CN212553075U - Wafer hold-down mechanism - Google Patents
Wafer hold-down mechanism Download PDFInfo
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- CN212553075U CN212553075U CN202020898517.8U CN202020898517U CN212553075U CN 212553075 U CN212553075 U CN 212553075U CN 202020898517 U CN202020898517 U CN 202020898517U CN 212553075 U CN212553075 U CN 212553075U
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- adjusting
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- main shaft
- sliding table
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Abstract
The utility model relates to a wafer processing field, concretely relates to wafer pressing mechanism, including compressing tightly the axis body, the pedestal is with connect in the first drive arrangement of pedestal, pedestal fixed connection is in the frame of wafer edging machine, compress tightly the axis body and the coaxial setting of processing main shaft, and compress tightly the top that the axis body is located the processing main shaft, compress tightly the axis body and rotate and connect in first drive arrangement, first drive arrangement drive compresses tightly the axis body along its axial motion in order to be close to or keep away from the processing main shaft, with compressing tightly or releasing the epaxial wafer of processing main, compress tightly the wafer in the processing main shaft when compressing tightly the axis body, it can also rotate relatively first drive arrangement to compress tightly the axis body, so that it is rotatory to follow the main shaft, need not to compress tightly the location again after the processing main shaft is rotatory, the production.
Description
Technical Field
The utility model relates to a wafer processing field especially relates to a wafer hold-down mechanism.
Background
The wafer edge grinding machine is used for grinding edges of wafers, the edge grinding machine adopts a grinding wheel to grind the outer edges of the wafers, the stability of the wafers is high in the grinding process, the wafers are pressed on a main shaft through a pressing device, and the wafers are prevented from being separated from the main shaft. The existing pressing device only considers the pressing and positioning of the wafer, namely, a pressing head of the pressing device cannot rotate along with the main shaft, when the main shaft drives the wafer to rotate, the pressing device needs to press and position the wafer again, the wafer machining efficiency is low, and the workload of workers is increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model aims at providing a wafer hold-down mechanism to solve the problem that current wafer closing device can not follow the main shaft rotation and lead to the processing step of wafer loaded down with trivial details, machining efficiency low.
Based on this, the utility model provides a wafer pressing means, including compressing tightly the axis body, pedestal and connect in the first drive arrangement of pedestal, compress tightly the axis body and the coaxial setting of processing main shaft, just compress tightly the axis body rotate connect in first drive arrangement, a drive arrangement drive compress tightly the axis body along its axial motion in order to be close to or keep away from the processing main shaft.
Preferably, the lifting device further comprises a lifting sliding table, the lifting sliding table is slidably connected to the base body, and the movement direction of the lifting sliding table is parallel to the movement direction of the first driving device; the first driving device is arranged on the lifting sliding table.
Preferably, the base body is provided with a lifting guide rail parallel to the pressing shaft body, and the lifting sliding table is slidably connected to the lifting guide rail.
Preferably, the lifting sliding table further comprises a second driving device, and two ends of the second driving device are respectively connected to the base body and the lifting sliding table.
Preferably, the stroke of the second drive means is greater than the stroke of the first drive means.
Preferably, a thrust bearing is provided between the first drive device and the pressure shaft body.
Preferably, the sliding table adjusting device further comprises a second adjusting sliding table and a base, the base is connected to the second adjusting sliding table, a second adjusting sliding groove which is horizontally arranged is formed in the second adjusting sliding table, and the base is slidably connected to the second adjusting sliding groove.
Preferably, the sliding table further comprises a first adjusting sliding table, the base is fixedly connected to the first adjusting sliding table, a first adjusting sliding groove is horizontally arranged on the first adjusting sliding table, the first adjusting sliding groove and the second adjusting sliding groove are perpendicular to each other, and the second adjusting sliding table is slidably connected to the first adjusting sliding groove.
Preferably, the base is provided with a second adjusting screw rod arranged in parallel with the second adjusting sliding groove, and the tail end of the second adjusting screw rod is connected with the second adjusting sliding table.
Preferably, the second adjusting sliding table is provided with a first adjusting screw rod arranged in parallel with the first adjusting sliding groove, and the tail end of the first adjusting screw rod is connected to the first adjusting sliding table.
The utility model discloses a wafer hold-down mechanism, including compressing tightly the axis body, the pedestal is with connect in the first drive arrangement of pedestal, pedestal fixed connection is in the frame of brilliant circle edging machine, compress tightly the axis body and the coaxial setting of processing main shaft, and compress tightly the axis body and be located the top of processing main shaft, it connects in first drive arrangement to compress tightly the axis body rotation, first drive arrangement drive compresses tightly the axis body along its axial motion in order to be close to or keep away from the processing main shaft, with compress tightly or release the epaxial wafer of processing, compress tightly the axis body with the wafer in the processing main shaft, it still can be relative first drive arrangement to compress tightly the axis body and rotate, so that it is rotatory to follow the main shaft, need not to compress tightly the location again after the rotation of processing main.
