CN111947810A - Fault simulation system and method for resistance type temperature sensor - Google Patents
Fault simulation system and method for resistance type temperature sensor Download PDFInfo
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- CN111947810A CN111947810A CN202010820207.9A CN202010820207A CN111947810A CN 111947810 A CN111947810 A CN 111947810A CN 202010820207 A CN202010820207 A CN 202010820207A CN 111947810 A CN111947810 A CN 111947810A
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004088 simulation Methods 0.000 title claims description 37
- 238000001816 cooling Methods 0.000 claims abstract description 33
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- 238000011084 recovery Methods 0.000 claims description 7
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
- G01K15/007—Testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
Abstract
The invention provides a system and a method for simulating faults of a resistance type temperature sensor, wherein the system comprises the following steps: the device comprises a power supply, an electric control unit, a resistance type temperature sensor, three analog heating circuits, three analog cooling circuits, a heating selection switch and a cooling selection switch; the power supply is connected with the electric control unit, the electric control unit is grounded, and the resistance type temperature sensor is connected with the electric control unit in parallel; the three analog temperature-raising circuits are connected in parallel and then connected in series with the resistance type temperature sensor, and the three analog temperature-lowering circuits are connected in parallel and then connected in parallel with the resistance type temperature sensor; the three analog temperature-raising circuits are connected with a temperature-raising selection switch in parallel, and the three analog temperature-lowering circuits are connected with a temperature-lowering selection switch in parallel. According to the invention, through a simple circuit structure, a temperature over-large fault, a temperature over-small fault, a sensor open-circuit fault and a sensor short-circuit fault of the resistance type temperature sensor are quickly simulated, so that the fault of the resistance type temperature sensor is quickly detected.
Description
Technical Field
The invention belongs to the technical field of automobile electronic control, and particularly relates to a system and a method for simulating faults of a resistance type temperature sensor.
Background
The resistive temperature sensor may be damaged during use and fault detection is required. The common manual transformation is used in the prior art for the resistor type temperature sensor fault part, the sensor is damaged during fault simulation, only one fault can be simulated by the manual transformation at one time, different faults need to be manually transformed for many times, and the situations with different severity in one fault need to be manually transformed for many times. When partial circuit short circuit or partial circuit open circuit exist in the sensor, the temperature value measured by the sensor is smaller or larger, and the simulation measurement can be realized only by reforming multiple tests for multiple times when the temperature value is smaller or larger. Based on the above, the invention provides a fault simulation system and method for a resistance type temperature sensor.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present invention provides a system and a method for simulating a fault of a resistive temperature sensor, so as to solve the above-mentioned technical problems.
In a first aspect, the present invention provides a resistive temperature sensor fault simulation system, comprising: the device comprises a power supply, an electric control unit, a resistance type temperature sensor, three analog heating circuits, three analog cooling circuits, a heating selection switch and a cooling selection switch; the power supply is connected with the electric control unit, the electric control unit is grounded, and the resistance type temperature sensor is connected with the electric control unit in parallel; the three analog temperature-raising circuits are connected in parallel and then connected in series with the resistance type temperature sensor, and the three analog temperature-lowering circuits are connected in parallel and then connected in parallel with the resistance type temperature sensor; the three analog temperature-raising circuits are connected with a temperature-raising selection switch in parallel, and the three analog temperature-lowering circuits are connected with a temperature-lowering selection switch in parallel.
Further, the analog temperature-raising circuit comprises a temperature-raising resistor and a temperature-raising circuit switch which are connected in series; the simulation cooling circuit comprises a cooling resistor and a cooling circuit switch which are connected in series.
Furthermore, a pull-up resistor is connected in series on a connection circuit of the electric control unit and the power supply.
Furthermore, the temperature-rise selection switch and the temperature-fall selection switch are respectively connected with the micro control unit through IO lines.
Further, the electric control unit is an MCU.
In a second aspect, the present invention provides a method for simulating a fault of a resistive temperature sensor, including:
the temperature-rising selection switch is turned on, at least one temperature-rising circuit switch is turned off, the temperature-reducing selection switch is turned on, and three temperature-reducing circuit switches are turned on to simulate a temperature-too-large fault of the resistance type temperature sensor;
the temperature-rise selection switch is closed, at least one temperature-reduction circuit switch is closed, the temperature-reduction selection switch is opened, and three temperature-rise circuit switches are opened to simulate a temperature-small fault of the resistance type temperature sensor;
the open-circuit fault of the resistance type temperature sensor is simulated by opening the temperature-rise selection switch, the three temperature-rise circuit switches, the three temperature-reduction circuit switches and the temperature-reduction selection switch;
the short-circuit fault of the resistance type temperature sensor is simulated by closing the temperature-rising selection switch and the temperature-lowering selection switch;
the fault recovery of the resistance type temperature sensor is simulated by closing the temperature-rising selection switch and opening the three temperature-rising circuit switches, the three temperature-reducing circuit switches and the temperature-reducing selection switch.
The beneficial effect of the invention is that,
the fault simulation system and method for the resistance type temperature sensor can accurately and rapidly simulate the temperature over-large fault, the temperature over-small fault, the sensor open-circuit fault and the sensor short-circuit fault of the resistance type temperature sensor, further rapidly detect the fault of the resistance type temperature sensor, improve the working efficiency and are suitable for large-scale application.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic block diagram of a system according to an embodiment of the invention;
FIG. 2 is a schematic flow diagram of a method of one embodiment of the invention;
wherein, 1, an electric control unit; 2. a pull-up resistor; 3. a first resistive temperature sensor circuit node; 4. a first temperature-raising circuit switch; 5. a first temperature-raising resistor; 6. a second temperature-raising circuit switch; 7. a second temperature-raising resistor; 8. a third temperature-raising circuit switch; 9. a third temperature-rising resistor; 10. a temperature-rise selection switch; 11. a second resistive temperature sensor circuit node; 12. a first cooling circuit switch; 13. a first temperature reduction resistor; 14. a second cooling circuit switch; 15. a second temperature-reducing resistor; 16. a third cooling circuit switch; 17. a third temperature-reducing resistor; 18. a cooling selection switch; 19. a third resistive temperature sensor circuit node; 20. the resistance type temperature sensor tests the temperature resistance; 21. a resistance type temperature sensor.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
The application provides a resistance type temperature sensor fault simulation system, includes: the device comprises a power supply, an electric control unit, a resistance type temperature sensor, three analog heating circuits, three analog cooling circuits, a heating selection switch and a cooling selection switch; the power supply is connected with the electric control unit, the electric control unit is grounded, and the resistance type temperature sensor is connected with the electric control unit in parallel; the three analog temperature-raising circuits are connected in parallel and then connected in series with the resistance type temperature sensor, and the three analog temperature-lowering circuits are connected in parallel and then connected in parallel with the resistance type temperature sensor; the three analog temperature-raising circuits are connected with a temperature-raising selection switch in parallel, and the three analog temperature-lowering circuits are connected with a temperature-lowering selection switch in parallel.
Optionally, as an embodiment of the present application, the analog temperature-raising circuit includes a temperature-raising resistor and a temperature-raising circuit switch connected in series; the simulation cooling circuit comprises a cooling resistor and a cooling circuit switch which are connected in series.
Optionally, as an embodiment of the present application, a pull-up resistor is connected in series to a connection line between the electronic control unit and the power supply.
Optionally, as an embodiment of the present application, the temperature-increasing selection switch and the temperature-decreasing selection switch are respectively connected to the micro control unit through an IO line.
Optionally, as an embodiment of the present application, the electronic control unit is an MCU.
In this embodiment, the power voltage is + 5V.
In this embodiment, pull-up resistor Rp1000 omega and the resistance of the connecting circuit line is 0.5 omega.
In this embodiment, the electronic control unit 1 is an MCU, and the MCU reads a voltage between a first resistance type temperature sensor circuit node and a third resistance type temperature sensor circuit node, and obtains a measurement sensor temperature value through a calibration CURVE table by voltage-temperature conversion.
In this embodiment, the analog temperature raising circuit includes three analog temperature raising circuits, and the first analog temperature raising circuit includes a first temperature raising circuit switch 4 and a first temperature raising resistor 5; the second path of analog heating circuit comprises a second heating circuit switch 6 and a second heating resistor 7; the third analog temperature-raising circuit comprises a third temperature-raising circuit switch 8 and a third temperature-raising resistor 9; a warming selection switch 10 is also included.
In this embodiment, the analog cooling circuits include three analog cooling circuits, and the first analog cooling circuit includes a first cooling circuit switch 12 and a first cooling resistor 13; the second circuit of analog cooling circuit comprises a second cooling circuit switch 14 and a second cooling resistor 15; the third analog cooling circuit comprises a third cooling circuit switch 16 and a third cooling resistor 17; a cool down select switch 18 is also included.
