CN212625551U - Chip positioning device - Google Patents
Chip positioning device Download PDFInfo
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- CN212625551U CN212625551U CN202021596279.1U CN202021596279U CN212625551U CN 212625551 U CN212625551 U CN 212625551U CN 202021596279 U CN202021596279 U CN 202021596279U CN 212625551 U CN212625551 U CN 212625551U
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- chip
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- fixedly connected
- heat
- mounting groove
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Abstract
The utility model discloses a chip positioning device, including the mounting panel, the mounting groove has been seted up at the top of mounting panel, the chip body has been placed to the inner chamber of mounting groove, the top of chip body extends to the top of mounting groove, first louvre has been seted up to the bottom of mounting groove, the bottom fixedly connected with heat-conducting plate of chip body, the cross slot has all been seted up to the both sides at mounting panel top, the inner chamber fixedly connected with horizontal pole of cross slot, the surface of horizontal pole is overlapped respectively and is equipped with sleeve pipe and spring, sheathed tube top fixedly connected with connecting rod. The utility model discloses possess the location installation of being convenient for, good heat dissipation, extension chip life's advantage has solved that the chip installation process is loaded down with trivial details, needs the mounting tool just to install, and the installation back chip is not circulated with circuit board contact site air, and the chip heat is difficult to be dispelled the heat, has reduced chip life's problem.
Description
Technical Field
The utility model relates to a chip location installation technical field specifically is a chip positioning device.
Background
The chip is an integrated circuit which manufactures a circuit on the surface of a semiconductor chip and is also called a thin film integrated circuit, and another thick film integrated circuit is a miniaturized circuit which is formed by independent semiconductor equipment and a passive component and integrated on a substrate or a circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip positioning device possesses the location installation of being convenient for, and good heat dissipation prolongs chip life's advantage, and it is loaded down with trivial details to have solved the chip installation process, needs the mounting tool just to install, and installation back chip and circuit board contact site air are not circulated, and the difficult heat dissipation of chip heat has reduced chip life's problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a chip positioning device, includes the mounting panel, the mounting groove has been seted up at the top of mounting panel, the chip body has been placed to the inner chamber of mounting groove, the top of chip body extends to the top of mounting groove, first louvre has been seted up to the bottom of mounting groove, the bottom fixedly connected with heat-conducting plate of chip body, the cross slot has all been seted up to the both sides at mounting panel top, the inner chamber fixedly connected with horizontal pole of cross slot, the surface of horizontal pole is overlapped respectively and is equipped with sleeve pipe and spring, sheathed tube top fixedly connected with connecting rod, the top of connecting rod extends to the top and the fixedly connected with L type fixture block of cross slot, L type fixture block and chip body joint.
Preferably, the mounting holes are formed in four corners of the top of the mounting plate, the supporting tubes are fixedly connected to four corners of the bottom of the mounting plate, and the supporting tubes are communicated with the mounting holes.
Preferably, both sides of the bottom of the heat conducting plate are fixedly connected with heat conducting rods, and the bottom of each heat conducting rod penetrates through the corresponding first heat dissipation hole and extends to the bottom of the corresponding first heat dissipation hole.
Preferably, the front side and the rear side of the mounting plate are both provided with second heat dissipation holes, and the second heat dissipation holes are communicated with the mounting groove.
Preferably, one end of the spring is fixedly connected with the inner wall of the transverse groove, and the end, far away from the inner wall of the transverse groove, of the spring is fixedly connected with the sleeve.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a mounting panel, mounting groove, chip body, first louvre, heat-conducting plate, cross slot, horizontal pole, sleeve pipe, spring, connecting rod and L type fixture block cooperate, possess the location installation of being convenient for, good heat dissipation, extension chip life's advantage has been solved chip installation process and has been loaded down with trivial details, needs the mounting tool just to install, and the installation back chip is not circulated with circuit board contact site air, and the chip heat is difficult to be dispelled the heat, has reduced chip life's problem.
