CN111970892A - Intelligent heat dissipation method and intelligent heat dissipation device for electronic product - Google Patents
Intelligent heat dissipation method and intelligent heat dissipation device for electronic product Download PDFInfo
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- CN111970892A CN111970892A CN202010705015.3A CN202010705015A CN111970892A CN 111970892 A CN111970892 A CN 111970892A CN 202010705015 A CN202010705015 A CN 202010705015A CN 111970892 A CN111970892 A CN 111970892A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- Microelectronics & Electronic Packaging (AREA)
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- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an intelligent heat dissipation method and an intelligent heat dissipation device for an electronic product, wherein the electronic product comprises more than two modules to be dissipated, and the intelligent heat dissipation method comprises the following steps: step S1: a single fan is respectively communicated with more than two modules to be radiated through an air cavity, an automatic air quantity adjusting assembly is connected between the fan and the modules to be radiated, and the temperature of each module to be radiated is detected through a temperature sensor; step S2: when the temperature of the module to be radiated exceeds a critical value, the temperature sensor feeds back a signal to the control system, and the control system controls the automatic air volume adjusting assembly to adjust the air volume entering the module to be radiated. By implementing the invention, the control system controls the automatic air quantity adjusting assembly to intelligently distribute the air quantity of each module to be radiated, so that the respective performance of the modules to be radiated can reach the optimal working state, the index performance, the quality and the market competitiveness of electronic products are improved, and the use experience of users is improved.
Description
Technical Field
The invention relates to the technical field of electronic product heat dissipation, in particular to an intelligent heat dissipation method and an intelligent heat dissipation device for an electronic product.
Background
With the development of science and technology, various electronic products enter the market to meet various requirements of people, such as electronic products like notebook computers, desktop computers, servers and power supplies, the electronic products usually comprise a plurality of modules, such as processors, hard disks, chips, etc., which generate heat during working, and due to the light, thin, short and small electronic products, when the heat cannot be dissipated in a limited space in time, the service efficiency and the service life of the electronic products are affected.
In the prior art, when each module in an electronic product is generally cooled, a turbofan is respectively arranged to cool each module independently or a fan is used to cool each module with the same air volume. However, since the heat dissipation requirements of the modules are different, if the air volume cannot be changed according to the actual situation, the heat dissipation cannot be optimized, and the noise generated during the operation of the fan and the electronic product cannot be adjusted to the optimum state.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides an intelligent heat dissipation method and an intelligent heat dissipation device for an electronic product, wherein the control system controls the automatic air volume adjusting assembly to intelligently distribute the air volume of each module to be dissipated, so that the respective performances of the modules to be dissipated can reach the optimal working state, the index performance, the quality and the market competitiveness of the electronic product are improved, and the use experience of a user is improved.
The technical effect to be achieved by the invention is realized by the following scheme: an intelligent heat dissipation method for an electronic product, wherein the electronic product comprises more than two modules to be dissipated, the intelligent heat dissipation method comprises the following steps:
step S1: a single fan is respectively communicated with more than two modules to be radiated through an air cavity, an automatic air quantity adjusting assembly is connected between the fan and the modules to be radiated, and the temperature of each module to be radiated is detected through a temperature sensor;
step S2: when the temperature of the module to be radiated exceeds a critical value, the temperature sensor feeds back a signal to the control system, and the control system controls the automatic air volume adjusting assembly to adjust the air volume entering the module to be radiated.
Preferably, the specific steps of the step S2 in which the control system controls the automatic air volume adjusting assembly to adjust the air volume entering the module to be cooled include: the automatic air quantity adjusting assembly comprises a driving motor, a transmission rack, an arc gear and an adjusting air distributing piece, the control system controls the driving motor to drive the transmission rack to move, the transmission rack drives the arc gear to rotate, the arc gear drives the adjusting air distributing piece to swing, and the air quantity entering the module to be cooled is adjusted by adjusting the swing of the air distributing piece.
Preferably, when the adjusting air distribution piece reaches the limit position, the transmission rack triggers the limit switch to stop the driving mechanism to adjust the transmission rack.
