CN212588706U - Intelligent heat dissipation system for electronic product - Google Patents

Intelligent heat dissipation system for electronic product Download PDF

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Publication number
CN212588706U
CN212588706U CN202021447066.2U CN202021447066U CN212588706U CN 212588706 U CN212588706 U CN 212588706U CN 202021447066 U CN202021447066 U CN 202021447066U CN 212588706 U CN212588706 U CN 212588706U
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heat dissipation
wind
cavity
air
module
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CN202021447066.2U
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陈能
戴志军
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Shenzhen Bachao Technology Co.,Ltd.
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Shenzhen Bachao Technology Co ltd
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Abstract

The utility model discloses an intelligence cooling system for electronic product, electronic product includes two and above the module of treating heat dissipation, every module of treating heat dissipation all is connected with temperature sensor, intelligence cooling system includes control system, the fan, wind chamber and automatic air regulation subassembly, wind chamber includes the first wind cavity with the fan intercommunication and treats the second wind cavity of heat dissipation module intercommunication with every, a plurality of second wind cavities all communicate with first wind cavity, automatic air regulation subassembly forms the position at first wind cavity and second wind cavity intercommunication, control system and temperature sensor, automatic air regulation subassembly electricity is connected, realize the different air regulation of a plurality of second wind cavities. Implement the utility model discloses, through every air supply volume of treating heat dissipation module of the automatic air regulation subassembly intelligent allocation of control system control, make the performance separately of treating heat dissipation module reach best operating condition, promote index performance, quality and the market competition of electronic product, promote user's use simultaneously and experience.

