CN212587852U - Optical fiber amplifier compatible with SFP + packaging - Google Patents

Abstract

The utility model relates to an optical fiber amplifier technical field specifically discloses an optical fiber amplifier of compatible SFP + encapsulation, wherein, include: the LED lamp comprises a shell, a circuit device and a light path device, wherein the circuit device and the light path device are arranged in the shell, the shell comprises a structure compatible with SFP + packaging, a containing space is arranged in the shell, the circuit device and the light path device are both located in the containing space, the light path device is located below the circuit device, a golden finger type power connector is arranged on the circuit device, and the golden finger type power connector can be exposed out of the shell. The utility model provides a compatible SFP + packaged fiber amplifier, inner space is very compact, the SFP + encapsulation of the appearance compatible standard of product, and the electrical interface pin also satisfies current SFP + encapsulation requirement, and can satisfy the dynamic plug, plug-and-play, and it is very convenient to use.

Description

Optical fiber amplifier compatible with SFP + packaging

Technical Field

The utility model relates to an optical fiber amplifier technical field especially relates to an optical fiber amplifier of compatible SFP + encapsulation.

Background

Modern communication is rapidly developed, requirements on compatibility and integration level of a transmission system are higher and higher, but the compatibility often brings larger loss, and the integration level of the system has high requirements, so that the requirements on the appearance volume of an erbium-doped fiber amplifier (EDFA) are higher and higher, and the EDFA can be plugged in the existing system and is convenient to use.

Disclosure of Invention

The utility model provides a compatible SFP + encapsulated fiber amplifier solves the unable problem that realizes the hot plug and reduce the volume simultaneously that exists among the correlation technique.

As an aspect of the present invention, there is provided an SFP + packaged optical fiber amplifier, wherein the optical fiber amplifier includes: the LED lamp comprises a shell, a circuit device and a light path device, wherein the circuit device and the light path device are arranged in the shell, the shell comprises a structure compatible with SFP + packaging, a containing space is arranged in the shell, the circuit device and the light path device are both located in the containing space, the light path device is located below the circuit device, a golden finger type power connector is arranged on the circuit device, and the golden finger type power connector can be exposed out of the shell.

Further, the casing includes the base and closes the apron on the base, form on the base accommodation space.

Further, the housing is further provided with a module unlocking mechanism, and the module unlocking mechanism is used for locking or unlocking the housing and the mounting cage of the SFP + packaging-compatible optical fiber amplifier.

Further, the module unlocking mechanism includes: the optical fiber amplifier locking device comprises a pull ring, a slide block and an elastic piece, wherein the pull ring is arranged at one end of a base, the slide block is arranged on a cover plate, the elastic piece is arranged on the slide block, the pull ring is connected with the slide block, the slide block can be pushed when the pull ring is pulled, the elastic piece can be compressed to realize unlocking between the shell and an installation cage of an optical fiber amplifier compatible with SFP + packaging, and when the pull ring is released, the slide block can be restored to a default state under the elastic force of the elastic piece to realize locking between the shell and the installation cage of the optical fiber amplifier compatible with SFP + packaging.

Further, the elastic part comprises springs which are symmetrically arranged on two sides of the sliding block respectively.

Further, the light path device includes two unification devices, trinity device, erbium-doped fiber and adapter, and erbium-doped fiber includes the loop configuration, two unification devices and trinity device all are located in the loop configuration, the pump light source is connected to two unification devices, the input of two unification devices is used for incoming optical signal, the output of two unification devices with pass through between the input of trinity device erbium-doped fiber connects, the output of trinity device is used for output optical signal, the adapter is located outside the loop configuration, two unification devices and trinity device all with the adapter is connected.

Further, the two-in-one device comprises a first isolator and a wavelength division multiplexer, and the three-in-one device comprises a second isolator, a light splitter and a photodiode.

Further, the pump light source comprises a 3-pin refrigeration-free series pump laser.

Further, the circuit device comprises a printed circuit board, and a pumping light source, a photoelectric detector, an analog circuit and a digital circuit which are arranged on the printed circuit board.

Further, the analog circuit and the digital circuit are arranged on both sides of the printed circuit board in a patch form.

The utility model provides a compatible SFP + packaged fiber amplifier, inner space is very compact, the SFP + encapsulation of the appearance compatible standard of product, and the electrical interface pin also satisfies current SFP + encapsulation requirement, and can satisfy the dynamic plug, plug-and-play, and it is very convenient to use.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.

Fig. 1 is a schematic diagram of the external structure of the SFP + package compatible optical fiber amplifier provided by the present invention.

Fig. 2 is a schematic structural view of fig. 1 with the cover plate removed.

Fig. 3 is an exploded view of the SFP + package compatible fiber amplifier provided by the present invention.

Fig. 4 is a block diagram of the optical circuit device provided by the present invention.

Detailed Description

It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances for purposes of describing the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In the present embodiment, an SFP + package compatible optical fiber amplifier is provided, as shown in fig. 1 to 3, including: casing 10 and circuit device 20 and the light path device 30 of setting in casing 10, casing 10 is including the structure of compatible SFP + encapsulation, set up accommodation space in the casing 10, circuit device 20 with light path device 30 all is located in the accommodation space, just light path device 30 is located the below of circuit device 20, be provided with golden finger type power connector 21 on the circuit device 20, just golden finger type power connector 21 can expose outside the casing 10.

The embodiment of the utility model provides an optical fiber amplifier of compatible SFP + encapsulation, inner space is very compact, the SFP + encapsulation of the appearance compatible standard of product, and the electrical interface pin also satisfies current SFP + encapsulation requirement, and can satisfy the dynamic plug, plug-and-play, and it is very convenient to use.

It should be noted that SFP + (Small Form-factor plugs) in the embodiment of the present invention can be simply understood as an upgraded version of gbic (gigabit Interface converter).

Specifically, the housing 10 includes a base 11 and a cover 12 covering the base 11, and the base 11 forms the accommodating space.

It should be noted that, as shown in fig. 3, the optical fiber amplifier compatible with SFP + package provided by the embodiment of the present invention further includes an EMC spring 40, where the EMC spring 40 is used to fix the covered base and the cover plate 12.

It should be understood that the housing 10 is in the form of an SFP + compatible package, the housing 10 includes a base 11 and a cover plate 12 covering the base 11, and the base 11 has a receiving compartment therein; the circuit device 20 comprises a printed circuit board, passive devices are arranged on the base 11, a pumping light source and a photoelectric detector are arranged on the printed circuit board, and the optical path device 30 is positioned below the printed circuit board; and a gold finger type electrical interface is arranged on one side of the printed circuit board. The utility model provides a compatible SFP + encapsulated fiber amplifier, compact structure, compatible traditional SFP + light transceiver module's size and pin picture.

Specifically, in order to facilitate the installation of the SFP + compatible optical fiber amplifier, a module unlocking mechanism is further disposed on the housing 10, and the module unlocking mechanism is used for locking or unlocking the housing and the installation cage of the SFP + compatible optical fiber amplifier.

In some embodiments, the module unlocking mechanism comprises: the optical fiber amplifier comprises a pull ring 13, a slide block 14 and an elastic piece 15, wherein the pull ring 13 is arranged at one end of the base 11, the slide block 14 is arranged on the cover plate 12, the elastic piece 15 is arranged on the slide block 14, the pull ring 13 is connected with the slide block 14, the slide block 14 can be pushed when the pull ring 13 is pulled, the elastic piece 15 can be compressed to realize the unlocking between the shell and the installation cage of the SFP + packaging-compatible optical fiber amplifier, and when the pull ring 13 is released, the slide block 14 can be restored to a default state under the elastic force of the elastic piece 15 to realize the locking between the shell and the installation cage of the SFP + packaging-compatible optical fiber amplifier.

Preferably, the elastic member 15 includes springs symmetrically disposed at both sides of the slider 14, respectively.

As shown in fig. 3, when unlocking, pulling the pull ring 13 to make the pull ring 13 push the slide block 14 to move forward, and pressing the locking spring piece on the cage to be separated from the triangular block 16 for locking on the cover plate 11 by using the inclined surface of the head of the slide block 14 to realize unlocking; when the pull ring 13 is released, the slider 14 is returned to the default state by the elastic force of the two springs on the slider 14 to facilitate locking when the SFP + packaged fiber amplifier is inserted into the cage.