2. The utility model discloses a set up mounting hole and stay tube, be convenient for carry out fixed mounting through the screw mounting panel, through setting up the stay tube, support the mounting panel, the thermal giving off of being convenient for, through setting up heat-conducting plate and heat-conducting rod, the heat that the conduction chip body of being convenient for produced, the thermal giving off of being convenient for, through setting up the second louvre, be convenient for give off the heat that chip body front side and rear side produced, through setting up the spring, produce tension to the sleeve pipe, make the sleeve pipe promote the connecting rod, the connecting rod promotes L type fixture block and chip body joint.
Drawings
FIG. 1 is a schematic sectional view of the structure of the present invention;
FIG. 2 is a top view of the present invention;
fig. 3 is a top sectional view of the structure of the present invention.
In the figure: 1 mounting panel, 2 mounting grooves, 3 chip bodies, 4 first louvres, 5 heat-conducting plates, 6 cross slots, 7 horizontal poles, 8 sleeve pipes, 9 springs, 10 connecting rods, 11L type fixture blocks, 12 mounting holes, 13 stay tubes, 14 heat-conducting rods, 15 second louvres.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses a mounting panel 1, mounting groove 2, chip body 3, first louvre 4, heat-conducting plate 5, cross slot 6, horizontal pole 7, sleeve pipe 8, spring 9, connecting rod 10, L type fixture block 11, mounting hole 12, stay tube 13, conducting rod 14 and second louvre 15 part are the parts that general standard spare or technical personnel in the field know, and its structure and principle all are that this technical personnel all can learn through the technical manual or learn through conventional experimental method.
Referring to fig. 1-3, a chip positioning device comprises a mounting plate 1, a mounting groove 2 is formed at the top of the mounting plate 1, a chip body 3 is placed in an inner cavity of the mounting groove 2, the top of the chip body 3 extends to the top of the mounting groove 2, a first heat dissipation hole 4 is formed at the bottom of the mounting groove 2, a heat conduction plate 5 is fixedly connected to the bottom of the chip body 3, transverse grooves 6 are formed at both sides of the top of the mounting plate 1, a cross bar 7 is fixedly connected to the inner cavity of the transverse groove 6, a sleeve 8 and a spring 9 are respectively sleeved on the surface of the cross bar 7, a connecting bar 10 is fixedly connected to the top of the sleeve 8, the top of the connecting bar 10 extends to the top of the transverse groove 6 and is fixedly connected with an L-shaped fixture block 11, the L-shaped fixture block 11 is clamped with the chip body, the supporting tube 13 is communicated with the mounting hole 12, by arranging the mounting hole 12 and the supporting tube 13, the fixing and mounting of the mounting plate 1 by a screw is facilitated, by arranging the supporting tube 13, the mounting plate 1 is supported, the heat dissipation is facilitated, the heat conducting rod 14 is fixedly connected to both sides of the bottom of the heat conducting plate 5, the bottom of the heat conducting rod 14 penetrates through the first heat dissipation hole 4 and extends to the bottom of the first heat dissipation hole 4, by arranging the heat conducting plate 5 and the heat conducting rod 14, the heat generated by the chip body 3 is facilitated to be conducted, the heat dissipation is facilitated, the front side and the rear side of the mounting plate 1 are respectively provided with a second heat dissipation hole 15, the second heat dissipation holes 15 are communicated with the mounting groove 2, by arranging the second heat dissipation holes 15, the heat generated by the front side and the rear side of the chip body 3 is facilitated to be dissipated, one end of the spring 9 is fixedly connected with, through setting up spring 9, produce tension to sleeve pipe 8, make sleeve pipe 8 promote connecting rod 10, connecting rod 10 promotes L type fixture block 11 and 3 joints of chip body, through mounting panel 1, mounting groove 2, chip body 3, first louvre 4, heat-conducting plate 5, cross slot 6, horizontal pole 7, sleeve pipe 8, spring 9, connecting rod 10 and L type fixture block 11 cooperate, possess the location installation of being convenient for, good heat dissipation, extension chip life's advantage, it is loaded down with trivial details to have solved the chip installation process, it just can install to need the mounting tool, the installation back chip is not circulated with circuit board contact site air, the chip heat is difficult with the heat dissipation, the problem of chip life has been reduced.