Description

Intelligent heat dissipation system for electronic product
Technical Field
The utility model relates to an electronic product heat dissipation technical field, more specifically relate to an intelligent cooling system for electronic product.
Background
With the development of science and technology, various electronic products enter the market to meet various requirements of people, such as electronic products like notebook computers, desktop computers, servers and power supplies, the electronic products usually comprise a plurality of modules, such as processors, hard disks, chips, etc., which generate heat during working, and due to the light, thin, short and small electronic products, when the heat cannot be dissipated in a limited space in time, the service efficiency and the service life of the electronic products are affected.
In the prior art, when each module in an electronic product is generally cooled, a turbofan is respectively arranged to cool each module independently or a fan is used to cool each module with the same air volume. However, since the heat dissipation requirements of the modules are different, if the air volume cannot be changed according to the actual situation, the heat dissipation cannot be optimized, and the noise generated during the operation of the fan and the electronic product cannot be adjusted to the optimum state.
SUMMERY OF THE UTILITY MODEL
In order to solve the not enough of prior art, the utility model provides an intelligence cooling system for electronic product, through the automatic air regulation subassembly intelligent allocation of control system control every air supply volume of treating heat dissipation module, can make the performance separately of treating heat dissipation module reach best operating condition, promote index performance, quality and the market competition of electronic product, promote user's use simultaneously and experience.
The utility model discloses the technological effect that will reach is realized through following scheme: the utility model provides an intelligence cooling system for electronic product, wherein electronic product includes two and above the module of treating the heat dissipation, every treat that the heat dissipation module all is connected with temperature sensor, intelligence cooling system includes control system, fan, wind chamber and automatic air regulation subassembly, the wind chamber include with the first wind cavity of fan intercommunication and with every treat the second wind cavity of heat dissipation module intercommunication, it is a plurality of the second wind cavity all communicates with first wind cavity, automatic air regulation subassembly forms in the position of first wind cavity and second wind cavity intercommunication, control system is connected with temperature sensor, automatic air regulation subassembly electricity, realizes a plurality ofly the different air regulation of second wind cavity.
Preferably, the automatic air volume adjusting assembly comprises a transmission rack, an arc-shaped gear, an adjusting air distributing sheet and a driving motor with a transmission gear, the driving motor is a forward and reverse rotation driving motor, the transmission rack is long-strip-shaped, one side surface of the transmission rack in the length direction is of a tooth-shaped structure, and the transmission gear of the driving motor is meshed with the transmission rack and is connected with the transmission rack.
Preferably, the adjusting air distribution piece is formed in the air cavity, one end of the adjusting air distribution piece is rotatably connected with the air cavity, the other end of the adjusting air distribution piece is fixedly connected with the arc-shaped gear, and the arc-shaped gear is meshed with the transmission rack.
Preferably, two ends of the transmission rack in the length direction are separated by a distance, and limit switches are further respectively arranged on the two ends of the transmission rack in the length direction.
Preferably, the control system is also electrically connected with the fan and the driving motor.
Preferably, the electronic product further comprises a circuit board, and the module to be cooled, the fan, the air cavity and the driving motor are all attached to the circuit board.
Preferably, the transmission rack is fixed on the circuit board through a fixing column and a clamping spring, and the transmission rack is formed above the air cavity.
Preferably, the adjusting air distribution piece is formed in the air cavity, one end of the adjusting air distribution piece is fixed in the air cavity through a rotating shaft and a clamping spring and is in a vertical state, and the other end of the adjusting air distribution piece is fixedly connected with an arc-shaped gear which is also formed above the air cavity through a fixing shaft and the clamping spring.
The utility model has the advantages of it is following:
1. the control system controls the automatic air quantity adjusting assembly to intelligently distribute the air quantity of each module to be radiated, so that the respective performance of the modules to be radiated can reach the optimal working state, the index performance, the quality and the market competitiveness of electronic products are improved, and the use experience of users is improved;
2. the control system is used for controlling the voltage of the fan, increasing or reducing the air output of the fan, and adjusting the air output by combining the adjusting air dividing sheet to achieve the purpose of temperature control, so that the voltage, the rotating speed and the running noise of the fan can be reduced;
3. a plurality of modules to be cooled are adjusted through a fan, the purpose of intelligent control cooling can be achieved according to the actual working condition of the electronic product, manual intervention is not needed, and the electronic product can be effectively self-adjusted according to the running condition of the electronic product.
Drawings
Fig. 1 is a schematic perspective view of an intelligent heat dissipation device for electronic products according to the present invention;
FIG. 2 is an exploded view of an intelligent heat sink for electronic products according to the present invention;
FIG. 3 is a schematic view of a three-dimensional structure of the intelligent heat sink for electronic products of the present invention with the housing removed and the circuit board flipped over
FIG. 4 is a schematic perspective view of an intelligent heat dissipation device for electronic products according to the present invention;
fig. 5 is an enlarged view at E in fig. 4.
Detailed Description
The invention is described in detail below with reference to the drawings, wherein examples of the embodiments are shown in the drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and "disposed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the interconnection of two elements or through the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1-5, an embodiment of the present invention provides an intelligent heat dissipation system for an electronic product, wherein the electronic product includes two or more modules to be dissipated (two modules to be dissipated are used as examples in the figure, and are respectively a module to be dissipated a heat a and a module to be dissipated B, and the module to be dissipated is disposed in a housing of the electronic product, and a vent hole is further disposed on the housing of the electronic product), the module to be dissipated may be a chip, etc., each the module to be dissipated is connected to a temperature sensor 400, and each the module to be dissipated may also be connected to a heat sink 500. The intelligent heat dissipation system comprises a fan 100, an air cavity 200 and an automatic air volume adjusting assembly 300, wherein the air cavity 200 comprises a first air cavity 210 communicated with the fan 100 and a second air cavity 220 communicated with each to-be-dissipated module, the second air cavities 220 are communicated with the first air cavity 210, the automatic air volume adjusting assembly 300 is formed at the position where the first air cavity 210 is communicated with the second air cavity 220 and used for adjusting different air volumes of the second air cavities 220. Through automatically regulated fan 100 voltage, rotational speed and automatic air regulation subassembly 300 intelligent distribution air output, can make the performance separately of treating heat dissipation module reach best operating condition, can reduce fan 100's voltage, rotational speed and noise at operation, promote electronic product's index performance, quality and market competition, promote user's use simultaneously and experience.