Drawings
Fig. 1 is a schematic perspective view of a wafer pressing mechanism according to an embodiment of the present invention;
fig. 2 is a second schematic perspective view of a wafer pressing mechanism according to an embodiment of the present invention;
fig. 3 is a schematic front view of a wafer pressing mechanism according to an embodiment of the present invention;
fig. 4 is a schematic side view of a wafer pressing mechanism according to an embodiment of the present invention.
Wherein, 1, pressing the shaft body; 2. a base body; 21. a lifting guide rail; 3. a first driving device; 4. processing a main shaft; 5. lifting the sliding table; 6. a second driving device; 7. a first adjusting sliding table; 71. a first regulating chute; 8. a second adjustment sliding table; 81. a second regulating chute; 82. a first adjusting screw; 9. a base; 91. and a second adjusting screw.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
With reference to fig. 1 to 4, schematically showing the wafer pressing mechanism of the present invention, including pressing shaft body 1, seat body 2 and first driving device 3, first driving device 3 can extend or contract, and can adopt cylinder, electric push rod or hydraulic cylinder, and first driving device 3 is installed on seat body 2. Compress tightly 1 and the coaxial setting of processing main shaft 4 of axis body, and compress tightly 1 tops that are located processing main shaft 4 of axis body, compress tightly 1 rotation of axis body and connect in first drive arrangement 3, first drive arrangement 3 is used for the drive to compress tightly 1 axis body along its axial motion in order to be close to or keep away from processing main shaft 4. The first driving device 3 drives the pressing shaft body 1 to be close to the processing main shaft 4 along the axial direction of the pressing shaft body, so that the wafer is pressed on the processing main shaft 4, when the processing main shaft 4 drives the wafer to rotate, the pressing shaft body 1 can be driven to rotate together, the wafer is pressed on the processing main shaft 4 through the pressing shaft body 1 all the time, the processing main shaft 4 does not need to be pressed and positioned again after rotating, the production steps are reduced, and the production efficiency is improved.
Further, wafer hold-down mechanism still includes lift slip table 5 and second drive arrangement 6, and lift slip table 5 slidable ground connects in pedestal 2, and the direction of motion of lift slip table 5 is parallel to each other with first drive arrangement 3's direction of motion, and lift slip table 5 is located to first drive arrangement 3, and pedestal 2 and lift slip table 5 are connected respectively at the both ends of second drive arrangement 6 to drive lift slip table 5 and slide relative pedestal 2. Wherein, be equipped with on the pedestal 2 with the parallel arrangement's of axis of pressure body 1 lift guide 21, lift slip table 5 slidable connects in lift guide 21. In the present embodiment, the stroke of the second driving device 6 is greater than the stroke of the first driving device 3, the second driving device 6 is used for driving the sliding table 5 to slide relative to the base body 2, so as to adjust the distance between the pressing shaft body 1 and the processing spindle 4 in a large range, and the first driving device 3 is used for driving the sliding table 5 to slide relative to the pressing shaft body 1, so as to adjust the distance between the pressing shaft body 1 and the processing spindle 4 in a small range.
A thrust bearing is arranged between the first driving device 3 and the pressing shaft body 1, and the thrust bearing can transmit the reaction force applied by the wafer to the pressing shaft body 1 to the first driving device 3 and the lifting sliding table 5.
As shown in fig. 1 and fig. 2, the wafer pressing mechanism further includes a first adjusting sliding table 7, a second adjusting sliding table 8 and a base 9, the base body 2 is fixedly connected to the first adjusting sliding table 7, a first adjusting sliding groove 71 horizontally disposed on the first adjusting sliding table 7, the second adjusting sliding table 8 is slidably connected to the first adjusting sliding groove 71, a second adjusting sliding groove 81 horizontally disposed on the second adjusting sliding table 8, and the base 9 is slidably connected to the second adjusting sliding groove 81, because the first adjusting sliding groove 71 and the second adjusting sliding groove 81 are perpendicular to each other, the base body 2 can slide relative to the base 9 in two mutually perpendicular directions. Wherein the first and second adjusting runners 71, 81 are both arranged horizontally.
In order to finely adjust the position of the seat body 2, a second adjusting screw 91 arranged in parallel with the second adjusting chute 81 is arranged on the base 9, and the tail end of the second adjusting screw 91 is connected to the second adjusting sliding table 8; the second adjusting sliding table 8 is provided with a first adjusting screw 82 arranged in parallel with the first adjusting sliding groove 71, and the tail end of the first adjusting screw 82 is connected to the first adjusting sliding table 7. The first adjusting screw 82 is rotated to drive the first adjusting sliding table 7 and the second adjusting sliding table 8 to slide relatively, and the second adjusting screw 91 is rotated to drive the base 9 and the second adjusting sliding table 8 to slide relatively.
To sum up, the utility model discloses a wafer hold-down mechanism, including compressing tightly the axis body 1, pedestal 2 and connecting in pedestal 2's first drive arrangement 3, 2 fixed connection of pedestal are in the frame of wafer edging machine, compress tightly axis body 1 and the coaxial setting of processing main shaft 4, and compress tightly the top that axis body 1 is located processing main shaft 4, compress tightly 1 rotation of axis body and connect in first drive arrangement 3, first drive arrangement 3 drive compresses tightly axis body 1 along its axial motion in order to be close to or keep away from processing main shaft 4, in order to compress tightly or release the wafer on the processing main shaft 4, compress tightly axis body 1 and compress tightly the wafer in processing main shaft 4, it still can be relative first drive arrangement 3 to compress tightly axis body 1 and rotate, so that it is rotatory to follow the main shaft, need not to compress tightly the location again after the main shaft is rotatory, the production step has.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (10)
1. The wafer pressing mechanism is characterized by comprising a pressing shaft body, a base body and a first driving device connected to the base body, wherein the pressing shaft body is coaxially arranged with a processing main shaft, the pressing shaft body is rotatably connected to the first driving device, and the first driving device drives the pressing shaft body to move along the axial direction of the pressing shaft body so as to be close to or far away from the processing main shaft.
2. The wafer pressing mechanism as claimed in claim 1, further comprising a lift slide slidably connected to the base, wherein a moving direction of the lift slide and a moving direction of the first driving device are parallel to each other; the first driving device is arranged on the lifting sliding table.
3. The wafer pressing mechanism as claimed in claim 2, wherein the base has a lifting rail disposed parallel to the pressing shaft, and the lifting platform is slidably connected to the lifting rail.
4. The wafer pressing mechanism as claimed in claim 2, further comprising a second driving device, wherein two ends of the second driving device are respectively connected to the base and the lifting slide table.
5. The wafer clamping mechanism of claim 4 wherein the stroke of said second drive means is greater than the stroke of said first drive means.
6. The wafer pressing mechanism as claimed in claim 1, wherein a thrust bearing is provided between the first driving device and the pressing shaft body.
7. The wafer pressing mechanism as claimed in claim 1, further comprising a second adjusting slide and a base, wherein the base is connected to the second adjusting slide, the second adjusting slide is provided with a second adjusting slide groove horizontally arranged, and the base is slidably connected to the second adjusting slide groove.
8. The wafer pressing mechanism as claimed in claim 7, further comprising a first adjusting sliding table, wherein the base is fixedly connected to the first adjusting sliding table, the first adjusting sliding table is provided with a first adjusting sliding groove horizontally arranged, the first adjusting sliding groove and the second adjusting sliding groove are perpendicular to each other, and the second adjusting sliding table is slidably connected to the first adjusting sliding groove.
9. The wafer pressing mechanism as claimed in claim 7, wherein a second adjusting screw is disposed on the base and parallel to the second adjusting chute, and a distal end of the second adjusting screw is connected to the second adjusting slide.
10. The wafer pressing mechanism as claimed in claim 8, wherein the second adjusting sliding table is provided with a first adjusting screw rod arranged in parallel with the first adjusting sliding groove, and a tail end of the first adjusting screw rod is connected to the first adjusting sliding table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020898517.8U CN212553075U (en) | 2020-05-25 | 2020-05-25 | Wafer hold-down mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020898517.8U CN212553075U (en) | 2020-05-25 | 2020-05-25 | Wafer hold-down mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212553075U true CN212553075U (en) | 2021-02-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020898517.8U Active CN212553075U (en) | 2020-05-25 | 2020-05-25 | Wafer hold-down mechanism |
Country Status (1)
| Country | Link |
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| CN (1) | CN212553075U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115356901A (en) * | 2022-09-23 | 2022-11-18 | 广东科视光学技术股份有限公司 | Pressing device for photoetching machine |
-
2020
- 2020-05-25 CN CN202020898517.8U patent/CN212553075U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115356901A (en) * | 2022-09-23 | 2022-11-18 | 广东科视光学技术股份有限公司 | Pressing device for photoetching machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210805 Address after: 511500 Industrial Zone, Heyun Town, Qingxin District, Qingyuan City, Guangdong Province (next to Yuba highway) (one photo and multiple addresses) Patentee after: VITAL MATERIALS Co.,Ltd. Address before: 511517 Guangdong Qingyuan hi tech Industrial Park 27-9 Patentee before: GUANGDONG CHANGXIN PRECISION EQUIPMENT Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210825 Address after: 221000 room 1241, office building, No. 11, Zhujiang East Road, high tech Industrial Development Zone, Xuzhou, Jiangsu Province Patentee after: Jiangsu pioneer Microelectronics Technology Co.,Ltd. Address before: 511500 Industrial Zone, Heyun Town, Qingxin District, Qingyuan City, Guangdong Province (next to Yuba highway) (one photo and multiple addresses) Patentee before: VITAL MATERIALS Co.,Ltd. |