Theory of operation, when breaking up chip body 3, remove L type fixture block 11 and keep away from chip body 3, upward movement chip body 3 can be dismantled, place chip body 3 in 2 inner chambers of mounting groove during the installation, produce tension to sleeve pipe 8 through setting up spring 9, make sleeve pipe 8 promote connecting rod 10, connecting rod 10 promotes L type fixture block 11 and chip body 3 joint, through setting up the heat that heat-conducting plate 5 and 14 conduction chip bodies of heat-conducting rod 3 bottoms produced, the thermal giving off of being convenient for, give off the heat that chip body 3 front side and rear side produced through second louvre 15.
In summary, the following steps: this chip positioner cooperates through mounting panel 1, mounting groove 2, chip body 3, first louvre 4, heat-conducting plate 5, transverse groove 6, horizontal pole 7, sleeve pipe 8, spring 9, connecting rod 10 and L type fixture block 11, and it is loaded down with trivial details to have solved the chip installation process, needs the mounting tool just to install, and the installation back chip is not circulated with circuit board contact site air, and the chip heat is difficult to dispel the heat, has reduced chip life's problem.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A chip positioning device, includes mounting panel (1), its characterized in that: the top of the mounting plate (1) is provided with a mounting groove (2), the inner cavity of the mounting groove (2) is provided with a chip body (3), the top of the chip body (3) extends to the top of the mounting groove (2), the bottom of the mounting groove (2) is provided with a first heat dissipation hole (4), the bottom of the chip body (3) is fixedly connected with a heat conducting plate (5), both sides of the top of the mounting plate (1) are provided with transverse grooves (6), the inner cavity of the transverse groove (6) is fixedly connected with a cross rod (7), the surface of the cross rod (7) is respectively sleeved with a sleeve (8) and a spring (9), the top fixedly connected with connecting rod (10) of sleeve pipe (8), the top of connecting rod (10) extends to the top and the fixedly connected with L type fixture block (11) of cross slot (6), L type fixture block (11) and chip body (3) joint.
2. The chip positioning apparatus of claim 1, wherein: mounting hole (12) have all been seted up in the four corners at mounting panel (1) top, the equal fixedly connected with stay tube (13) in four corners of mounting panel (1) bottom, stay tube (13) and mounting hole (12) intercommunication.
3. The chip positioning apparatus of claim 1, wherein: the heat conducting plate is characterized in that heat conducting rods (14) are fixedly connected to two sides of the bottom of the heat conducting plate (5), and the bottom of each heat conducting rod (14) penetrates through the corresponding first heat dissipation hole (4) and extends to the bottom of the corresponding first heat dissipation hole (4).
4. The chip positioning apparatus of claim 1, wherein: second louvre (15) have all been seted up to the front side and the rear side of mounting panel (1), second louvre (15) and mounting groove (2) intercommunication.
5. The chip positioning apparatus of claim 1, wherein: one end of the spring (9) is fixedly connected with the inner wall of the transverse groove (6), and one end, far away from the inner wall of the transverse groove (6), of the spring (9) is fixedly connected with the sleeve (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021596279.1U CN212625551U (en) | 2020-08-04 | 2020-08-04 | Chip positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021596279.1U CN212625551U (en) | 2020-08-04 | 2020-08-04 | Chip positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212625551U true CN212625551U (en) | 2021-02-26 |
Family
ID=74729420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021596279.1U Active CN212625551U (en) | 2020-08-04 | 2020-08-04 | Chip positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212625551U (en) |
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2020
- 2020-08-04 CN CN202021596279.1U patent/CN212625551U/en active Active
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