Specifically, as shown in fig. 2 and 5, the automatic air volume adjusting assembly 300 includes a transmission rack 320, an arc-shaped gear 330, an adjusting air distributing piece 340 and a driving motor 310 with a transmission gear, the driving motor 310 is a forward and backward rotation driving motor 310, the transmission rack 320 is long-strip-shaped, one side surface of the transmission rack in the length direction is a tooth-shaped structure, and the transmission gear of the driving motor 310 is engaged with the transmission rack 320. The adjusting air distribution piece 340 is formed in the air cavity 200, one end of the adjusting air distribution piece is rotatably connected with the air cavity 200, the other end of the adjusting air distribution piece is fixedly connected with the arc-shaped gear 330, and the arc-shaped gear 330 is meshed with the transmission rack 320. When the air volume needs to be adjusted, the driving motor 310 is started to drive the transmission gear to rotate, the transmission gear drives the transmission rack 320 to linearly move, the transmission rack 320 drives the arc gear 330 to do curvilinear motion, the arc gear 330 drives the adjusting air distributing sheet 340 to deflect so as to adjust the area communicated between the first air cavity 210 and the second air cavity 220, and finally, the adjustment of different air volumes of the second air cavity 220 is realized.
The utility model discloses an adjust the swing of dividing wind piece 340 and adjust the amount of wind that gets into and treat heat dissipation module, can realize that infinitely variable control more can the accurate control wind volume in the chamber 200, with respect to aerodynamics, the automatic air regulation subassembly 300 of this application is in the same direction as wind guide fluid structure, rather than sudden change structure of keeping out the wind, more is favorable to gaseous flow.
As a further improvement of the utility model, the length direction both ends of transmission rack 320 separate a distance and still are equipped with limit switch 600 respectively, limit switch 600 plays the limiting displacement to transmission rack 320, and when transmission rack 320 triggered limit switch 600, driving motor 310 stopped this direction transmission to transmission rack 320, and the adjustment was divided wind piece 340 and was reached the maximum value of adjusting this moment.
The utility model discloses an intelligence cooling system still includes control system (not shown in the figure), control system and fan 100, temperature sensor 400, driving motor 310 and limit switch 600 electricity are connected, when temperature sensor 400 detected the temperature rise of treating heat dissipation module and exceeded the critical value, temperature sensor 400 feedback signal to control system, control system sends out instruction control driving motor 310 and drives the motion of driving rack 320 and then through adjusting the amount of wind that divides wind piece 340 to increase to treat heat dissipation module, the temperature of treating heat dissipation module is in normal range when temperature sensor 400 senses, then temperature sensor 400 feedback signal to control system, stop adjusting the amount of wind. The temperature sensor 400 may detect the temperature of the module to be heat-dissipated through the temperature of the heat sink 500. The fan 100 can adjust the air volume of the fan 100 through a control system. The conversion comparison between the intelligent cooling system control and the control system is visual and understandable.
The utility model discloses an electronic product still includes circuit board C, treat that heat dissipation module (A, B), fan 100 and wind chamber 200 all paste and establish on circuit board C, driving motor 310 also fixes on circuit board C, transmission rack 320 passes through the fixed column and the jump ring is fixed on circuit board C and transmission rack 320 forms the top at wind chamber 200. The adjusting air distributing plate 340 is formed in the air cavity 200, one end of the adjusting air distributing plate is fixed in the air cavity 200 through a rotating shaft and a clamping spring in a vertical state, and the other end of the adjusting air distributing plate is fixedly connected with an arc-shaped gear 330 which is also formed above the air cavity 200 through a fixing shaft and a clamping spring.
The intelligent heat dissipation method of the embodiment of the present invention is specifically that, when the module a to be dissipated works, the temperature of the module a to be dissipated will be higher and higher, and then the temperature of the heat sink 500 will also be higher and higher, when the temperature sensor 400 detects that the temperature rise exceeds the critical value, the temperature sensor 400 feeds back the signal to the control system, the control system makes a judgment and sends an instruction to the driving motor 310, the driving motor 310 rotates counterclockwise, and further drives the driving rack 320 to move linearly right, and further drives the arc gear 330 to move rightwards, and further drives the adjusting wind distributing plate 340 to swing rightwards, and the adjusting wind distributing plate 340 plays the role of wind distributing and guiding in the wind cavity 200, and the adjusting wind distributing plate 340 moving rightwards distributes more wind to the second wind cavity 220 on the left, so that the module a to be dissipated obtains better heat cooling, until the temperature sensor 400 senses that the temperature of the module a to be dissipated is within the normal range, the control system controls the drive motor 310 to suspend the adjustment. When the transmission rack 320 moves rightmost, that is, the adjusting wind-dividing blade 340 reaches the rightmost limit position, the transmission rack 320 triggers the limit switch 600 to stop the driving mechanism to drive the transmission rack 320 to adjust rightmost.
When the module B to be cooled is working, the temperature of the module B to be cooled will be higher and higher, and the temperature of the heat sink 500 will be higher and higher, when the temperature sensor 400 detects that temperature = rise exceeds the critical value, the temperature sensor 400 feeds back a signal to the control system, the control system makes a judgment and issues an instruction to the driving motor 310, the driving motor 310 rotates clockwise, thereby driving the transmission rack 320 to move linearly leftward, and further driving the arc gear 330 to move leftward, thereby driving the adjusting air distributing piece 340 to swing leftwards, the adjusting air distributing piece 340 plays the role of air distributing and guiding in the air cavity 200, the adjusting air distributing piece 340 moving leftwards distributes more air quantity to the second air cavity 220 on the right, therefore, the module B to be cooled is cooled by better heat dissipation, and until the temperature sensor 400 senses that the temperature of the module B to be cooled is within the normal range, the control system controls the driving motor 310 to suspend adjustment. When the transmission rack 320 moves to the leftmost side, that is, the adjusting wind-dividing blade 340 reaches the extreme position of the leftmost side, the transmission rack 320 triggers the limit switch 600 to stop the driving mechanism to drive the transmission rack 320 to adjust to the left.
When the module a to be cooled and the module B to be cooled work simultaneously, the temperature sensor 400 detects the actual heat dissipation requirements of the module a to be cooled and the module B to be cooled respectively at the same time, the temperature sensor 400 feeds back signals to the control system, the control system makes a judgment and sends an instruction to the driving motor 310, the driving motor 310 rotates forward and backward, the driving rack 320 is driven to move linearly left and right, the arc-shaped gear 330 is driven to move left and right, and then the adjusting air distributing piece 340 is driven to swing left and right, so that the air volume of the module a to be cooled and the air volume of the module B to be cooled are effectively adjusted. When the temperature sensor 400 still detects that the temperature exceeds the critical value, the control system controls the fan 100 to increase the voltage, increases the air supply quantity of the fan 100, and achieves the purpose of temperature control by combining the adjustment of the air quantity by the air distribution piece 340.
The utility model discloses a treat heat dissipation module is two and more, when treating heat dissipation module's quantity is more, then can set up a plurality of fans 100, and every fan 100 can adjust two and more heat dissipation module of treating, as the example in the picture, only shows a fan 100 and adjusts two and treat heat dissipation module, nevertheless should not use this as the limit. A plurality of modules to be cooled are adjusted through the fan 100, the purpose of intelligent control cooling can be achieved according to the actual working condition of the electronic product, manual intervention is not needed, and the electronic product can be effectively self-adjusted according to the running condition of the electronic product.
It should be finally noted that the above embodiments are only used for illustrating the technical solutions of the embodiments of the present invention and not for limiting the same, and although the embodiments of the present invention are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the present invention can still be modified or replaced with equivalents, and these modifications or equivalent replacements cannot make the modified technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (8)

1. The utility model provides an intelligent cooling system for electronic product, wherein electronic product includes two and above the module of treating the heat dissipation, every treat the heat dissipation module and all be connected with temperature sensor, its characterized in that, intelligent cooling system includes control system, fan, wind chamber and automatic air regulation subassembly, the wind chamber include with the fan intercommunication first wind cavity and with every treat the second wind cavity of heat dissipation module intercommunication, it is a plurality of second wind cavity all communicates with first wind cavity, automatic air regulation subassembly forms the position at first wind cavity and second wind cavity intercommunication, control system is connected with temperature sensor, automatic air regulation subassembly electricity, realizes a plurality ofly the different air regulation of second wind cavity.
2. The intelligent heat dissipation system for electronic products of claim 1, wherein the automatic air volume adjusting assembly comprises a driving rack, an arc-shaped gear, an adjusting air distribution piece and a driving motor with a transmission gear, the driving motor is a forward and reverse rotation driving motor, the driving rack is in a long strip shape, one side surface in the length direction of the driving rack is in a tooth-shaped structure, and the transmission gear of the driving motor is meshed with the driving rack.
3. The intelligent heat dissipation system for electronic products as claimed in claim 2, wherein the adjusting air distribution plate is formed in the air cavity, one end of the adjusting air distribution plate is rotatably connected with the air cavity, the other end of the adjusting air distribution plate is fixedly connected with the arc-shaped gear, and the arc-shaped gear is engaged with the transmission rack.
4. The intelligent heat dissipation system for electronic products as claimed in claim 2, wherein the two ends of the driving rack in the length direction are spaced apart by a distance and are respectively provided with a limit switch.
5. The intelligent heat dissipation system for electronic products of claim 2, wherein the control system is further electrically connected to a fan and a drive motor.
6. The intelligent heat dissipation system for electronic products of claim 2, wherein the electronic product further comprises a circuit board, and the module to be dissipated, the fan, the air cavity and the driving motor are all attached to the circuit board.
7. The intelligent heat dissipation system for electronic products of claim 6, wherein the driving rack is fixed on the circuit board by a fixing column and a snap spring and the driving rack is formed above the air cavity.
8. The intelligent heat dissipation system for electronic products of claim 7, wherein the adjusting air distribution plate is formed in the air cavity, one end of the adjusting air distribution plate is fixed in the air cavity through a rotating shaft and a clamp spring in a vertical state, and the other end of the adjusting air distribution plate is fixedly connected with an arc-shaped gear which is also formed above the air cavity through a fixing shaft and a clamp spring.
CN202021447066.2U 2020-07-21 2020-07-21 Intelligent heat dissipation system for electronic product Active CN212588706U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021447066.2U CN212588706U (en) 2020-07-21 2020-07-21 Intelligent heat dissipation system for electronic product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021447066.2U CN212588706U (en) 2020-07-21 2020-07-21 Intelligent heat dissipation system for electronic product

