (3) are mounted on the inner side surface of each mounting hole (201), the cover plate (4) is mounted on the carrier plate (2), and base positioning carrier holes (401) corresponding to base mounting positions in the mounting holes (201) are formed in the cover plate (4);
the bottom plate (1) is used for mounting the carrier plate (2) and the miniature reed assembly (3), and the bottom of the bottom plate (1) is in close contact with a heating block of a bonding device to achieve good heat transfer; the mounting holes (201) are used for bearing the base and the miniature reed assemblies (3) and form a base array; the miniature reed assembly (3) is used for extruding and clamping the side surface of the base in the mounting hole (201); the cover plate (4) is used for covering the carrier plate (2) and pressing the miniature reed assembly (3), and the base positioning loading hole (401) is correspondingly matched with the mounting hole (201) to carry and position the base; a through hole (101) corresponding to the position of the base positioning carrying hole (401) is formed in the bottom plate (1);
the bottom plate (1) and the carrier plate (2) are both rectangular, the width of the bottom plate (1) is larger than that of the carrier plate (2), the carrier plate (2) and the bottom plate (1) are symmetrically assembled in the width direction, and rail clamping guide grooves (102) are formed in two sides of the bottom plate (1);
the miniature reed assembly (3) comprises: miniature reed (301), miniature spring (302) and miniature draw-in groove (303), miniature draw-in groove (303) both ends have the notch of intercommunication, install miniature reed (301) and miniature spring (302) in the notch of miniature draw-in groove (303), the one end of miniature spring (302) with the inner wall connection of miniature draw-in groove (303) a lateral wall face, the other end of miniature spring (302) with the base of miniature reed (301) is connected, be the elastic contact structure on the base of miniature reed (301), the elastic contact structure is followed the outside protrusion of another lateral wall face of miniature draw-in groove (303) and contact with the base side.
2. The holder for a base of a subminiature surface-mount crystal oscillator according to claim 1, wherein the base of the micro reed (301) has a reed poke hole (304).
3. The holder of claim 2, wherein said cover plate (4) has a pick through hole (402) corresponding to the position of said reed pick (304).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011588805.4A CN112787617B (en) | 2020-12-29 | 2020-12-29 | Base clamping and bearing clamp for subminiature surface-mounted crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011588805.4A CN112787617B (en) | 2020-12-29 | 2020-12-29 | Base clamping and bearing clamp for subminiature surface-mounted crystal oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112787617A CN112787617A (en) | 2021-05-11 |
| CN112787617B true CN112787617B (en) | 2022-08-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011588805.4A Active CN112787617B (en) | 2020-12-29 | 2020-12-29 | Base clamping and bearing clamp for subminiature surface-mounted crystal oscillator |
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Families Citing this family (1)
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| CN114384096B (en) * | 2021-12-30 | 2024-03-29 | 北京无线电计量测试研究所 | X-ray photographing jig and equipment for surface-mounted crystal components |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102197589B (en) * | 2008-08-27 | 2014-06-25 | 精工电子水晶科技股份有限公司 | Piezoelectric vibrator, method for manufacturing piezoelectric vibrator, oscillator, electronic device, and radio-controlled clock |
| JP2014150332A (en) * | 2013-01-31 | 2014-08-21 | Nippon Dempa Kogyo Co Ltd | Surface-mounted crystal oscillator and manufacturing method of the same |
| CN205304749U (en) * | 2016-01-09 | 2016-06-08 | 烟台晶英电子有限公司 | Surface -mounted quartz crystal resonator |
| CN105450197A (en) * | 2016-01-09 | 2016-03-30 | 烟台晶英电子有限公司 | Surface-mounted quartz crystal resonator and processing process thereof |
| CN206850737U (en) * | 2017-06-27 | 2018-01-05 | 应达利电子股份有限公司 | The pedestal and pedestal matrix of quartz crystal oscillator pasted on surface are large stretch of |
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