CN212570976U - Plastic package power module - Google Patents

Plastic package power module Download PDF

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Publication number
CN212570976U
CN212570976U CN202021447353.3U CN202021447353U CN212570976U CN 212570976 U CN212570976 U CN 212570976U CN 202021447353 U CN202021447353 U CN 202021447353U CN 212570976 U CN212570976 U CN 212570976U
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China
Prior art keywords
metal tube
substrate
power module
epoxy resin
metal
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Active
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CN202021447353.3U
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Chinese (zh)
Inventor
梁小广
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Wuxi Lipus Semiconductor Co ltd
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Wuxi Lipus Semiconductor Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model provides a plastic envelope power module, include: the electronic component comprises a substrate, an electronic component, a metal tube and an epoxy resin layer; the electronic component and the metal tube are connected to the substrate; the substrate, the electronic component and the metal tube are plastically packaged through the epoxy resin layer; the metal tube is of a structure with one end open and the other end sealed, the open end is connected to the substrate, and the sealed end is located inside the epoxy resin layer. Through the utility model discloses a structure, manufacturing process can increase the insulation distance between the terminal, and the terminal is to the insulation distance between the outside fin, reduce power module's volume simultaneously.

Description

Plastic package power module
Technical Field
The utility model relates to the field of semiconductor technology, specifically, relate to a plastic envelope power module.
Background
In power supply and power electronic converter applications, power semiconductor (IGBT, MOSFET, SiC, GaN, etc.) devices are widely used, and module packaging is generally used in high power applications. As shown in fig. 1, a package form widely used at present is a power module mainly composed of a metal base plate, a solder layer, a DBC (double-sided copper-clad ceramic substrate), an AMB (foil-soldered copper-clad ceramic substrate), an insulating heat-dissipating resin film or other insulating heat-dissipating material, a bonding wire, a terminal for electrical connection, an epoxy resin, and the like. The power semiconductor chip is fixed to the insulating and heat dissipating material by soldering, and then electrically connected to the insulating and heat dissipating material by an aluminum bonding wire. And then, other insulating heat dissipation materials of the DBC are welded on the metal base plate through processes of reflow soldering, sintering and the like, heat emitted by the power semiconductor wafer is conducted to the metal base plate through the DBC or other insulating heat dissipation materials and the welding layer, the metal base plate is cooled by air cooling or water cooling, and the terminal is used for being connected with an external electric circuit.
Fig. 2 shows an example of a compression molding and plastic packaging process, in which epoxy resin heated to a liquid state is injected into a compression mold under high pressure, and a copper frame is molded together with other devices into a compression molding and plastic packaging power module. After the epoxy resin is cured, the copper frame is subjected to rib cutting and pin forming to become the terminal for electrical connection.
In the method for forming the terminals for electrical connection by using the copper frame, the terminals can only be distributed on two sides (or the periphery) of the power module, and because the molding thickness of the plastic-molded module is limited (generally less than 10mm), after the power module is installed on the radiating fins, the insulating distance between the terminals and the external radiating fins (copper or aluminum) is difficult to expand when the terminals are arranged on two sides of the module.
In addition, the terminals are arranged on two sides (or four sides) of the module, so that the size of the module is increased, and the miniaturization of an application system is not facilitated.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model aims at providing a plastic envelope power module.
According to the utility model provides a pair of plastic envelope power module, include: the electronic component comprises a substrate, an electronic component, a metal tube and an epoxy resin layer;
the electronic component and the metal tube are connected to the substrate;
the substrate, the electronic component and the metal tube are plastically packaged through the epoxy resin layer;
the metal tube is of a structure with an opening at one end and a sealed end, the opening end is connected to the substrate, and the sealed end is positioned inside the epoxy resin layer;
the sealing end is a filling sealing structure which comprises a filler, and the filler is in interference fit with the inner wall of the end part of the metal pipe, so that the sealing end is formed.
Preferably, the metal tube is welded or sintered on the substrate.
Preferably, the thickness of the filler is from 0.5mm to 1mm, or from 1mm to 3 mm.
Preferably, the filler comprises metal or engineering plastic.
Preferably, the temperature resistance temperature of the filler is higher than the temperature of the plastic packaging process of the epoxy resin.
Compared with the prior art, the utility model discloses following beneficial effect has:
through the utility model discloses a structure, manufacturing process can increase the insulation distance between the terminal, and the terminal is to the insulation distance between the outside fin, reduce power module's volume simultaneously.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of a conventional plastic package power module;
fig. 2 is a manufacturing process diagram of a conventional plastic package power module;
fig. 3 is a schematic structural diagram of the plastic package power module of the present invention;
fig. 4 is a schematic structural view of the plastic package mold of the present invention;
fig. 5 is a schematic structural view of the metal tube of embodiment 1 of the present invention;
fig. 6 is a schematic structural view of a metal tube of the present invention in an embodiment 2;
fig. 7 is a schematic structural view of a metal pipe of the present invention in an embodiment 3;
fig. 8 is a schematic structural view of a metal tube according to an embodiment 4 of the present invention;
fig. 9 is a schematic structural diagram of a connection metal terminal according to embodiment 4 of the present invention.
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
As shown in fig. 3, the utility model provides a pair of plastic envelope power module, include: the electronic component comprises a substrate 1, an electronic component 2, a metal tube 4, an epoxy resin layer 6 and a metal terminal 5. Bonding wires 3 are used to make electrical connections between the parts. The substrate 1 is a DBC substrate (double-sided copper-clad ceramic substrate), the electronic component 2 and the metal tube 4 are connected to the substrate 1, and the substrate 1, the electronic component 2 and the metal tube 4 are plastically packaged through the epoxy resin layer 6. The epoxy layer 6 is used for protecting an internal circuit from corrosion and moisture and isolating internal components at high voltage. One end of the metal tube 4 is connected to the substrate 1, the other end is communicated with the external space of the epoxy resin layer 6, and one end of the metal terminal 5 penetrates through the metal tube 4 to be connected to the substrate 1 and used for being connected with an external electric circuit.