The fault simulation method of the resistance type temperature sensor comprises the following steps:
the temperature-rising selection switch is turned on, at least one temperature-rising circuit switch is turned off, the temperature-reducing selection switch is turned on, and three temperature-reducing circuit switches are turned on to simulate a temperature-too-large fault of the resistance type temperature sensor;
the temperature-rise selection switch is closed, at least one temperature-reduction circuit switch is closed, the temperature-reduction selection switch is opened, and three temperature-rise circuit switches are opened to simulate a temperature-small fault of the resistance type temperature sensor;
the open-circuit fault of the resistance type temperature sensor is simulated by opening the temperature-rise selection switch, the three temperature-rise circuit switches, the three temperature-reduction circuit switches and the temperature-reduction selection switch;
the short-circuit fault of the resistance type temperature sensor is simulated by closing the temperature-rising selection switch and the temperature-lowering selection switch;
the fault recovery of the resistance type temperature sensor is simulated by closing the temperature-rising selection switch and opening the three temperature-rising circuit switches, the three temperature-reducing circuit switches and the temperature-reducing selection switch.
FIG. 2 is a schematic flow diagram of a method of one embodiment of the invention. The implementation body in fig. 2 may be a resistance type temperature sensor fault simulation system.
As shown in fig. 2, the method includes:
s100, starting;
s101, simulating a fault with a large temperature;
s102, judging whether a fault with large temperature occurs: if not, returning to the step S101; if yes, carrying out the next step;
s103, recovering temperature and simulating without fault
S104, simulating a temperature small fault;
s105, judging whether a temperature small fault occurs: if not, returning to the step S104; if yes, carrying out the next step;
s106, recovering temperature fault-free simulation;
s107, performing open-circuit fault simulation;
s108, judging whether an open-circuit fault occurs: if not, returning to the step S107; if yes, carrying out the next step;
s109, simulating the opening temperature without faults;
S10A, recovering short-circuit fault-free simulation;
S10B, judging whether short-circuit fault occurs: if not, returning to the step S10A; if yes, carrying out the next step;
S10C, recovering temperature and simulating without fault;
and S10D, ending.
Sequentially simulating a temperature-too-large fault, a temperature-too-small fault, a sensor open-circuit fault and a sensor short-circuit fault of the resistance type temperature sensor, wherein the steps are respectively corresponding to the steps S101, S104, S107 and S10A; then fault detection is respectively carried out, which respectively corresponds to the steps S102, S105, S108 and S10B; if the fault detection finds that the fault occurrence requirement is not met, returning to the fault simulation step, namely returning to the steps S101, S104, S107 and S10A respectively; when the failure detection satisfies the failure occurrence request, failure recovery simulation is performed, corresponding to steps S103, S106, S109, and S10C, respectively.
In this embodiment, in the resistive temperature sensor fault simulation method, in order to simulate a fault in which the temperature of the resistive temperature sensor is too high, the temperature-increasing selection switch 10 is controlled to be turned on, at least one of the first temperature-increasing circuit switch 4, the second temperature-increasing circuit switch 6, and the third temperature-increasing circuit switch 8 is turned off, and the first temperature-decreasing circuit switch 12, the second temperature-decreasing circuit switch 14, the third temperature-decreasing circuit switch 16, and the temperature-decreasing selection switch 18 are all turned on.
In this embodiment, the resistances of the first path, the second path, and the third path of the analog temperature-raising circuit are stepped and gradually reduced, so as to realize fault simulation of the resistance-type temperature sensor for different degrees when the temperature is increased. The initial value of the third temperature increasing resistor 9 is set to be a resistance threshold value x 120% when a temperature-excessive fault occurs in the resistance type temperature sensor.
In this embodiment, when the temperature of the resistance type temperature sensor is too high, the third temperature-raising circuit switch 8 is selected to be turned off; if a larger degree of temperature-bias fault needs to be simulated, the second temperature-raising circuit switch 6 and the first temperature-raising circuit switch 4 are respectively selected.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the temperature large fault simulation is calculated as follows:
wherein R issIs a temperature sensor resistance, RerrFor fault-simulating resistance, RpAs pull-up resistor, RLeadIs a line resistance, UsIs the voltage at the power supply terminal.