Preferably, the control system is also used for controlling the voltage of the fan and increasing or decreasing the air supply quantity of the fan. .
Preferably, each module to be radiated is further provided with a radiator, and the temperature sensor detects the temperature of each module to be radiated by detecting the temperature of the radiator.
The utility model provides an intelligent heat abstractor for electronic product, wherein electronic product includes two and above the module of treating the heat dissipation, every treat that the heat dissipation all is connected with temperature sensor, intelligent heat abstractor includes fan, wind chamber and automatic air regulation subassembly, the wind chamber include with the first wind cavity of fan intercommunication and with every treat the second wind cavity of heat dissipation module intercommunication, it is a plurality of the second wind cavity all communicates with first wind cavity, automatic air regulation subassembly forms in the position of first wind cavity and second wind cavity intercommunication, is used for adjusting a plurality ofly the different amount of wind of second wind cavity.
The invention has the following advantages:
1. the control system controls the automatic air quantity adjusting assembly to intelligently distribute the air quantity of each module to be radiated, so that the respective performance of the modules to be radiated can reach the optimal working state, the index performance, the quality and the market competitiveness of electronic products are improved, and the use experience of users is improved;
2. the control system is used for controlling the voltage of the fan, increasing or reducing the air output of the fan, and adjusting the air output by combining the adjusting air dividing sheet to achieve the purpose of temperature control, so that the voltage, the rotating speed and the running noise of the fan can be reduced;
3. a plurality of modules to be cooled are adjusted through a fan, the purpose of intelligent control cooling can be achieved according to the actual working condition of the electronic product, manual intervention is not needed, and the electronic product can be effectively self-adjusted according to the running condition of the electronic product.
Drawings
Fig. 1 is a working step diagram of an intelligent heat dissipation method for electronic products according to the present invention;
fig. 2 is a schematic perspective view of an intelligent heat dissipation device for electronic products according to the present invention;
FIG. 3 is an exploded view of an intelligent heat sink for electronic products according to the present invention;
FIG. 4 is a schematic perspective view of the intelligent heat sink for electronic products of the present invention with the housing removed and the circuit board flipped over;
FIG. 5 is a schematic perspective view of an intelligent heat sink for electronic products according to the present invention;
fig. 6 is an enlarged view at E in fig. 5.
Detailed Description
The invention is described in detail below with reference to the drawings, wherein examples of the embodiments are shown in the drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the interconnection of two elements or through the interaction of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example one
As shown in fig. 1, an embodiment of the present invention provides an intelligent heat dissipation method for an electronic product, where the electronic product includes more than two modules to be dissipated (in the figure, two modules to be dissipated are taken as an example, a module a to be dissipated and a module B to be dissipated, respectively, and the modules to be dissipated are disposed in a housing of the electronic product, and the housing of the electronic product is further provided with a vent hole), and the modules to be dissipated may be chips and the like. The intelligent heat dissipation method comprises the following steps:
step S1: a single fan 100 is respectively communicated with more than two modules to be radiated through an air cavity 200, an automatic air quantity adjusting assembly 300 is connected between the fan 100 and the modules to be radiated, and the temperature of each module to be radiated is detected through a temperature sensor 400;
step S2: when the temperature of the module to be cooled exceeds the critical value, the temperature sensor 400 feeds back a signal to the control system, and the control system controls the automatic air volume adjusting assembly 300 to adjust the air volume entering the module to be cooled.
According to the intelligent heat dissipation method provided by the embodiment of the invention, the control system controls the automatic air quantity adjusting assembly 300 to intelligently distribute the air quantity of each module to be dissipated, so that the respective performance of the modules to be dissipated can reach the optimal working state, the index performance, the quality and the market competitiveness of an electronic product are improved, and the use experience of a user is improved. The conversion comparison between the intelligent heat dissipation method and the control system is visual and easy to understand.
In the intelligent heat dissipation method according to the first embodiment of the present invention, the control system may be further configured to control the voltage of the fan 100, increase or decrease the air output of the fan 100, and adjust the air output by combining with the adjustment of the air dividing fins to achieve the purpose of temperature control, so as to reduce the voltage, the rotation speed, and the operation noise of the fan 100.