The metal tube is arranged to connect the metal terminals to the substrate after the epoxy resin is cured, so that the structure design increases the insulation distance between the metal terminals and the external heat sink, and reduces the volume of the power module.
In the epoxy resin curing process, two schemes are adopted for preventing the epoxy resin from entering the metal tube: 1. designing a special plastic package mold; 2. a metal tube having one end open and the other end sealed is used.
For a first scheme, as shown in fig. 4, the utility model also provides a plastic package mould for make above-mentioned plastic package power module, the plastic package mould includes mould 7 and lower mould 8. The upper die 7 or the lower die 8 is provided with a power module fixing part, correspondingly, the lower die 8 or the upper die 7 is connected with a movable column 9 in a sliding way, the position of the movable column 9 corresponds to the position of the metal pipe 4, and the movable column 9 can seal the other end of the metal pipe 4 in a die closing state. And a sealing ring 10 is arranged between the upper die and the lower die to prevent epoxy resin from overflowing.
The process adopting the plastic package mold comprises the following steps:
and S1, fixing the power module to be plastically packaged on the upper die or the lower die, wherein two ends of the metal tube are open, and the other end of the metal tube correspondingly faces the lower die or the upper die.
And S2, closing the mold to enable the movable column to seal the other end of the metal tube.
And S3, injecting liquid epoxy resin into the plastic package mould.
S4, before the liquid epoxy resin is completely cured, the movable column is drawn out (after the liquid epoxy resin is completely cured, the movable column cannot be drawn out).
And S5, inserting the metal terminal into the metal tube to form electric connection with the substrate.
For the second scheme, a metal tube with one open end and one sealed end in an original state is used, the open end is connected to the substrate in a welding and sintering mode, and the sealed end is located inside the epoxy resin layer. The sealing end is removed in a cutting or grinding mode, so that the outer wall of the epoxy resin layer is flush. The metal terminal may be a conventional metal terminal, and may be a metal terminal with a crimp end (Press Fit).
Can be manufactured and implemented by a number of different metal tube 4 configurations as follows:
example 1
As shown in fig. 5, the original state of the metal tube is an integrated structure with one open end and one sealed end, the metal tube can be a copper tube, an aluminum tube, etc., and the thickness of the sealed end is 0.1mm to 0.5 mm. The open end is connected on the substrate by welding and sintering, and each device of the power module, including the metal tube, is sealed by epoxy resin through Transfer molding plastic package (Transfer molding) or Compression molding plastic package (Compression molding), wherein the epoxy resin is slightly higher than the outer end of the metal tube by 0.1mm to 0.5 mm. And grinding the surface of the epoxy resin until the sealing end of the metal tube is removed to expose the tube hole. At this time, the metal terminal is pressed into the metal tube by pressing or punching, and is electrically connected to the substrate.
Example 2
As shown in fig. 6, since the integrated metal pipe of embodiment 1 is high in processing cost, this embodiment uses a metal pipe 5 having both ends open, and uses a cover plate 51 having an adhesive 52 on one surface to close one end of the metal pipe 5. The thickness of the cover plate 51 is 0.1mm to 0.5mm, and the material of the cover plate 51 may be metal (such as copper, aluminum, etc.), engineering plastic, etc. The temperature resistance of the engineering plastic and the adhesive is higher than that of the plastic packaging process (the problem of plastic packaging is generally 150-200 ℃).
Example 3
As shown in fig. 7, since the integrated metal tube in embodiment 1 has a high processing cost, the metal tube 5 with openings at both ends is used, and the cap 53 is used, the top thickness of the cap 53 is 0.1mm to 0.5mm, and the inner diameter of the cap must be slightly smaller than the outer diameter of the copper tube, so as to achieve interference fit, ensure that the cap is tightly connected when being installed on one side of the copper tube, and during the plastic package process, the dissolved resin does not flow into the copper tube. The material of the cap can be metal (such as copper, aluminum and the like), engineering plastic and the like. The temperature resistance of the engineering plastic is higher than that of the plastic packaging process (the problem of plastic packaging is generally 150-200 ℃).
Example 4
As shown in fig. 8, since the integral metal pipe of embodiment 1 is processed at a high cost, this embodiment uses a rod-shaped filler 54 to be inserted into one end of the metal pipe 5 to seal it. To ensure that the desired abrasive thickness is not excessive, the filler 54 has a thickness of 0.5mm to 1 mm. The outer diameter of the filler is slightly larger than the inner diameter of the copper pipe, interference fit is achieved, the rodlike filler is tightly connected when being installed on one side of the copper pipe, and dissolved resin cannot flow into the copper pipe in the plastic package process. The material of the filler can be metal (such as copper, aluminum and the like), engineering plastic and the like. The temperature resistance of the engineering plastic is higher than that of the plastic packaging process (the problem of plastic packaging is generally 150-200 ℃).
The plastic packaging method of the plastic-packaged power module of embodiments 1 to 4 includes the steps of:
and S1, fixing the power module to be plastically packaged on the upper die or the lower die of the plastic packaging die, wherein the sealing end of the metal tube correspondingly faces the lower die or the upper die.
And S2, injecting liquid epoxy resin into the plastic package mold after mold closing.
And S3, after the liquid epoxy resin is cured, removing the sealing end by cutting or grinding.
And S4, inserting the metal terminal into the metal tube to form electric connection with the substrate.
Example 5
As shown in fig. 9, considering that the thickness to be polished in example 4 is increased, the processing time is increased. After a bar-shaped filler with the length of 1mm to 3mm is plugged into a metal tube, plastic packaging is carried out, after the plastic packaging, only epoxy resin above a copper tube is ground, and then a metal terminal (generally copper with good conductivity) or a metal terminal with a Presfit function is pressed into the metal tube together with the bar-shaped filler in a pressure or stamping mode to form a terminal for electrical connection. The rod-shaped filler is under the metal terminal. The material of the rod-shaped filler can be metal (such as copper, aluminum and the like), engineering plastic and the like. The temperature resistance of the engineering plastic is higher than that of the plastic packaging process (the problem of plastic packaging is generally 150-200 ℃).
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of the specific embodiments of the invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims (5)

1. A plastic package power module, comprising: the electronic component comprises a substrate, an electronic component, a metal tube and an epoxy resin layer;
the electronic component and the metal tube are connected to the substrate;
the substrate, the electronic component and the metal tube are plastically packaged through the epoxy resin layer;
the metal tube is of a structure with an opening at one end and a sealed end, the opening end is connected to the substrate, and the sealed end is positioned inside the epoxy resin layer;
the sealing end is a filling sealing structure which comprises a filler, and the filler is in interference fit with the inner wall of the end part of the metal pipe, so that the sealing end is formed.
2. A plastic package power module according to claim 1, wherein the metal tube is welded or sintered on the substrate.
3. A plastic package power module according to claim 1, wherein the filler has a thickness of 0.5mm to 1mm, or 1mm to 3 mm.
4. The plastic package power module as defined in claim 1, wherein the filler comprises a metal or an engineering plastic.
5. A plastic package power module according to claim 1, wherein the temperature resistance of the filler is higher than the temperature of the epoxy molding process.
CN202021447353.3U 2020-07-21 2020-07-21 Plastic package power module Active CN212570976U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021447353.3U CN212570976U (en) 2020-07-21 2020-07-21 Plastic package power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021447353.3U CN212570976U (en) 2020-07-21 2020-07-21 Plastic package power module

Publications (1)

Publication Number Publication Date
CN212570976U true CN212570976U (en) 2021-02-19

Family

ID=74631107

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021447353.3U Active CN212570976U (en) 2020-07-21 2020-07-21 Plastic package power module

Country Status (1)

Country Link
CN (1) CN212570976U (en)

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