In this embodiment, in the resistive temperature sensor fault simulation method, in order to simulate a fault in which the temperature of the resistive temperature sensor is low, the temperature-increasing selection switch 10 is controlled to be turned off, at least one of the first temperature-decreasing circuit switch 12, the second temperature-decreasing circuit switch 14, and the third temperature-decreasing circuit switch 16 is turned off, and the first temperature-increasing circuit switch 4, the second temperature-increasing circuit switch 6, the third temperature-increasing circuit switch 8, and the temperature-decreasing selection switch 18 are turned on.
In this embodiment, the resistors on the first path, the second path and the third path of the simulation cooling circuit are gradually reduced in a step shape, so as to realize the fault simulation of the resistance type temperature sensor with temperature reduction at different degrees. The initial value of the first temperature-reducing resistor 13 is set to a resistance threshold value x 80% when a temperature-too-small fault occurs in the resistance type temperature sensor.
In this embodiment, when the temperature of the resistance type temperature sensor is smaller, the switch 12 for closing the temperature reducing channel 1 of the resistance type temperature sensor is selected; if a larger degree of temperature-lowering faults need to be simulated, the second temperature-lowering circuit switch 14 and the third temperature-lowering circuit switch 16 are turned off respectively.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the temperature small fault simulation is calculated as follows:
wherein R issIs a temperature sensor resistance, RerrFor fault-simulating resistance, RpAs pull-up resistor, RLeadIs a line resistance, UsIs the voltage at the power supply terminal.
In this embodiment, in the resistive temperature sensor fault simulation method, in the sensor open-circuit fault simulation, the control switches, namely the first temperature-raising circuit switch 4, the second temperature-raising circuit switch 6, the third temperature-raising circuit switch 8, the temperature-raising selection switch 10, the first temperature-lowering circuit switch 12, the second temperature-lowering circuit switch 14, the third temperature-lowering circuit switch 16, and the temperature-lowering selection switch 18, are all turned on.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the open-circuit fault simulation is calculated as follows:
U＝Us
wherein, UsIs the voltage at the power supply terminal.
In this embodiment, in the resistive temperature sensor fault simulation method, the sensor short-circuit fault simulation is performed to control the temperature-increasing selection switch 10 and the temperature-decreasing selection switch 18 to be turned off.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the short-circuit fault simulation is calculated as follows:
wherein R ispAs pull-up resistor, RLeadIs a line resistance, UsIs the voltage at the power supply terminal.
In this embodiment, in the resistive temperature sensor fault simulation method, when the sensor fault recovery simulation is performed, the temperature-raising selection switch 10 is turned off, and the remaining fault simulation switches control the switches, i.e., the first temperature-raising circuit switch 4, the second temperature-raising circuit switch 6, the third temperature-raising circuit switch 8, the first temperature-lowering circuit switch 12, the second temperature-lowering circuit switch 14, the third temperature-lowering circuit switch 16, and the temperature-lowering selection switch 18, to be turned on, the sensor fault recovery simulation is performed.
In this embodiment, the voltage between the first resistance type temperature sensor circuit node and the third resistance type temperature sensor circuit node during the fault recovery simulation is calculated as follows:
wherein R issIs a temperature sensor resistance, RpAs pull-up resistor, RLeadIs a line resistance, UsIs the voltage at the power supply terminal.
In this embodiment, the first temperature-raising circuit switch 4, the second temperature-raising circuit switch 6, the third temperature-raising circuit switch 8, the temperature-raising selection switch 10, the first temperature-lowering circuit switch 12, the second temperature-lowering circuit switch 14, the third temperature-lowering circuit switch 16, and the temperature-lowering selection switch 18 are all connected to the electronic control unit 1 through IO.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. A resistive temperature sensor fault simulation system, comprising: the device comprises a power supply, an electric control unit, a resistance type temperature sensor, three analog heating circuits, three analog cooling circuits, a heating selection switch and a cooling selection switch; the power supply is connected with the electric control unit, the electric control unit is grounded, and the resistance type temperature sensor is connected with the electric control unit in parallel; the three analog temperature-raising circuits are connected in parallel and then connected in series with the resistance type temperature sensor, and the three analog temperature-lowering circuits are connected in parallel and then connected in parallel with the resistance type temperature sensor; the three analog temperature-raising circuits are connected with a temperature-raising selection switch in parallel, and the three analog temperature-lowering circuits are connected with a temperature-lowering selection switch in parallel.
2. The system of claim 1, wherein the analog temperature-raising circuit comprises a temperature-raising resistor and a temperature-raising circuit switch connected in series; the simulation cooling circuit comprises a cooling resistor and a cooling circuit switch which are connected in series.