As a further improvement of the first embodiment of the present invention, as shown in fig. 2 to fig. 6, the specific steps of the step S2, in which the control system controls the automatic air volume adjusting assembly 300 to adjust the air volume entering the module to be cooled, include: the automatic air quantity adjusting assembly 300 comprises a driving motor 310, a transmission rack 320, an arc-shaped gear 330 and an adjusting air distributing sheet 340, wherein the control system controls the driving motor 310 to drive the transmission rack 320 to move, the transmission rack 320 drives the arc-shaped gear 330 to rotate, the arc-shaped gear 330 drives the adjusting air distributing sheet 340 to swing, the air quantity entering a module to be cooled is adjusted by adjusting the swing of the air distributing sheet 340, stepless adjustment can be realized to more accurately control the air quantity in the air cavity 200, and in terms of aerodynamics, the automatic air quantity adjusting assembly 300 is of a structure which is in the same direction as the air guide direction fluid, but not of a sudden change wind shielding structure, and is more favorable for the flow of gas.
Specifically, the air cavity 200 is provided as a first air cavity 210 communicated with the fan 100 and a second air cavity 220 communicated with each module to be cooled, the plurality of second air cavities 220 are communicated with the first air cavity 210, and the automatic air volume adjusting assembly 300 is formed at a position where the first air cavity 210 is communicated with the second air cavity 220, and is used for adjusting different air volumes of the plurality of second air cavities 220. The driving motor 310 is a forward and reverse rotation driving motor 310, the transmission rack 320 is in a strip shape, one side surface of the transmission rack in the length direction is in a tooth-shaped structure, and a transmission gear of the driving motor 310 is meshed and connected with the transmission rack 320. The adjusting air distribution piece 340 is formed in the air cavity 200, one end of the adjusting air distribution piece is rotatably connected with the air cavity 200, the other end of the adjusting air distribution piece is fixedly connected with the arc-shaped gear 330, and the arc-shaped gear 330 is meshed with the transmission rack 320. When the air volume needs to be adjusted, the driving motor 310 is started to drive the transmission gear to rotate, the transmission gear drives the transmission rack 320 to linearly move, the transmission rack 320 drives the arc gear 330 to do curvilinear motion, the arc gear 330 drives the adjusting air distributing sheet 340 to deflect so as to adjust the area communicated between the first air cavity 210 and the second air cavity 220, and finally, the adjustment of different air volumes of the second air cavity 220 is realized.
As a further improvement of the first embodiment of the present invention, each module to be cooled is further provided with a heat sink 500, and the temperature sensor 400 detects the temperature of each module to be cooled by detecting the temperature of the heat sink 500. Preferably, each module to be cooled is provided with a temperature sensor 400.
As a further improvement of the first embodiment of the present invention, when the adjusting air-distributing blade 340 reaches the limit position, the driving rack 320 is triggered by the driving rack 320 to stop the driving mechanism from adjusting the driving rack 320. Specifically, the limit switches 600 are further respectively arranged at two ends of the transmission rack 320 in the length direction at intervals, the limit switches 600 limit the transmission rack 320, when the transmission rack 320 triggers the limit switches 600, the driving motor 310 stops the transmission action on the transmission rack 320 in the direction, and at the moment, the adjusting air-distributing piece 340 reaches the maximum adjusting value.
The control system is electrically connected with the fan 100, the temperature sensor 400, the driving motor 310 and the limit switch 600 to realize the intelligent heat dissipation function for the electronic product.
