CN212599548U - Semi-automatic tin point prosthetic devices with guide function - Google Patents
Semi-automatic tin point prosthetic devices with guide function Download PDFInfo
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- CN212599548U CN212599548U CN202021173119.6U CN202021173119U CN212599548U CN 212599548 U CN212599548 U CN 212599548U CN 202021173119 U CN202021173119 U CN 202021173119U CN 212599548 U CN212599548 U CN 212599548U
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Abstract
The utility model relates to the technical field of laser guide welding equipment, in particular to a semi-automatic tin point repairing device with a guide function, which comprises a frame, an optical detection mechanism, a semi-automatic tin point mechanism and a material loading mechanism, wherein the semi-automatic tin point mechanism comprises a laser emission structure movably arranged on the frame, and the material loading mechanism is used for loading a circuit board; the optical detection mechanism is used for acquiring bad point information recorded into the circuit board, and the laser emission structure is used for emitting laser which is used for indicating the position of the bad point of the circuit board. The utility model discloses an optical detection mechanism scans the bad point information of discernment and input circuit board to the circuit board, and the laser of laser emission structure can be clear, accurate, indicate out the bad point position of circuit board fast for the bad point position of operation workman quick identification circuit board directly welds the repair to it, reduces the process that pastes the label, improves the yields of circuit board, improves production efficiency, reduction in production cost.
Description
Technical Field
The utility model belongs to the technical field of laser guide welding equipment technique and specifically relates to indicate a semi-automatic tin point prosthetic devices with guide function.
Background
The printed circuit board has bad points in the production process, and the bad points need to be repaired and are usually detected by using optical detection equipment. Optical detection equipment is when detecting the circuit board, it shows in the graphoscope to detect out the bad point that does not conform to the production requirement on the circuit board, in the prior art, the operation workman need be facing to graphoscope and circuit board confirm bad point information one by one, and paste the mark label of bad information on the circuit board, the circuit board that pastes the mark label gets into next process, the operation workman can clearly the accurate bad point position on the discernment circuit board, so that handle bad point, the efficiency of artifical labeling is low, the rate of accuracy is low, the cost of labor is high, label material cost is high, can't satisfy the demand of modern production.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a semi-automatic tin point prosthetic devices with guide function can acquire and type the bad point information of circuit board automatically, and the laser is direct and accurately indicate out the bad point position of circuit board, improves production efficiency, reduction in production cost.
In order to solve the technical problem, the utility model discloses a following technical scheme:
a semi-automatic tin point repairing device with a guiding function comprises a rack, an optical detection mechanism, a semi-automatic tin point mechanism and a material loading mechanism, wherein the semi-automatic tin point mechanism comprises a laser emission structure movably mounted on the rack; the optical detection mechanism is used for acquiring and recording bad point information of the circuit board, the laser emission structure is used for emitting laser, and the laser is used for indicating the position of the bad point of the circuit board.
Furthermore, semi-automatic tin point prosthetic devices still includes the loading board, install in the Y axle track of loading board, slidable mounting in the orbital X axle track of Y axle, install in Y axle track tip and be used for driving the gliding Y axle driving piece of X axle track and install in the orbital X axle driving piece of X axle, laser emission structure slidable mounting in X axle track, X axle driving piece and laser emission structure drive are connected, the orbital moving path of X axle sets up with the moving path of laser emission structure is perpendicular.
Furthermore, the optical detection mechanism is provided with a display screen, and the display screen is arranged on the material loading mechanism.
Furthermore, the semi-automatic tin point repairing device also comprises a control center system, wherein the laser emission structure, the Y-axis driving piece, the X-axis driving piece and the display screen are respectively and electrically connected with the control center system; the control center system is used for indicating the position of a bad point on the circuit board by driving the laser emission structure to move according to the bad point information of the circuit board which is recorded in the optical detection mechanism in advance.
Furthermore, the material loading mechanism comprises a material loading plate arranged on the rack, a feeding driving part arranged on the material loading plate, two material loading frames arranged on the material loading plate and two conveying belts respectively rotatably arranged on the two material loading frames, the two conveying belts are matched for bearing the circuit board, and the feeding driving part is used for driving the two conveying belts to rotate simultaneously.
Furthermore, the material carrying mechanism further comprises a material blocking structure, the material blocking structure comprises a material blocking driving part fixedly installed on the material carrying frames and a blocking part connected with the output end of the material blocking driving part, one end, far away from the material blocking driving part, of the blocking part extends to the upper side of the conveying belt, and the material blocking driving part is used for driving the blocking part to stretch into or stretch out of the space between the two material carrying frames.