3. The system of claim 1, wherein a pull-up resistor is connected in series with the electrical control unit and the power supply connection line.
4. The system according to claim 1, wherein the temperature-raising selection switch and the temperature-lowering selection switch are respectively connected to the micro control unit through IO lines.
5. The system of claim 1, wherein the electronic control unit is an MCU.
6. A method for simulating a fault of a resistive temperature sensor, comprising:
the temperature-rising selection switch is turned on, at least one temperature-rising circuit switch is turned off, the temperature-reducing selection switch is turned on, and three temperature-reducing circuit switches are turned on to simulate a temperature-too-large fault of the resistance type temperature sensor;
the temperature-rise selection switch is closed, at least one temperature-reduction circuit switch is closed, the temperature-reduction selection switch is opened, and three temperature-rise circuit switches are opened to simulate a temperature-small fault of the resistance type temperature sensor;
the open-circuit fault of the resistance type temperature sensor is simulated by opening the temperature-rise selection switch, the three temperature-rise circuit switches, the three temperature-reduction circuit switches and the temperature-reduction selection switch;
the short-circuit fault of the resistance type temperature sensor is simulated by closing the temperature-rising selection switch and the temperature-lowering selection switch;
the fault recovery of the resistance type temperature sensor is simulated by closing the temperature-rising selection switch and opening the three temperature-rising circuit switches, the three temperature-reducing circuit switches and the temperature-reducing selection switch.
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| CN202010820207.9A CN111947810A (en) | 2020-08-14 | 2020-08-14 | Fault simulation system and method for resistance type temperature sensor |
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| CN202010820207.9A CN111947810A (en) | 2020-08-14 | 2020-08-14 | Fault simulation system and method for resistance type temperature sensor |
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| IT8421084A0 (en) * | 1984-05-24 | 1984-05-24 | Axis Spa | EQUIPMENT AND METHOD FOR MEASUREMENT OF COIL RESISTANCES AND CONNECTION BETWEEN WINDINGS AND COLLECTOR BLADES IN ELECTRIC MOTORS. |
| CN103543379A (en) * | 2013-10-11 | 2014-01-29 | 联合汽车电子有限公司 | Circuit fault simulation device of vehicle engine management system |
| CN104167138A (en) * | 2009-11-16 | 2014-11-26 | 江苏省电力公司常州供电公司 | Power cable fault simulating and positioning system |
| CN106093668A (en) * | 2016-08-15 | 2016-11-09 | 国家电网公司 | A kind of distribution network failure analog and method |
| CN108169602A (en) * | 2018-01-22 | 2018-06-15 | 北京丹华昊博电力科技有限公司 | A kind of distribution network failure simulator |
| CN110685772A (en) * | 2019-09-27 | 2020-01-14 | 中国汽车技术研究中心有限公司 | Engine oil pressure temperature sensor fault simulation device |
| CN211016003U (en) * | 2019-11-13 | 2020-07-14 | 酒泉职业技术学院 | Simple fault setting box for automobile temperature sensor practical training teaching |
-
2020
- 2020-08-14 CN CN202010820207.9A patent/CN111947810A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT8421084A0 (en) * | 1984-05-24 | 1984-05-24 | Axis Spa | EQUIPMENT AND METHOD FOR MEASUREMENT OF COIL RESISTANCES AND CONNECTION BETWEEN WINDINGS AND COLLECTOR BLADES IN ELECTRIC MOTORS. |
| CN104167138A (en) * | 2009-11-16 | 2014-11-26 | 江苏省电力公司常州供电公司 | Power cable fault simulating and positioning system |
| CN103543379A (en) * | 2013-10-11 | 2014-01-29 | 联合汽车电子有限公司 | Circuit fault simulation device of vehicle engine management system |
| CN106093668A (en) * | 2016-08-15 | 2016-11-09 | 国家电网公司 | A kind of distribution network failure analog and method |
| CN108169602A (en) * | 2018-01-22 | 2018-06-15 | 北京丹华昊博电力科技有限公司 | A kind of distribution network failure simulator |
| CN110685772A (en) * | 2019-09-27 | 2020-01-14 | 中国汽车技术研究中心有限公司 | Engine oil pressure temperature sensor fault simulation device |
| CN211016003U (en) * | 2019-11-13 | 2020-07-14 | 酒泉职业技术学院 | Simple fault setting box for automobile temperature sensor practical training teaching |
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Application publication date: 20201117 |