CN212583130U - Metal wood floor with high heat conduction and expansion and shrinkage resistance - Google Patents

Metal wood floor with high heat conduction and expansion and shrinkage resistance Download PDF

Info

Publication number
CN212583130U
CN212583130U CN202020023847.2U CN202020023847U CN212583130U CN 212583130 U CN212583130 U CN 212583130U CN 202020023847 U CN202020023847 U CN 202020023847U CN 212583130 U CN212583130 U CN 212583130U
Authority
CN
China
Prior art keywords
metal
layer
wood
floor
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020023847.2U
Other languages
Chinese (zh)
Inventor
陈庄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Xiangxiangjia Technology Co ltd
Original Assignee
Shanghai Xiangxiangjia Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Xiangxiangjia Technology Co ltd filed Critical Shanghai Xiangxiangjia Technology Co ltd
Priority to CN202020023847.2U priority Critical patent/CN212583130U/en
Application granted granted Critical
Publication of CN212583130U publication Critical patent/CN212583130U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model discloses a metal-wood floor of high heat conduction, anti breathing, it includes syntropy table sheet layer, can be equipped with syntropy core plate layer or centreless sheet layer, hinders wet glue film and syntropy metal bottom plate layer. The metal wood floor realizes high heat conductivity and can realize the purpose of anti-expansion through the mode that the metal bottom plate layer combines with core plate layer, surface plate layer.

Description

Metal wood floor with high heat conduction and expansion and shrinkage resistance
Technical Field
The utility model relates to a floor technical field, the more specifically metal-wood floor who has high thermal conductivity and anti breathing that says so.
Background
Along with the progress of the times, people tend to have good life, and floors for building decoration are more and more colorful. The existing log floor, multilayer solid wood composite floor, three-layer solid wood composite floor, two-layer solid wood composite floor, impregnated paper laminated wood floor (strengthened floor), PVC surface layer solid wood floor, stone plastic floor, etc.
All floors, the most critical technical difficulty, are the thermal conductivity and stability of the product. The dry shrinkage and wet expansion of the floor, except for the stone plastic floor, the expansion and contraction of other floors are difficult to reach the expected value. Thermal conductivity (e.g., stone plastic flooring) is often sacrificed in order to increase product stability and resistance to deformation. Therefore, there is a need to develop a flooring having high thermal conductivity and resistance to expansion and contraction.
SUMMERY OF THE UTILITY MODEL
Because prior art has above-mentioned technical problem, this application provides a metal-wood floor of high heat conduction, anti breathing, its aim at solves the low and yielding problem of current floor heat conductivity.
In order to achieve the technical purpose, the following technical scheme is adopted in the application:
the metal wood floor with high heat conductivity and expansion and shrinkage resistance sequentially comprises a surface plate layer, a moisture-resistant adhesive layer and a metal bottom plate layer in the same direction.
Preferably, the metal bottom plate layer is made of metal materials such as copper, steel, iron, aluminum and the like, or carbon fiber skin and carbon fiber sheets.
Preferably, the thickness of the metal bottom plate layer is 0.1-3 mm.
Preferably, the surface layer is metal or wood or PVC or technical wood or impregnated paper.
Preferably, the skin layer is 0.1 to 25 mm.
Preferably, a core layer is arranged between the surface plate layer and the metal bottom plate layer, and the moisture-blocking adhesive layer is arranged between the surface plate layer and the core layer and between the core layer and the metal bottom plate layer.
Preferably, the core board layer is made of one of raw wood, multi-layer wood, wood finger board, SPC and density board.
Owing to adopt above-mentioned technical scheme, the mode that metal wood floor of this application combined through metal bottom plate layer and table ply or have the core plate layer realizes the high thermal conductivity and can realize the purpose of anti breathing.
Drawings
FIG. 1 is a schematic structural diagram of a first embodiment of the present application;
fig. 2 is a schematic structural diagram of a second embodiment of the present application.
Detailed Description
The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a first embodiment of the present application. In this embodiment, the metal wood flooring with high thermal conductivity and resistance to expansion and contraction of the present application includes a surface layer 1 and a metal bottom layer 2 which are arranged in the same direction. The surface plate layer 1 and the metal bottom plate layer 2 are adhered together through a moisture-resistant adhesive layer 3.
The metal bottom plate layer 2 is different from the existing floor adopting wood or composite wood materials, the metal bottom plate layer 2 is made of metal materials, and metal materials such as copper, steel, iron and aluminum or carbon fiber skins (sheets) can be adopted to ensure high thermal conductivity. Since the metal floor layer itself is more resistant to swelling and shrinkage than the wood floor and has higher thermal conductivity, the stability of the shape is maintained by the structural increase without sacrificing the thermal conductivity. Preferably, the thickness of the metal bottom plate layer 2 is 0.1-3 mm, and the metal bottom plate layer 2 with the thickness can meet the requirement of thermal conductivity, save heat energy, meet the requirement of stability and save materials.
The surface plate layer 1 is 0.1-25mm thick, and can be made of metal materials such as copper, steel, iron and aluminum, carbon fiber skins (sheets), raw wood solid wood, natural wood skins, technical wood skins, PVC color films and impregnated paper, or embossed and wire-drawn skins (sheets) or carbon fiber skins (sheets) of metals such as copper, steel, iron and aluminum.
The utility model provides a whole consumptive material of floor is few, and has guaranteed the high thermal conductivity and has possessed splendid anti breathing performance. In addition, the flatness is good, the paving step can be simplified, and the direct mounting is only needed.
Fig. 2 is a schematic structural diagram of a second embodiment of the present application. In the second embodiment, a core layer 5 is added between the surface plate layer 3 and the metal bottom plate layer 4, and the layers are bonded through a moisture-resistant adhesive layer 6. The core board layer 5 is composed of one of raw wood, multi-layer solid wood, solid wood finger joint board, SPC and density board.
The above-described embodiments are merely illustrative of the present invention and are not intended to limit the scope of the present invention. Those skilled in the art will recognize that changes and modifications can be made in the invention as described herein without departing from the scope of the invention as defined by the appended claims.