Publications (1)

Publication Number Publication Date
CN212588706U true CN212588706U (en) 2021-02-23

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Application Number Title Priority Date Filing Date
CN202021447066.2U Active CN212588706U (en) 2020-07-21 2020-07-21 Intelligent heat dissipation system for electronic product

Country Status (1)

Country Link
CN (1) CN212588706U (en)

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CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 3-4 / F, building 16, Hejing Industrial Zone, No.87 Hexiu West Road, Heping community, Fuhai street, Bao'an District, Shenzhen, Guangdong 518100

Patentee after: Shenzhen Bachao Technology Co.,Ltd.

Address before: 3-4 / F, building 16, Hejing Industrial Zone, No.87 Hexiu West Road, Heping community, Fuhai street, Bao'an District, Shenzhen, Guangdong 518100

Patentee before: SHENZHEN BACHAO TECHNOLOGY Co.,Ltd.

CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: 518103 301-401, building 16, Hejing Industrial Zone, No. 87, Hexiu West Road, Zhancheng community, Fuhai street, Bao'an District, Shenzhen, Guangdong Province

Patentee after: Shenzhen Bachao Technology Co.,Ltd.

Address before: 3-4 / F, building 16, Hejing Industrial Zone, No.87 Hexiu West Road, Heping community, Fuhai street, Bao'an District, Shenzhen, Guangdong 518100

Patentee before: Shenzhen Bachao Technology Co.,Ltd.