The utility model has the advantages that: the utility model discloses a carry material mechanism and be used for transporting the circuit board to predetermineeing the position, optics detection mechanism scans the circuit board and discerns and type the bad point information of circuit board, and the laser of laser emission structure can be clear, accurate, indicate out the bad point position of circuit board fast for the operation workman discerns the bad point position of circuit board fast and directly welds the repair to it, reduces the process that marks the label, improves the yields of circuit board, improves production efficiency, reduction in production cost.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a partially enlarged schematic structural view of a portion a in fig. 1.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention.
As shown in fig. 1 to fig. 2, the utility model provides a semi-automatic solder bump repairing device with guiding function, which comprises a frame 01, an optical detection mechanism (not shown in the figure), a semi-automatic solder bump mechanism 03 and a material carrying mechanism 04, wherein the semi-automatic solder bump mechanism 03 comprises a laser emitting structure 05 movably mounted on the frame 01, and the material carrying mechanism 04 is used for carrying a circuit board; the optical detection mechanism is used for acquiring and recording bad point information of the circuit board, and the laser emission structure 05 is used for emitting laser which is used for indicating the position of the bad point of the circuit board.
In the in-service use, carry material mechanism 04 and be used for transporting the circuit board to preset the position, optical detection mechanism scans the circuit board and discerns and type the bad point information of circuit board, when needs are restoreed, laser emission mechanism 05 sends laser according to the bad point information of type and instructs, make the operation workman discern the bad point position of circuit board fast and directly weld repair it, reduce the process that marks the label, improve the yields of circuit board, improve production efficiency, reduction in production cost.
In this embodiment, the semi-automatic solder repairing device further includes a bearing plate 06, a Y-axis track 07 installed on the bearing plate 06, an X-axis track 08 slidably installed on the Y-axis track 07, a Y-axis driving member 09 installed at an end of the Y-axis track 07 and used for driving the X-axis track 08 to slide, and an X-axis driving member 10 installed at an end of the X-axis track 08, wherein the laser emitting structure 05 is slidably installed on the X-axis track 08, the X-axis driving member 10 is drivingly connected with the laser emitting structure 05, and a moving path of the X-axis track 08 is perpendicular to a moving path of the laser emitting structure 05. Preferably, the X-axis driver 10 and the Y-axis driver 09 both use motors; specifically, the design of the Y-axis track 07 and the X-axis track 08 is used for adjusting the spatial position of the laser emission structure, so that the laser beam emitted by the laser emission structure can accurately and clearly indicate the bad points of the circuit board, and the welding accuracy and the welding efficiency are greatly improved. It should be noted that the optical detection mechanism belongs to the conventional means in the art, and therefore, the detailed structure and principle thereof will not be described again.
In this embodiment, the optical detection mechanism is provided with a display screen 11, the display screen 11 is installed on the material loading mechanism 04, and the display screen 11 is in signal connection with the optical detection mechanism and the semi-automatic tin spot mechanism 03 respectively. The display screen 11 is used for displaying the position of a bad point of the circuit board; the optical detection mechanism scans the circuit board, identifies bad points on the circuit board, improves the working efficiency and the identification precision, and further improves the yield of the circuit board.
In this embodiment, the semi-automatic tin point repairing device further includes a control center system (not shown in the figure), and the laser emission structure 05, the Y-axis driving member 09, the X-axis driving member 10, and the display screen 11 are electrically connected to the control center system respectively; the control center system is used for driving the laser emission structure 05 to move to indicate the position of a bad point on a circuit board according to the bad point information of the circuit board of the optical detection mechanism which is input in advance, so that a worker can weld quickly and accurately, the working efficiency is improved, and the yield is improved.
In this embodiment, the material loading mechanism 04 includes a material loading plate 12 installed on the frame 01, a feeding driving member 13 installed on the material loading plate 12, two material loading frames 14 installed on the material loading plate 12, and two conveyor belts (not shown in the figure) respectively rotatably installed on the two material loading frames 14, where the two conveyor belts are used to cooperate to load a circuit board, and the feeding driving member 13 is used to drive the two conveyor belts to rotate simultaneously. Preferably, the feeding driving part 13 is a motor; the conveyer belt is used for transporting the circuit board to preset position to the laser beam of laser emission structure 05 indicates the bad point of circuit board, has realized the effect of automatic transmission circuit board. Furthermore, the utility model discloses a set up laser emission structure 05 into portable, and be provided with and carry material mechanism to come the drive circuit board to remove, make the utility model discloses can realize the laser indication of the circuit board of bigger specification.