Claims (7)

1. The metal wood floor with high heat conduction and expansion and shrinkage resistance is characterized by sequentially comprising a surface plate layer, a moisture-resistant adhesive layer and a metal bottom plate layer in the same direction.
2. The metal wood floor with high thermal conductivity and expansion and contraction resistance as claimed in claim 1, wherein the metal floor layer is made of metal materials such as copper, steel, iron and aluminum, or carbon fiber skin and carbon fiber sheet.
3. The metal wood flooring with high thermal conductivity and resistance to shrinkage and swelling according to claim 1, wherein the thickness of the metal flooring layer is 0.1-3 mm.
4. The metal wood flooring with high thermal conductivity and resistance to swelling and shrinking according to claim 1, wherein the surface layer is metal or wood or PVC or technical wood or impregnated paper.
5. The metal wood flooring with high thermal conductivity and resistance to shrinkage and swelling according to claim 3, wherein the surface layer is 0.1-25 mm.
6. The metal wood flooring of claim 1, wherein a core layer is disposed between the surface layer and the metal bottom layer, and the moisture-blocking adhesive layer is interposed between the surface layer and the core layer and between the core layer and the metal bottom layer.
7. The metal wood flooring of claim 6, wherein the core layer is comprised of one of raw wood, multi-layered wood, wood finger-jointed board, SPC and density board.
CN202020023847.2U 2020-01-06 2020-01-06 Metal wood floor with high heat conduction and expansion and shrinkage resistance Active CN212583130U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020023847.2U CN212583130U (en) 2020-01-06 2020-01-06 Metal wood floor with high heat conduction and expansion and shrinkage resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020023847.2U CN212583130U (en) 2020-01-06 2020-01-06 Metal wood floor with high heat conduction and expansion and shrinkage resistance

Publications (1)

Publication Number Publication Date
CN212583130U true CN212583130U (en) 2021-02-23

Family

ID=74656756

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020023847.2U Active CN212583130U (en) 2020-01-06 2020-01-06 Metal wood floor with high heat conduction and expansion and shrinkage resistance

Country Status (1)

Country Link
CN (1) CN212583130U (en)

Similar Documents

Publication Publication Date Title
CA2401197A1 (en) Abrasion resistant laminate
WO2006126930A1 (en) A decorative laminate
CN212583130U (en) Metal wood floor with high heat conduction and expansion and shrinkage resistance
US20060177633A1 (en) Back grooved wood flooring composed of hpl, waterproof plywood and soundproof layer, and method of manufactruing the same
CN1330469C (en) Bamboo-wood plywood for container bottom board
JP2008115642A (en) Plate member for construction
JP3226989U (en) New solid wood flooring
CN210792340U (en) Novel environment-friendly flame-retardant wood profile
JP2008068421A (en) Manufacturing method of composite base material
CN214462139U (en) High-temperature-resistant, noise-reduction and waterproof composite floor
CN211517783U (en) Super flat anti-cracking furniture board
CN110561862A (en) Novel environment-friendly flame-retardant wood profile and manufacturing method thereof
JP7436104B2 (en) non-combustible cardboard board
JP3418096B2 (en) panel
JP4047100B2 (en) Incombustible decorative board
CN214027570U (en) Anti-deformation vertical core plate
CN213563163U (en) Composite plywood
JPH04191040A (en) Thermosetting resin decorative laminated sheet
CN211313208U (en) Laminated wood-plastic composite floor
CN2353522Y (en) Corrugated-paper composite board
CN214117494U (en) Modularization building templates structure
CN211467679U (en) High stability plywood
CN219808641U (en) Novel decoration panel
CN215618688U (en) Plywood with interlayer
CN217205100U (en) Composite laminate flooring with strong stability

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant