CN212585876U - Fault simulation system for resistance type temperature sensor - Google Patents
Fault simulation system for resistance type temperature sensor Download PDFInfo
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- CN212585876U CN212585876U CN202021708319.7U CN202021708319U CN212585876U CN 212585876 U CN212585876 U CN 212585876U CN 202021708319 U CN202021708319 U CN 202021708319U CN 212585876 U CN212585876 U CN 212585876U
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Abstract
The utility model provides a resistance type temperature sensor fault analog system, include: the device comprises a power supply, a micro control unit, a resistance type temperature sensor, a simulation heating unit and a simulation cooling unit; the power supply is connected with the micro control unit, the micro control unit is grounded, and the resistance type temperature sensor is connected with the micro control unit in parallel; the simulation temperature rising unit is connected with the resistance type temperature sensor in series, and the simulation temperature lowering unit is connected with the resistance type temperature sensor in parallel. The utility model discloses a simple circuit structure, the temperature of quick simulation resistance type temperature sensor is big fault on the earth, the temperature is little fault on the earth, sensor open circuit trouble, sensor short circuit trouble, and then short-term test resistance type temperature sensor trouble.
Description
Technical Field
The utility model belongs to the technical field of automotive electronics control, concretely relates to resistance type temperature sensor fault analog system.
Background
The resistive temperature sensor may be damaged during use and fault detection is required. The common manual transformation is used in the prior art for the resistor type temperature sensor fault part, the sensor is damaged during fault simulation, only one fault can be simulated by the manual transformation at one time, different faults need to be manually transformed for many times, and the situations with different severity in one fault need to be manually transformed for many times. When partial circuit short circuit or partial circuit open circuit exist in the sensor, the temperature value measured by the sensor is smaller or larger, and the simulation measurement can be realized only by reforming multiple tests for multiple times when the temperature value is smaller or larger. Based on this, the utility model provides a resistance type temperature sensor fault analog system.
SUMMERY OF THE UTILITY MODEL
The above-mentioned not enough to prior art, the utility model provides a resistance type temperature sensor fault analog system to solve above-mentioned technical problem.
The utility model provides a resistance type temperature sensor fault analog system, include: the device comprises a power supply, a micro control unit, a resistance type temperature sensor, a simulation heating unit and a simulation cooling unit; the power supply is connected with the micro control unit, the micro control unit is grounded, and the resistance type temperature sensor is connected with the micro control unit in parallel; the simulation temperature rising unit is connected with the resistance type temperature sensor in series, and the simulation temperature lowering unit is connected with the resistance type temperature sensor in parallel.
Furthermore, the analog heating unit comprises a plurality of analog heating circuits and a heating selection switch, the plurality of analog heating circuits are connected in parallel with the heating selection switch, and each analog heating circuit comprises a heating resistor and a heating circuit switch which are connected in series; the simulation cooling unit comprises a multi-path simulation cooling circuit and a cooling selection switch, the multi-path simulation cooling circuit and the cooling selection switch are connected in parallel, and the simulation cooling circuit comprises a cooling resistor and a cooling circuit switch which are connected in series.
Furthermore, a pull-up resistor is connected in series on a connection circuit of the micro control unit and the power supply.
Furthermore, the temperature-rise selection switch and the temperature-fall selection switch are respectively connected with the micro control unit through IO lines.
Further, the micro control unit is an MCU.
The utility model has the advantages that,
the utility model provides a pair of resistance type temperature sensor fault simulation system can accurate quick simulation resistance type temperature sensor temperature big fault on the large side, temperature fault on the small side, sensor open circuit trouble, sensor short circuit trouble, and then short circuit fault of short-term test resistance type temperature sensor, improves work efficiency, is suitable for extensive application.
Furthermore, the utility model relates to a principle is reliable, and simple structure has very extensive application prospect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a system according to an embodiment of the present invention;
FIG. 2 is a schematic flow diagram of a method of one embodiment of the present invention;
wherein, 1, a micro control unit; 2. a pull-up resistor; 3. a first resistive temperature sensor circuit node; 4. A first temperature-raising circuit switch; 5. a first temperature-raising resistor; 6. a second temperature-raising circuit switch; 7. a second temperature-raising resistor; 8. a third temperature-raising circuit switch; 9. a third temperature-rising resistor; 10. a temperature-rise selection switch; 11. a second resistive temperature sensor circuit node; 12. a first cooling circuit switch; 13. a first temperature reduction resistor; 14. A second cooling circuit switch; 15. a second temperature-reducing resistor; 16. a third cooling circuit switch; 17. a third temperature-reducing resistor; 18. a cooling selection switch; 19. a third resistive temperature sensor circuit node; 20. the resistance type temperature sensor tests the temperature resistance; 21. a resistance type temperature sensor.
Detailed Description
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
The embodiment of the application provides a resistance type temperature sensor fault simulation system, includes: the device comprises a power supply, a micro control unit, a resistance type temperature sensor, a simulation heating unit and a simulation cooling unit; the power supply is connected with the micro control unit, the micro control unit is grounded, and the resistance type temperature sensor is connected with the micro control unit in parallel; the simulation temperature rising unit is connected with the resistance type temperature sensor in series, and the simulation temperature lowering unit is connected with the resistance type temperature sensor in parallel.
Optionally, as an embodiment of the present application, the analog temperature-raising unit includes a plurality of analog temperature-raising circuits and a temperature-raising selection switch, the plurality of analog temperature-raising circuits are connected in parallel with the temperature-raising selection switch, and the analog temperature-raising circuit includes a temperature-raising resistor and a temperature-raising circuit switch connected in series; the simulation cooling unit comprises a multi-path simulation cooling circuit and a cooling selection switch, the multi-path simulation cooling circuit and the cooling selection switch are connected in parallel, and the simulation cooling circuit comprises a cooling resistor and a cooling circuit switch which are connected in series.
Optionally, as an embodiment of the present application, a pull-up resistor is connected in series to a connection line between the micro control unit and the power supply.
Optionally, as an embodiment of the present application, the temperature-increasing selection switch and the temperature-decreasing selection switch are respectively connected to the micro control unit through an IO line.
Optionally, as an embodiment of the present application, the micro control unit is an MCU.
In this embodiment, the power voltage is + 5V.
In this embodiment, pull-up resistor Rp1000 omega and the resistance of the connecting circuit line is 0.5 omega.
In this embodiment, the micro control unit 1 is an MCU, and the MCU reads a voltage between a first resistance type temperature sensor circuit node and a third resistance type temperature sensor circuit node, and obtains a measurement sensor temperature value through a calibration CURVE table by voltage-temperature conversion.
In this embodiment, the analog temperature-raising unit includes three analog temperature-raising circuits and a temperature-raising selection switch; the simulation cooling unit comprises three paths of simulation cooling circuits and a cooling selection switch; the first path of analog temperature-raising circuit comprises a first temperature-raising circuit switch 4 and a first temperature-raising resistor 5; the second path of analog heating circuit comprises a second heating circuit switch 6 and a second heating resistor 7; the third analog temperature-raising circuit comprises a third temperature-raising circuit switch 8 and a third temperature-raising resistor 9; a warming selection switch 10 is also included.
In this embodiment, the analog cooling circuits include three analog cooling circuits, and the first analog cooling circuit includes a first cooling circuit switch 12 and a first cooling resistor 13; the second circuit of analog cooling circuit comprises a second cooling circuit switch 14 and a second cooling resistor 15; the third analog cooling circuit comprises a third cooling circuit switch 16 and a third cooling resistor 17; and a cooling selection switch 18.
The fault simulation method of the resistance type temperature sensor comprises the following steps:
the temperature-rising selection switch is turned on, at least one temperature-rising circuit switch is turned off, the temperature-reducing selection switch is turned on, and three temperature-reducing circuit switches are turned on to simulate a temperature-too-large fault of the resistance type temperature sensor;
the temperature-rise selection switch is closed, at least one temperature-reduction circuit switch is closed, the temperature-reduction selection switch is opened, and three temperature-rise circuit switches are opened to simulate a temperature-small fault of the resistance type temperature sensor;
the open-circuit fault of the resistance type temperature sensor is simulated by opening the temperature-rise selection switch, the three temperature-rise circuit switches, the three temperature-reduction circuit switches and the temperature-reduction selection switch;
the short-circuit fault of the resistance type temperature sensor is simulated by closing the temperature-rising selection switch and the temperature-lowering selection switch;
the fault recovery of the resistance type temperature sensor is simulated by closing the temperature-rising selection switch and opening the three temperature-rising circuit switches, the three temperature-reducing circuit switches and the temperature-reducing selection switch.
As shown in fig. 2, the specific implementation method of the system is as follows:
s100, starting;
s101, simulating a fault with a large temperature;
s102, judging whether a fault with large temperature occurs: if not, returning to the step S101; if yes, carrying out the next step;
s103, recovering temperature and simulating without fault
S104, simulating a temperature small fault;
s105, judging whether a temperature small fault occurs: if not, returning to the step S104; if yes, carrying out the next step;
s106, recovering temperature fault-free simulation;
s107, performing open-circuit fault simulation;
s108, judging whether an open-circuit fault occurs: if not, returning to the step S107; if yes, carrying out the next step;
s109, simulating the opening temperature without faults;
S10A, recovering short-circuit fault-free simulation;
S10B, judging whether short-circuit fault occurs: if not, returning to the step S10A; if yes, carrying out the next step;
S10C, recovering temperature and simulating without fault;
and S10D, ending.
Simulating a temperature-too-high fault, a temperature-too-low fault, a sensor open-circuit fault and a sensor short-circuit fault of the resistance type temperature sensor in sequence, wherein the steps correspond to the steps S101, S104, S107 and S10A respectively; then fault detection is respectively carried out, which respectively corresponds to the steps S102, S105, S108 and S10B; if the fault detection finds that the fault occurrence requirement is not met, returning to the fault simulation step, namely returning to the steps S101, S104, S107 and S10A respectively; when the failure detection satisfies the failure occurrence request, failure recovery simulation is performed, corresponding to steps S103, S106, S109, and S10C, respectively.
In this embodiment, in the resistive temperature sensor fault simulation method, in order to simulate a fault in which the temperature of the resistive temperature sensor is too high, the temperature-increasing selection switch 10 is controlled to be turned on, at least one of the first temperature-increasing circuit switch 4, the second temperature-increasing circuit switch 6, and the third temperature-increasing circuit switch 8 is turned off, and the first temperature-decreasing circuit switch 12, the second temperature-decreasing circuit switch 14, the third temperature-decreasing circuit switch 16, and the temperature-decreasing selection switch 18 are all turned on.
In this embodiment, the resistances of the first path, the second path, and the third path of the analog temperature-raising circuit are stepped and gradually reduced, so as to realize fault simulation of the resistance-type temperature sensor for different degrees when the temperature is increased. The initial value of the third temperature increasing resistor 9 is set to be a resistance threshold value x 120% when a temperature-excessive fault occurs in the resistance type temperature sensor.
In this embodiment, when the temperature of the resistance type temperature sensor is too high, the third temperature-raising circuit switch 8 is selected to be turned off; if a larger degree of temperature-bias fault needs to be simulated, the second temperature-raising circuit switch 6 and the first temperature-raising circuit switch 4 are respectively selected.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the temperature large fault simulation is calculated as follows:
wherein R issIs a temperature sensor resistance, RerrFor fault-simulating resistance, RpAs pull-up resistor, RLeadIs a line resistance, UsIs the voltage at the power supply terminal.
In this embodiment, in the resistive temperature sensor fault simulation method, in order to simulate a fault in which the temperature of the resistive temperature sensor is low, the temperature-increasing selection switch 10 is controlled to be turned off, at least one of the first temperature-decreasing circuit switch 12, the second temperature-decreasing circuit switch 14, and the third temperature-decreasing circuit switch 16 is turned off, and the first temperature-increasing circuit switch 4, the second temperature-increasing circuit switch 6, the third temperature-increasing circuit switch 8, and the temperature-decreasing selection switch 18 are turned on.
In this embodiment, the resistors on the first path, the second path and the third path of the simulation cooling circuit are gradually reduced in a step shape, so as to realize the fault simulation of the resistance type temperature sensor with temperature reduction at different degrees. The initial value of the first temperature-reducing resistor 13 is set to a resistance threshold value x 80% when a temperature-too-small fault occurs in the resistance type temperature sensor.
In this embodiment, when the temperature of the resistance type temperature sensor is smaller, the switch 12 for closing the temperature reducing channel 1 of the resistance type temperature sensor is selected; if a larger degree of temperature-lowering faults need to be simulated, the second temperature-lowering circuit switch 14 and the third temperature-lowering circuit switch 16 are turned off respectively.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the temperature small fault simulation is calculated as follows:
wherein R issIs a temperature sensor resistance, RerrFor fault-simulating resistance, RpAs pull-up resistor, RLeadIs a line resistance, UsIs the voltage at the power supply terminal.
In this embodiment, in the resistive temperature sensor fault simulation method, in the sensor open-circuit fault simulation, the control switches, namely the first temperature-raising circuit switch 4, the second temperature-raising circuit switch 6, the third temperature-raising circuit switch 8, the temperature-raising selection switch 10, the first temperature-lowering circuit switch 12, the second temperature-lowering circuit switch 14, the third temperature-lowering circuit switch 16, and the temperature-lowering selection switch 18, are all turned on.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the open-circuit fault simulation is calculated as follows:
U＝Us
wherein, UsIs the voltage at the power supply terminal.
In this embodiment, in the resistive temperature sensor fault simulation method, the sensor short-circuit fault simulation is performed to control the temperature-increasing selection switch 10 and the temperature-decreasing selection switch 18 to be turned off.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the short-circuit fault simulation is calculated as follows:
wherein R ispAs pull-up resistor, RLeadIs a line resistance, UsIs the voltage at the power supply terminal.
In this embodiment, in the resistive temperature sensor fault simulation method, when the sensor fault recovery simulation is performed, the temperature-raising selection switch 10 is turned off, and the remaining fault simulation switches control the switches, i.e., the first temperature-raising circuit switch 4, the second temperature-raising circuit switch 6, the third temperature-raising circuit switch 8, the first temperature-lowering circuit switch 12, the second temperature-lowering circuit switch 14, the third temperature-lowering circuit switch 16, and the temperature-lowering selection switch 18, to be turned on, the sensor fault recovery simulation is performed.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the fault recovery simulation is calculated as follows:
wherein R issIs a temperature sensor resistance, RpAs pull-up resistor, RLeadIs a line resistance, UsIs the voltage at the power supply terminal.
In this embodiment, the first temperature-raising circuit switch 4, the second temperature-raising circuit switch 6, the third temperature-raising circuit switch 8, the temperature-raising selection switch 10, the first temperature-lowering circuit switch 12, the second temperature-lowering circuit switch 14, the third temperature-lowering circuit switch 16, and the temperature-lowering selection switch 18 are all connected to the micro control unit 1 through IO.
Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. A resistive temperature sensor fault simulation system, comprising: the device comprises a power supply, a micro control unit, a resistance type temperature sensor, a simulation heating unit and a simulation cooling unit; the power supply is connected with the micro control unit, the micro control unit is grounded, and the resistance type temperature sensor is connected with the micro control unit in parallel; the simulation temperature rising unit is connected with the resistance type temperature sensor in series, and the simulation temperature lowering unit is connected with the resistance type temperature sensor in parallel.
2. The fault simulation system of the resistive temperature sensor according to claim 1, wherein the analog temperature-raising unit comprises a plurality of analog temperature-raising circuits and a temperature-raising selection switch, the plurality of analog temperature-raising circuits and the temperature-raising selection switch are connected in parallel, and the analog temperature-raising circuit comprises a temperature-raising resistor and a temperature-raising circuit switch which are connected in series; the simulation cooling unit comprises a multi-path simulation cooling circuit and a cooling selection switch, the multi-path simulation cooling circuit and the cooling selection switch are connected in parallel, and the simulation cooling circuit comprises a cooling resistor and a cooling circuit switch which are connected in series.
3. The system of claim 1, wherein the micro-control unit is connected to a power supply in series with a pull-up resistor.
4. The system according to claim 2, wherein the temperature-raising selection switch and the temperature-lowering selection switch are respectively connected with the micro control unit through IO lines.
5. The system of claim 1, wherein the micro-control unit is an MCU.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202021708319.7U CN212585876U (en) | 2020-08-14 | 2020-08-14 | Fault simulation system for resistance type temperature sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021708319.7U CN212585876U (en) | 2020-08-14 | 2020-08-14 | Fault simulation system for resistance type temperature sensor |
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| CN212585876U true CN212585876U (en) | 2021-02-23 |
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