In this embodiment, the material loading mechanism 04 further includes a material blocking structure 16, the material blocking structure 16 includes a material blocking driving member 17 fixedly installed on the material loading frame 14 and a blocking member 18 connected to an output end of the material blocking driving member 17, one end of the blocking member 18 far away from the material blocking driving member 17 extends to a position above the conveyor belt, and the material blocking driving member 17 is used for driving the blocking member 18 to extend into or extend out between the two material loading frames 14. Preferably, the material blocking driving piece 17 is a cylinder or an electric cylinder; the stopping member 18 is used to stop the circuit board on the conveyor belt so that the circuit board is positioned at a predetermined position so that the laser beam of the laser emitting structure 05 indicates a defective spot of the circuit board.
All the technical features in the embodiment can be freely combined according to actual needs.
The above-mentioned embodiment is the utility model discloses the implementation scheme of preferred, in addition, the utility model discloses can also realize by other modes, any obvious replacement is all within the protection scope of the utility model under the prerequisite that does not deviate from this technical scheme design.
Claims (6)
1. The utility model provides a semi-automatic tin point prosthetic devices with guide function, includes the frame, its characterized in that: the automatic tin point soldering machine further comprises an optical detection mechanism, a semi-automatic tin point mechanism and a material loading mechanism which are all arranged on the rack, wherein the semi-automatic tin point mechanism comprises a laser emission structure movably arranged on the rack, and the material loading mechanism is used for loading a circuit board; the optical detection mechanism is used for acquiring and recording bad point information of the circuit board, the laser emission structure is used for emitting laser, and the laser is used for indicating the position of the bad point of the circuit board.
2. The semi-automatic solder repairing apparatus with guiding function according to claim 1, wherein: the semi-automatic tin point repairing device further comprises a bearing plate, a Y-axis track arranged on the bearing plate, an X-axis track arranged on the Y-axis track in a sliding mode, a Y-axis driving piece arranged at the end portion of the Y-axis track and used for driving the X-axis track to slide, and an X-axis driving piece arranged at the end portion of the X-axis track.
3. The semi-automatic solder repairing apparatus with guiding function according to claim 2, wherein: the optical detection mechanism is provided with a display screen, and the display screen is arranged on the material loading mechanism.
4. The semi-automatic solder repairing apparatus with guiding function according to claim 3, wherein: the semi-automatic tin point repairing device further comprises a control center system, and the laser emission structure, the Y-axis driving piece, the X-axis driving piece and the display screen are respectively and electrically connected with the control center system; the control center system is used for indicating the position of a bad point on the circuit board by driving the laser emission structure to move according to the bad point information of the circuit board which is recorded in the optical detection mechanism in advance.
5. The semi-automatic solder repairing apparatus with guiding function according to claim 1, wherein: the material loading mechanism comprises a material loading plate arranged on the rack, a feeding driving part arranged on the material loading plate, two material loading frames arranged on the material loading plate and two conveying belts respectively rotatably arranged on the two material loading frames, the two conveying belts are matched for bearing a circuit board, and the feeding driving part is used for driving the two conveying belts to rotate simultaneously.
6. The semi-automatic solder repairing apparatus with guiding function according to claim 5, wherein: the material loading mechanism further comprises a material blocking structure, the material blocking structure comprises a material blocking driving part fixedly installed on the material loading frame and a blocking part connected with the output end of the material blocking driving part, one end, far away from the material blocking driving part, of the blocking part extends to the upper portion of the conveying belt, and the material blocking driving part is used for driving the blocking part to stretch into or stretch out of the space between the two material loading frames.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021173119.6U CN212599548U (en) | 2020-06-22 | 2020-06-22 | Semi-automatic tin point prosthetic devices with guide function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021173119.6U CN212599548U (en) | 2020-06-22 | 2020-06-22 | Semi-automatic tin point prosthetic devices with guide function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212599548U true CN212599548U (en) | 2021-02-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021173119.6U Active CN212599548U (en) | 2020-06-22 | 2020-06-22 | Semi-automatic tin point prosthetic devices with guide function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212599548U (en) |
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2020
- 2020-06-22 CN CN202021173119.6U patent/CN212599548U/en active Active
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