The intelligent heat dissipation method of the first embodiment of the invention is specifically that when the module a to be dissipated works, the temperature of the module a to be dissipated becomes higher and higher, and the temperature of the heat sink 500 also becomes higher and higher, when the temperature sensor 400 detects that the temperature rise exceeds the critical value, the temperature sensor 400 feeds back a signal to the control system, the control system makes a judgment and sends an instruction to the driving motor 310, the driving motor 310 rotates counterclockwise, and further drives the driving rack 320 to move linearly to the right, and further drives the arc-shaped gear 330 to move to the right, and further drives the adjusting air distribution piece 340 to swing to the right, the adjusting air distribution piece 340 plays roles of air distribution and air guidance in the air cavity 200, and the adjusting air distribution piece 340 moving to the right distributes more air quantity to the second air cavity 220 on the left, so that the module a to be dissipated obtains better heat dissipation cooling until the temperature sensor 400 senses that the temperature of the module a to be dissipated is within a normal, the control system controls the drive motor 310 to suspend the adjustment. When the transmission rack 320 moves rightmost, that is, the adjusting wind-dividing blade 340 reaches the rightmost limit position, the transmission rack 320 triggers the limit switch 600 to stop the driving mechanism to drive the transmission rack 320 to adjust rightmost.
When the module B to be cooled is working, the temperature of the module B to be cooled will be higher and higher, and the temperature of the heat sink 500 will be higher and higher, when the temperature sensor 400 detects that temperature = rise exceeds the critical value, the temperature sensor 400 feeds back a signal to the control system, the control system makes a judgment and issues an instruction to the driving motor 310, the driving motor 310 rotates clockwise, thereby driving the transmission rack 320 to move linearly leftward, and further driving the arc gear 330 to move leftward, thereby driving the adjusting air distributing piece 340 to swing leftwards, the adjusting air distributing piece 340 plays the role of air distributing and guiding in the air cavity 200, the adjusting air distributing piece 340 moving leftwards distributes more air quantity to the second air cavity 220 on the right, therefore, the module B to be cooled is cooled by better heat dissipation, and until the temperature sensor 400 senses that the temperature of the module B to be cooled is within the normal range, the control system controls the driving motor 310 to suspend adjustment. When the transmission rack 320 moves to the leftmost side, that is, the adjusting wind-dividing blade 340 reaches the extreme position of the leftmost side, the transmission rack 320 triggers the limit switch 600 to stop the driving mechanism to drive the transmission rack 320 to adjust to the left.
When the module a to be cooled and the module B to be cooled work simultaneously, the temperature sensor 400 detects the actual heat dissipation requirements of the module a to be cooled and the module B to be cooled respectively at the same time, the temperature sensor 400 feeds back signals to the control system, the control system makes a judgment and sends an instruction to the driving motor 310, the driving motor 310 rotates forward and backward, the driving rack 320 is driven to move linearly left and right, the arc-shaped gear 330 is driven to move left and right, and then the adjusting air distributing piece 340 is driven to swing left and right, so that the air volume of the module a to be cooled and the air volume of the module B to be cooled are effectively adjusted. When the temperature sensor 400 still detects that the temperature exceeds the critical value, the control system controls the fan 100 to increase the voltage, increases the air supply quantity of the fan 100, and achieves the purpose of temperature control by combining the adjustment of the air quantity by the air distribution piece 340.
In the first embodiment of the present invention, when the number of the modules to be heat dissipated is large, a plurality of fans 100 may be provided, and each fan 100 may adjust two or more modules to be heat dissipated, which is shown as an example in the figure, where only one fan 100 adjusts two modules to be heat dissipated, but should not be limited thereto. A plurality of modules to be cooled are adjusted through the fan 100, the purpose of intelligent control cooling can be achieved according to the actual working condition of the electronic product, manual intervention is not needed, and the electronic product can be effectively self-adjusted according to the running condition of the electronic product.
Example two
Referring to fig. 2 to 6, a second embodiment of the present invention provides an intelligent heat dissipation apparatus for an electronic product, where the electronic product includes two or more modules to be dissipated (in the figures, two modules to be dissipated are taken as examples, and are a module a to be dissipated and a module B to be dissipated respectively, the modules to be dissipated are disposed in a housing of the electronic product, the housing of the electronic product is further provided with a vent hole), the modules to be dissipated may be chips or the like, each module to be dissipated is connected to a temperature sensor 400, and each module to be dissipated may also be connected to a heat sink 500. The intelligent heat dissipation device comprises a fan 100, an air cavity 200 and an automatic air volume adjusting assembly 300, wherein the air cavity 200 comprises a first air cavity 210 communicated with the fan 100 and a second air cavity 220 communicated with each to-be-dissipated module, the second air cavities 220 are communicated with the first air cavity 210, the automatic air volume adjusting assembly 300 is formed at the position where the first air cavity 210 is communicated with the second air cavity 220 and used for adjusting different air volumes of the second air cavities 220. Through automatic air regulation subassembly 300 intelligent distribution air output, can make the performance of waiting to dispel the heat module separately reach best operating condition, promote electronic product's index performance, quality and market competition, promote user's use simultaneously and experience.
Specifically, as shown in fig. 3 and 6, the automatic air volume adjusting assembly 300 includes a driving rack 320, an arc-shaped gear 330, an adjusting air distributing piece 340 and a driving motor 310 with a driving gear, the driving motor 310 is a forward and backward rotation driving motor 310, the driving rack 320 is long-strip-shaped, one side surface of the driving rack 320 in the length direction is a tooth-shaped structure, and the driving gear of the driving motor 310 is engaged with the driving rack 320. The adjusting air distribution piece 340 is formed in the air cavity 200, one end of the adjusting air distribution piece is rotatably connected with the air cavity 200, the other end of the adjusting air distribution piece is fixedly connected with the arc-shaped gear 330, and the arc-shaped gear 330 is meshed with the transmission rack 320. When the air volume needs to be adjusted, the driving motor 310 is started to drive the transmission gear to rotate, the transmission gear drives the transmission rack 320 to linearly move, the transmission rack 320 drives the arc gear 330 to do curvilinear motion, the arc gear 330 drives the adjusting air distributing sheet 340 to deflect so as to adjust the area communicated between the first air cavity 210 and the second air cavity 220, and finally, the adjustment of different air volumes of the second air cavity 220 is realized.
The invention adjusts the air quantity entering the module to be radiated by adjusting the swing of the air distributing sheet 340, can realize stepless adjustment and can more accurately control the air quantity in the air cavity 200, and the automatic air quantity adjusting component 300 of the invention is in a structure of guiding air to the fluid along with the air rather than a structure of suddenly stopping the wind in terms of aerodynamics, and is more beneficial to the flow of air.
As a further improvement of the present invention, two ends of the transmission rack 320 in the length direction are further provided with a limit switch 600 at a distance, the limit switches 600 limit the transmission rack 320, when the transmission rack 320 triggers the limit switches 600, the driving motor 310 stops the transmission action on the transmission rack 320 in the direction, and at this time, the adjusting air-distributing piece 340 reaches the maximum adjusting value.
The intelligent heat dissipation device of the present invention further includes a control system (not shown), the control system is electrically connected to the fan 100, the temperature sensor 400, the driving motor 310 and the limit switch 600, the voltage and the rotation speed of the fan 100 can be automatically adjusted by the control system, and the voltage, the rotation speed and the operation noise of the fan 100 can be reduced. When the temperature sensor 400 detects that the temperature rise of the module to be cooled exceeds a critical value, the temperature sensor 400 feeds back a signal to the control system, the control system sends an instruction to control the driving motor 310 to drive the driving rack 320 to move so as to increase the air volume of the module to be cooled by adjusting the air distributing pieces 340, and when the temperature sensor 400 senses that the temperature of the module to be cooled is within a normal range, the temperature sensor 400 feeds back a signal to the control system to stop adjusting the air volume. The temperature sensor 400 may detect the temperature of the module to be heat-dissipated through the temperature of the heat sink 500. The fan 100 can adjust the air volume of the fan 100 through a control system. The conversion comparison between the intelligent cooling system control and the control system is visual and understandable.
The electronic product further comprises a circuit board C, the module to be cooled (A, B), the fan 100 and the air cavity 200 are all attached to the circuit board C, the driving motor 310 is also fixed on the circuit board C, the transmission rack 320 is fixed on the circuit board C through a fixing column and a clamp spring, and the transmission rack 320 is formed above the air cavity 200. The adjusting air distributing plate 340 is formed in the air cavity 200, one end of the adjusting air distributing plate is fixed in the air cavity 200 through a rotating shaft and a clamping spring in a vertical state, and the other end of the adjusting air distributing plate is fixedly connected with an arc-shaped gear 330 which is also formed above the air cavity 200 through a fixing shaft and a clamping spring.
The number of the modules to be heat dissipated is two or more, when the number of the modules to be heat dissipated is large, a plurality of fans 100 may be provided, and each fan 100 may adjust two or more modules to be heat dissipated, which is shown in the figure as an example, only one fan 100 is used to adjust two modules to be heat dissipated, but should not be limited thereto. A plurality of modules to be cooled are adjusted through the fan 100, the purpose of intelligent control cooling can be achieved according to the actual working condition of the electronic product, manual intervention is not needed, and the electronic product can be effectively self-adjusted according to the running condition of the electronic product.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the embodiments of the present invention and not for limiting the same, and although the embodiments of the present invention are described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the embodiments of the present invention, and these modifications or equivalent substitutions cannot make the modified technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. An intelligent heat dissipation method for an electronic product, wherein the electronic product comprises more than two modules to be dissipated, is characterized by comprising the following steps:
step S1: a single fan is respectively communicated with more than two modules to be radiated through an air cavity, an automatic air quantity adjusting assembly is connected between the fan and the modules to be radiated, and the temperature of each module to be radiated is detected through a temperature sensor;
step S2: when the temperature of the module to be radiated exceeds a critical value, the temperature sensor feeds back a signal to the control system, and the control system controls the automatic air volume adjusting assembly to adjust the air volume entering the module to be radiated.
2. The intelligent heat dissipation method for electronic products as claimed in claim 1, wherein the step S2, in which the control system controls the automatic airflow adjusting assembly to adjust the airflow entering the module to be dissipated, comprises the specific steps of: the automatic air quantity adjusting assembly comprises a driving motor, a transmission rack, an arc gear and an adjusting air distributing piece, the control system controls the driving motor to drive the transmission rack to move, the transmission rack drives the arc gear to rotate, the arc gear drives the adjusting air distributing piece to swing, and the air quantity entering the module to be cooled is adjusted by adjusting the swing of the air distributing piece.
3. The intelligent heat dissipation method for electronic products as claimed in claim 2, wherein when the adjustment wind distribution piece reaches the limit position, the transmission rack is triggered by the transmission rack to stop the driving mechanism from adjusting the transmission rack.
4. The intelligent heat dissipation method for electronic products as claimed in claim 1, wherein the control system is further configured to control the voltage of the fan to increase or decrease the air output of the fan.
5. The intelligent heat dissipation method for electronic products as claimed in claim 1, wherein each module to be dissipated is further provided with a heat sink, and the temperature sensor detects the temperature of each module to be dissipated by detecting the temperature of the heat sink.
6. The utility model provides an intelligent heat abstractor for electronic product, wherein electronic product includes two and above the module of treating the heat dissipation, every treat the heat dissipation module and all be connected with temperature sensor, its characterized in that, intelligent heat abstractor includes fan, wind chamber and automatic air regulation subassembly, the wind chamber include with the first wind cavity of fan intercommunication and with every treat the second wind cavity of heat dissipation module intercommunication, it is a plurality of the second wind cavity all communicates with first wind cavity, automatic air regulation subassembly forms in the position of first wind cavity and second wind cavity intercommunication, is used for adjusting a plurality ofly the different amount of wind of second wind cavity.
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| CN210444737U (en) * | 2019-09-26 | 2020-05-01 | 江苏东盈电子科技有限公司 | Electronic power equipment customization intelligent radiator structure |
| CN111414062A (en) * | 2020-03-25 | 2020-07-14 | 联想(北京)有限公司 | Electronic apparatus and control method |
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| WO2022267014A1 (en) * | 2021-06-25 | 2022-12-29 | Intel Corporation | Fan enclosure with adjustable side venting |
| CN114007352A (en) * | 2021-09-28 | 2022-02-01 | 广州市力驰微电子科技有限公司 | A/D conversion circuit module structure and heat dissipation method |
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