Specifically, as shown in fig. 3 and 4, light path device 30 includes two unification devices 31, trinity device 32, erbium-doped fiber 33 and adapter 34, and erbium-doped fiber 33 includes the loop configuration, two unification devices 31 and trinity device 33 all are located in the loop configuration, pump light source 22 is connected to two unification devices 31, two unification devices 31's input is used for input optical signal, two unification devices 31's output with pass through between trinity device 32's the input erbium-doped fiber 33 connects, trinity device 32's output is used for output optical signal, adapter 34 is located outside the loop configuration, two unification devices 31 and trinity device 32 all with adapter 34 connects.

Further specifically, the two-in-one device 31 includes a first isolator and a wavelength division multiplexer, and the three-in-one device 32 includes a second isolator, a beam splitter, and a photodiode.

It should be understood that the two-in-one device 31 is connected to the pump light source 22, and the two-in-one device 31 and the three-in-one device 32 are connected by the erbium-doped fiber 33; the two-in-one device 31 is connected with an input optical signal, the three-in-one device 32 is connected with an output optical signal, and the optical fiber amplifier compatible with SFP + packaging provided by the embodiment can monitor the output power in real time, so that the amplifier can well keep stable output.

Preferably, the pump light source 22 comprises a 3-pin coolerless series pump laser.

It should be noted that the adapter 34 is placed in the annular groove of the base 11 according to the protocol requirements, and when the cover is closed, the upper cover is used to press the adapter to achieve complete positioning; the pumping light source 22 is arranged at the middle position in the base and is ensured to be in close contact with the boss at the corresponding position of the base so as to ensure good heat dissipation, the light path device and the thermal shrinkage melting point are arranged at two sides of the pumping light source and ensure that enough space is reserved between the device and two side walls in the base so as to arrange the erbium-doped optical fiber; the circuit device is placed in the base right above the whole optical circuit device according to the position required by the protocol.

The embodiment of the utility model provides an appearance and the circuit device of compatible SFP + encapsulated fiber amplifier accord with SFF-8432V 5.2's relevant requirement completely, can utilize corresponding SFP +'s cage and electric interface in order to realize the hot plug of amplifier.

Specifically, the circuit device comprises a printed circuit board, and a pumping light source, a photoelectric detector, an analog circuit and a digital circuit which are arranged on the circuit board.

Preferably, the analog circuit and the digital circuit are arranged on both sides of the printed circuit board in a patch form.

It should be appreciated that in terms of Printed Circuit Board (PCB) design, device positive and negative patch placement is employed to minimize PCB size as much as possible; the analog circuit and the digital circuit are relatively and intensively arranged according to functions on the layout respectively, so that the interference influence of the digital part on the analog circuit is avoided, and particularly the detection influence on the output signal light is avoided.

In some embodiments, the housing 10 has dimensions 72mm x 13.55 mm x 8.55mm, and is also dominated by a relatively thin 165 μm diameter fiber, which is also 165 μm diameter, inside the housing, which saves space and makes possible an SFP + package compatible EDFA (erbium doped fiber amplifier).

Since most of the communication networks outside the products are 250 μm optical fibers, if 165 μm optical fibers are directly used at the input and output ends of the products, extra loss is caused by different mode field diameters, and in order to solve this problem, the embodiment of the present invention uses a hybrid fiber type combining device (the input of the two-in-one device and the output of the three-in-one device are 250 μm optical fibers, the output and pump end of the two-in-one device are 165 μm optical fibers, and the input of the three-in-one device is 165 μm optical fibers), so that the optical fibers are transited from 250 μm to 165 μm through the combining device, and after being connected to the erbium-doped optical fibers of 165 μm, the fibers are changed into 250 μm optical fibers through the three-in-one device of the hybrid. The pumping end of two unification devices has used 165 mu m optic fibre, the utility model discloses the diameter of the pumping optic fibre in the compatible SFP + encapsulated fiber amplifier who provides really is also 165 mu m, the butt fusion that the pumping also can be smooth like this. The embodiment of the utility model provides a compatible SFP + encapsulated fiber amplifier, the splice point does not have 250 mu m optic fibre to 165 mu m optic fibre, has avoided the different extra losses that lead to of optic fibre mode field diameter like this.

In order to realize the miniaturization of the amplifier, the utility model discloses still used two core heat-shrinkable tube, put two optical fiber splice points in a heat-shrinkable tube, like this can the at utmost save space.

Because the output power of amplifier is not very big (the biggest 16dbm output that supports to because the overall dimension of module only 72mm x 13.55 mm x 8.55mm, can only select miniature no refrigeration pumping, the pumping laser adopts 3 needles no refrigeration series pumping, because the product heats lessly in normal work, the convenient problem that can not have of heat dissipation, can satisfy the product reliability requirement.

The embodiment of the utility model provides a compatible SFP + encapsulated fiber amplifier, inner structure have adopted the multilayer design, under printed circuit board, the light path device has been placed to the base top, and the light path device is glass encapsulation, does not take the structure of metal sleeve encapsulation, like this with the PCB contact, can not arouse the device short circuit on the PCB board. Additionally the utility model provides a compatible SFP + encapsulated fiber amplifier, compact structure, totally compatible traditional SFP + optical transceiver module's size and pin picture. The invention is very suitable for a transmitting or receiving board card with high density integration due to small volume, convenient installation, plug-in and pull-out, and extremely low power consumption, and can meet the requirements of a backbone network, an access network and a cable television network of an optical fiber communication system.

It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (10)

1. An SFP + package compatible optical fiber amplifier, comprising: the LED lamp comprises a shell, a circuit device and a light path device, wherein the circuit device and the light path device are arranged in the shell, the shell comprises a structure compatible with SFP + packaging, a containing space is arranged in the shell, the circuit device and the light path device are both located in the containing space, the light path device is located below the circuit device, a golden finger type power connector is arranged on the circuit device, and the golden finger type power connector can be exposed out of the shell.

2. The SFP + packaged fiber amplifier of claim 1, wherein the housing comprises a base and a cover plate covering the base, the base defining the receiving space.

3. The SFP + packaged fiber amplifier of claim 2, wherein a module unlocking mechanism is further provided on the housing for locking or unlocking the housing with the mounting cage of the SFP + packaged fiber amplifier.

4. The SFP + packaged compatible fiber amplifier of claim 3, wherein the module unlocking mechanism comprises: the optical fiber amplifier locking device comprises a pull ring, a slide block and an elastic piece, wherein the pull ring is arranged at one end of a base, the slide block is arranged on a cover plate, the elastic piece is arranged on the slide block, the pull ring is connected with the slide block, the slide block can be pushed when the pull ring is pulled, the elastic piece can be compressed to realize unlocking between the shell and an installation cage of an optical fiber amplifier compatible with SFP + packaging, and when the pull ring is released, the slide block can be restored to a default state under the elastic force of the elastic piece to realize locking between the shell and the installation cage of the optical fiber amplifier compatible with SFP + packaging.

5. The SFP + package compatible fiber amplifier of claim 4, wherein the resilient member comprises springs symmetrically disposed on both sides of the slider, respectively.

6. The SFP + packaged fiber amplifier according to any one of claims 1 to 5, wherein the optical path device comprises a two-in-one device, a three-in-one device, an erbium-doped fiber and an adaptor, the erbium-doped fiber comprises a ring structure, the two-in-one device and the three-in-one device are both located in the ring structure, the two-in-one device is connected with the pump light source, the input end of the two-in-one device is used for inputting optical signals, the output end of the two-in-one device is connected with the input end of the three-in-one device through the erbium-doped fiber, the output end of the three-in-one device is used for outputting optical signals, the adaptor is located outside the ring structure, and the two-in-one device and.

7. The SFP + packaged compatible fiber amplifier of claim 6, wherein the two-in-one device comprises a first isolator and a wavelength division multiplexer, and the three-in-one device comprises a second isolator, an optical splitter, and a photodiode.

8. The SFP + packaged compatible fiber amplifier of claim 6, wherein the pump light source comprises a 3-pin coolerless series pump laser.

9. An SFP + packaged fiber amplifier according to any of claims 1 to 5 wherein the circuit devices comprise a printed circuit board and a pump light source, photodetector, analogue circuitry and digital circuitry disposed on the circuit board.

10. The SFP + package compatible optical fiber amplifier of claim 9, wherein the analog and digital circuits are both disposed in a patch on both sides of the printed circuit board.

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